LT
Document overview
- Manufacturer or author: Linear Technology Corporation
- PDF pages: 20
Technical content
Rev. CFor more information www.linear .com/L TM2987 TYPICAL APPLICATION FEATURES DESCRIPTION 16-Channel µModule PMBus Power System Manager 16-Channel PMBus Power System Manager Power Supply Accuracy The LT M®2987 is a 16-channel µModule® (micromodule) Power System Manager used to sequence, trim (servo), margin, supervise, manage faults, provide telemetry and create fault logs. PMBus commands support power sup- ply sequencing, precision point-of-load voltage adjustment and margining. DACs use a proprietary soft-connect algo- rithm to minimize supply disturbances. Supervisory func- tions include overvoltage and undervoltage threshold limits for sixteen power supply output channels and two power supply input channels, as well as over and under tempera- ture limits. Programmable fault responses can disable the power supplies with optional retry after a fault is detected. Faults that disable a power supply can automatically trig- ger black box EEPROM storage of fault status and associ- ated telemetry. An internal 16-bit ADC monitors sixteen output voltages, two input voltages, and die temperature. In addition, odd numbered channels can be configured to measure the voltage across a current sense resistor . A programmable watchdog timer monitors microprocessor activity for a stalled condition and resets the microproces- sor if necessary. A single wire bus synchronizes power supplies across multiple L TC Power System Management (PSM) devices. Configuration EEPROM with ECC supports autonomous operation without additional software.
APPLICATIONS
n Sequence, T rim, Margin and Supervise 16 Power Supplies n Manage Faults, Monitor Telemetry and Create Fault Logs n PMBus™ Compliant Command Set n Supported by L TpowerPlay® GUI n Margin or T rim Supplies to Within 0.25% of Target n Fast OV/UV Supervisors Per Channel n Coordinate Sequencing and Fault Management Across Multiple L TC PSM Devices n Automatic Fault Logging to Internal EEPROM n Operate Autonomously without Additional Software n Internal Temperature and Input Voltage Supervisors n Accurate Monitoring of 16 Output Voltages, T wo Input Voltages and Internal Die Temperature n I2C/SMBus Serial Interface n Can Be Powered from 3.3V, or 4.5V to 15V n Programmable Watchdog Timer n Available in 144-Pin 15mm × 15mm BGA Package n Computers and Network Servers n Industrial Test and Measurement n High Reliability Systems n Medical Imaging n Video All other trademarks are the property of their respective owners. Protected by U.S. Patents including 7382303, 7420359 and 7940091. DC IN R20 R10 R30 LOAD V OUT V FB V IN RUN DC/DC CONVERTER V SENSE V DAC V OUT_EN V IN_SNS V PWR V DD33 IBC EN IN OUT 4.5V ≤ V IBUS ≤ 15V FAUL T PWRGD SDA SCL ALERTB CONTROL PMBus INTERFACE NOTE: SOME DETAILS OMITTED FOR CLARITY ONL Y ONE OF 16 CHANNELS SHOWN * L TM2987 MAY ALSO BE POWERED DIRECTL Y FROM AN EXTERNAL 3.3V SUPPL Y L TM2987 V IN_EN
2987 TA01a
ERROR (%) –0.25 NUMBER OF PARTS
2987 TA01b
46 PARTS SOLDERED DOWN
Rev. C For more information www.linear .com/L TM2987 PIN CONFIGURATIONABSOLUTE MAXIMUM RATINGS Supply Voltages: Digital Input/Output Voltages: ALERTB, SDA, SCL, CONTROL0, PWRGD, SHARE_CLK, FAULT B00, FAULTB01, FAULTB10, Analog Voltages: Pull-Up Resistors: Operating Junction Temperature Range: *See OPERATION section of the LTC2977 data sheet for detailed EEPROM derating information for junction temperatures in excess of 105°C. (Notes 1, 2, 3) A B C D E F G H J K L M PIN 1 2 3 4 5 6 7 TOP VIEW BGA PACKAGE 144-LEAD (15mm × 15mm × 3.42mm) 8 9 10 11 12 TJMAX = 125°C, θJA = 25.2°C/W , θJCtop = 15.6°C/W , θJCbottom = 7.1°C/W , θJB = 10.4°C/ W, WEIGHT = 1.6g, VALUES DETERMINED PER JEDEC 51-9, 51-12 ORDER INFORMATION PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE TYPE MSL RATING OPERATING JUNCTION TEMPERATURE RANGEDEVICE FINISH CODE LTM2987CY#PBF SAC305 (RoHS) LTM2987Y e1 BGA 3 0°C to 70°C LTM2987IY#PBF SAC305 (RoHS) LTM2987Y e1 BGA 3 –40°C to 105°C Consult Marketing for parts specified with wider operating temperature ranges. *Device temperature grade is indicated by a label on the shipping container . Pad or ball finish code is per IPC/JEDEC J-STD-609.
