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µModule Boost LED Driver and Current Source The L TM®8042 is a complete μModule® Boost LED Driver specifically designed to drive LEDs up to 1A, while the L TM8042-1 drives up to 350mA. It combines a boost power topology with a unique current loop to operate as a constant-current source. The PWM input provides as much as 3000:1 LED dimming, while 10:1 analog dimming can be accomplished by a single resistor or analog voltage applied to the CTL pin. As with any boost topology, the L TM8042/L TM8042-1 has an uninterrupted current path between its input and output and is thus intolerant to a short-circuit or overload from the output to ground. # WHITE LEDS LED CURRENT 12V IN 24VIN 6 1A L TM8042 7 350mA L TM8042-1 8 1A L TM8042 9 350mA L TM8042-1 The L TM8042/L TM8042-1 is packaged in a thermally enhanced, compact overmolded land grid array (LGA) package. The L TM8042/L TM8042-1 is Pb-free and a RoHS compliant. μModule Boost LED Driver , Driving 8 White LEDs at 1A
APPLICATIONS
n T rue Color PWM™ with 3000:1 Dimming Ratio n Operates in Boost, Buck Mode or Buck-Boost Mode n Wide Input Voltage Range: Operation from 3V to 30V T ransient Protection to 40V n Gate Driver for Optional PWM Dimming with P-channel MOSFET n Adjustable Frequency: 250kHz to 2MHz n Constant-Current and Constant-Voltage Regulation n Low Shutdown Current: <1μA n RoHS Compliant Package with Gold Pad Finish n Tiny, Low Profile (9mm × 15mm × 2.82mm) Surface Mount LGA Package n Display Backlighting n Automotive and Avionic Lighting n Illumination n Scanners Efficiency vs VIN L, L T , L TC, L TM, Linear Technology, the Linear logo and μModule are registered trademarks and T rue Color PWM is a trademark of Linear Technology Corporation. All other trademarks are the property of their respective owners. VIN (V) EFFICIENCY (%) 1918
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BSTIN/BKLED– PWM SYNC TGEN SS V IN 16V TO 26V LED+ TG BSTOUT/BKIN 4.7μF 33.2k fSW = 550kHz 4.7μF UP TO 26.8V
PIN CONFIGURATIONABSOLUTE MAXIMUM RATINGS Internal Operating Temperature (Note 1) ABCDEF BANK 1 BANK 3 BANK 4 TG BANK 5 BSTOUT/BKIN LED + BANK 2 GND G RUN SYNC RT SS PWM HJKL TGEN CTL VCC LGA PACKAGE 77-LEAD (15mm s 9mm s 2.82mm) BSTIN/BKLED– TJMAX = 125°C, θJA = 15.7°C/W , θJCtop = 13.6°C/W , θJCbottom = 4.5°C/W , θJB = 9.4°C/W θ VALUES DETERMINED PER JESD 51-12 WEIGHT = 1.1g ORDER INFORMATION LEAD FREE FINISH TRAY PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE L TM8042EV#PBF L TM8042EV#PBF L TM8042V 77-Lead (15mm × 9mm × 2.82mm) LGA –40°C to 125°C L TM8042IV#PBF L TM8042IV#PBF L TM8042V 77-Lead (15mm × 9mm × 2.82mm) LGA –40°C to 125°C L TM8042EV-1#PBF L TM8042EV-1#PBF L TM8042-1V 77-Lead (15mm × 9mm × 2.82mm) LGA –40°C to 125°C L TM8042IV-1#PBF L TM8042IV-1#PBF L TM8042-1V 77-Lead (15mm × 9mm × 2.82mm) LGA –40°C to 125°C Consult L TC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container . For more information on lead free part marking, go to: http://www.linear .com/leadfree/ This product is only offered in trays. For more information go to: http://www.linear .com/packaging/
ELECTRICAL CHARACTERISTICS
Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: Absolute maximum voltage at V CC, RUN, PWM, TGEN, BSTIN/ BKLED– pins is 40V for non-repetitive one second transients and 30V for continuous operation. Note 3: The L TM8042E/L TM8042E-1 are guaranteed to meet performance specifications from 0°C to 125°C ambient. Specifications over the full –40°C to 125°C internal operating temperature range are assured by design, characterization and correlation with statistical process controls. The l denotes the specifications which apply over the full internal operating temperature range, otherwise specifications are at TA = 25°C. VCC = 5V , buck mode with 4Ω load. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VCC(MIN) Minimum Input DC Voltage l 3V ILED L TM8042 LED Current L TM8042-1 LED Current CTL Open CTL Open, RCTL = 6.81k RCTL = 6.81k 0.9 0.45 0.34 0.17 0.5 1.05 0.55 0.39 0.20 A A A A V CLAMP Open LED Clamp Voltage Boost Mode, LED + Open 36 V ΔIOUT/IOUT Output Current Line Regulation L TM8042, 6V < BSTOUT/BKIN < 30V L TM8042-1, 6V < BSTOUT/BKIN < 30V 0.5 0.5 IQVCC VCC Supply Current PWM = 0V RUN = 0V 4.2 0.1 1 mA μA fSW Switching Frequency RT = 90.9k RT = 22.1k RT = 6.04k 0.22 0.68 1.7 0.25 0.8 0.27 0.92 2.3 MHz MHz MHz I SS Soft-Start Pin Current SS = 0.5V , Out of Pin 6 9 12 μA fSYNC Synchronization Frequency Range 0.3 2.5 MHz ISYNC SYNC Pull-Down Current (Into the Pin) V SYNC = 2V 60 μA VSYNC(IL) SYNC Input Low 0.4 V VSYNC(IH) SYNC Input High 1.5 V ICTL CTL Input Bias Current CTL = 0V , Flows Out of Pin 100 μA VRUN(IH) RUN Input Voltage High 1.5 V VRUN(IL) RUN Input Voltage Low 0.4 V IRUN RUN Pin Bias Current 60 100 μA VPWM(IH) PWM Input Voltage High 1.5 V VPWM(IL) PWM Input Voltage Low 0.4 V IPWM PWM Pin Bias Current 60 120 μA VTG(OH) TG Output High Voltage Relative to LED +, 100k from LED+ to TG 0 V VTG(OL) TG Output Low Voltage Relative to LED +, 100k from LED+ to TG –7 V VTGEN(IH) TGEN Input Voltage High PWM = 0V 1.5 V VTGEN(IL) TGEN Input Voltage Low 0.4 V ITGEN TGEN Pin Bias Current 100 200 μA The L TM8042I/L TM8042I-1 are guaranteed to meet specifications over the full –40°C to 125°C internal operating temperature range. Note that the maximum internal temperature is determined by specific operating conditions in conjunction with board layout, the rated package thermal resistance and other environmental factors. Note 4: This device includes overtemperature protection that is intended to protect the device during momentary overload conditions. Junction temperature will exceed the maximum internal operating temperature when overtemperature protection is active. Continuous operation above the specified maximum operating junction temperature may impair device reliability.
TYPICAL PERFORMANCE CHARACTERISTICS Efficiency vs VIN, Boost Operation, 16.7V at 1A LED String Efficiency vs VIN, Boost Operation, 20.1V at 1A LED String Efficiency vs VIN, Boost Operation, 23.4V at 1A LED String Efficiency vs VIN, Boost Operation, 26.8V at 1A LED String Efficiency vs VIN, Buck Mode, 3.5V at 1A LED String Efficiency vs VIN, Buck Mode, 6.8V at 1A LED String Efficiency vs VIN, Boost Operation, 6.8V at 1A LED String Efficiency vs VIN, Boost Operation, 10.1V at 1A LED String Efficiency vs VIN, Boost Operation, 13.4V at 1A LED String TA = 25°C, unless otherwise noted. L TM8042 VIN (V) EFFICIENCY (%)
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VIN (V) EFFICIENCY (%)
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VIN (V) EFFICIENCY (%) 109
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VIN (V) EFFICIENCY (%) 1413
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VIN (V) EFFICIENCY (%) 1713
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VIN (V) EFFICIENCY (%) 1514
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VIN (V) EFFICIENCY (%) 1918
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VIN (V) EFFICIENCY (%) 1816
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14 2010861 2 2 6 2422 30 32 28 34 VIN (V) EFFICIENCY (%) 1816
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14 2010 12 26 2422 30 32 28 34
TYPICAL PERFORMANCE CHARACTERISTICS Efficiency vs VIN, Buck-Boost Mode, 3.6V at 1A LED String Efficiency vs VIN, Buck-Boost Mode, 6.8V at 1A LED String Efficiency vs VIN, Buck-Boost Mode, 10.1V at 1A LED String Efficiency vs VIN, Buck Mode, 10.1V at 1A LED String Efficiency vs VIN, Buck Mode, 13.4V at 1A LED String Efficiency vs VIN, Buck Mode, 16.7V at 1A LED String TA = 25°C, unless otherwise noted. Maximum LED Current vs Input Voltage, Boost Operation L TM8042 Efficiency vs VIN, Buck-Boost Mode, 13.4V at 1A LED String VIN (V) EFFICIENCY (%) 1816
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VIN (V) EFFICIENCY (%)
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VIN (V) EFFICIENCY (%)
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VIN (V) EFFICIENCY (%) 2624
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20 22 28 301086 1 21 41 61 8 VIN (V) EFFICIENCY (%) 262422
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VIN (V) EFFICIENCY (%) 242322
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VIN (V) EFFICIENCY (%)
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INPUT VOLTAGE (V) MAXIMUM LED CURRENT (mA) 2015 1200
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7.4V AT 1A 10.9V AT 1A 14.5V AT 1A 18.1V AT 1A 21.4V AT 1A 24.8V AT 1A 28.2V AT 1A
TYPICAL PERFORMANCE CHARACTERISTICS LED Current vs CTL Voltage Quiescent Current vs Input Voltage, Open LED Junction Temperature Rise vs Load, Boost Operation, 8.3V at 1A LED String Maximum LED Current vs V IN, Buck Mode Maximum LED Current vs Input Voltage, Buck-Boost Mode Junction Temperature Rise vs Load, Boost Operation, 18.1V at 1A LED String Junction Temperature Rise vs Load, Boost Operation, 13.6V at 1A LED String Junction Temperature Rise vs Load, Boost Operation, 10.9V at 1A LED String VIN (N) LED CURRENT (mA) 2015 1000
