LTM8050 LINER | Alldatasheet
Document overview
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Technical content
For more information www.linear .com/L TM8050 TYPICAL APPLICATION
FEATURES
APPLICATIONS
DESCRIPTION
58V, 2A Step-Down µModule Regulator The LT M®8050 is a 58VIN, 2A step down µModule® (mi- cromodule) converter. Included in the package are the switching controller, power switches, inductor and all support components. Operating over an input voltage range of 3.6V to 58V, the LTM8050 supports an output voltage range of 0.8V to 24V and a switching frequency range of 100kHz to 2.4MHz, each set by a single resistor. Only the bulk input and output filter capacitors are needed to finish the design. The LTM8050 is packaged in a 9mm × 15mm × 4.92mm ball grid array (BGA) package suitable for automated assembly by standard surface mount equipment. The LTM8050 is available with SnPb (BGA) or RoHS compli- ant terminal finish. L, LT, LT C, LT M, Linear Technology, the Linear logo, µModule and Burst Mode are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. n Wide Input Voltage Range: 3.6V to 58V (60V Absolute Maximum) n Up to 2A Output Current n Parallelable for Increased Output Current n 0.8V to 24V Output Voltage n Adjustable Switching Frequency: 100kHz to 2.4MHz n Configurable as an Inverter n Current Mode Control n Programmable Soft-Start n 9mm × 15mm × 4.92mm BGA Package n Automotive Batter y Regulation n Power for Portable Products n Distributed Supply Regulation n Industrial Supplies n Wall T ransformer Regulation Efficiency vs Output Current, 12VOUT 12VOUT, 2A µModule Regulator OUTPUT CURRENT (A)
8050 TA01b
EFFICIENCY (%) 0 0.5 1.0 1.5 2.0 VIN = 24V VIN = 36V VIN = 48V VIN RUN/SS SHARE RT FB VOUT GND
8050 TA01a
VIN* 17V TO 58V *RUNNING VOL TAGE RANGE. PLEASE REFER TO APPLICATIONS INFORMATION SECTION FOR START-UP DETAILS VOUT 12V AT 2A 57.6k f = 600kHz 34.8k 4.7µF 22µF PGOOD SYNC AUX BIAS Click to view associated TechClip Videos.
For more information www.linear .com/L TM8050 ABSOLUTE MAXIMUM RATINGS FB, RT V P 5°C 5°C (Notes 1, 3) ORDER INFORMATION PIN CONFIGURATION GND A B C BANK 1 BANK 2 BANK 3 D E F G H J K L 2 3 4 TOP VIEW BGA PACKAGE 70-PIN (15mm × 9mm × 4.92mm) 5 6 7 VOUT VIN RT SHARE PGOOD FB SYNCRUN/SS AUX BIAS TJMAX = 125°C, θJA = 24.4°C/W, θJC(BOTTOM) = 11.5°C/W, θJC(TOP) = 42.7°C/W, θJB = 18.7°C/W θ VALUES DETERMINED PER JESD51-9, MAX OUTPUT POWER WEIGHT = 1.8 GRAMS PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE TYPE MSL RA TING TEMPERATURE RANGE (SEE NOTE 2)DEVICE FINISH CODE LT M8050EY#PBF SAC305 (RoHS) LT M8050Y e1 BGA 3 –40°C to 125°C LT M8050IY#PBF SAC305 (RoHS) LT M8050Y e1 BGA 3 –40°C to 125°C LT M8050IY SnPb (63/37) LT M8050Y e0 BGA 3 –40°C to 125°C LT M8050MPY#PBF SAC305 (RoHS) LT M8050Y e1 BGA 3 –55°C to 125°C LT M8050MPY SnPb (63/37) LT M8050Y e0 BGA 3 –55°C to 125°C Consult Marketing for parts specified with wider operating temperature ranges. *Device temperature grade is indicated by a label on the shipping container . Pad or ball finish code is per IPC/JEDEC J-STD-609.
- Terminal Finish Part Marking: www.linear .com/leadfree
- Recommended LGA and BGA PCB Assembly and Manufacturing Procedures: www .linear .com/umodule/pcbassembly
- LGA and BGA Package and T ray Drawings: www.linear .com/packaging http://www.linear.com/product/LTM8050#orderinfo
For more information www.linear .com/L TM8050
ELECTRICAL CHARACTERISTICS
Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LTM8050E is guaranteed to meet performance specifications from 0°C to 125°C internal. Specifications over the full –40°C to 125°C internal operating temperature range are assured by design, characterization and correlation with statistical process controls. The PARAMETER CONDITIONS MIN TYP MAX UNITS Minimum Input Voltage l 3.6 V Output DC Voltage 0 < IOUT ≤ 2A; RFB Open 0 < IOUT ≤ 2A; RFB = 16.9k; VIN = 32V 0.8 V V Output DC Current 0 2 A Quiescent Current into VIN RUN/SS = 0V Not Switching BIAS = 0V, Not Switching 0.01 120 160 µA µA µA Quiescent Current into BIAS RUN/SS = 0V Not Switching BIAS = 0V, Not Switching 0.01 0.5 120 µA µA µA Line Regulation 5.5V < V IN < 58V, IOUT = 1A 0.3 % Load Regulation 0A < IOUT < 2A 0.3 % Output Voltage Ripple (RMS) 0A < IOUT < 2A 10 mV Switching Frequency RT = 45.3k 750 kHz Voltage (at FB Pin) l 775 770 790 805 810 mV mV Internal Feedback Resistor 499 kΩ Minimum BIAS V oltage for Proper Operation 2.8 V RUN/SS Pin Current RUN/SS = 2.5V 6 10 µA RUN Input High Voltage 2.5 V RUN Input Low Voltage 0.2 V PGOOD Threshold (at FB Pin) VOUT Rising 730 mV PGOOD Leakage Current PGOOD = 30V 0.1 1 µA PGOOD Sink Current PGOOD = 0.4V 200 600 µA SYNC Input Low Threshold fSYNC = 550kHz 0.5 V SYNC Input High Threshold fSYNC = 550kHz 0.7 V SYNC Bias Current SYNC = 0V 0.1 µA The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. VIN = 12V, RUN/SS = 12V, BIAS = 3V unless otherwise noted. (Note 2) LTM8050I is guaranteed to meet specifications over the full –40°C to 125°C internal operating temperature range. The LTM8050MP is guaranteed to meet specifications over the full –55°C to 125°C internal operating temperature range. Note that the maximum internal temperature is determined by specific operating conditions in conjunction with board layout, the rated package thermal resistance and other environmental factors. Note 3: Unless otherwise noted, the absolute minimum voltage is zero.