- Terminal Finish Part Marking: www.linear .com/leadfree
- Recommended LGA and BGA PCB Assembly and Manufacturing Procedures: www.linear .com/umodule/pcbassembly
- LGA and BGA Package and T ray Drawings: www.linear .com/packaging http://www.linear .com/product/LTM2987#orderinfo
Rev. CFor more information www.linear .com/L TM2987 ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TJ = 25°C. VPWR = VIN_SNS = 12V, VDD33, REFP and REFM pins floating, unless otherwise indicated. (Notes 2, 3) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS Power Supply Characteristics VPWR VPWR Supply Input Operating Range l 4.5 15 V IPWR VPWR Supply Current 4.5V ≤ VPWR ≤ 15V, VDD33 Floating l 10 13 mA IVDD33 VDD33 Supply Current 3.13V ≤ VDD33 ≤ 3.47V, VPWR = VDD33 l 10 13 mA VUVLO_VDD33 VDD33 Undervoltage Lockout VDD33 Ramping Up, VPWR = VDD33 l 2.35 2.55 2.8 V VDD33 Undervoltage Lockout Hysteresis 120 mV VDD33 Supply Input Operating Range VPWR = VDD33 l 3.13 3.47 V Regulator Output Voltage 4.5V ≤ VPWR ≤ 15V l 3.13 3.26 3.47 V Regulator Output Short-Circuit Current VPWR = 4.5V, VDD33 = 0V l 75 90 140 mA Regulator Output Short-Circuit Current VPWR = VDD33 = 3.47V, VDD25 = 0V l 30 55 80 mA tINIT Initialization Time Time from VIN Applied Until the TON_DELAY Timer Starts 42 ms Voltage Reference Characteristics VREF Output Voltage (Note 4) 1.232 V Temperature Coefficient 3 ppm/°C Hysteresis (Note 5) 100 ppm ADC Characteristics VIN_ADC Voltage Sense Input Range Differential Voltage: VIN_ADC = (VSENSEPn – VSENSEMn) l 0 6 V Single-Ended Voltage: VSENSEMn l –0.1 0.1 V Current Sense Input Range (Odd Numbered Channels Only) Single-Ended Voltage: VSENSEPn, VSENSEMn l –0.1 6 V Differential Voltage: VIN_ADC l –170 170 mV N_ADC Voltage Sense Resolution (Uses L16 Format) 0V ≤ VIN_ADC ≤ 6V Mfr_config_adc_hires = 0 122 µV/LSB Current Sense Resolution (Odd Numbered Channels Only) 0mV ≤ |VIN_ADC| < 16mV (Note 6) 32mV ≤ |VIN_ADC| < 63.9mV 63.9mV ≤ |VIN_ADC| < 127.9mV 127.9mV ≤ |VIN_ADC| Mfr_config_adc_hires = 1 15.625 31.25 62.5 125 250 µV/LSB µV/LSB µV/LSB µV/LSB µV/LSB TUE_ADC_ VOLT_SNS Total Unadjusted Error (Note 4) Voltage Sense Mode VIN_ADC ≥ 1V l ±0.25 % of Reading Voltage Sense Mode 0 ≤ VIN_ADC ≤ 1V l ±2.5 mV TUE_ADC_ CURR_SNS Total Unadjusted Error (Note 4) Current Sense Mode, Odd Numbered Channels Only, 20mV ≤ VIN_ADC ≤ 170mV l ±0.7 % of Reading Current Sense Mode, Odd Numbered Channels Only, VIN_ADC ≤ 20mV l ±140 µV VOS_ADC Offset Error Current Sense Mode, Odd Numbered Channels Only l ±35 µV tCONV_ADC Conversion Time Voltage Sense Mode (Note 7) 6.15 ms Current Sense Mode (Note 7) 24.6 ms Temperature Input (Note 7) 24.6 ms
Rev. C For more information www.linear .com/L TM2987 ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TJ = 25°C. VPWR = VIN_SNS = 12V, VDD33, REFP and REFM pins floating, unless otherwise indicated. (Notes 2, 3) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS tUPDATE_ADC Update Time Odd Numbered Channels in Current Sense Mode (Note 7) 160 ms CIN_ADC Input Sampling Capacitance 1 pF fIN_ADC Input Sampling Frequency 62.5 kHz IIN_ADC Input Leakage Current VIN_ADC = 0V, 0V ≤ VCOMMONMODE ≤ 6V, Current Sense Mode l ±0.5 µA Differential Input Current VIN_ADC = 0.17V, Current Sense Mode l 80 250 nA VIN_ADC = 6V, Voltage Sense Mode l 10 15 µA DAC Output Characteristics N_VDACP Resolution 10 Bits VFS_VDACP Full-Scale Output Voltage (Programmable) DAC Code = 0x3FF DAC Polarity = 1 Buffer Gain Setting_0 Buffer Gain Setting_1 l l 1.3 2.5 1.38 2.65 1.44 2.77 V V INL_VDACP Integral Nonlinearity (Note 8) l ±2 LSB DNL_VDACP Differential Nonlinearity (Note 8) l ±2.4 LSB VOS_VDACP Offset Voltage (Note 8) l ±10 mV VDACP Load Regulation (VDACPn – VDACMn) VDACPn = 2.65V, IVDACPn Sourcing = 2mA 100 ppm/mA VDACPn = 0.1V, IVDACPn Sinking = 2mA 100 ppm/mA PSRR (VDACPn – VDACMn) DC: 3.13V ≤ VDD33 ≤ 3.47V, VPWR = VDD33 60 dB 100mV Step in 20ns with 50pF Load 40 dB DC CMRR (VDACPn – VDACMn) –0.1V ≤ VDACMn ≤ 0.1V 60 dB Leakage Current VDACPn Hi-Z, 0V ≤ VDACPn ≤ 6V l ±100 nA Short-Circuit Current Low VDACPn Shorted to GND l –10 –4 mA Short-Circuit Current High VDACPn Shorted to VDD33 l 4 10 mA COUT Output Capacitance VDACPn Hi-Z 10 pF tS_VDACP DAC Output Update Rate Fast Servo Mode 500 µs DAC Soft-Connect Comparator Characteristics VOS_CMP Offset Voltage VDACPn = 0.2V l ±1 ±18 mV VDACPn = 1.3V l ±2 ±26 mV VDACPn = 2.65V l ±3 ±52 mV Voltage Supervisor Characteristics VIN_VS Input Voltage Range (Programmable) VIN_VS = (VSENSEPn – VSENSEMn) Low Resolution Mode High Resolution Mode l l 3.8 V V Single-Ended Voltage: VSENSEMn l –0.1 0.1 V N_VS Voltage Sensing Resolution 0V to 3.8V Range: High Resolution Mode 4 mV/LSB 0V to 6V Range: Low Resolution Mode 8 mV/LSB TUE_VS Total Unadjusted Error 2V ≤ VIN_VS ≤ 6V, Low Resolution Mode l ±1.25 % of Reading 1.5V < VIN_VS ≤ 3.8V, High Resolution Mode l ±1.0 % of Reading 0.8V ≤ VIN_VS ≤ 1.5V, High Resolution Mode l ±1.5 % of Reading tS_VS Update Period 12.21 µs