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3.8V AT 1A 7.4V AT 1A 10.9V AT 1A 14.5V AT 1A 18.1V AT 1A 21.4V AT 1A 24.8V AT 1A INPUT VOLTAGE (V) MAXIMUM LED CURRENT (mA) 1200
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7.4V AT 1A 10.9V AT 1A 14.5V AT 1A 18.1V AT 1A 21.4V AT 1A 24.8V AT 1A 28.2V AT 1A ADJUST VOLTAGE (mV) LED CURRENT SCALING (%) 800600 100
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INPUT VOLTAGE (V) QUIESCENT CURRENT (mA) 2015
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LED CURRENT (mA) TEMPERATURE (°C) 600400
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LED CURRENT (mA) TEMPERATURE (°C) 600400
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LED CURRENT (mA) TEMPERATURE (°C) 600400
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LED CURRENT (mA) TEMPERATURE (°C) 600400
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TA = 25°C, unless otherwise noted. L TM8042
TYPICAL PERFORMANCE CHARACTERISTICS Junction Temperature Rise vs Load, Buck Mode, 10.9V at 1A LED String Junction Temperature Rise vs Load, Buck-Boost Mode, 3.8V at 1A LED String Junction Temperature Rise vs Load, Buck-Boost Mode, 8.3V at 1A LED String Junction Temperature Rise vs Load, Buck-Boost Mode, 2.9V at 1A LED String Junction Temperature Rise vs Load, Buck Mode, 2.9V at 1A LED String Junction Temperature Rise vs Load, Buck Mode, 3.8V at 1A LED String Junction Temperature Rise vs Load, Buck Mode, 8.3V at 1A LED String Junction Temperature Rise vs Load, Buck Mode, 13.6V at 1A LED String Junction Temperature Rise vs Load, Buck Mode, 18.1V at 1A LED String LED CURRENT (mA) TEMPERATURE (°C) 600400
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LED CURRENT (mA) TEMPERATURE (°C) 600400
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LED CURRENT (mA) TEMPERATURE (°C) 600400
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LED CURRENT (mA) TEMPERATURE (°C) 600400
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LED CURRENT (mA) TEMPERATURE (°C) 600400
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LED CURRENT (mA) TEMPERATURE (°C) 600400
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LED CURRENT (mA) TEMPERATURE (°C) 600400
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LED CURRENT (mA) TEMPERATURE (°C) 600400
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LED CURRENT (mA) TEMPERATURE (°C) 600400
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TA = 25°C, unless otherwise noted. L TM8042
TYPICAL PERFORMANCE CHARACTERISTICS RUN Pin Current vs Voltage Efficiency vs VIN, Boost Operation, 6.7V at 350mA LED String Junction Temperature Rise vs Load, Buck-Boost Mode, 10.9V at 1A LED String Junction Temperature Rise vs Load, Buck-Boost Mode, 13.6V at 1A LED String Junction Temperature Rise vs Load, Buck-Boost Mode, 15.5V at 350mA LED String L TM8042-1 LED CURRENT (mA) TEMPERATURE (°C) 600400
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LED CURRENT (mA) TEMPERATURE (°C) 600400
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LED CURRENT (mA) TEMPERATURE (°C) 200100 250150
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RUN VOLTAGE (V) RUN CURRENT (μA) 2010 160
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TA = 25°C, unless otherwise noted. L TM8042 Efficiency vs VIN, Boost Operation, 9.7V at 350mA LED String Efficiency vs VIN, Boost Operation, 12.6V at 350mA LED String VIN (V) EFFICIENCY (%)
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VIN (V) 2.5 EFFICIENCY (%) 4.5
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6.5 8.5 VIN (V) EFFICIENCY (%)
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TYPICAL PERFORMANCE CHARACTERISTICS Efficiency vs VIN, Buck Mode, 6.7V at 350mA LED String Efficiency vs VIN, Buck Mode, 9.7V at 350mA LED String Efficiency vs VIN, Buck Mode, 12.6V at 350mA LED String Efficiency vs VIN, Buck Mode, 3.7V at 350mA LED String Efficiency vs VIN, Buck Mode, 15.6V at 350mA LED String TA = 25°C, unless otherwise noted. L TM8042-1 Efficiency vs VIN, Boost Operation, 15.6V at 350mA LED String Efficiency vs VIN, Boost Operation, 18.6V at 350mA LED String Efficiency vs VIN, Boost Operation, 21.6V at 350mA LED String Efficiency vs VIN, Boost Operation, 24.8V at 350mA LED String VIN (V) EFFICIENCY (%) 12651 3 78 1 0 91 1