For more information www.linear .com/L TM8050 Operating conditions are per T able 1 and TA = 25°C, unless otherwise noted. EFFICIENCY (%) 0 0.5 1.0 1.5 2.0
8050 G04
OUTPUT CURRENT (A) TYPICAL PERFORMANCE CHARACTERISTICS Efficiency vs Output Current, 2.5VOUT Efficiency vs Output Current, 3.3V OUT Efficiency vs Output Current, OUT Efficiency vs Output Current, OUT Efficiency vs Output Current, 12V OUT Efficiency vs Output Current, 18V OUT Efficiency vs Output Current, 24V OUT Efficiency, VOUT ≤ 2V, 2A Load, BIAS = 5V Input Current vs Output Current 2.5V OUT EFFICIENCY (%) 0 0.5 1.0 1.5 2.0
8050 G01
OUTPUT CURRENT (A) EFFICIENCY (%) 0 0.5 1.0 1.5 2.0
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OUTPUT CURRENT (A) EFFICIENCY (%) 0 0.5 1.0 1.5 2.0
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OUTPUT CURRENT (A) 12VIN 24VIN 36VIN 48VIN OUTPUT CURRENT (A)
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EFFICIENCY (%) 0 0.5 1.0 1.5 2.0 24VIN 36VIN 48VIN OUTPUT CURRENT (A)
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EFFICIENCY (%) 0 0.5 1.0 1.5 36VIN 48VIN EFFICIENCY (%) 0 0.5 1.0 1.5
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OUTPUT CURRENT (A) 36VIN 48VIN EFFICIENCY (%)
8050 G08
VOUT (V) 5VIN 12VIN 24VIN 36VIN 48VIN 1.2 0.4 0.8 1.4 0.6 1.0 0.2INPUT CURRENT (A) 0 0.5 1.0 1.5 2.0
8050 G09
OUTPUT CURRENT (A) 5VIN 12VIN 24VIN 36VIN 48VIN
For more information www.linear .com/L TM8050 Operating conditions are per T able 1 and TA = 25°C, unless otherwise noted. TYPICAL PERFORMANCE CHARACTERISTICS Input Current vs Output Current 3.3VOUT Input Current vs Output Current OUT Input Current vs Output Current OUT Input Current vs Output Current 12V OUT Input Current vs Output Current 18V OUT Input Current vs Output Current 24V OUT Input Current vs VIN Output Shorted Output Current vs VIN Output Shorted BIAS Current vs Output Current 2.5V OUT BIAS = 5V 0.6 0.2 0.4 0.8 0.7 0.3 0.5
0.1 INPUT CURRENT (A)
0 0.5 1.0 1.5 2.0
8050 G10
OUTPUT CURRENT (A) 12VIN 24VIN 36VIN 48VIN 0.6 0.2 0.4 1.2 1.0 0.8INPUT CURRENT (A) 0 0.5 1.0 1.5 2.0
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OUTPUT CURRENT (A) 12VIN 24VIN 36VIN 48VIN 0.6 0.8 1.0 1.2 1.4 0.2 0.4 1.6INPUT CURRENT (A) 0 0.5 1.0 1.5 2.0
8050 G12
OUTPUT CURRENT (A) 12VIN 24VIN 36VIN 48VIN 0.6 0.2 0.4 1.2 1.0 0.8INPUT CURRENT (A) 0 0.5 1.0 1.5 2.0
8050 G13
OUTPUT CURRENT (A) 24VIN 36VIN 48VIN 0.6 0.2 0.4 1.2 1.0 0.8INPUT CURRENT (A) 0 0.5 1.0 1.5
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OUTPUT CURRENT (A) 36VIN 48VIN 0.6 0.8 1.0 1.2 0.2 0.4 1.4INPUT CURRENT (A) 0 0.5 1.0 1.5
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OUTPUT CURRENT (A) 36VIN 48VIN INPUT VOL TAGE (V) INPUT CURRENT (mA) 400 300 200 100
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RT = 215k (200kHz) RT = 93.1k (400kHz) RT = 57.6k (600kHz) RT = 33.2k (900kHz) INPUT VOL TAGE (V) OUTPUT CURRENT (A) RT = 215k (200kHz) RT = 93.1k (400kHz) RT = 57.6k (600kHz) RT = 33.2k (900kHz) BIAS CURRENT (mA) 0 0.5 1.0 1.5 2.0
8050 G18
OUTPUT CURRENT (A) 12VIN 24VIN 36VIN 48VIN
For more information www.linear .com/L TM8050 BIAS CURRENT (mA) 0 0.5 1.0 1.5 2.0
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OUTPUT CURRENT (A) 24VIN 36VIN 48VIN BIAS CURRENT (mA) 0 0.5 1.0 1.5 2.0
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OUTPUT CURRENT (A) 12VIN 24VIN 36VIN 48VIN BIAS CURRENT (mA) 0 0.5 1.0 1.5 2.0
8050 G20
OUTPUT CURRENT (A) 12VIN 24VIN 36VIN 48VIN BIAS CURRENT (mA) 0 0.5 1.0 1.5 2.0
8050 G21
OUTPUT CURRENT (A) 12VIN 24VIN 36VIN 48VIN MINIMUM VIN (V) 0 5 10 2520 15
8050 G25
VOUT (V) 3.00 4.00 3.75 3.50 3.25 MINIMUM VIN (V) 0 0.5 1.0 1.5 2.0
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OUTPUT CURRENT (A) 0 0.5 1.0 1.5 2.0
8050 G27
OUTPUT CURRENT (A) 3.5 4.2 4.1 4.0 3.9 3.8 3.7
3.6 MINIMUM VIN (V)
BIAS CURRENT (mA) 0 0.5 1.0 1.5
8050 G23
OUTPUT CURRENT (A) 36VIN 48VIN BIAS CURRENT (mA) 0 0.5 1.0 1.5