Rev. CFor more information www.linear .com/L TM2987 ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TJ = 25°C. VPWR = VIN_SNS = 12V, VDD33, REFP and REFM pins floating, unless otherwise indicated. (Notes 2, 3) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VIN_SNS Input Characteristics VVIN_SNS VIN_SNS Input Voltage Range l 0 15 V RVIN_SNS VIN_SNS Input Resistance l 70 90 110 kΩ TUEVIN_SNS VIN_ON, VIN_OFF Threshold Total Unadjusted Error 3V ≤ VVIN_SNS ≤ 8V l ±2.0 % of Reading VVIN_SNS > 8V l ±1.0 % of Reading READ_VIN Total Unadjusted Error 3V ≤ VVIN_SNS ≤ 8V l ±1.5 % of Reading VVIN_SNS > 8V l ±1.0 % of Reading Temperature Sensor Characteristics TUE_TS Total Unadjusted Error ±1 °C VOUT Enable Output (VOUT_EN [3:0]) Characteristics VVOUT_ENn Output High Voltage (Note 9) IVOUT_ENn = –5µA, VDD33 = 3.3V l 10 12.5 14.7 V IVOUT_ENn Output Sourcing Current VVOUT_ENn Pull-Up Enabled, VVOUT_ENn = 1V l –5 –6 –8 µA Output Sinking Current Strong Pull-Down Enabled, VVOUT_ENn = 0.4V l 3 5 8 mA Weak Pull-Down Enabled, VVOUT_ENn = 0.4V l 33 50 60 µA Output Leakage Current Internal Pull-Up Disabled, 0V ≤ VVOUT_ENn ≤ 15V l ±1 µA VOUT Enable Output (VOUT_EN [7:4]) Characteristics IVOUT_ENn Output Sinking Current Strong Pull-Down Enabled, VOUT_ENn = 0.1V l 3 6 9 mA Output Leakage Current 0V ≤ VVOUT_ENn ≤ 6V l ±1 µA VIN Enable Output (VIN_EN) Characteristics VVIN_EN Output High Voltage IVIN_EN = –5µA, VDD33 = 3.3V l 10 12.5 14.7 V IVIN_EN Output Sourcing Current VIN_EN Pull-Up Enabled, VVIN_EN = 1V l –5 –6 –8 µA Output Sinking Current VVIN_EN = 0.4V l 3 5 8 mA Leakage Current Internal Pull-Up Disabled, 0V ≤ VVIN_EN ≤ 15V l ±1 µA EEPROM Characteristics Endurance (Notes 10, 11) 0°C < TJ < 85°C During EEPROM Write Operations l 10,000 Cycles Retention (Notes 10, 11) TJ < 105°C l 20 Years tMASS_WRITE Mass Write Operation Time (Note 12) STORE_USER_ALL, 0°C < TJ < 85°C During EEPROM Write Operations l 440 4100 ms General Purpose Pull-Up Resistors RPU Pull-Up Resistance 10 kΩ Digital Inputs SCL, SDA, CONTROL0, CONTROL1, WDI/RESETB, FAUL TB00, FAUL TB01, FAUL TB10, FAUL TB11, WP VIH High Level Input Voltage l 2.1 V VIL Low Level Input Voltage l 1.5 V VHYST Input Hysteresis 20 mV
Rev. C For more information www.linear .com/L TM2987 ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TJ = 25°C. VPWR = VIN_SNS = 12V, VDD33, REFP and REFM pins floating, unless otherwise indicated. (Notes 2, 3) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS ILEAK Input Leakage Current 0V ≤ VPIN ≤ 5.5V, SDA, SCL, CONTROLn Pins Only l ±2 µA 0V ≤ VPIN ≤ VDD33 + 0.3V, FAUL TBzn, WDI/RESETB, WP Pins Only l ±2 µA tSP Pulse Width of Spike Suppressed FAUL TBzn, CONTROLn Pins Only 10 µs SDA, SCL Pins Only 98 ns tFAULT_MIN Minimum Low Pulse Width for Externally Generated Faults 110 ms tRESETB Pulse Width to Assert Reset VWDI/RESETB ≤ 1.5V l 300 µs tWDI Pulse Width to Reset Watchdog Timer VWDI/RESETB ≤ 1.5V l 0.3 200 µs fWDI Watchdog Interrupt Input Frequency l 1 MHz CIN Digital Input Capacitance 10 pF Digital Input SHARE_CLK VIH High Level Input Voltage l 1.6 V VIL Low Level Input Voltage l 0.8 V fSHARE_CLK_IN Input Frequency Operating Range l 90 110 kHz tLOW Assertion Low Time VSHARE_CLK < 0.8V l 0.825 1.1 µs tRISE Rise Time VSHARE_CLK < 0.8V to VSHARE_CLK > 1.6V l 450 ns ILEAK Input Leakage Current 0V ≤ VSHARE_CLK ≤ VDD33 + 0.3V l ±1 µA CIN Input Capacitance 10 pF Digital Outputs SDA, ALERTB, PWRGD, SHARE_CLK, FAUL TB00, FAUL TB01, FAUL TB10, FAUL TB11 VOL Digital Output Low Voltage ISINK = 3mA l 0.4 V fSHARE_CLK_OUT Output Frequency Operating Range 5.49kΩ Pull-Up to VDD33 l 90 100 110 kHz Digital Inputs ASEL0,ASEL1 VIH Input High Threshold Voltage l VDD33 – 0.5 V VIL Input Low Threshold Voltage l 0.5 V IIH, IIL High, Low Input Current ASEL[1:0] = 0, VDD33 l ±95 µA IHIZ Hi-Z Input Current l ±24 µA CIN Input Capacitance 10 pF Serial Bus Timing Characteristics fSCL Serial Clock Frequency (Note 13) l 10 400 kHz tLOW Serial Clock Low Period (Note 13) l 1.3 µs tHIGH Serial Clock High Period (Note 13) l 0.6 µs tBUF Bus Free Time Between Stop and Start (Note 13) l 1.3 µs tHD,STA Start Condition Hold Time (Note 13) l 600 ns tSU,STA Start Condition Setup Time (Note 13) l 600 ns tSU,STO Stop Condition Setup Time (Note 13) l 600 ns tHD,DAT Data Hold Time (LTM2987 Receiving Data) (Note 13) l 0 ns Data Hold Time (LTM2987 T ransmitting Data) (Note 13) l 300 900 ns