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VIN (V) EFFICIENCY (%) 12651 3 78 1 0 91 1
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VIN (V) EFFICIENCY (%) 1261 378 1 0 91 1
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VIN (V) EFFICIENCY (%) 1281 0
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VIN (V) EFFICIENCY (%) 128
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16 20 24 2861 4 10 18 22 26 30 32 VIN (V) EFFICIENCY (%)
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16 20 24 281410 18 22 26 30 32 34 VIN (V) EFFICIENCY (%)
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19 21 25 291713 23 27 31 33 VIN (V) EFFICIENCY (%)
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VIN (V) EFFICIENCY (%)
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TYPICAL PERFORMANCE CHARACTERISTICS Maximum LED Current vs Input Voltage, Boost Operation Maximum LED Current vs Input Voltage, Buck Mode Efficiency vs VIN, Buck-Boost Mode, 6.7V at 350mA LED String Efficiency vs VIN, Buck-Boost Mode, 9.7V at 350mA LED String Efficiency vs VIN, Buck-Boost Mode, 12.6V at 350mA LED String INPUT VOLTAGE (V) MAXIMUM LED CURRENT (mA) 2015 400
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6.3V AT 350mA 15.5V AT 350mA 18.6V AT 350mA 21.7V AT 350mA 24.8V AT 350mA INPUT VOLTAGE (V) MAXIMUM LED CURRENT (mA) 400
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3.2V AT 350mA 6.3V AT 350mA 9.4V AT 350mA 12.4V AT 350mA 15.5V AT 350mA 18.6V AT 350mA Efficiency vs VIN, Buck-Boost Mode, 3.7V at 350mA LED String TA = 25°C, unless otherwise noted. L TM8042-1 Efficiency vs VIN, Buck Mode, 18.6V at 350mA LED String Efficiency vs VIN, Buck-Boost Mode, 15.6V at 350mA LED String Efficiency vs VIN, Buck-Boost Mode, 18.6V at 350mA LED String VIN (V) EFFICIENCY (%)
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VIN (V) EFFICIENCY (%)
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VIN (V) EFFICIENCY (%)
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VIN (V) EFFICIENCY (%)
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VIN (V) EFFICIENCY (%)
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VIN (V) EFFICIENCY (%)
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VIN (V) EFFICIENCY (%)
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Maximum LED Current vs Input Voltage, Buck-Boost Mode LED Current vs CTL Voltage Quiescent Current vs Input Voltage, Open LED INPUT VOLTAGE (V) MAXIMUM LED CURRENT (mA) 400
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3.2V AT 350mA 6.3V AT 350mA 9.4V AT 350mA 12.4V AT 350mA 15.5V AT 350mA 18.6V AT 350mA CTL VOLTAGE (mV) LED CURRENT SCALING (%) 400 120 100
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INPUT VOLTAGE (V) QUIESCENT CURRENT (mA) 20105
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TYPICAL PERFORMANCE CHARACTERISTICS Junction Temperature Rise vs Load, Boost Operation, 6.8V at 350mA LED String Junction Temperature Rise vs Load, Boost Operation, 9.4V at 350mA LED String LED CURRENT (mA) TEMPERATURE (°C) 20010050
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vs Load, Boost Operation, 11.2V at 350mA LED String LED CURRENT (mA) TEMPERATURE (°C) 20010050
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LED CURRENT (mA) TEMPERATURE (°C) 20010050
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vs Load, Boost Operation, 15.5V at 350mA LED String LED CURRENT (mA) TEMPERATURE (°C) 20010050
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TA = 25°C, unless otherwise noted. L TM8042-1 Junction Temperature Rise vs Load, Buck Mode, 2.3V at 350mA LED String Junction Temperature Rise vs Load, Buck Mode, 3.2V at 350mA LED String LED CURRENT (mA) TEMPERATURE (°C) 20010050
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LED CURRENT (mA) TEMPERATURE (°C) 20010050
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TYPICAL PERFORMANCE CHARACTERISTICS Junction Temperature Rise vs Load, Buck-Boost Mode, 2.3V at 350mA LED String Junction Temperature Rise vs Load, Buck-Boost Mode, 3.2V at 350mA LED String Junction Temperature Rise vs Load, Buck Mode, 15.5V at 350mA LED String Junction Temperature Rise vs Load, Buck-Boost Mode, 6.8V at 350mA LED String Junction Temperature Rise vs Load, Buck-Boost Mode, 9.4V at 350mA LED String Junction Temperature Rise vs Load, Buck Mode, 9.4V at 350mA LED String Junction Temperature Rise vs Load, Buck Mode, 11.2V at 350mA LED String LED CURRENT (mA) TEMPERATURE (°C) 20010050