8050 G24
OUTPUT CURRENT (A) 36VIN 48VIN Operating conditions are per T able 1 and TA = 25°C, unless otherwise noted. TYPICAL PERFORMANCE CHARACTERISTICS BIAS Current vs Output Current 3.3VOUT BIAS = 5V BIAS Current vs Output Current OUT BIAS = 5V BIAS Current vs Output Current OUT BIAS = 5V BIAS Current vs Output Current 12V OUT BIAS = 5V BIAS Current vs Output Current 18V OUT BIAS = 5V BIAS Current vs Output Current 24V OUT BIAS = 5V Minimum VIN vs VOUT Maximum Load, BIAS = 5V Minimum VIN vs Output Current 1.8VOUT and Below, BIAS = 5V Minimum VIN vs Output Current 2.5VOUT, BIAS = 5V
For more information www.linear .com/L TM8050 Operating conditions are per T able 1 and TA = 25°C, unless otherwise noted. TYPICAL PERFORMANCE CHARACTERISTICS Minimum VIN vs Output Current 3.3VOUT, BIAS = VOUT Minimum VIN vs Output Current 5VOUT, BIAS = VOUT Minimum VIN vs Output Current 8VOUT, BIAS = VOUT Minimum VIN vs Output Current 12VOUT, BIAS = VOUT Minimum VIN vs Output Current 18VOUT, BIAS = VOUT Minimum VIN vs Output Current 24VOUT, BIAS = 5V Minimum VIN vs Output Current –3.3VOUT, BIAS = GND Minimum VIN vs Output Current –5VOUT, BIAS = GND Minimum VIN vs Output Current –8VOUT, BIAS = GND 3.0 6.0 4.5 4.0 5.5 5.0 3.5 MINIMUM VIN (V) 0 0.5 1.0 1.5 2.0
8050 G28
OUTPUT CURRENT (A) RUNNING TO START , RUN CONTROL TO START , RUN = V IN 7.05 7.55 7.10 7.15 7.20 7.25 7.30 7.35 7.40 7.45 7.50 MINIMUM VIN (V) 0 0.5 1.0 1.5 2.0
8050 G29
OUTPUT CURRENT (A) RUNNING TO START , RUN CONTROL TO START , RUN = V IN 7.5 12.5 8.0 8.5 9.0 9.5 10.0 10.5 11.0 11.5 12.0 MINIMUM VIN (V) 0 0.5 1.0 1.5 2.0
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OUTPUT CURRENT (A) RUNNING TO START , RUN CONTROL TO START , RUN = V IN MINIMUM VIN (V) 0 0.5 1.0 1.5 2.0
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OUTPUT CURRENT (A) RUNNING TO START , RUN CONTROL TO START , RUN = V IN 0 0.5 1.0 1.5
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OUTPUT CURRENT (A) MINIMUM VIN (V) MINIMUM VIN (V) 0 0.5 1.0 1.5
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OUTPUT CURRENT (A)
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MINIMUM VIN (V) 0 0.5 1.0 1.5 2.0 OUTPUT CURRENT (A) RUNNING TO START , RUN CONTROL TO START , RUN = V IN
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MINIMUM VIN (V) 0 0.5 1.0 1.5 2.0 OUTPUT CURRENT (A) RUNNING TO START , RUN CONTROL TO START , RUN = V IN
8050 G36
MINIMUM VIN (V) 0 0.5 1.0 1.5 2.0 OUTPUT CURRENT (A) RUNNING TO START , RUN CONTROL TO START , RUN = V IN
For more information www.linear .com/L TM8050 Operating conditions are per T able 1 and TA = 25°C, unless otherwise noted. TEMPERATURE RISE (°C) 0 0.5 1.0 1.5 2.0
8050 G40
OUTPUT CURRENT (A) TYPICAL PERFORMANCE CHARACTERISTICS Minimum VIN vs Output Current –12VOUT, BIAS = GND Minimum VIN vs Output Current –18VOUT, BIAS = GND Minimum VIN vs Output Current –24VOUT, BIAS = GND Internal Temperature Rise vs Output Current, 2.5VOUT Internal Temperature Rise vs Output Current, 3.3V OUT Internal Temperature Rise vs Output Current, 5V OUT
8050 G37
MINIMUM VIN (V) 0 0.5 1.0 1.5 OUTPUT CURRENT (A) RUNNING TO START , RUN CONTROL TO START , RUN = V IN
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MINIMUM VIN (V) 0 0.25 0.50 0.75 OUTPUT CURRENT (A) RUNNING TO START , RUN CONTROL TO START , RUN = V IN
8050 G39
MINIMUM VIN (V) OUTPUT CURRENT (A) RUNNING TO START , RUN CONTROL TO START , RUN = V IN TEMPERATURE RISE (°C) 0 0.5 1.0 1.5 2.0
8050 G41
OUTPUT CURRENT (A) 12VIN 24VIN 36VIN 48VIN TEMPERATURE RISE (°C) 0 0.5 1.0 1.5 2.0
8050 G42
OUTPUT CURRENT (A) 12VIN 24VIN 36VIN 48VIN
For more information www.linear .com/L TM8050 Operating conditions are per T able 1 and TA = 25°C, unless otherwise noted. TYPICAL PERFORMANCE CHARACTERISTICS Internal Temperature Rise vs Output Current, 24VOUT Soft-Start Waveform for Various C SS Values 1A Resistive Load, DC1723A Demo Board Output Ripple at 2A Load, Standard DC1723A Demo Board TEMPERATURE RISE (°C) 0 0.5 1.0 1.5
