M1MA174 BILIN | Alldatasheet
Document overview
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Technical content
Surface Mount Switching Diode M 1 M A 1 7 4 F068 www.gmicroelec.com R e v . A 1
FEATURES
z Fast t rr<4.0ns. z Low C D,<1.0pF. z Pb-free packages are available.
APPLICATIONS
z For high speed switching applications. SOT-323
ORDERING INFORMATION
T y p e N o . M a r k i n g P a c k a g e C o d e M1MA174 J6 SOT-323 MAXIMUM RATING @ Ta=25℃ unless otherwise specified Parameter Symbol Limits Unit Continuous reverse voltage V R 100 V Forward output Current I F 200 mA Peak Forward Surge Current (10μs) I FSM 500 mA Power Dissipation P d 200 mW Thermal resistance,junction to ambient R θJA 625 ℃/W Junction temperature T j 150 ℃ Storage temperature range T stg -55 to +150 ℃ ELECTRICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified Parameter Symbol Test conditions MIN MAX UNIT Reverse Breakdown voltage V (BR) I R=100μA 100 V Reverse current I R VR=20V VR=75V 25 5.0 nA μA Forward voltage V F IF=10mA 1.0 V Diode capacitance C D V R=0V,f=1MHz 4.0 pF Reverse recovery time t rr IF=IR=10mA 4.0 ns Pb Lead-free
Surface Mount Switching Diode M 1 M A 1 7 4 F068 www.gmicroelec.com R e v . A 2 TYPICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified
Surface Mount Switching Diode M 1 M A 1 7 4 F068 www.gmicroelec.com R e v . A 3 PACKAGE OUTLINE Plastic surface mounted package SOT-323 SOLDERING FOOTPRINT Unit : mm
PACKAGE INFORMATION
M1MA174 SOT-323 3000/Tape&Reel SOT-323 Dim Min Max A 2.00 2.20 B 1.15 1.35 C 0.95 Typical D 0.30 Typical E 0.25 0.40 G 1.2 1.4 H 0.02 0.10 J 0.10 Typical K 2.20 2.40 All Dimensions in mm 1.90 0.650.65 0.90 0.70 A B K D E J H G C