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LED CURRENT (mA) TEMPERATURE (°C) 20010050
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LED CURRENT (mA) TEMPERATURE (°C) 20010050
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3.3VIN 12VIN LED CURRENT (mA) TEMPERATURE (°C) 20010050
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3.3VIN 24VIN LED CURRENT (mA) TEMPERATURE (°C) 20010050
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LED CURRENT (mA) TEMPERATURE (°C) 20010050
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TA = 25°C, unless otherwise noted. L TM8042-1 LED CURRENT (mA) TEMPERATURE (°C) 20010050
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vs Load, Buck Mode, 6.8V at 350mA LED String LED CURRENT (mA) TEMPERATURE (°C) 20010050
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vs Load, Buck-Boost Mode, 11.2V at 350mA LED String Junction Temperature Rise vs Load, Buck-Boost Mode, 15.5V at 350mA LED String PIN FUNCTIONS GND (Bank 1): Signal and Power Return. Tie these pads to a local ground plane below the L TM8042/L TM8042-1 and the circuit components. In most applications, the bulk of the heat flow out of the L TM8042/L TM8042-1 is through these pads, so the printed circuit design has a large impact on the thermal performance of the part. See the PCB Layout and Thermal Considerations sections for more details. V CC (Bank 2): Internal Housekeeping Power for the L TM8042/L TM8042-1. Connect to an external power source between 3V and 30V . The L TM8042/L TM8042-1 can withstand transients of 40V . BSTIN/BKLED – (Bank 3): Power Input for Boost Operation, as Well as the Cathode Connection for the LED String in Buck Mode. If the L TM8042/L TM8042-1 is used in boost mode, these pins must be locally decoupled. BSTOUT/BKIN (Bank 4): Output of the Boost Converter , as Well as the Input for Buck Mode. If the L TM8042/ L TM8042-1 is used in buck mode, these pins must be locally decoupled. LED + (Bank 5): Connect this to the anode of the LED string. This can also be connected to the PWM dimming MOSFET if used. RUN (Pin F1): Module Enable. Tie to 1.5V or higher to enable the L TM8042/L TM8042-1 or 0.4V or less to dis- able device. SYNC (Pin G1): Frequency Synchronization Pin. Tie an external clock signal here. The RT resistor should be chosen to program a switching frequency that is 20% slower than SYNC pulse frequency. Tie the SYNC pin to GND if this feature is not used. RT (Pin H1): Timing Resistor Pin. Used to program the switching frequency of the L TM8042/L TM8042-1 by con- necting a resistor from this pin to GND. The Applications Information section of the data sheet includes a table to determine the resistance value based on the desired switching frequency. Minimize capacitance at this pin. SS (Pin J1): Soft-Start Pin. Place a soft-start capacitor here. Leave the pin open if not used. LED CURRENT (mA) TEMPERATURE (°C) 20010050
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LED CURRENT (mA) TEMPERATURE (°C) 20010050
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TYPICAL PERFORMANCE CHARACTERISTICSTA = 25°C, unless otherwise noted. L TM8042-1
0.1μF 4.7μH 0.1μF BSTIN/BKLED– RUN SS PWM SYNC V CC 1M 0.1μF 28.0k 20.0k RSNS 0.10Ω (L TM8042) 0.27Ω (L TM8042-1) GND RT TGEN CTL TG LED+ BSTOUT/BKIN CURRENT SENSE+ CURRENT SENSE– OPEN LED PROTECTION (1V THRESHOLD) 50k PIN FUNCTIONS TG (Pin J7): Top Gate Driver Output. In response to an active high PWM signal, this pin will drive the gate of an external series P-channel MOSFET device low. An internal 7V clamp protects the PFET gate. This pin can also be used to disconnect the load when RUN is pulled low. Leave TG unconnected if not used. PWM (Pin K1): Pulse Width Modulation Input Pin. A low signal turns off the LED string, disables the main switch and pulls the TG pin high. Drive above 1.55V to deliver current to the output. Tie the PWM pin to the RUN pin if not used. There is an equivalent 50k resistor from PWM pin to ground internally. CTL (Pin L2): LED Current Adjustment Pin. Apply a voltage between approximately 1V and 0V to modulate the LED output current, or tie a resistor to GND to modulate the LED + current. CTL is internally tied to a 2V precision refer- ence via a 20k 1% resistor . Leave floating if unused. TGEN (Pin L3): Top Gate (TG) Enable Input Pin. Tie to 1.5V or higher to enable the P-channel MOSFET driver function. Tie the TGEN pin to ground if the TG function is not used. There is an internal 40k resistor from TGEN to GND.