Rev. CFor more information www.linear .com/L TM2987 ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TJ = 25°C. VPWR = VIN_SNS = 12V, VDD33, REFP and REFM pins floating, unless otherwise indicated. (Notes 2, 3) Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating for extended periods may affect device reliability and lifetime. Note 2: All currents into device pins are positive. All currents out of device pins are negative. All voltages are referenced to GND unless otherwise specified. If power is supplied to the chip via the VDD33 pin only, connect VPWR and VDD33 pins together . Note 3: The LTM2987 electrical characteristics apply to each half of the device, unless otherwise noted. The specifications and functions are the same for both Device A pins and Device B pins. Note 4: The ADC total unadjusted error includes all error sources. First, a two-point analog trim is performed to achieve a flat reference voltage (VREF) over temperature. This results in minimal temperature coefficient, but the absolute voltage can still vary. To compensate for this, a high- resolution, drift-free, and noiseless digital trim is applied at the output of the ADC, resulting in a very high accuracy measurement. Note 5: Hysteresis in the output voltage is created by package stress that differs depending on whether the module was previously at a higher or lower temperature. Output voltage is always measured at 25°C, but the module is cycled to 105°C or –40°C before successive measurements. Hysteresis is roughly proportional to the square of the temperature change. Note 6: The current sense resolution is determined by the L11 format and the mV units of the returned value. For example a full scale value of 170mV returns a L11 value of 0xF2A8 = 680 • 2–2 = 170. This is the lowest range that can represent this value without overflowing the L11 mantissa and the resolution for 1LSB in this range is 2–2 mV = 250µV. Each successively lower range improves resolution by cutting the LSB size in half. Note 7: The time between successive ADC conversions (latency of the ADC) for any given channel is given as: 36.9ms + (6.15ms • number of ADC channels configured in Low Resolution mode) + (24.6ms • number of ADC channels configured in High Resolution mode). Note 8: Nonlinearity is defined from the first code that is greater than or equal to the maximum offset specification to full-scale code, 1023. Note 9: Output enable pins are charge pumped from VDD33. Note 10: EEPROM endurance and retention are guaranteed by design, characterization and correlation with statistical process controls. The minimum retention specification applies for devices whose EEPROM has been cycled less than the minimum endurance specification. Note 11: EEPROM endurance and retention will be degraded when TJ > 105°C. Note 12: The LTM2987 will not acknowledge any PMBus commands while a mass write operation is being executed. This includes the STORE_USER_ALL and MFR_FAULT_LOG_STORE commands or a fault log store initiated by a channel faulting off. Note 13: Maximum capacitive load, CB, for SCL and SDA is 400pF. Data and clock rise time (tr) and fall time (tf) are: (20 + 0.1 • CB) (ns) < tr < 300ns and (20 + 0.1 • CB) (ns) < tf < 300ns. CB = capacitance of one bus line in pF . SCL and SDA external pull-up voltage, VIO, is 3.13V < VIO < 5.5V. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS tSU,DAT Data Setup Time (Note 13) l 100 ns tSP Pulse Width of Spike Suppressed (Note 13) 98 ns tTIMEOUT_BUS Time Allowed to Complete any PMBus Command After Which Time SDA Will Be Released and Command Terminated Mfr_config_all_longer_pmbus_timeout = 0 Mfr_config_all_longer_pmbus_timeout = 1 l l 200 280 ms ms Additional Digital Timing Characteristics tOFF_MIN Minimum Off Time for Any Channel 100 ms PMBUS TIMING DIAGRAM SDA SCL tHD(STA) tHD(DAT) tSU(STA) tSU(STO) tSU(DAT) tLOW tHD(STA) tSP tBUF START CONDITION STOP CONDITION REPEATED START CONDITION START CONDITION tr tf trtf tHIGH 2987 TD
Rev. C For more information www.linear .com/L TM2987 TYPICAL PERFORMANCE CHARACTERISTICS ADC Zero Code Center Offset Voltage vs Temperature ADC INL ADC DNL ADC Noise Histogram Voltage Supervisor Total Unadjusted Error vs Temperature Reference Voltage vs Temperature Temperature Sensor Error vs Temperature ADC Total Unadjusted Error vs Temperature TEMPERATURE (°C) REFERENCE OUTPUT VOL TAGE (V) 1.2325 1.2320 1.2315 1.2310 1.2305 1.2300 1.2295 1.2290 1.2285
2987 G01
–50 5010 90 110–30 –10 30 70 TEMPERATURE (°C) –50 –0.25 ERROR (%)–0.05 –0.10 –0.15 –0.20 0.05 0.10 0.15 0.25
2987 G03
0.20 10 90 110–30 –10 30 70 VSENSEP0 = 1.8V THREE TYPICAL PARTS TEMPERATURE (°C) OFFSET (µV) 250 200 150 100 –50 –100 –150 –200 –250
2987 G04
–50 5010 90 110–30 –10 30 70 INPUT VOL TAGE (V) –0.2 ERROR (LSBs) 5.8 3.0 2.5 2.0 1.5 1.0 0.5 –0.5 –1.0 –1.5
2987 G05
122µV/LSB INPUT VOL TAGE (V) –0.2 ERROR (LSBs) 5.8 0.8 0.6 0.4 0.2 –0.2 –0.4 –0.6 –0.8 –1.0
2987 G06
122µV/LSB READ_VOUT (µV) –20 NUMBER OF READINGS 200 400 600 800 1000 1200 –10 0 10 20
2987 G07
VIN = 0V HIGH RESOLUTION MODE TEMPERATURE (°C) SUPERVISOR ERROR (%)
2987 G08
–50 –1.0 –0.2 –0.4 –0.6 –0.8 0.2 0.4 0.6 1.0 0.8 10 90 110–30 –10 30 70 VSENSEP0 = 1.5V HIGH RESOLUTION MODE THREE TYPICAL PARTS Input Sampling Current vs Differential Input Voltage INPUT VOL TAGE (V) INPUT SAMPLING CURRENT (µA)
