M1FL20U SHINDENGEN | Alldatasheet

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200V 1.1A Copyright & Copy;2000 Shindengen Electric Mfg.Co.Ltd iUnit : mm OUTLINE DIMENSIONS RATINGS SHINDENGEN Case : M1F œSmall SMT œLow noise œtrr35ns

FEATURES

œSwitching power supply œDC/DC converter œ Free Wheel œHome Appliances, Office Equipment œTelecommunication, Factory Automation œAbsolute Maximum Ratings (If not specified Tl=25Ž) Item Symbol Conditions RatingsUnit Storage Temperature Tstg -55\`150Ž Operating Junction TemperatureTj 150 Ž Maximum Reverse VoltageVRM 200 V Average Rectified Forward CurrentIO 50Hz sine wave, R-load, Ta=25Ž On alumina substrate 1.1 A 50Hz sine wave, R-load, Ta=25Ž On glass-epoxy substrate 0.75 Peak Surge Forward CurrentIFSM 50Hz sine wave, Non-repetitive 1 cycle peak value, Tj=25Ž30 A œElectrical Characteristics (If not specified Tl=25Ž) Item Symbol Conditions RatingsUnit Forward Voltage VF IF=1.1A, Pulse measurement Max.0.98V Reverse Current IR VR=200V, Pulse measurement Max.10 ƒÊA Reverse Recovery Time trrIF=0.5A,@ IR=1A Max.35 ns ƒÆjljunction to lead Max.20 Thermal Resistance ƒÆjajunction to ambient On alumina substrateMax.108Ž/W junction to ambient On glass-epoxy substrate Max.186 Super Fast Recovery Rectifiers Single

0.1 0 0.5 1 1.5 2 M1FL20U Tl=150°C [MAX] Tl=25°C [MAX] Pulse measurement per diode Tl=150°C [TYP] Tl=25°C [TYP] Forward Voltage V F [V] Forward Current I F [A]

T D=tp/T 0.5 1.5 0 0.5 1 1.5 2 M1FL20U 0.3 Forward Power Dissipation Tj = 150°C SIN 0.2 0.1 D=0.8 DC 0.5 0.05 Average Rectified Forward Current I O [A] Forward Power Dissipation P F [W]

T D=tp/T 0.5 1.5 0 20 40 60 80 100 120 140 160 M1FL20U 0.3 Derating Curve SIN 0.2 0.1 D=0.8DC 0.5 0.05 VR VR = VRM Ambient Temperature Ta [ °C] Average Rectified Forward Current I O [A] Alumina substrate Soldering land 2mm φ Conductor layer 20 µm Substrate thickness 0.64mm

T D=tp/T 0.2 0.4 0.6 0.8 1.2 0 20 40 60 80 100 120 140 160 M1FL20U 0.3 Derating Curve SIN 0.2 0.1 D=0.8DC 0.5 0.05 VR VR = VRM Ambient Temperature Ta [ °C] Average Rectified Forward Current I O [A] Glass-epoxy substrate Soldering land 2mm φ Conductor layer 35 µm

Peak Surge Forward Capability 1 10 100 M1FL20U 2 5 20 50 IFSM 10ms 10ms 1 cycle Number of Cycles [cycles] Peak Surge Forward Current I FSM [A] non-repetitive, sine wave, Tj=25°C before surge current is applied

0.05 0.50.2 20 5052 200 500 2000 5000 Junction Capacitance Reverse Voltage VR [V] Junction Capacitance Cj [pF] f=1MHz Tl=25°C TYP per diode