The L TM8042/L TM8042-1 is a complete, full featured, current mode regulator specifically designed to drive light emitting diodes (LEDs) or other loads where a constant cur- rent up to 1A (350mA for the L TM8042-1) is required. The L TM8042/L TM8042-1 can operate in any of three LED drive topologies: boost, buck mode and buck-boost mode. The device features both analog and PWM dimming, a PWM P-channel MOSFET driver , and a suite of control functions: RUN control, soft-start, user programmable switching frequency, and external frequency synchronization. Operation can be best understood by referring to the Block Diagram. The power stage is a boost converter that regulates the output current by reading the voltage across a power sense resistor that is in series with the output. As with any boost topology, there is an uninterrupted cur- rent path between the input and output terminals. Current between these two terminals is not limited, so the device is intolerant to a short-circuit or overload from any of the output terminals (LED +, BSTOUT/BKIN) to GND. There are two ways to dim a LED with the L TM8042/ L TM8042-1. One way is to adjust the current on the LED array by setting the analog voltage on the CTL pin. The CTL pin is internally pulled up to a precision 2V reference through a 1% 20k resistor . Leaving the CTL pin floating sets the LED pin current to 1A. Reducing the voltage below 1.1V on the CTL pin proportionally reduces the current flowing out of LED +. This can be accomplished by connect- ing a resistor from the CTL pin to GND, forming a divider network with the internal 20k resistor , or by driving the CTL pin directly to a voltage source, such as a DAC. The other way the L TM8042/L TM8042-1 can dim a LED array is by pulse width modulation using the PWM pin and an optional external P-channel MOSFET . The external P-channel MOSFET can be conveniently operated by the integrated gate driver at pin TG. The gate drive function can be enabled or disabled by the TGEN pin. If the PWM pin is pulled high, the part operates nor- mally. If the PWM pin is unconnected or pulled low, the L TM8042/L TM8042-1 stops switching and the internal control circuitry is held in its present state. This way, the L TM8042/L TM8042-1 “remembers” the current sourced from the LED + output until PWM is pulled high again. This leads to a highly linear relationship between pulse width and output light, allowing for a large and accurate dimming range. The RUN pin is used to deactivate the L TM8042/L TM8042-1. When the RUN pin is pulled to a logic low state, the device is shut down and draws typically less than 1μA of current. The SS pin is used to limit inrush current during start-up. The L TM8042/L TM8042-1 integrates a current source with this function, so only a capacitor is necessary to establish the soft-start characteristics of the output current. The switching frequency is set by applying a single resistor from the RT pin to GND, allowing operation anywhere from 250kHz to 2MHz, and the SYNC pin allows synchroniza- tion to an external source between 300kHz and 2.5MHz.
- Decide whether the L TM8042/L TM8042-1 should operate
in boost, buck, or buck-boost mode.
- Look at Tables 1 through 6 and find the line that best
- Connect the remaining pins as needed by the system
BSTOUT/BKIN pin to protect the output against overvoltage. within the diode, which raises the junction temperature. taken at high operating temperatures. for a variety of switching frequencies. Table 7. Switching Frequency vs RT Typical Applications section.
the voltage across the LED string. to conveniently accommodate all three operating modes. examples of how to lay out each operating mode. Figure 1. The L TM8042/L TM8042-1 dimming range by an additional factor of ten.
and buck-boost operating modes. Ensure that the grounding and heat sinking are acceptable.
- Place the CIN and CVCC capacitor as close as possible
- Place the C OUT capacitor as close as possible to the
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Figure 2. Suggested Layout for Boost Operation
- Place the CIN, CVCC and COUT capacitors such that their
- Connect all of the GND connections to as large a copper
components and the L TM8042/L TM8042-1. path to the internal planes of the printed circuit board. their proximity to internal power handling components. vias than a board that uses larger holes.