2987 G09
TEMPERATURE (°C) ERROR (°C) 1.5 1.0 0.5 –0.5 –1.0 –1.5
2987 G02
–50 5010 90 110 130–30 –10 30 70
Rev. CFor more information www.linear .com/L TM2987 TYPICAL PERFORMANCE CHARACTERISTICS Closed-Loop Servo Error DAC Short-Circuit Current vs Temperature DAC Output Impedance vs Frequency DAC T ransient Response to 1LSB DAC Code Change ADC High Resolution Mode Differential Input Current DAC Full-Scale Output Voltage vs Temperature DAC Offset Voltage vs Temperature DIFFERENTIAL INPUT VOL TAGE (mV) DIFFERENTIAL INPUT CURRENT (nA)10 120 140 160
2987 G10
TEMPERATURE (°C) DAC OUTPUT VOLTAGE (V) 2.68 2.67 2.66 2.65 2.64 2.63 2.62 2.61 2.60
2987 G11
–50 5010 90 110–30 –10 30 70 GAIN SETTING = 1 THREE TYPICAL PARTS TEMPERATURE (°C) DAC OUTPUT VOLTAGE (mV) –10
2987 G12
–50 5010 90 110–30 –10 30 70 GAIN SETTING = 1 THREE TYPICAL PARTS 500µV/DIV 2µs/DIV 2987 G16 CODE ‘h1FF CODE ‘h200 10mV/DIV 500µs/DIV 100k SERIES RESISTANCE ON CODE: ‘h1FF
2987 G17
500µs/DIV 100k SERIES RESISTANCE ON CODE: ‘h1FF
2987 G18
DAC Soft-Connect T ransient Response When T ransitioning from ON State to Hi-Z State DAC Soft-Connect T ransient Response When T ransitioning from Hi-Z State to ON State TEMPERATURE (°C) SHORT-CIRCUIT CURRENT (mA)
2987 G13
–50 5010 90 110–30 –10 30 70 GAIN SETTING = 1 THREE TYPICAL PARTS FREQUENCY (kHz) 0.01 OUTPUT IMPEDANCE (/uni03A9) 100 1000 100
2987 G14
0.1 0.01 0.1 1 10 1000 ERROR (%) –0.25 NUMBER OF PARTS
2987 G15
Rev. C For more information www.linear .com/L TM2987 TYPICAL PERFORMANCE CHARACTERISTICS TEMPERATURE (°C) OUTPUT VOL TAGE (V) 3.29 3.28 3.27 3.26 3.25 3.24 3.23 3.22
2987 G19
–50 5010 90 110–30 –10 30 70 THREE TYPICAL PARTS CURRENT SOURCING (mA) 3.10 OUTPUT VOL TAGE (V) 3.12 3.16 3.18 3.20 3.28
2987 G20
3.14 4020 10060 120 3.22 3.24 3.26 –40°C 105°C 25°C SUPPLY VOLTAGE (V) SUPPLY CURRENT (mA) 10 14
2987 G21
8.96 8.98 6 8 12 9.24 9.22 9.20 9.18 9.16 9.14 9.12 9.10 9.08 9.06 9.04 9.02 9.00 TEMPERATURE = 33°C THREE TYPICAL PARTS TEMPERATURE (°C) 8.8 SUPPLY CURRENT (mA) 8.9 9.1 9.2 9.3 9.6
2987 G22
9.0 9.4 9.5 VPWR = 15V –50 5010 90 110–30 –10 30 70 CURRENT SOURCING (µA) 9.5 OUTUPT HIGH VOL TAGE (V) 10.0 11.0 11.5 12.0 14.0
2987 G23
10.5 21 5 63 7 12.5 13.0 13.5 105°C 25°C –40°C CURRENT SINKING (mA) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 6 10
2987 G24
VOL (V) 105°C 25°C –40°C CURRENT SINKING (mA) VOL (V) 0.1 0.2 0.3 0.4 0.6 4 8 12 16
2987 G25
0.5 105°C 25°C –40°C V DD33 V OUT_ENn WITH 10k PULL–UP TO V DD33 V OUT_EN[7:4] V OUT_EN[3:0] V DD33 VOL TAGE (V) 0.5 1.5 0.2 0.4 0.6 0.8 1.0 V OUT_ENn VOL TAGE (V)
2977 G26
VDD33 Regulator Output Voltage vs Temperature VDD33 Regulator Load Regulation VOUT_EN[3:0] and VIN_EN Output High Voltage vs Current Supply Current vs Supply Voltage (1/2 LTM2987) Supply Current vs Temperature (1/2 LTM2987) VOUT_EN[7:4] VOL vs Current VOUT_EN[7:0] Output Voltage vs VDD33 VOUT_EN[3:0] and VIN_EN Output VOL vs Current
Rev. CFor more information www.linear .com/L TM2987 PIN FUNCTIONS PIN NAME PIN PIN TYPE DESCRIPTION Device A Device B VSENSEP0 F7* M7* In DC/DC Converter Differential (+) Output Voltage-0 Sensing Pin VSENSEM0 F6* M6* In DC/DC Converter Differential (–) Output Voltage-0 Sensing Pin VSENSEP1 F12* M12* In DC/DC Converter Differential (+) Output Voltage or Current-1 Sensing Pins. VSENSEM1 F11* M11* In DC/DC Converter Differential (–) Output Voltage or Current-1 Sensing Pins. VSENSEP2 E12* L12* In DC/DC Converter Differential (+) Output Voltage-2 Sensing Pin VSENSEM2 E11* L11* In DC/DC Converter Differential (–) Output Voltage-2 Sensing Pin VSENSEP3 D12* K12* In DC/DC Converter Differential (+) Output Voltage or Current-3 Sensing Pins. VSENSEM3 D11* K11* In DC/DC Converter Differential (–) Output Voltage or Current-3 Sensing Pins. VSENSEP4 C12* J12* In DC/DC Converter Differential (+) Output Voltage-4 Sensing Pin VSENSEM4 C11* J11* In DC/DC Converter Differential (–) Output Voltage-4 Sensing Pin VSENSEP5 B12* H12* In DC/DC Converter Differential (+) Output Voltage or Current-5 Sensing Pins. VSENSEM5 B11* H11* In DC/DC Converter Differential (–) Output Voltage or Current-5 Sensing Pins. VSENSEP6 A12* G12* In DC/DC Converter Differential (+) Output Voltage-6 Sensing Pin VSENSEM6 A11* G11* In DC/DC Converter Differential (–) Output Voltage-6 Sensing Pin VSENSEP7 A7* G7* In DC/DC Converter Differential (+) Output Voltage or Current-7 Sensing Pin VSENSEM7 A6* G6* In DC/DC Converter Differential (–) Output Voltage or Current-7 Sensing Pin VOUT_EN0 D7 K7 Out DC/DC Converter Enable-0 Pin. Output High Voltage Optionally Pulled Up to 12V by 5µA VOUT_EN1 F8 M8 Out DC/DC Converter Enable-1 Pin. Output High Voltage Optionally Pulled Up to 12V by 5µA VOUT_EN2 E8 L8 Out DC/DC Converter Enable-2 Pin. Output High Voltage Optionally Pulled Up to 12V by 5µA VOUT_EN3 D8 K8 Out DC/DC