LTM2889

LTM2889 - Isolated CAN FD µModule Transceiver and Power

Document overview

• Manufacturer or author: Analog Devices, Inc.
• PDF pages: 30

Technical content

2889faFor more information www.linear .com/L TM2889 TYPICAL APPLICATION FEATURES DESCRIPTION Isolated CAN FD µModule Transceiver and Power The LT M®2889 is a complete galvanically-isolated Con- troller Area Network (CAN) µModule ® (micromodule) transceiver. No external components are required – a single supply powers both sides of the interface through an integrated, isolated DC/DC converter. Separate versions are available for 3.3V and 5V power supplies. The dual voltage CAN transceiver and the adjustable regulator allow 3.3V or 5V isolated power with either the 3.3V or 5V version. Coupled inductors and an isolation power transformer provide 2500VRMS of isolation between the line transceiver and the logic interface. This device is ideal for systems where the ground loop is broken, allowing for large common mode voltage ranges. Communication remains uninter - rupted for common mode transients greater than 30kV/μs. Supports up to 4 Mbps CAN with Flexible Data Rate (CAN FD). A logic supply pin allows easy interfacing with different logic levels from 1.62V to 5.5V, independent of the main supply. Enhanced ESD protection allows this part to withstand up to ±25kV Human Body Model (HBM) on the transceiver interface pins and ±10kV HBM across the isolation barrier without latchup or damage. Isolated Powered CAN Transceiver LTM2889 Operating at 1Mbps with 45 kV/µs Common Mode T ransients Across the Isolation Barrier

APPLICATIONS

n Isolated 4Mbps CAN FD Transceiver n 2500VRMS for 1 Minute Per UL1577 n Isolated DC Power: 5V (Adjustable to 3.3V) n Up to 150mA Available Isolated Power Output n 3.3V or 5V Input Supply Voltage Options n UL-CSA Recognized File #E151738 n No External Components Required n High Bus Fault Voltage Tolerance: ±60V n Low Power OFF Mode: <1µA Typical n High Common Mode T ransient Immunity: 30kV/µs n Variable Slew Rate Driver with Active Symmetry Control and SPLIT Pin for Low EME n Fully ISO 11898-2 and CAN FD Compliant n Ideal Passive Behavior to CAN Bus with Supply Off n T ransmit Data (TXD) Dominant Timeout Function n High ESD: ±25kV CANH, CANL to GND2 and VCC2; ±10kV Across Isolation Barrier n Ambient Operation from –40°C to 125°C n Low Profile 15mm × 11.25mm BGA Package n Isolated CAN Bus Interface n Industrial Networks n DeviceNet Applications L, LT, LT C, LT M, Linear Technology, µModule and the Linear logo are registered trademarks of Analog Devices, Inc. All other trademarks are the property of their respective owners.

2889 TA01

1.62V TO 5.5V 3.3V (L TM2889-3) OR 5V (L TM2889-5) *USE OF SPLIT PIN IS OPTIONAL 5V OUTPUT (ADJUSTABLE) AVAILABLE CURRENT : 150mA (L TM2889-5) 100mA (L TM2889-3) RXD TXD ON S RE V CCVL PVCC VCC2 GND2RSGND 60/uni03A9 60/uni03A9 CAN CONTROLLER GND PWR VDD ADJ CANH CANL SPLIT* ISOLATION BARRIER 50ns/DIV 2V/DIV 2V/DIV TXD 500V/DIV MULTIPLE SWEEPS OF COMMON MODE TRANSIENTS ACROSS ISOLATION BARRIER

2889 TA01a

2889fa For more information www.linear .com/L TM2889 PIN CONFIGURATIONABSOLUTE MAXIMUM RATINGS Signal Voltages (ON, S, RE, RXD, TXD) 3V to VL +0.3V 60V 20V Operating Temperature Range (Note 4) LTM28 °C to 70°C LTM28 40°C to 85°C LTM28 0°C to 125°C 5°C 55°C to 125°C 5°C (Note 1) GND GND2 GND2DNC BGA PACKAGE 32-PIN (15mm × 11.25mm × 3.42mm) TOP VIEW F G H L J K E A B C D 2 1 4 3 5 6 7 8 RXDRE S TXD ON V L VCC PVCC SPLIT CANL GND2 RS ADJCANH VCC2 TJMAX = 125°C, θJA = 32.2°C/W, θJCTOP = 27.2°C/W θJCBOTTOM = 20.9°C/W, θJB =26.4°C/W, Weight = 1.1g PRODUCT SELECTION GUIDE LEAD FREE DESIGNATOR PBF = Lead Free LTM2889 I Y –3 #PBF INPUT VOLTAGE RA NGE 3 = 3V to 3.6V 5 = 4.5V to 5.5V PACKAGE TYPE Y = Ball Grid Array (BGA) TEMPERATURE GRADE C = Commercial Temperature Range (0°C to 70°C) I = Industrial Temperature Ra nge (–40°C to 85°C) H = Automoti ve Temperature Ra nge (–40°C t o 125°C) PRODUCT PART NUMBER