Figure 3. Suggested Layout for Buck Mode Figure 4. Suggested Layout for Buck-Boost Mode
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Table 1. L TM8042 Recommended Values and Configuration for Boost (TA = 25°C)
Table 2. L TM8042 Recommended Values and Configuration for Buck Mode (TA = 25°C)
Table 3. L TM8042 Recommended Values and Configuration for Buck-Boost Mode (TA = 25°C)
Table 4. L TM8042-1 Recommended Values and Configuration for Boost (TA = 25°C)
Table 5. L TM8042-1 Recommended Values and Configuration for Buck Mode (TA = 25°C)
Table 6. L TM8042-1 Recommended Values and Configuration for Buck-Boost Mode (TA = 25°C)
The L TM8042/L TM8042-1 output current may need to be derated if it is required to operate in a high ambient tem- perature or deliver a large amount of continuous power . The amount of current derating is dependent upon the input voltage, output power and ambient temperature. The temperature rise curves given in the Typical Performance Characteristics section can be used as a guide. These curves were generated by an L TM8042/L TM8042-1 mounted to a 51cm 2 4-layer FR4 printed circuit board. Boards of other sizes and layer count can exhibit different thermal behavior , so it is in-cumbent upon the user to verify proper operation over the intended system’s line, load and environmental operating conditions. The thermal resistance numbers listed in the Pin Configura- tion section of the data sheet are based on modeling the μModule package mounted on a test board specified per JESD51-9 (“Test Boards for Area Array Surface Mount Package Thermal Measurements”). The thermal coef- ficients provided are based on JESD 51-12 (“Guidelines for Reporting and Using Electronic Package Thermal Information”). For increased accuracy and fidelity to the actual applica- tion, many designers use finite element analysis (FEA) to predict thermal performance. To that end, the Pin Con- figuration section of the data sheet typically gives four thermal coefficients: 1. θ JA: thermal resistance from junction to ambient. 2. θJCBOTTOM: thermal resistance from junction to the bottom of the product case. 3. θJCTOP: thermal resistance from junction to top of the product case. 4. θJB: thermal resistance from junction to the printed circuit board. While the meaning of each of these coefficients may seem to be intuitive, JEDEC has defined each to avoid confusion and inconsistency. These definitions are given in JESD 51-12, and are quoted or paraphrased in the following: 1. θ JA is the natural convection junction-to-ambient air thermal resistance measured in a one cubic foot sealed enclosure. This environment is sometimes referred to as “still air” although natural convection causes the air to move. This value is determined with the part mounted to a JESD 51-9 defined test board, which does not reflect an actual application or viable operating condition. 2. θ JCBOTTOM is the junction-to-board thermal resistance with all of the component power dissipation flowing through the bottom of the package. In the typical μModule regulator , the bulk of the heat flows out the bottom of the package, but there is always heat flow out into the ambient environment. As a result, this thermal resistance value may be useful for comparing packages but the test conditions don’t generally match the user’s application. 3. θ JCTOP is determined with nearly all of the component power dissipation flowing through the top of the package. As the electrical connections of the typical μModule regulator are on the bottom of the package, it is rare for an application to operate such that most of the heat flows from the junction to the top of the part. As in the case of θ JCBOTTOM, this value may be useful for comparing packages but the test conditions don’t generally match the user’s application. 4. θ JB is the junction-to-board thermal resistance where almost all of the heat flows through the bottom of the μModule regulator and into the board, and is really the sum of the θ JCBOTTOM and the thermal resistance of the bottom of the part through the solder joints and through a portion of the board. The board temperature is measured a specified distance from the package, using a two sided, two layer board. This board is described in JESD 51-9.
The most appropriate way to use the coefficients is when running a detailed thermal analysis, such as FEA, which considers all of the thermal resistances simultaneously. None of them can be individually used to accurately pre- dict the thermal performance of the product, so it would be inappropriate to attempt to use any one coefficient to correlate to the junction temperature versus load graphs given in the L TM8042/L TM8042-1 data sheet. A graphical representation of these thermal resistances is given in Figure 5. The blue resistances are contained within the μModule regulator , and the green are outside.