Converter Enable-3 Pin. Output High Voltage Optionally Pulled Up to 12V by 5µA VOUT_EN4 C8 J8 Out DC/DC Converter Enable-4 Pin. Open-Drain Pull-Down Output. VOUT_EN5 B8 H8 Out DC/DC Converter Enable-5 Pin. Open-Drain Pull-Down Output. VOUT_EN6 A8 G8 Out DC/DC Converter Enable-6 Pin. Open-Drain Pull-Down Output. VOUT_EN7 C7 J7 Out DC/DC Converter Enable-7 Pin. Open-Drain Pull-Down Output. VIN_EN E5 L5 Out DC/DC Converter VIN ENABLE Pin. Output High Voltage Optionally Pulled Up to 12V by 5µA VIN_SNS A5 G5 In VIN SENSE Input. This Voltage is Compared Against the VIN On and Off Voltage Thresholds in Order to Determine When to Enable and Disable, Respectively, the Downstream DC/DC Converters VPWR B5 H5 In VPWR Serves as the Unregulated Power Supply Input to the Chip (4.5V to 15V). If a 4.5V to 15V Supply Voltage is Unavailable, Short VPWR to VDD33 and Power the Chip Directly from a 3.3V Supply VDD33 A4 G4 In/Out If Shorted to VPWR, it Serves as 3.13V to 3.47V Supply Input Pin. Otherwise it is a 3.3V Internally Regulated Voltage Output. If using the internal regulator to provide VDD33, do not connect to VDD33 pins of any other devices VDD33 A3 G3 In Input for Internal 2.5V Sub-Regulator . Short Pin A3 to Pin A4 and Pin G3 to Pin G4. If using the internal regulator to provide VDD33, do not connect to VDD33 pins of any other devices VDD25 A2 G2 In/Out 2.5V Internally Regulated Voltage Output. Do not connect to VDD25 pins of any other devices WP A1 G1 In Digital Input. Write-Protect Input Pin, Active High PWRGD B1 H1 Out Power Good Open-Drain Output. Indicates When Outputs are Power Good. Can be Used as System Power-On Reset. The Latency of This Signal May Be as Long as the ADC Latency. See Note 6 SHARE_CLK B2 H2 In/Out Bidirectional Clock Sharing Pin. Connect a 5.49k Pull-Up Resistor to VDD33. Connect to all other SHARE_CLK pins in the system WDI/RESETB B4 H4 In Watchdog Timer Interrupt and Chip Reset Input. Connect a 10k Pull-Up Resistor to VDD33. Rising Edge Resets Watchdog Counter . Holding This Pin Low for More Than tRESETB Resets the Chip FAUL TB00 C3 J3 In/Out Open-Drain Output and Digital Input. Active Low Bidirectional Fault Indicator-00. Connect a 10k Pull-Up Resistor to VDD33 FAUL TB01 D3 K3 In/Out Open-Drain Output and Digital Input. Active Low Bidirectional Fault Indicator-01. Connect a 10k Pull-Up Resistor to VDD33
Rev. C For more information www.linear .com/L TM2987 PIN FUNCTIONS PIN NAME PIN PIN TYPE DESCRIPTION Device A Device B FAUL TB10 C4 J4 In/Out Open-Drain Output and Digital Input. Active Low Bidirectional Fault Indicator-10. Connect a 10k Pull-Up Resistor to VDD33 FAUL TB11 D4 K4 In/Out Open-Drain Output and Digital Input. Active Low Bidirectional Fault Indicator-11. Connect a 10k Pull-Up Resistor to VDD33 SDA C1 J1 In/Out PMBus Bidirectional Serial Data Pin SCL D1 K1 In PMBus Serial Clock Input Pin (400kHz Maximum) ALERTB E2 L2 Out Open-Drain Output. Generates an Interrupt Request in a Fault/Warning Situation CONTROL0 E1 L1 In Control Pin 0 Input CONTROL1 F1 M1 In Control Pin 1 Input ASEL0 F3 M3 In Ternary Address Select Pin 0 Input. Connect to VDD33, GND or Float to Encode 1 of 3 Logic States ASEL1 F2 M2 In Ternary Address Select Pin 1 Input. Connect to VDD33, GND or Float to Encode 1 of 3 Logic States REFP F5 M5 Out Reference Voltage Output REFM F4 M4 Out Reference Return Pin VDACP0 E7 L7 Out DAC0 Output VDACM0 E6* L6* Out DAC0 Return. Connect to Channel 0 DC/DC Converter’s GND Sense or Return to GND VDACP1 F10 M10 Out DAC1 Output VDACM1 F9* M9* Out DAC1 Return. Connect to Channel 1 DC/DC Converter’s GND Sense or Return to GND VDACP2 E10 L10 Out DAC2 Output VDACM2 E9* L9* Out DAC2 Return. Connect to Channel 2 DC/DC Converter’s GND Sense or Return to GND VDACP3 D10 K10 Out DAC3 Output VDACM3 D9* K9* Out DAC3 Return. Connect to Channel 3 DC/DC Converter’s GND Sense or Return to GND VDACP4 C10 J10 Out DAC4 Output VDACM4 C9* J9* Out DAC4 Return. Connect to Channel 4 DC/DC Converter’s GND Sense or Return to GND VDACP5 B10 H10 Out DAC5 Output VDACM5 B9* H9* Out DAC5 Return. Connect to Channel 5 DC/DC Converter’s GND Sense or Return to GND VDACP6 A10 G10 Out DAC6 Output VDACM6 A9* G9* Out DAC6 Return. Connect to Channel 6 DC/DC Converter’s GND Sense or Return to GND VDACP7 B7 H7 Out DAC7 Output VDACM7 B6* H6* Out DAC7 Return. Connect to Channel 7 DC/DC Converter’s GND Sense or Return to GND VPU B3 H3 In Common Connection for Internal Pull-Up Resistors RPU1 E3 L3 Out General Purpose 10k Pull-Up Resistor 1 RPU2 D2 K2 Out General Purpose 10k Pull-Up Resistor 2 RPU3 C2 J2 Out General Purpose 10k Pull-Up Resistor 3 RPU4 E4 L4 Out General Purpose 10k Pull-Up Resistor 4 GND C6, D5, J6, K5, Ground Device A Ground Pins are Isolated from the Device B Ground Pins DNC C5 J5 Do Not Connect Do Not Connect to This Pin *Any unused VSENSEPn or VSENSEMn or VDACMn pins must be tied to GND.