8050 G46
OUTPUT CURRENT (A) 36VIN 48VIN 58VIN Internal Temperature Rise vs Output Current, 8VOUT Internal Temperature Rise vs Output Current, 12V OUT Internal Temperature Rise vs Output Current, 18V OUT TEMPERATURE RISE (°C) 0 0.5 1.0 1.5 2.0
8050 G43
OUTPUT CURRENT (A) 12VIN 24VIN 36VIN 48VIN TEMPERATURE RISE (°C) 0 0.5 1.0 1.5 2.0
8050 G44
OUTPUT CURRENT (A) 24VIN 36VIN 48VIN TEMPERATURE RISE (°C) 0 0.5 1.0 1.5
8050 G45
OUTPUT CURRENT (A) 24VIN 36VIN 48VIN 1V/DIV
8050 G47
200µs/DIV CSS = 0µF CSS = 0.1µF CSS = 0.47µF RSS = 100k 10mV/DIV
8050 G48
1µs/DIV FREE RUNNING (400kHz) 600kHz SYNC 800kHz SYNC REFER TO DC1723A DEMO MANUAL FOR PROPER RIPPLE MEASUREMENT TECHNIQUE
For more information www.linear .com/L TM8050 PIN FUNCTIONS VOUT (Bank 1): Power Output Pins. Apply the output filter capacitor and the output load between these pins and GND pins. GND (Bank 2): Tie these GND pins to a local ground plane below the LTM8050 and the circuit components. In most applications, the bulk of the heat flow out of the LTM8050 is through these pads, so the printed circuit design has a large impact on the thermal performance of the part. See the PCB Layout and Thermal Considerations sections for more details. Return the feedback divider (RFB) to this net. VIN (Bank 3): The VIN pin supplies current to the LTM8050’s internal regulator and to the internal power switch. This pin must be locally bypassed with an external, low ESR capacitor; see Table 1 for recommended values. AUX (Pin G5): Low Current Voltage Source for BIAS. In many designs, the BIAS pin is simply connected to V OUT. The AUX pin is internally connected to VOUT and is placed adjacent to the BIAS pin to ease printed circuit board rout- ing. Although this pin is internally connected to V OUT, it is not intended to deliver a high current, so do not draw current from this pin to the load. If this pin is not tied to BIAS, leave it floating. BIAS (Pin H5): The BIAS pin connects to the internal power bus. Connect to a power source greater than 2.8V and less than 25V. If the output is greater than 2.8V, connect this pin there. If the output voltage is less, connect this to a voltage source between 2.8V and 25V. Also, make sure that BIAS + VIN is less than 72V. RUN/SS (Pin L5): Pull the RUN/SS pin below 0.2V to shut down the LTM8050. Tie to 2.5V or more for normal operation. If the shutdown feature is not used, tie this pin to the VIN pin. RUN/SS also provides a soft-start function; see the Applications Information section. SYNC (Pin L6): This is the external clock synchronization input. Ground this pin for low ripple Burst Mode operation at low output loads. Tie to a stable voltage source greater than 0.7V to disable Burst Mode operation. Do not leave this pin floating. Tie to a clock source for synchroniza - tion. Clock edges should have rise and fall times faster than 1μs. See the Synchronization section in Applications Information. RT (Pin G7): The RT pin is used to program the switching frequency of the LTM8050 by connecting a resistor from this pin to ground. Table 2 gives the resistor values that correspond to the resultant switching frequency. Minimize the capacitance at this pin. SHARE (Pin H7): Tie this to the SHARE pin of another LTM8050 when paralleling the outputs. Otherwise, do not connect. PGOOD (Pin J7): The PGOOD pin is the open-collector output of an internal comparator. PGOOD remains low until the FB pin is within 10% of the final regulation voltage. PGOOD output is valid when V IN is above 3.6V and RUN/SS is high. If this function is not used, leave this pin floating. FB (Pin K7): The LTM8050 regulates its FB pin to 0.79V. Connect the adjust resistor from this pin to ground. The value of RFB is given by the equation RFB = 394.21/(VOUT – 0.79), where RFB is in kΩ. PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULL Y.