80421 F05
μMODULE DEVICE JUNCTION-TO-CASE (TOP) RESISTANCE JUNCTION-TO-BOARD RESISTANCE JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD) CASE (TOP)-TO-AMBIENT RESISTANCE BOARD-TO-AMBIENT RESISTANCE JUNCTION-TO-CASE (BOTTOM) RESISTANCE JUNCTION At CASE (BOTTOM)-TO-BOARD RESISTANCE The die temperature of the L TM8042/L TM8042-1 must be lower than the maximum rating of 125°C, so care should be taken in the layout of the circuit to ensure good heat sinking of the L TM8042/L TM8042-1. The bulk of the heat flow out of the L TM8042/L TM8042-1 is through the bottom of the module and the LGA pads into the printed circuit board. Consequently, a poor printed circuit board design can cause excessive heating, resulting in impaired performance or reliability. Please refer to the PCB Layout section for printed circuit board design suggestions. Figure 5 TYPICAL APPLICATIONS Boost Operation, Driving 6 White LEDs at 1A
80421 TA02
BSTIN/BKLED– PWM SYNC TGEN SS V IN 11.6V TO 19V LED+ TG BSTOUT/BKIN 4.7μF 22.6k fSW = 750kHz 4.7μF UP TO 20.6V
Buck-Boost Mode, Driving 5 White LEDs at 500mA with PWM Dimming Buck Mode, Driving 4 White LEDs at 1A Boost Operation, Driving 9 White LEDs at 100mA TYPICAL APPLICATIONS
80421 TA03
UP TO 16.3V RT GND CTL 2.2μF 7.32k19.6k fSW = 850kHz 1μF VCC RUN PWM TGEN SYNC SS V IN 7V TO 17.5V LED+ TG BSTOUT/BKIN BSTIN/BKLED– 1μF 500mA
80421 TA04
4.7μF 15.8k fSW = 1MHz 2.2μF UP TO 13.9VVCC RUN PWM SYNC TGEN SS V IN 19V TO 30V LED+ TG BSTOUT/BKIN BSTIN/BKLED– 1μF
80421 TA05
BSTIN/BKLED– PWM TGEN SYNC SS V IN 6V TO 22V LED+ TG BSTOUT/BKIN 3.4k 2.2μF 2.2μF 24.9k fSW = 700kHz 100mA UP TO 29V
PIN NAME PIN NAME PIN NAME PIN NAME PIN NAME PIN NAME A1 GND B1 GND C1 GND D1 GND E1 GND F1 RUN A2 GND B2 GND C2 GND D2 GND E2 GND F2 GND A3 GND B3 GND C3 GND D3 GND E3 GND F3 GND A4 GND B4 GND C4 GND D4 GND E4 GND F4 GND A5 GND B5 GND C5 BSTIN/BKLED– D5 BSTIN/BKLED– E5 GND F5 GND A6 V CC B6 V CC C6 BSTIN/BKLED– D6 BSTIN/BKLED– E6 GND F6 GND A7 V CC B7 V CC C7 BSTIN/BKLED– D7 BSTIN/BKLED– E7 GND F7 GND PIN NAME PIN NAME PIN NAME PIN NAME PIN NAME G1 SYNC H1 RT J1 SS K1 PWM L1 GND G2 GND H2 GND J2 GND K2 GND L2 CTL G3 GND H3 GND J3 GND K3 GND L3 TGEN G4 GND H4 GND J4 GND K4 GND L4 GND G5 BSTOUT/BKIN H5 BSTOUT/BKIN J5 BSTOUT/BKIN K5 LED+ L5 LED+ G6 BSTOUT/BKIN H6 BSTOUT/BKIN J6 BSTOUT/BKIN K6 LED+ L6 LED+ G7 BSTOUT/BKIN H7 BSTOUT/BKIN J7 TG K7 LED+ L7 LED+ Pin Assignment Table (Arranged by Pin Number) PACKAGE PHOTOGRAPH
77-Lead (15mm × 9mm × 2.82mm) (Reference L TC DWG # 05-08-1859 Rev Ø) NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS LAND DESIGNATION PER JESD MO-222, SPP-010 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. THE TOTAL NUMBER OF PADS: 77 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE SYMBOL aaa bbb eee TOLERANCE 0.15 0.10 0.05 2.72 – 2.92 DETAIL B DETAIL B SUBSTRATE MOLD CAP 0.27 – 0.37 2.45 – 2.55 // bbb Z Z BSC PACKAGE TOP VIEW BSC PAD 1 CORNER X Y aaa Z aaa Z DETAIL A 12.70 BSC 1.27 BSC 7.62 BSC L K J H G F E D C B PACKAGE BOTTOM VIEW PADS SEE NOTES A 1234567 DETAIL A 0.635 ±0.025 SQ. 76x S YXeee SUGGESTED PCB LAYOUT TOP VIEW 0.000 1.270 1.270 2.540 2.540 3.810 3.810 5.080 5.080 6.350 6.350 3.810 1.270 2.540 0.000 1.270 3.810 2.540 LGA 77 (1859) 0709 REV Ø PAD 1 DIA (0.635) 0.9525 1.5875 0.9525 1.5875 PACKAGE IN TRAY LOADING ORIENTATION LTMXXXXXX MModule TRAY PIN 1 BEVEL COMPONENT PIN “A1”
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However , no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
REVISION HISTORY
REV DATE DESCRIPTION PAGE NUMBER A 01/11 Updated features. Updated ILED conditions in the Electrical Characteristics section. Updated text in the Operation section. Updated text in the Setting the Switching Frequency section.
Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear .com © LINEAR TECHNOLOGY CORPORATION 2010 LT 0111 REV A • PRINTED IN USA RELATED PARTS TYPICAL APPLICATION PART NUMBER DESCRIPTION COMMENTS L TM8040 36V , 1A, μModule LED Driver and Current Source 4V ≤ V IN ≤ 36V; Open LED and Short-Circuit Protection, 9mm × 15mm × 4.32mm LGA Package L TM8032 EMC 36V , 2A, μModule Regulator EN55022 Class B Compliant; 0.8V ≤ V OUT ≤ 10V L TM4607 Buck-Boost μModule Regulator 4.5V ≤ V IN ≤ 36V; 0.8V ≤ VOUT ≤ 25V , 15mm × 15mm × 2.8mm Boost Operation, Driving 9 Red LEDs at 350mA with Analog Dimming
80421 TA06
BSTIN/BKLED– PWM SYNC TGEN SS V IN 7V TO 24.8V LED+ TG BSTOUT/BKIN 2.2μF ANALOG CONTROL VOL TAGE 19.6k fSW = 850kHz 2.2μF 350mA UP TO 28V