LTM8046 LINER | Alldatasheet
Document overview
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Technical content
8046fbFor more information www.linear .com/L TM8046 VIN (V) MAXIMUM OUTPUT CURRENT (mA) 700 600 400 200 500 300 100 10 20
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3.1VIN to 31VIN, 2kVAC Isolated DC/DC µModule Converter The LT M®8046 is an isolated flyback DC/DC µModule ® (micromodule) converter. The LTM8046 has an isolation rating of 2kVAC. Included in the package are the switching controller, power switches, transformer, and all support components. Operating over an input voltage range of 3.1V to 31V, the LTM8046 supports an output voltage range of 1.8V to 12V, set by one resistor. Only output, input, and bias capacitors are needed to finish the design. An optional capacitor can be used to set the soft-start period. The LTM8046 is packaged in a 9mm × 15mm × 4.92mm over-molded ball grid array (BGA) package suitable for automated assembly by standard surface mount equip - ment. The LTM8046 is available with SnPb (BGA) or RoHS compliant terminal finish. L, LT, LT C, LT M, Linear Technology, the Linear logo and µModule are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners.
applicaTions
n 2kVAC Isolated µModule Converter (Tested to 3kVDC) n UL 60950 Recognized ® , File E464570 n Wide Input Voltage Range: 3.1V to 31V n 5V at 550mA from 24VIN n 1.8V to 12V Output Voltage n Current Mode Control n Programmable Soft-Start n User Configurable Undervoltage Lockout n SnPb or RoHS Compliant Finish n 9mm × 15mm × 4.92mm BGA Package n Industrial Sensors n Industrial Switches n Ground Loop Mitigation Maximum Output Current vs VIN 2kV Isolated Low Noise µModule Regulator 2kVAC ISOLATION L TM8046
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4.3V TO 26V VOUT 100µF 1µF 1µF 8.45k VOUTVIN RUN FB SS BIAS GND VOUT– ISOLATION BARRIER
8046fb For more information www.linear .com/L TM8046 pin conFiguraTionabsoluTe MaxiMuM raTings Max Pea (Note 1) L K J H G F E D C B A TOP VIEW 1 2 3 4 5 6 7 BANK 4 VOUT BANK 3 VOUT– BANK 2 GND RUN FBBIAS SS BANK 1 VIN BGA PACKAGE 51-LEAD (15mm × 9mm × 4.92mm) TJMAX = 125°C, θJA = 21.9°C/W, θJCbottom = 7.9°C/W, θJCtop = 17.9°C/W, θJB = 8.4°C/W WEIGHT = 1.5g, θ VALUES DETERMINED PER JEDEC 51-9, 51-12 orDer inForMaTion PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE TYPE MSL RATING TEMPERATURE RANGE (See Note 3)DEVICE FINISH CODE LTM8046EY#PBF SAC305 (RoHS) LTM8046Y e1 BGA 3 –40°C to 125°C LTM8046IY#PBF SAC305 (RoHS) LTM8046Y e1 BGA 3 –40°C to 125°C LTM8046IY SnPb (63/37) LTM8046Y e0 BGA 3 –40°C to 125°C LTM8046MPY#PBF SAC305 (RoHS) LTM8046Y e1 BGA 3 –55°C to 125°C LTM8046MPY SnPb (63/37) LTM8046Y e0 BGA 3 –55°C to 125°C Consult Marketing for parts specified with wider operating temperature ranges. *Device temperature grade is indicated by a label on the shipping container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
- Pb-free and Non-Pb-free Part Markings: www.linear.com/leadfree
- Recommended LGA and BGA PCB Assembly and Manufacturing Procedures: www.linear.com/umodule/pcbassembly
- LGA and BGA Package and T ray Drawings: www.linear.com/packaging
8046fbFor more information www.linear .com/L TM8046
elecTrical characTerisTics
Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LTM8046 isolation is tested at 3kVDC for one second. Note 3: The LTM8046E is guaranteed to meet performance specifications from 0°C to 125°C. Specifications over the –40°C to 125°C internal temperature range are assured by design, characterization and correlation with statistical process controls. LTM8046I is guaranteed to meet specifications over the full –40°C to 125°C internal operating temperature range. The LTM8046MP is guaranteed to meet specifications over the full –55°C to 125°C internal operating temperature range. Note that the maximum internal temperature is determined by specific operating conditions in conjunction with board layout, the rated package thermal resistance and other environmental factors. The l denotes the specifications which apply over the full internal operating temperature range, otherwise specifications are at TA = 25°C, RUN = 12V (Note 3). PARAMETER CONDITIONS MIN TYP MAX UNITS Minimum Input DC Voltage BIAS = VIN, VRUN = 2V BIAS Open, VRUN = 2V l l 3.1 4.3 V V V OUT DC Voltage RFB = 14.7k RFB = 8.45k RFB = 3.83k l 4.75 2.5 5.25 V V V V IN Quiescent Current VRUN = 0V 1 µA VOUT Line Regulation 6V ≤ VIN ≤ 31V, IOUT = 0.15A, VRUN = 2V 1 % VOUT Load Regulation 0.05A ≤ IOUT ≤ 0.4A, VRUN = 2V 1.5 % VOUT Ripple (RMS) IOUT = 0.1A, BW = 1MHz 20 mV Isolation Test Voltage (Note 2) 3000 VDC Input Short Circuit Current VOUT Shorted 30 mA RUN Pin Input Threshold VRUN Pin Rising 1.18 1.24 1.30 V RUN Pin Current VRUN = 1V VRUN = 1.3V 2.5 0.1 µA µA SS Threshold 0.7 V SS Sourcing Current SS = 0V –8 µA BIAS Current V IN = 12V, BIAS = 5V, IOUT = 100mA 10 mA Minimum BIAS Voltage (Note 4) I OUT = 100mA 3.1 V Note 4: This is the BIAS pin voltage at which the internal circuitry is powered through the BIAS pin and not the integrated regulator. See BIAS Pin Considerations for details. Note 5: V IN + 2VOUT is defined as the sum of the voltage between (VIN – GND) added to twice the voltage between (VOUT – VOUT–).
8046fb For more information www.linear .com/L TM8046 Typical perForMance characTerisTics 5VOUT Efficiency vs Output Current 8VOUT Efficiency vs Output Current 12VOUT Efficiency vs Output Current 1.8VOUT Efficiency vs Output Current 2.5VOUT Efficiency vs Output Current 3.3VOUT Efficiency vs Output Current 1.8VOUT Input Current vs Output Current 2.5VOUT Input Current vs Output Current 3.3VOUT Input Current vs Output Current OUTPUT CURRENT (mA) EFFICIENCY (%) 600
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BIAS = 3.3V OUTPUT CURRENT (mA) EFFICIENCY (%)
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BIAS = 3.3V OUTPUT CURRENT (mA) EFFICIENCY (%) 600
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BIAS = 3.3V OUTPUT CURRENT (mA) EFFICIENCY (%) 600
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BIAS = 3.3V OUTPUT CURRENT (mA) EFFICIENCY (%) 50 150
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BIAS = 3.3V OUTPUT CURRENT (mA) INPUT CURRENT (mA) 250 100 150 200 200 600
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BIAS = 3.3V 12VIN 5VIN 24VIN OUTPUT CURRENT (mA) INPUT CURRENT (mA) 250 100 150 200
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BIAS = 3.3V 0 200 800400 600 OUTPUT CURRENT (mA) EFFICIENCY (%) 200
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BIAS = 3.3V OUTPUT CURRENT (mA) INPUT CURRENT (mA) 300 250 150 200 100
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BIAS = 3.3V
8046fbFor more information www.linear .com/L TM8046 Typical perForMance characTerisTics 5VOUT Input Current vs Output Current 8VOUT Input Current vs Output Current 12VOUT Input Current vs Output Current 1.8VOUT Bias Current vs Output Current 2.5VOUT Bias Current vs Output Current 3.3VOUT Bias Current vs Output Current 8VOUT Bias Current vs Output Current 12VOUT Bias Current vs Output Current 5VOUT Bias Current vs Output Current 0 800400200 OUTPUT CURRENT (mA) INPUT CURRENT (mA) 350 300 100 150 200 250
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BIAS = 3.3V OUTPUT CURRENT (mA) INPUT CURRENT (mA) 400 350 300 100 200 150 250
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BIAS = 3.3V 0 200 500400300100 5VIN 12VIN 20VIN OUTPUT CURRENT (mA) INPUT CURRENT (mA) 400 250 350 150 300 200 100 8046 12 BIAS = 3.3V 0 100 25020015050 5VIN 12VIN OUTPUT CURRENT (mA) BIAS CURRENT (mA)