Rev. CFor more information www.linear .com/L TM2987 BLOCK DIAGRAM CONTROL0 (E1, L1) CONTROL1 (F1, M1) SHARE_CLK (B2, H2) GNDASEL0 DNC VIN_EN VIN_SNS VPWR GND (C6, J6) DNC (C5, J5) VIN_EN (E5, L5) VIN_SNS (A5, G5) VPWR (B5, H5) GND (D5, K5) GND (D6, K6) VSENSEP0 VSENSEM0 VSENSEP7 VSENSEM7 VSENSEP0 (F7, M7) VSENSEM0 (F6, M6) VDACP0 VDACP0 (E7, L7) VDACM0 VDACM0 (E6, L6) VOUT_EN0 VOUT_EN0 (D7, K7) ASEL0 (F3, M3) VSENSEP1 VSENSEM1 VSENSEP1 (F12, M12) VSENSEM1 (F11, M11) VDACP1 VDACP1 (F10, M10) VDACM1 VDACM1 (F9, M9) VOUT_EN1 VOUT_EN1 (F8, M8) VSENSEP2 VSENSEM2 1/2 L TM2987 (L TC2977)* VSENSEP2 (E12, L12) VSENSEM2 (E11, L11) VDACP2 VDACP2 (E10, L10) VDACM2 VDACM2 (E9, L9) VOUT_EN2 VOUT_EN2 (E8, L8) VSENSEP3 VSENSEM3 VSENSEP3 (D12, K12) VSENSEM3 (D11, K11) VDACP3 VDACP3 (D10, K10) VDACM3 VDACM3 (D9, K9) VOUT_EN3 *NOTES: 1. ONL Y 1/2 OF THE L TM2987 MODULE SHOWN 2. THE TWO 8-CHANNEL L TC2977 HALVES ARE IDENTICAL AND COMPLETEL Y ISOLATED 3. PIN NAMES REFER TO (DEVICE A, DEVICE B) VDACP7 VDACM7 VOUT_EN7 VSENSEP6 VSENSEM6 VDACP6 VDACM6 VOUT_EN6 VSENSEP5 VSENSEM5 VDACP5 VDACM5 VOUT_EN5 VSENSEP4 VSENSEM4 VDACP4 VDACM4 VOUT_EN4 2987 BD VOUT_EN3 (D8, K8) 10k VPU (B3, H3) RPU1 (E3, L3) RPU2 (D2, K2) RPU3 (C2, J2) RPU4 (E4, L4) VSENSEP7 (A7, G7) VDD33 (A4, G4) VDD33 (A3, G3) VDD25 (A2, G2) REFP (F5, M5) REFM (F4, M4) VSENSEM7 (A6, G6) VDACP7 (B7, H7) VDACM7 (B6, H6) VOUT_EN7 (C7, J7) VSENSEP6 (A12, G12) VSENSEM6 (A11, G11) VDACP6 (A10, G10) VDACM6 (A9, G9) VOUT_EN6 (A8, G8) VSENSEP5 (B12, H12) VSENSEM5 (B11, H11) VDACP5 (B10, H10) VDACM5 (B9, H9) VOUT_EN5 (B8, H8) VSENSEP4 (C12, J12) VSENSEM4 (C11, J11) VDACP4 (C10, J10) VDACM4 (C9, J9) VOUT_EN4 (C8, J8) VDD33 VDD33 VDD25 REFP REFM ASEL1 ASEL1 (F2, M2) CONTROL0 CONTROL1 FAUL TB00FAUL TB00 (C3, J3) FAUL TB01FAUL TB01 (D3, K3) FAUL TB10FAUL TB10 (C4, J4) FAUL TB11FAUL TB11 (D4, K4) SCLSCL (D1, K1) SDASDA (C1, J1) ALERTBALERTB (E2, L2) WDIWDI (B4, H4) SHARE_CLK WPWP (A1, G1) PWRGDPWRGD (B1, H1) 10k 10k 10k 100/uni03A9 100/uni03A9 100nF 100nF 100/uni03A9 100/uni03A9 100nF 100nF 100/uni03A9 100/uni03A9 100nF 100nF 100/uni03A9 100/uni03A9 100nF 100nF 100nF 100nF 100nF 100nF 100/uni03A9 100/uni03A9 100nF 100nF 100/uni03A9 100/uni03A9 100nF 100nF 100/uni03A9 100/uni03A9 100nF 100nF 100/uni03A9 100/uni03A9 100nF 100nF
materials and improving PC board routing efficiency. MFR_SPECIAL_ID values for the LTM2987. Table 1. LTM2987 MFR_SPECIAL_ID Values
Figure 3. Undedicated Pull-Up Resistors
2987 F03
pliant interface and command set. between 3.13V and 3.47V. Tie V PWR to the V DD33 pins. Figure 1. Powering LTM2987 Directly from an Intermediate Bus Figure 2. Powering LTM2987 from External 3.3V Supply
2987 F01
2987 F02
has independent voltage regulators.