For more information www.linear .com/L TM8050 BLOCK DIAGRAM OPERATION The LTM8050 is a standalone nonisolated step-down switching DC/DC power supply that can deliver up to 2A of output current. This module provides a precisely regulated output voltage programmable via one external resistor from 0.8V to 24V. The input voltage range is 3.6V to 58V. Given that the LTM8050 is a step-down converter, make sure that the input voltage is high enough to support the desired output voltage and load current. As shown in the Block Diagram, the LTM8050 contains a current mode controller, power switching element, power inductor, power Schottky diode and a modest amount of input and output capacitance. The LTM8050 is a fixed frequency PWM regulator. The switching frequency is set by simply connecting the appropriate resistor value from the RT pin to GND. An internal regulator provides power to the control circuitry. The bias regulator normally draws power from the V IN pin, but if the BIAS pin is connected to an external volt- age higher than 2.8V, bias power will be drawn from the external source (typically the regulated output voltage). This improves efficiency. The RUN/SS pin is used to place the LTM8050 in shutdown, disconnecting the output and reducing the input current to less than 1μA. To further optimize efficiency, the LTM8050 automatically switches to Burst Mode® operation in light load situations. Between bursts, all circuitry associated with controlling the output switch is shut down reducing the input supply current to 50μA in a typical application. The oscillator reduces the LTM8050’s operating frequency when the voltage at the FB pin is low. This frequency fold- back helps to control the output current during start-up and overload. The LTM8050 contains a power good comparator which trips when the FB pin is at roughly 90% of its regulated value. The PGOOD output is an open-collector transistor that is off when the output is in regulation, allowing an external resistor to pull the PGOOD pin high. Power good is valid when the LTM8050 is enabled and VIN is above 3.6V. The LTM8050 is equipped with a thermal shutdown that will inhibit power switching at high junction tempera- tures. The activation threshold of this function, however, is above 125°C to avoid interfering with normal operation. Thus, prolonged or repetitive operation under a condition in which the thermal shutdown activates may damage or impair the reliability of the device. 8050 BD VIN 8.2µH 4.4µF0.2µF CURRENT MODE CONTROLLER RUN/SS SHARE SYNC AUX BIAS GND RT FBPGOOD VOUT 15pF 499k
For more information www.linear .com/L TM8050 APPLICATIONS INFORMATION For most applications, the design process is straight forward, summarized as follows: 1. Look at Table 1 and find the row that has the desired input range and output voltage. 2. Apply the recommended CIN, COUT, RFB and RT values. 3. Connect BIAS as indicated. While these component combinations have been tested for proper operation, it is incumbent upon the user to verify proper operation over the intended system’s line, load and environmental conditions. Bear in mind that the maximum output current is limited by junction tempera- ture, the relationship between the input and output voltage magnitude and polarity and other factors. Please refer to the graphs in the Typical Performance Characteristics section for guidance. The maximum frequency (and attendant R T value) at which the LTM8050 should be allowed to switch is given in Table 1 in the f MAX column, while the recommended frequency (and RT value) for optimal efficiency over the given input condition is given in the f OPTIMAL column. There are additional conditions that must be satisfied if the synchronization function is used. Please refer to the Synchronization section for details. Capacitor Selection Considerations The C IN and C OUT capacitor values in Table 1 are the minimum recommended values for the associated oper- ating conditions. Applying capacitor values below those indicated in Table 1 is not recommended, and may result in undesirable operation. Using larger values is generally acceptable, and can yield improved dynamic response, if it is necessary. Again, it is incumbent upon the user to verify proper operation over the intended system’s line, load and environmental conditions. Ceramic capacitors are small, robust and have very low ESR. However, not all ceramic capacitors are suitable. X5R and X7R types are stable over temperature and ap - plied voltage and give dependable service. Other types, including Y5V and Z5U have very large temperature and voltage coefficients of capacitance. In an application cir- cuit they may have only a small fraction of their nominal capacitance resulting in much higher output voltage ripple than expected. Ceramic capacitors are also piezoelectric. In Burst Mode operation, the LTM8050’s switching frequency depends on the load current, and can excite a ceramic capacitor at audio frequencies, generating audible noise. Since the LTM8050 operates at a lower current limit during Burst Mode operation, the noise is typically very quiet to a casual ear. If this audible noise is unacceptable, use a high perfor- mance electrolytic capacitor at the output. It may also be a parallel combination of a ceramic capacitor and a low cost electrolytic capacitor. A final precaution regarding ceramic capacitors concerns the maximum input voltage rating of the LTM8050. A ceramic input capacitor combined with trace or cable inductance forms a high Q (under damped) tank circuit. If the LTM8050 circuit is plugged into a live supply, the input voltage can ring to twice its nominal value, possi - bly exceeding the device’s rating. This situation is easily avoided; see the Hot-Plugging Safely section. Frequency Selection The LTM8050 uses a constant frequency PWM architec- ture that can be programmed to switch from 100kHz to 2.4MHz by using a resistor tied from the RT pin to ground. Table 2 provides a list of RT resistor values and their re- sultant frequencies.