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BIAS = 3.3V OUTPUT CURRENT (mA) BIAS CURRENT (mA)
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BIAS = 3.3V 24VIN OUTPUT CURRENT (mA) BIAS CURRENT (mA)
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BIAS = 3.3V 5VIN 20VIN OUTPUT CURRENT (mA) BIAS CURRENT (mA)
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BIAS = 3.3V 5VIN 12VIN OUTPUT CURRENT (mA) BIAS CURREBT (mA)
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BIAS = 3.3V OUTPUT CURRENT (mA) BIAS CURRENT (mA)
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0 700400 600 500300 200 100 24VIN 12VIN 5VIN BIAS = 3.3V
8046fb For more information www.linear .com/L TM8046 Typical perForMance characTerisTics Maximum Output Current vs VIN Maximum Output Current vs VIN Minimum Load vs VIN Minimum Load vs VIN 12VOUT Minimum Load vs VIN Input Current vs VIN Output Shorted Temperature Rise vs Output Current 3.3VOUT Temperature Rise vs Output Current 2.5V OUT OUTPUT CURRENT (mA) TEMPERATURE RISE (°C)
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3.3VIN 5VIN 12VIN 24VIN VIN (V) MAXIMUM OUTPUT CURRENT (mA) 800 700 600 400 500 200 300
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1.8VOUT 2.5VOUT 3.3VOUT BIAS = 3.3V VIN (V) MAXIMUM OUTPUT CURRENT (mA) 600 500 400 200 300 100
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BIAS = 3.3V VIN (V) MINIMUM LOAD (mA)
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BIAS = 3.3V VIN (V) INPUT CURRENT (mA) 120 100
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BIAS = 3.3V OUTPUT CURRENT (mA) TEMPERATURE RISE (°C)
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3.3VIN 5VIN 12VIN 24VIN VIN (V) MINIMUM LOAD (mA)
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BIAS = 3.3V 8VOUT MINIMUM LOAD (mA) VIN (V)
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1.8VOUT 2.5VOUT 3.3VOUT BIAS = 3.3V
8046fbFor more information www.linear .com/L TM8046 Typical perForMance characTerisTics Temperature Rise vs Output Current 8VOUT Temperature Rise vs Output Current 12V OUT Output Ripple Step Input Start-Up Waveform Temperature Rise vs Output Current 5V OUT OUTPUT CURRENT (mA) TEMPERATURE RISE (°C)
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0 700500 600100 200 300 400 3.3VIN 5VIN 12VIN 24VIN OUTPUT CURRENT (mA) TEMPERATURE RISE (°C)
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3.3VIN 5VIN 12VIN OUTPUT CURRENT (mA) TEMPERATURE RISE (°C)
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3.3VIN 5VIN 12VIN 24VIN, 5VOUT 570mA LOAD DC1559A DEMO BOARD UNMODIFIED 150MHz BW 50mV/ DIV
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2µs/DIV 24VIN, 5VOUT 20/uni03A9 RESISTIVE LOAD 1V/ DIV
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200µs/DIV CSS = 0.1µF CSS = 0.033µF NO CSS
8046fb For more information www.linear .com/L TM8046 pin FuncTions VIN (Bank 1): V IN supplies current to the LTM8046’s internal regulator and to the integrated power switch. These pins must be locally bypassed with an external, low ESR capacitor. GND (Bank 2): This is the primary side local ground of the LTM8046 primary. In most applications, the bulk of the heat flow out of the LTM8046 is through the GND and VOUT– pads, so the printed circuit design has a large impact on the thermal performance of the part. See the PCB Layout and Thermal Considerations sections for more details. V OUT– (Bank 3): V OUT– is the return for V OUT. VOUT and VOUT– comprise the isolated output of the LTM8046. In most applications, the bulk of the heat flow out of the LTM8046 is through the GND and V OUT– pads, so the printed circuit design has a large impact on the thermal performance of the part. See the PCB Layout and Thermal Considerations sections for more details. Apply an external capacitor