2987 F04
Figure 4. Connecting Unused Inputs to GND resistors, as shown in Figure 4. n Use appropriate pull-up resistors on all VOUT_ENn pins. VIN_SNS already has an internal calibrated divider . CLK, WDI, ASELn, PWRGD) are not exceeded. and pull up to 3.3V with a 5.49k resistor . connect a capacitor to the WDI/RESETB pin. n Tie WP to either VDD33 or GND. Do not leave floating. Information section of the LTC2977 data sheet. n Select appropriate resistor for desired margin range. pendent, internal regulator . LTM2987 product page: www.linear.com/LTM2987. LTM2987. No additional bypass capacitance is required. power supply noise and ensure proper device operation. recommended for simplest in system programming. Table 1 of the LTC2977 data sheet. bus and any global addresses.
Rev. CFor more information www.linear .com/L TM2987 PACKAGE DESCRIPTION LTM2987 Component BGA Pinout (Top View) 1 2 3 4 5 6 7 8 9 10 11 12 Device A A WP VDD25 VDD33 VDD33 VIN_SNS VSENSEM7 VSENSEP7 VOUT_EN6 VDACM6 VDACP6 VSENSEM6 VSENSEP6 B PWRGD SHARE_CLK VPU WDI VPWR VDACM7 VDACP7 VOUT_EN5 VDACM5 VDACP5 VSENSEM5 VSENSEP5 C SDA RPU3 FAUL TB00 FAUL TB10 DNC GND VOUT_EN7 VOUT_EN4 VDACM4 VDACP4 VSENSEM4 VSENSEP4 D SCL RPU2 FAUL TB01 FAUL TB11 GND GND VOUT_EN0 VOUT_EN3 VDACM3 VDACP3 VSENSEM3 VSENSEP3 E CONTROL0 ALERTB RPU1 RPU4 VIN_EN VDACM0 VDACP0 VOUT_EN2 VDACM2 VDACP2 VSENSEM2 VSENSEP2 F CONTROL1 ASEL1 ASEL0 REFM REFP VSENSEM0 VSENSEP0 VOUT_EN1 VDACM1 VDACP1 VSENSEM1 VSENSEP1 Device B G WP VDD25 VDD33 VDD33 VIN_SNS VSENSEM7 VSENSEP7 VOUT_EN6 VDACM6 VDACP6 VSENSEM6 VSENSEP6 H PWRGD SHARE_CLK VPU WDI VPWR VDACM7 VDACP7 VOUT_EN5 VDACM5 VDACP5 VSENSEM5 VSENSEP5 J SDA RPU3 FAUL TB00 FAUL TB10 DNC GND VOUT_EN7 VOUT_EN4 VDACM4 VDACP4 VSENSEM4 VSENSEP4 K SCL RPU2 FAUL TB01 FAUL TB11 GND GND VOUT_EN0 VOUT_EN3 VDACM3 VDACP3 VSENSEM3 VSENSEP3 L CONTROL0 ALERTB RPU1 RPU4 VIN_EN VDACM0 VDACP0 VOUT_EN2 VDACM2 VDACP2 VSENSEM2 VSENSEP2 M CONTROL1 ASEL1 ASEL0 REFM REFP VSENSEM0 VSENSEP0 VOUT_EN1 VDACM1 VDACP1 VSENSEM1 VSENSEP1
Rev. C For more information www.linear .com/L TM2987 PACKAGE DESCRIPTION Please refer to http://www.linear.com/product/LTM2987#packaging for the most recent package drawings. PIN “A1” CORNER NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS BALL DESIGNATION PER JESD MS-028 AND JEP95 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE PACKAGE TOP VIEW X Y aaa Z aaa Z PACKAGE BOTTOM VIEW SEE NOTES SUGGESTED PCB LAYOUT TOP VIEW BGA 144 1113 REV A L TMXXXXXX µModule TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION COMPONENT PIN “A1” DETAIL A PIN 1 0.0000 0.0000 DETAIL A Øb (144 PLACES) DETAIL B SUBSTRATE 0.27 – 0.37 2.45 – 2.55 // bbb Z D A ccc Z DETAIL B PACKAGE SIDE VIEW MOLD CAP Z M X YZddd M Zeee 0.630 ±0.025 Ø 144x SYMBOL A b D E e F G aaa bbb ccc ddd eee MIN 3.22 0.50 2.72 0.60 0.60 NOM 3.42 0.60 2.82 0.75 0.63 15.0 15.0 1.27 13.97 13.97 MAX 3.62 0.70 2.92 0.90 0.66 0.15 0.10 0.20 0.30 0.15 NOTES DIMENSIONS TOTAL NUMBER OF BALLS: 144 E b e e b F G 144-Lead (15mm × 15mm × 3.42mm) (Reference LTC DWG # 05-08-1946 Rev A) 0.6350 0.6350 1.9050 1.9050 3.1750 3.1750 4.4450 4.4450 5.7150 5.7150 6.9850 6.9850 6.9850 5.7150 5.7150 4.4450 4.4450 3.1750 3.1750 1.9050 1.9050 0.6350 0.6350 6.9850 G F E A B D C H M L K J 2 14 356712 891011
7 PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULL Y SEE NOTES
Rev. CFor more information www.linear .com/L TM2987 Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However , no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
REVISION HISTORY
REV DATE DESCRIPTION PAGE NUMBER A 08/16 Added EEPROM ECC information and updated Typical Application Increased Maximum Solder Temperature from 245°C to 250°C Updated DAC Output Update Rate (tS_VDACP) to 500µs from 250µs Added Note 4 Added graph: VOUT_EN[7:0] Output Voltage vs VDD33 Updated VDD33 and SHARE_CLK pin functions Changed MFR_SPECIAL_ID in Table 1 B 07/22 Update VOS_ADC MAX Update VDAC Full-Scale MIN Specification Remove Temp Dot for DAC INL Specification IVOUT_ENn Output Sinking Current at condition Weak Pull-Down Enabled: minimum spec changed from 33µA to 28µA and typical spec changed from 50µA to 43µA IVOUT_ENn Output Sinking Current at condition Strong Pulldown Enabled, VOUT_ENn = 0.1V: spec updated to typical value only at room temperature C 12/24 Changed tINIT from 30ms to 42ms in the Electrical Characteristics table 3
Figure 5. LTM2987 16-Channel Application Circuit with External 3.3V Chip Power