For more information www.linear .com/L TM8050 APPLICATIONS INFORMATION Table 1: Recommended Component Values and Configuration (TA = 25°C) VIN RANGE V OUT VBIAS CIN COUT RFB fOPTIMAL RT(OPTIMAL) fMAX RT(MIN) 3.6V to 58V 0.8V 2.8V to 25V 3× 4.7µF, 2220, 100V 3× 220µF, 1206, 4V Open 110kHz 392k 125kHz 340k 3.6V to 58V 1V 2.8V to 25V 3× 4.7µF, 2220, 100V 3× 220µF, 1206, 4V 1.87M 110kHz 392k 125kHz 340k 3.6V to 58V 1.2V 2.8V to 25V 2× 4.7µF, 2220, 100V 3× 220µF, 1206, 4V 953k 125kHz 340k 150kHz 280k 3.6V to 58V 1.5V 2.8V to 25V 2× 4.7µF, 2220, 100V 2× 220µF, 1206, 4V 549k 150kHz 280k 180kHz 232k 3.6V to 58V 1.8V 2.8V to 25V 2× 4.7µF, 2220, 100V 2× 220µF, 1206, 4V 383k 180kHz 232k 215kHz 191k 4.1V to 58V 2.5V 2.8V to 25V 4.7µF, 2220, 100V 220µF, 1206, 4V 226k 230kHz 174k 270kHz 150k 5.3V to 58V 3.3V AUX 4.7µF, 2220, 100V 220µF, 1206, 4V 154k 280kHz 140k 330kHz 118k 17V to 58V 12V AUX 4.7µF, 2220, 100V 22µF, 1210, 16V 34.8k 600kHz 57.6k 750kHz 44.2k 34V to 58V 24 V 9V to 24V 0.8V V IN 4.7µF, 1206, 25V 2× 220µF, 1206, 4V Open 150kHz 280k 300kHz 130k 9V to 24V 1V V IN 4.7µF, 1206, 25V 2× 220µF, 1206, 4V 1.87M 180kHz 232k 345kHz 113k 9V to 24V 1.2V V IN 4.7µF, 1206, 25V 2× 220µF, 1206, 4V 953k 230kHz 174k 400kHz 93.1k 9V to 24V 1.5V V IN 4.7µF, 1206, 25V 220µF, 1206, 4V 549k 280kHz 140k 460kHz 80.6k 9V to 24V 1.8V V IN 4.7µF, 1206, 25V 220µF, 1206, 4V 383k 330kHz 118k 500kHz 73.2k 9V to 24V 2.5V V IN 4.7µF, 1206, 25V 100µF, 1210, 6.3V 226k 345kHz 113k 600kHz 57.6k 9V to 24V 5V AUX 4.7µF, 1206, 25V 47µF, 1210, 10V 93.1k 500kHz 73.2k 700kHz 48.7k 17V to 24V 12V AUX 2.2µF, 1206, 50V 22µF, 1210, 16V 34.8k 760kHz 42.2k 850kHz 36.5k 18V to 36V 0.8V 2.8V to 25V 1µF, 1206, 50V 3× 220µF, 1206, 4V Open 100kHz 432k 200kHz 205k 18V to 36V 1V 2.8V to 25V 1µF, 1206, 50V 3× 220µF, 1206, 4V 1.87M 120kHz 357k 250kHz 162k 18V to 36V 1.2V 2.8V to 25V 1µF, 1206, 50V 2× 220µF, 1206, 4V 953k 140 kHz 301k 270kHz 150k 18V to 36V 1.5V 2.8V to 25V 1µF, 1206, 50V 2× 220µF, 1206, 4V 549k 180kHz 232k 300kHz 130k 18V to 36V 1.8V 2.8V to 25V 1µF, 1206, 50V 220µF, 1206, 4V 383k 220kHz 187k 350kHz 110k 18V to 36V 2.5V 2.8V to 25V 1µF, 1206, 50V 100µF, 1210, 6.3V 226k 300kHz 130k 425kHz 88.7k 18V to 36V 3.3V AUX 1µF, 1206, 50V 100µF, 1210, 6.3V 154k 345kHz 113k 550kHz 64.9k 18V to 36V 5V AUX 1µF, 1206, 50V 47µF, 1210, 10V 93.1k 425kHz 88.7k 800kHz 38.3k 18V to 58V 0.8V 2.8V to 25V 1µF, 1206, 100V 3× 220µF, 1206, 4V Open 100kHz 432k 125kHz 340k 18V to 58V 1V 2.8V to 25V 1µF, 1206, 100V 3× 220µF, 1206, 4V 1.87M 100kHz 432k 125kHz 340k 18V to 58V 1.2V 2.8V to 25V 1µF, 1206, 100V 3× 220µF, 1206, 4V 953k 100kHz 432k 150kHz 280k 18V to 58V 1.5V 2.8V to 25V 1µF, 1206, 100V 2× 220µF, 1206, 4V 549k 110kHz 392k 180kHz 232k 18V to 58V 1.8V 2.8V to 25V 1µF, 1206, 100 V 2× 220µF, 1206, 4V 383k 125kHz 340k 215kHz 191k 18V to 58V 2.5V 2.8V to 25V 1µF, 1206, 100V 220µF, 1206, 4V 226k 180kHz 232k 270kHz 150k 18V to 58V 3.3V AUX 1µF, 1206, 100V 100µF, 1210, 6.3V 154k 280kHz 140k 330kHz 118k 18V to 58V 5V AUX 1µF, 1206, 100V 100µF, 1210, 6.3V 93.1k 400kHz 93.1k 460kHz 80.6k 18V to 58V 8V AUX 2.2µF, 1206, 100V 47µF, 1210, 10V 54.9k 550kHz 64.9k 690kHz 49.9k 18V to 58V 12V AUX 2.2µF, 1206, 100V 22µF, 1210, 16V 34.8k 600kHz 57.6k 960kHz 30.1k Note: Do not allow V IN + BIAS to exceed 72V.
Table 2. Switching Frequency vs RT Value too much output ripple or too large of an output capacitor. power switching stage and operate other internal circuitry. apply a decoupling capacitor locally to the pin. reduced, resulting in higher efficiency. Burst Mode operation is enabled by tying SYNC to GND. voltage above 0.7V. Do not leave the SYNC pin floating.
Figure 1. Apply an RC Network to RUN/SS to Control the IN, it takes 5.5VIN to start. Typical Performance Characteristics section. the Typical Performance Characteristics section. potentially large output capacitance of the load. to maintain regulation instead. be held high when the input to the LTM8050 is absent. against a shorted or reversed input. function of how far the output is below the target voltage.
Figure 2. The Input Diode Prevents a Shorted Input from heat sinking are acceptable. and GND connection of the LTM8050. VOUT and GND connection of the LTM8050. their proximity to internal power handling components. thermal vias than a board that uses larger holes.
8050 F02
8050 F03
Figure 3. Layout Showing Suggested External Components, GND
Figure 4. In Negative Output Voltage Applications, Prevent Adverse Effects from Fast Rising VIN by Adding Clamp and Rectifying Diodes voltages or even damage the LTM8050. parallel Schottky diode may be used to clamp the voltage. BIAS and its voltage source. system’s line, load and environmental operating conditions. and Using Electronic Package Thermal Information). many designers use FEA to predict thermal performance.