between VOUT and VOUT–. VOUT (Bank 4): V OUT and V OUT– comprise the isolated output of the LTM8046 flyback stage. Apply an external capacitor between VOUT and VOUT–. Do not allow VOUT– to exceed VOUT. RUN (Pin L3): A resistive divider connected to VIN and this pin programs the minimum voltage at which the LTM8046 will operate. Below 1.24V, the LTM8046 does not deliver power to the secondary. Above 1.24V, power will be de- livered to the secondary and 8µA will be fed into the SS pin. When RUN is less than 1.24V, the pin draws 2.5µA, allowing for a programmable hysteresis. Do not allow a negative voltage (relative to GND) on this pin. BIAS (Pin L4): This pin supplies the power necessary to operate the LTM8046. It must be locally bypassed with a low ESR capacitor of at least 1μF. Do not allow this pin voltage to rise above VIN. SS (Pin L5): Place a soft-start capacitor here to limit inrush current and the output voltage ramp rate. Do not allow a negative voltage (relative to GND) on this pin. FB (Pin L6): Apply a resistor from this pin to GND to set the output voltage, using the recommended value given in Table 1. If Table 1 does not list the desired VOUT value, the equation RFB =31.6 V OUT –0.84 ( ) kΩ may be used to approximate the value. To the seasoned designer, this exponential equation may seem unusual. The equation is exponential due to non-linear current sources that are used to temperature compensate the output regulation.
8046fbFor more information www.linear .com/L TM8046 block DiagraM VIN RUN FB *DO NOT ALLOW BIAS VOL TAGE TO EXCEED VIN GND 0.1µF 1µF VOUT CURRENT MODE CONTROLLER VOUT– SS BIAS* 8046 BD operaTion The LTM8046 is a stand-alone isolated flyback switching DC/DC µModule converter that can deliver over 700mA of output current. This module provides a regulated output voltage programmable via one external resistor from 1.8V to 12V. The input voltage range of the LTM8046 is 3.1V to 31V. Given that the LTM8046 is a flyback converter, the output current depends upon the input and output voltages, so make sure that the input voltage is high enough to support the desired output voltage and load current. The Typical Performance Characteristics section gives several graphs of the maximum load versus VIN for several output voltages. A simplified block diagram is given. The LTM8046 contains a current mode controller, power switching element, power transformer, power Schottky diode, a modest amount of input and output capacitance. The LTM8046 has a galvanic primary to secondary isola- tion rating of 2kVAC. This is verified by applying 3kVDC between the primary to secondary for 1 second. Note that the 2kVAC isolation is verified by a 3kVDC test. This is because the 2kVAC waveform has a peak voltage 1.414 times higher than 2kV, or 2.83kVDC. For the LTM8046, at least 3kVDC is applied. For further details please refer to the Isolation and Working Voltage section. An internal regulator provides power to the control cir - cuitry. The bias regulator normally draws power from the VIN pin, but if the BIAS pin is connected to an external voltage higher than 3.1V, bias power will be drawn from the external source, improving efficiency. VBIAS must not exceed VIN. The RUN pin is used to turn on or off the LTM8046, disconnecting the output and reducing the input current to 1μA or less. The LTM8046 is a variable frequency device. For a fixed input and output voltage, the frequency decreases as the load increases. For light loads, the current through the internal transformer may be discontinuous, so that frequency may appear to decrease. Note that a minimum load is required to keep the output voltage in regulation. Refer to the Typical Performance Characteristics section.
input range and output voltage.
- Apply the recommended CIN, COUT and RFB.