8050 F04
For more information www.linear .com/L TM8050 APPLICATIONS INFORMATION still air although natural convection causes the air to move. This value is determined with the part mounted to a JESD 51-9 defined test board, which does not reflect an actual application or viable operating condition. θJCbottom is the thermal resistance between the junction and bottom of the package with all of the component power dissipation flowing through the bottom of the package. In the typical µModule converter, the bulk of the heat flows out the bottom of the package, but there is always heat flow out into the ambient environment. As a result, this thermal resistance value may be useful for comparing packages but the test conditions don’t generally match the user’s application. θJCtop is determined with nearly all of the component power dissipation flowing through the top of the package. As the electrical connections of the typical µModule converter are on the bottom of the package, it is rare for an application to operate such that most of the heat flows from the junc- tion to the top of the part. As in the case of θJCbottom, this value may be useful for comparing packages but the test conditions don’t generally match the user’s application. θJB is the junction-to-board thermal resistance where almost all of the heat flows through the bottom of the µModule converter and into the board, and is really the sum of the θJCbottom and the thermal resistance of the bottom of the part through the solder joints and through a portion of the board. The board temperature is measured a specified distance from the package, using a two sided, two layer board. This board is described in JESD 51-9. Given these definitions, it should now be apparent that none of these thermal coefficients reflects an actual physical operating condition of a µModule converter. Thus, none of them can be individually used to accurately predict the thermal performance of the product. Likewise, it would be inappropriate to attempt to use any one coefficient to correlate to the junction temperature vs load graphs given in the product’s data sheet. The only appropriate way to use the coefficients is when running a detailed thermal analysis, such as FEA, which considers all of the thermal resistances simultaneously. A graphical representation of these thermal resistances follows: The blue resistances are contained within the µModule converter, and the green are outside. The die temperature of the LTM8050 must be lower than the maximum rating of 125°C, so care should be taken in the layout of the circuit to ensure good heat sinking of the LTM8050. The bulk of the heat flow out of the LTM8050 is through the bottom of the μModule converter and the LGA pads into the printed circuit board. Consequently a poor printed circuit board design can cause excessive heating, resulting in impaired performance or reliability. Please refer to the PCB Layout section for printed circuit board design suggestions. µMODULE DEVICE JUNCTION-TO-CASE (TOP) RESISTANCE JUNCTION-TO-BOARD RESISTANCE JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD) CASE (TOP)-TO-AMBIENT RESISTANCE BOARD-TO-AMBIENT RESISTANCE JUNCTION-TO-CASE (BOTTOM) RESISTANCE JUNCTION At CASE (BOTTOM)-TO-BOARD RESISTANCE
For more information www.linear .com/L TM8050 TYPICAL APPLICATIONS 1.8V Step-Down Converter VIN RUN/SS SHARE RT FB VOUT GND
8050 TA02
3.6V TO 58V VOUT 1.8V AT 2A 232k f = 180kHz 383k 10µF 440µF PGOOD SYNC AUX BIAS3.3V 2.5V Step-Down Converter VIN RUN/SS SHARE RT FB V OUT GND
8050 TA03
VIN* 4.1V TO 58V VOUT 2.5V AT 2A 174k f = 230kHz 226k 4.7µF PGOOD SYNC AUX BIAS3.3V *RUNNING VOL TAGE RANGE. PLEASE REFER TO APPLICATIONS INFORMATION SECTION FOR START-UP DETAILS 220µF 8V Step-Down Converter VIN RUN/SS SHARE RT FB V OUT GND
8050 TA04
VIN* 11V TO 58V VOUT 8V AT 2A 64.9k f = 550kHz 54.9k 4.7µF 47µF PGOOD SYNC AUX BIAS *RUNNING VOL TAGE RANGE. PLEASE REFER TO APPLICATIONS INFORMATION SECTION FOR START-UP DETAILS –5V Negative Output Converter VIN RUN/SS SHARE RT FB V OUT GND
8050 TA05
–5V 93.1k f = 400kHz 93.1k 4.7µF 47µF PGOOD SYNC AUX BIAS Minimum VIN vs Output Current –5VOUT, BIAS = GND
8050 TA05b
MINIMUM VIN (V) 0 0.5 1.0 1.5 2.0 OUTPUT CURRENT (A) RUNNING TO START , RUN CONTROL TO START , RUN = V IN
For more information www.linear .com/L TM8050 TYPICAL APPLICATIONS Tw o LTM8050s in Parallel, 2.5V at 3.8A VIN RUN/SS SHARE RT FB VOUT GND L TM8050 VIN* 4.1V TO 58V VOUT 2.5V AT 3.8A 174k 230kHz 113k PGOOD SYNC AUX BIAS VIN RUN/SS SHARE RT FB V OUT GND
8050 TA06
10µF 10µF 300µF PGOOD SYNC AUX BIAS *RUNNING VOL TAGE RANGE. PLEASE REFER TO APPLICATIONS INFORMATION SECTION FOR START-UP DETAILS NOTE: SYNCHRONIZE THE TWO MODULES TO AVOID BEAT FREQUENCIES, IF NECESSARY. OTHERWISE, TIE EACH SYNC TO GND 3.3V Step-Down Converter VIN RUN/SS SHARE RT FB VOUT GND
8050 TA07
VIN* 5.3V TO 58V VOUT 3.3V AT 2A 140k f = 280kHz 154k 4.7µF 220µF PGOOD SYNC AUX BIAS *RUNNING VOL TAGE RANGE. PLEASE REFER TO APPLICATIONS INFORMATION SECTION FOR START-UP DETAILS
For more information www.linear .com/L TM8050 Pin Assignment Table (Arranged by Pin Number) PIN NAME PIN NAME PIN NAME PIN NAME PIN NAME PIN NAME A1 VOUT B1 VOUT C1 VOUT D1 VOUT E1 GND F1 GND A2 VOUT B2 VOUT C2 VOUT D2 VOUT E2 GND F2 GND A3 VOUT B3 VOUT C3 VOUT D3 VOUT E3 GND F3 GND A4 VOUT B4 VOUT C4 VOUT D4 VOUT E4 GND F4 GND A5 GND B5 GND C5 GND D5 GND E5 GND F5 GND A6 GND B6 GND C6 GND D6 GND E6 GND F6 GND A7 GND B7 GND C7 GND D7 GND E7 GND F7 GND PIN NAME PIN NAME PIN NAME PIN NAME PIN NAME G1 GND H1 - J1 VIN K1 VIN L1 VIN G2 GND H2 - J2 VIN K2 VIN L2 VIN G3 GND H3 - J3 VIN K3 VIN L3 VIN G4 GND H4 - J 4 - K 4 - L 4 - G5 AUX H5 BIAS J5 GND K5 GND L5 RUN/SS G6 GND H6 GND J6 GND K6 GND L6 SYNC G7 RT H7 SHARE J7 PGOOD K7 FB L7 GND PACKAGE DESCRIPTION PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULL Y.