- Connect BIAS as indicated, or
up to 15V or VIN, whichever is less. load and environmental conditions. ESR. However, not all ceramic capacitors are suitable. easily avoided; see the Hot-Plugging Safely section. Table 1. Recommended Components and Configuration (TA = 25°C)
8046fbFor more information www.linear .com/L TM8046 applicaTions inForMaTion BIAS Pin Considerations The BIAS pin is the output of an internal linear regulator that powers the LTM8046’s internal circuitry. It is set to 3V and must be decoupled with a low ESR capacitor of at least 1μF. The LTM8046 will run properly without apply- ing a voltage to this pin, but will operate more efficiently and dissipate less power if a voltage greater than 3.1V is applied. At low V IN, the LTM8046 will be able to deliver more output current if BIAS is 3.1V or greater. Up to 31V may be applied to this pin, but a high BIAS voltage will cause excessive power dissipation in the internal circuitry. For applications with an input voltage less than 15V, the BIAS pin is typically connected directly to the VIN pin. For input voltages greater than 15V, it is preferred to leave the BIAS pin separate from the VIN pin, either powered from a separate voltage source or left running from the internal regulator. This has the added advantage of keeping the physical size of the BIAS capacitor small. Do not allow BIAS to rise above VIN. Soft-Start For many applications, it is necessary to minimize the inrush current at start-up. The built-in soft-start circuit significantly reduces the start-up current spike and out - put voltage overshoot by applying a capacitor from SS to GND. When the LTM8046 is enabled, whether from V IN reaching a sufficiently high voltage or RUN being pulled high, the LTM8046 will source approximately 8µA out of the SS pin. As this current gradually charges the capaci- tor from SS to GND, the LTM8046 will correspondingly increase the power delivered to the output, allowing for a graceful turn-on ramp. Isolation Working Voltage and Safety The LTM8046 isolation is 100% hi-pot tested by tying all of the primary pins together, all of the secondary pins together and subjecting the two resultant circuits to a differential of 3kVDC for one second. This establishes the isolation voltage rating of the LTM8046 component. The isolation rating of the LTM8046 is not the same as the working or operational voltage that the application will experience. This is subject to the application’s power source, operating conditions, the industry where the end product is used and other factors that dictate design requirements such as the gap between copper planes, traces and component pins on the printed circuit board, as well as the type of connector that may be used. To maximize the allowable working voltage, the LTM8046 has three rows of solder balls removed to facilitate the printed circuit board design. The ball to ball pitch is 1.27mm, and the typical ball diameter is 0.78mm. Accounting for the missing row and the ball diameter, the printed circuit board may be designed for a metal-to-metal separation of up to 4.3mm. This may have to be reduced somewhat to allow for tolerances in solder mask or other printed circuit board design rules. To reiterate, the manufacturer’s isolation voltage rating and the required operational voltage are often different numbers. In the case of the LTM8046, the isolation voltage rating is established by 100% hi-pot testing. The working or operational voltage is a function of the end product and its system level specifications. The actual required operational voltage is often smaller than the manufacturer’s isolation rating. For those situations where information about the spacing of LTM8046 internal circuitry is required, the minimum metal to metal separation of the primary and secondary is 1.9mm. The LTM8046 is a UL recognized comp onent under UL 60950-1, file number E464570. The UL 60950-1 insula- tion category of the LTM8046 transformer is Functional. Considering UL 60950-1 Table 2N and the gap distances stated above, 4.3mm external and 1.9mm internal, the LTM8046 may be operated with up to 400V working voltage in a pollution degree 2 environment. The actual working voltage, insulation category, pollution degree and other critical parameters for the specific end application depend upon the actual environmental, application and safety compliance requirements. It is therefore up to the user to perform a safety and compliance review to ensure that the LTM8046 is suitable for the intended application.
and heat sinking are acceptable.
- Place the CIN capacitor as close as possible to the VIN
and GND connections of the LTM8046.
- Place the COUT capacitor as close as possible to VOUT
- Place the C IN and C OUT capacitors such that their
Figure 1. Layout Showing Suggested External Components,
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reversal if the load is short-circuited through a long cable. with the V OUT capacitance, which drives V OUT negative. conditions at room temperature. temperature, line, load and other operating conditions.
8046fbFor more information www.linear .com/L TM8046 applicaTions inForMaTion GND planes at these locations, due to their proximity to internal power handling components. The optimum number of thermal vias depends upon the printed circuit board design. For example, a board might use very small via holes. It should employ more thermal vias than a board that uses larger holes. The printed circuit board construction has an impact on the isolation performance of the end product. For example, increased trace and layer spacing, as well as the choice of core and prepreg materials (such as using polyimide versus FR4) can significantly affect the isolation withstand of the end product. Hot-Plugging Safely The small size, robustness and low impedance of ceramic capacitors make them an attractive option for the input bypass capacitor of the LTM8046. However, these capaci- tors can cause problems if the LTM8046 is plugged into a live supply (see Linear Technology Application Note 88 for a complete discussion). The low loss ceramic capacitor combined with stray inductance in series with the power source forms an underdamped tank circuit, and the volt- age at the VIN pin of the LTM8046 can ring to more than twice the nominal input voltage, possibly exceeding the LTM8046’s rating and damaging the part. If the input supply is poorly controlled or the user will be plugging the LTM8046 into an energized supply, the input network should be designed to prevent this overshoot. This can be accomplished by installing a small resistor in series to V IN, but the most popular method of controlling input voltage overshoot is adding an electrolytic bulk capacitor to VIN. This capacitor’s relatively high equivalent series resistance damps the circuit and eliminates the voltage overshoot. The extra capacitor improves low frequency ripple filtering and can slightly improve the efficiency of the circuit, though it can be a large component in the circuit. Thermal Considerations The LTM8046 output current may need to be derated if it is required to operate in a high ambient temperature. The amount of current derating is dependent upon the input voltage, output power and ambient temperature. The temperature rise curves given in the Typical Performance Characteristics section can be used as a guide. These curves were generated by the LTM8046 mounted to a 58cm 2 4-layer FR4 printed circuit board. Boards of other sizes and layer count can exhibit different thermal behavior, so it is incumbent upon the user to verify proper operation over the intended system’s line, load and environmental operating conditions. For increased accuracy and fidelity to the actual application, many designers use FEA to predict thermal performance. To that end, the Pin Configuration section of the data sheet typically gives four thermal coefficients: θ JA: Thermal resistance from junction to ambient θ JCbottom: Thermal resistance from junction to the bot- tom of the product case θ JCtop: Thermal resistance from junction to top of the product case θ JB: Thermal resistance from junction to the printed circuit board. While the meaning of each of these coefficients may seem to be intuitive, JEDEC has defined each to avoid confusion and inconsistency. These definitions are given in JESD 51-12, and are quoted or paraphrased as follows: θ JA is the natural convection junction-to-ambient air thermal resistance measured in a one cubic foot sealed enclosure. This environment is sometimes referred to as still air although natural convection causes the air to move. This value is determined with the part mounted to a JESD 51-9 defined test board, which does not reflect an actual application or viable operating condition. θJCbottom is the junction-to-board thermal resistance with all of the component power dissipation flowing through the bottom of the package. In the typical µModule converter, the bulk of the heat flows out the bottom of the package, but there is always heat flow out into the ambient envi - ronment. As a result, this thermal resistance value may be useful for comparing packages but the test conditions don’t generally match the user’s application.
8046fb For more information www.linear .com/L TM8046 applicaTions inForMaTion θJCtop is determined with nearly all of the component power dissipation flowing through the top of the package. As the electrical connections of the typical µModule converter are on the bottom of the package, it is rare for an application to operate such that most of the heat flows from the junc- tion to the top of the part. As in the case of θJCbottom, this value may be useful for comparing packages but the test conditions don’t generally match the user’s application. θJB is the junction-to-board thermal resistance where almost all of the heat flows through the bottom of the µModule converter and into the board, and is really the sum of the θJCbottom and the thermal resistance of the bottom of the part through the solder joints and through a portion of the board. The board temperature is measured a specified distance from the package, using a two-sided, two-layer board. This board is described in JESD 51-9. Given these definitions, it should now be apparent that none of these thermal coefficients reflects an actual physical operating condition of a µModule converter. Thus, none of them can be individually used to accurately predict the thermal performance of the product. Likewise, it would be inappropriate to attempt to use any one coefficient to correlate to the junction temperature vs load graphs given in the product’s data sheet. The only appropriate way to use the coefficients is when running a detailed thermal analysis, such as FEA, which considers all of the thermal resistances simultaneously. A graphical representation of these thermal resistances is given in Figure 2. The blue resistances are contained within the µModule converter, and the green are outside. The die temperature of the LTM8046 must be lower than the maximum rating of 125°C, so care should be taken in the layout of the circuit to ensure good heat sinking of the LTM8046. The bulk of the heat flow out of the LTM8046 is through the bottom of the module and the BGA pads into the printed circuit board. Consequently a poor printed circuit board design can cause excessive heating, result- ing in impaired performance or reliability. Please refer to the PCB Layout section for printed circuit board design suggestions. Figure 2.