For more information www.linear .com/L TM8050 Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. 70-Lead (15mm × 9mm × 4.92mm) (Reference LTC DWG# 05-08-1918 Rev A) NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS BALL DESIGNATION PER JESD MS-028 AND JEP95 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE DETAIL A Øb (70 PLACES) DETAIL B SUBSTRATE A ccc Z DETAIL B PACKAGE SIDE VIEW MOLD CAP Z M X Y Z ddd M Z eee SYMBOL A b D E e F G aaa bbb ccc ddd eee MIN 4.72 0.50 4.22 0.60 0.60 0.27 3.95 NOM 4.92 0.60 4.32 0.75 0.63 15.00 9.00 1.27 12.70 7.62 0.32 4.00 MAX 5.12 0.70 4.42 0.90 0.66 0.37 4.05 0.15 0.10 0.20 0.30 0.15 NOTES DIMENSIONS TOTAL NUMBER OF BALLS: 70 // bbb Z Z BGA 70 1212 REV A SUGGESTED PCB LAYOUT TOP VIEW 0.000 2.540 3.810 5.080 6.350 1.270 3.810 2.540 1.270 5.080 6.350 3.810 2.540 1.270 3.810 2.540 1.270 0.3175 0.3175 0.000 0.630 ±0.025 Ø 70x PACKAGE TOP VIEW PIN “A1” CORNER Y X aaa Z aaa Z D E DETAIL A PACKAGE BOTTOM VIEW SEE NOTES A B C D E F G H J K L PIN 1 e b F G 7 6 5 4 3 2 1 TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION COMPONENT PIN “A1” L TMXXXXXX µModule
7 PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULL Y SEE NOTES PACKAGE DESCRIPTION Please refer to http://www.linear.com/product/LTM8050#packaging for the most recent package drawings.
For more information www.linear .com/L TM8050
REVISION HISTORY
REV DATE DESCRIPTION PAGE NUMBER A 02/14 Add SnPb BGA package option 1, 2 B 05/14 Add TechClip Video icons Correct Typical Performance Characteristics labels C 10/16 Corrected BIAS voltage from 33V to 3.3V (top of page) 19
For more information www.linear .com/L TM8050 LINEAR TECHNOLOGY CORPORATION 2013 LT
1016 REV C • PRINTED IN USA
Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear .com/L TM8050 PACKAGE PHOTO RELATED PARTS PART NUMBER DESCRIPTION COMMENTS LTM4601/LTM4603 12A and 6A DC/DC µModule Pin Compatible; Remote Sensing; PLL, T racking and Margining, 4.5V ≤ V IN ≤ 28V LTM4604A 4A, Low VIN DC/DC µModule 2.375V ≤ VIN ≤ 5.5V, 0.8V ≤ VOUT ≤ 5V, 9mm × 15mm × 2.3mm LGA Package LTM4606 Low EMI 6A, 28V DC/DC µModule 4.5V ≤ VIN ≤ 28V, 0.6V ≤ VOUT ≤ 5V, 15mm × 15mm × 2.8mm LGA Package LTM8020 200mA, 36V DC/DC µModule 4V ≤ VIN ≤ 36V, 1.25V ≤ VOUT ≤ 5V, 6.25mm × 6.25mm × 2.32mm LGA Package LTM8022/LTM8023 1A and 2A, 36V DC/DC µModule Pin Compatible 3.6V ≤ VIN ≤ 36V, 0.8V ≤ VOUT ≤ 10V, 11.25mm × 9mm × 2.82mm LGA Package LTM8027 60V, 4A DC/DC µModule 4.5V ≤ VIN ≤ 60V; 2.5V ≤ VOUT ≤ 24V, 15mm × 15mm × 4.32mm LGA Package DESIGN RESOURCES SUBJECT DESCRIPTION µModule Design and Manufacturing Resources Design:
- Selector Guides
- Demo Boards and Gerber Files
- Free Simulation Tools Manufacturing:
- Quick Start Guide
- PCB Design, Assembly and Manufacturing Guidelines
- Package and Board Level Reliability µModule Regulator Products Sear ch 1. Sort table of products by parameters and download the result as a spread sheet. 2. Search using the Quick Power Sear ch parametric table. TechClip Videos Quick videos detailing how to bench test electrical and thermal performance of µModule products. Digital Power System Management Linear Technology’s family of digital power supply management ICs are highly integrated solutions that offer essential functions, including power supply monitoring, supervision, margining and sequencing, and feature EEPROM for storing user configurations and fault logging.