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µMODULE DEVICE JUNCTION-TO-CASE (TOP) RESISTANCE JUNCTION-TO-BOARD RESISTANCE JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD) CASE (TOP)-TO-AMBIENT RESISTANCE BOARD-TO-AMBIENT RESISTANCE JUNCTION-TO-CASE (BOTTOM) RESISTANCE JUNCTION AMBIENT CASE (BOTTOM)-TO-BOARD RESISTANCE
8046fbFor more information www.linear .com/L TM8046 Typical applicaTions 3.3V Isolated Flyback Converter Maximum Output Current vs VIN VIN (V) MAXIMUM OUTPUT CURRENT (mA) 800 700 500 600 300 400 200 10 20
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3.3V TO 29V 3.3V VOUT 3.3V 11.8k1µF VOUTVIN RUN FB SS BIAS GND VOUT– ISOLATION BARRIER 100µF 1µF
8046fb For more information www.linear .com/L TM8046 Typical applicaTions Maximum Output Current vs VIN Use Tw o LTM8046 Flyback Converters to Generate ±5V VIN (V) MAXIMUM OUTPUT CURRENT (mA) 700 600 500 100 200 300 400 10 20 25
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–5V 8.45k1µF VOUTVIN RUN FB SS BIAS GND VOUT– 1µF ISOLATION BARRIER 2kVAC ISOLATION 1µF 100µF L TM8046 VIN 4.3V TO 26V 5V 8.45k1µF VOUTVIN RUN FB SS BIAS GND VOUT– 1µF ISOLATION BARRIER 2kVAC ISOLATION 22µF 100µF 1µF
8046fbFor more information www.linear .com/L TM8046 PIN NAME PIN NAME PIN NAME PIN NAME PIN NAME PIN NAME PIN NAME PIN NAME PIN NAME PIN NAME PIN NAME A1 VOUT B1 VOUT C1 VOUT– D1 - E1 - F1 - G1 GND H1 - J1 VIN K1 VIN L1 VIN A2 VOUT B2 VOUT C2 VOUT– D2 - E2 - F2 - G2 GND H2 - J2 - K2 - L2 - A3 VOUT B3 VOUT C3 VOUT– D3 - E3 - F3 - G3 GND H3 GND J3 GND K3 GND L3 RUN A4 VOUT B4 VOUT C4 VOUT– D4 - E4 - F4 - G4 GND H4 GND J4 GND K4 GND L4 BIAS A5 VOUT– B5 VOUT– C5 VOUT– D5 - E5 - F5 - G5 GND H5 GND J5 GND K5 GND L5 SS A6 VOUT– B6 VOUT– C6 VOUT– D6 - E6 - F6 - G6 GND H6 GND J6 GND K6 GND L6 FB A7 VOUT– B7 VOUT– C7 VOUT– D7 - E7 - F7 - G7 GND H7 GND J7 GND K7 GND L7 GND Pin Assignment Table (Arranged by Pin Number) package DescripTion package phoTo
8046fb For more information www.linear .com/L TM8046 package DescripTion Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. PACKAGE TOP VIEW PIN “A1” CORNER Y X aaa Z aaa Z DETAIL A PACKAGE BOTTOM VIEW SEE NOTES L K J H G F E D C B A 1 2 3 4 5 6 7PIN 1 51-Lead (15.00mm × 9.00mm × 4.92mm) (Reference LTC DWG# 05-08-1889 Rev Ø) NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS BALL DESIGNATION PER JESD MS-028 AND JEP95 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION CAN BE 96.5% Sn/3.0% Ag/0.5% Cu OR Sn Pb EUTECTIC DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE DETAIL A Øb (51 PLACES) DETAIL B SUBSTRATE A ccc Z DETAIL B PACKAGE SIDE VIEW MOLD CAP Z M X Y Z ddd M Z eee SYMBOL A b D E e F G aaa bbb ccc ddd eee MIN 4.72 0.50 4.22 0.71 0.60 0.27 3.95 NOM 4.92 0.60 4.32 0.78 0.63 15.00 9.00 1.27 12.70 7.62 0.32 4.00 MAX 5.12 0.70 4.42 0.85 0.66 0.37 4.05 0.15 0.10 0.20 0.30 0.15 NOTES DIMENSIONS TOTAL NUMBER OF BALLS: 51 D E e b F G SUGGESTED PCB LAYOUT TOP VIEW 0.000 3.810 5.080 3.810 6.350 5.080 6.350 2.540 1.270 3.810 2.540 1.270 3.810 2.540 1.270 0.3175 0.3175 0.000 // bbb Z Z 0.630 ±0.025 Ø 51x BGA 51 1110 REV Ø TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION COMPONENT PIN “A1” L TMXXXXXX µModule
8046fbFor more information www.linear .com/L TM8046 Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
revision hisTory
REV DATE DESCRIPTION PAGE NUMBER A 07/14 Add MP-grade 2, 3 B 04/15 V IN changed from 32V to 31V 1
8046fb For more information www.linear .com/L TM8046 Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 LINEAR TECHNOLOGY CORPORATION 2014 LT 0415 REV B • PRINTED IN USA (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear .com/L TM8046 relaTeD parTs Typical applicaTion 12V Isolated Flyback Converter Maximum Output Current vs VIN PART NUMBER DESCRIPTION COMMENTS LTM8057 UL60950 Recognized 1.5W, 2kVAC Isolated µModule Converter 3.1V ≤ VIN ≤ 31V, 2.5V ≤ VOUT ≤ 12V, 5% VOUT Accuracy, Internal Isolated T ransformer, 9mm × 11.25mm × 4.92mm BGA LTM8058 UL60950 Recognized 1.5W, 2kVAC Isolated µModule Converter with LDO Post Regulator 3.1V ≤ V IN ≤ 31V, 1.2V ≤ VOUT ≤ 12V, 2.5% VOUT Accuracy, 1mVP-P Output Ripple, Internal Isolated T ransformer, 9mm × 11.25mm × 4.92mm BGA LTM8048 1.5W, 725VDC Galvanically Isolated µModule Converter with LDO Post Regulator 3.1V ≤ V IN ≤ 32V, 1.2V ≤ VOUT ≤ 12V, 2.5% VOUT Accuracy, 1mVP-P Output Ripple, Internal Isolated T ransformer, 9mm × 11.25mm × 4.92mm BGA LTM8045 Inverting or SEPIC μModule DC/DC Converter with Up to 700mA Output Current 2.8V ≤ V IN ≤ 18V, ±2.5V ≤ VOUT ≤ ±15V, Synchronizable, No Derating or Logic Level Shift for Control Inputs When Inverting, 6.25mm × 11.25mm × 4.92mm BGA LTM4609 36V IN, 5A DC/DC μModule Buck-Boost Regulator 4.5V ≤ V IN ≤ 36V, 0.8V ≤ VOUT ≤ 34V, Adjustable Soft-Start, Clock Input, 15mm × 15mm × 2.82mm LGA and 15mm × 15mm × 3.42mm BGA LTM8061 32V, 2A Step-Down μModule Battery Charger with Programmable Input Current Limit Suitable for Charging Single and Dual Cell Li-Ion or Li-Poly Batteries, 4.95V ≤ V IN ≤ 32V, C/10 or Adjustable Timer Charge Termination, NTC Resistor Monitor Input, 9mm × 15mm × 4.32mm LGA VIN (V) MAXIMUM OUTPUT CURRENT (mA)
8046 TA04b
8046 TA04
3.3VDC TO 12VDC VOUT 12V 3.83k1µF 3.3V VOUTVIN RUN FB SS BIAS GND VOUT– ISOLATION BARRIER 10µF 1µF Design resources SUBJECT DESCRIPTION µModule Design and Manufacturing Resources Design:
- Selector Guides
- Demo Boards and Gerber Files
- Free Simulation Tools Manufacturing:
- Quick Start Guide
- PCB Design, Assembly and Manufacturing Guidelines
- Package and Board Level Reliability µModule Regulator Products Search 1. Sort table of products by parameters and download the result as a spread sheet. 2. Search using the Quick Power Search parametric table. TechClip Videos Quick videos detailing how to bench test electrical and thermal performance of µModule products. Digital Power System Management Linear Technology’s family of digital power supply management ICs are highly integrated solutions that offer essential functions, including power supply monitoring, supervision, margining and sequencing, and feature EEPROM for storing user configurations and fault logging.