2889faFor more information www.linear .com/L TM2889

ELECTRICAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS Power Supplies VCC Supply Voltage l 3.0 5.5 V ICC Supply Current OFF: ON = 0V l 0 10 µA ON = VL l 3.1 5 mA PVCC Supply Voltage, Isolated Power Converter LTM2889-3 l 3.0 3.3 3.6 V LTM2889-5 l 4.5 5.0 5.5 V PICC Supply Current, Isolated Power Converter, (VCC2 External Load Current ILOAD = 0) OFF: ON = 0V l 0 10 µA Recessive: ON = VL, TXD = VL and/or S = VL LTM2889-3 l 34 60 mA LTM2889-5 l 32 50 mA Dominant: ON = VL, TXD = S = 0 LTM2889-3 l 140 225 mA LTM2889-5 l 94 130 mA VL Logic Supply Voltage l 1.62 3.3 5.5 V IL Logic Supply Current OFF: ON = 0V, TXD = VL l 0 10 µA Recessive: ON = VL, TXD = VL l 0 10 µA Dominant: ON = VL, TXD = S = 0V l 6 50 µA VCC2 Regulated VCC2 Output Voltage to GND2 No Load, TXD = V L l 4.75 5.0 5.25 V ILOAD = 100mA, TXD = VL LTM2889-3 l 4.75 5.0 5.25 V ILOAD = 150mA, TXD = VL LTM2889-5 l 4.75 5.0 5.25 V VCC2-3.3V Regulated VCC2 Output Voltage to GND2, 3.3V Output No Load, (Fig. 10) l 3.1 3.3 3.5 V ILOAD = 100mA, (Fig. 10) LTM2889-3 l 3.0 3.3 3.5 V ILOAD = 150mA, (Fig. 10) LTM2889-5 l 3.0 3.3 3.5 V VCC2 Short Circuit Current VCC2 = 0V, TXD = VL 200 mA The l denotes specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. Unless otherwise noted, the following conditions apply: PVCC = VCC = 3.3V for the LTM2889-3, PVCC = VCC = 5V for the LTM2889-5, VL = 3.3V, GND = GND2 = S = RE = RS = 0V, ON = VL. Figure 10 applies for VCC2 = 3.3V; otherwise ADJ is floating. Figure 1 applies with RL = 60Ω and dominant mode measurements are taken prior to TXD dominant timeout (t < tTOTXD). (Note 2) PART NUMBER PAD OR BALL FINISH PART MARKING PACKAGE TYPE MSL RA TING INPUT VOL TAGE RANGE TEMPERATURE RANGE DEVICE FINISH CODE LTM2889CY-3#PBF SAC305 (RoHS) LTM2889Y-3 e1 32-Lead BGA 3 3V to 3.6V 0°C to 70°C LTM2889IY-3#PBF 3V to 3.6V –40°C to 85°C LTM2889HY-3#PBF 3V to 3.6V –40°C to 125°C LTM2889CY-5#PBF LTM2889Y-5 4.5V to 5.5V 0°C to 70°C LTM2889IY-5#PBF 4.5V to 5.5V –40°C to 85°C LTM2889HY-5#PBF 4.5V to 5.5V –40°C to 125°C Device temperature grade is indicated by a label on the shipping container.

• Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Terminal Finish Part Marking: www.linear.com/leadfree
• This product is not recommended for second side reflow. For more information, go to www.linear.com/BGA-assy
• Recommended BGA PCB Assembly and Manufacturing Procedures: www.linear.com/BGA-assy ray Drawings: www.linear.com/packaging
• This product is moisture sensitive. For more information, go to: www.linear.com/BGA-assy http://www.linear.com/product/LTM2889#orderinfo

2889fa For more information www.linear .com/L TM2889 ELECTRICAL CHARACTERISTICS The l denotes specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. Unless otherwise noted, the following conditions apply: PVCC = VCC = 3.3V for the LTM2889-3, PVCC = VCC = 5V for the LTM2889-5, VL = 3.3V, GND = GND2 = S = RE = RS = 0V, ON = VL. Figure 10 applies for VCC2 = 3.3V; otherwise ADJ is floating. Figure 1 applies with RL = 60Ω and dominant mode measurements are taken prior to TXD dominant timeout (t < tTOTXD). (Note 2) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS Control Inputs S, ON, RE: VIH HIGH-level Input Voltage VL ≥ 2.35V l 0.7 • VL VL + 0.3 V 1.62V ≤ VL < 2.35V l 0.75 • VL VL + 0.3 V VIL LOW-level Input Voltage VL ≥ 2.35V l –0.3 0.3 • VL V 1.62V ≤ VL < 2.35V l –0.3 0.25 • VL V IIH HIGH-level Input Current ON = S = RE = VL l 11 25 µA IIL LOW-level Input Current ON = S = RE = 0V l ±1 µA CAN T ransmit Data Input Pin TXD V IH HIGH-level Input Voltage VL ≥ 2.35V l 0.7 • VL VL + 0.3 V 1.62V ≤ VL < 2.35V l 0.75 • VL VL + 0.3 V VIL LOW-level Input Voltage VL ≥ 2.35V l –0.3 0.3 • VL V 1.62V ≤ VL < 2.35V l –0.3 0.25 • VL V IIH HIGH-level Input Current TXD = VL l ±5 µA IIL LOW-level Input Current TXD = 0V l –50 –2 µA CIN Input Capacitance (Note 6) 5 pF CAN Receive Data Output Pin RXD I OH HIGH-level Output Current RXD = VL – 0.4V 3V ≤ V L ≤ 5.5V l –4 mA 1.62V ≤ VL < 3V l –1 mA IOL LOW-level Output Current RXD = 0.4V, Bus Dominant 3V ≤ VL ≤ 5.5V l 4 mA 1.62V ≤ VL < 3V l 1 mA Bus Driver Pins CANH, CANL VO(D) Bus Output Voltage (Dominant) to GND2 CANH TXD = 0V, t< t TOTXD VCC2 = 5V l 2.75 3.6 4.5 V VCC2 = 3.3V l 2.15 2.9 3.3 V CANL TXD = 0V, t< t TOTXD VCC2 = 5V l 0.5 1.4 2.25 V VCC2 = 3.3V l 0.5 0.9 1.65 V VO(R) Bus Output Voltage (Recessive) to GND2 V CC2 = 5V, No Load (Figure 1) l 2 2.5 3 V VCC2 = 3.3V, No Load (Figure 1) l 1.45 1.95 2.45 V VOD(D) Differential Output Voltage (Dominant) R L = 50Ω to 65Ω (Figure 1) l 1.5 2.2 3 V VOD(R) Differential Output Voltage (Recessive) No Load (Figure 1) l –500 0 50 mV VOC(D) Common Mode Output Voltage (Dominant) to GND2 V CC2 = 5V, (Figure 1) l 2 2.5 3 V VCC2 = 3.3V, (Figure 1) l 1.45 1.95 2.45 V IOS(D) Bus Output Short-Circuit Current (Dominant) CANH CANH = 0V to GND2 l –100 –75 mA CANH CANH = ±60V to GND2 l –100 3 mA CANL CANL = 5V to GND2 l 75 110 mA CANL CANL = ±60V to GND2 l –3 100 mA

2889faFor more information www.linear .com/L TM2889 ELECTRICAL CHARACTERISTICS The l denotes specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. Unless otherwise noted, the following conditions apply: PVCC = VCC = 3.3V for the LTM2889-3, PVCC = VCC = 5V for the LTM2889-5, VL = 3.3V, GND = GND2 = S = RE = RS = 0V, ON = VL. Figure 10 applies for VCC2 = 3.3V; otherwise ADJ is floating. Figure 1 applies with RL = 60Ω and dominant mode measurements are taken prior to TXD dominant timeout (t < tTOTXD). (Note 2) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS Bus Receiver Pins CANH, CANL VCM Bus Common Mode Voltage to GND2 = (CANH + CANL)/2 for Data Reception VCC2 = 5V l ±36 V VCC2 = 3.3V l ±25 V VTH+ Bus Input Differential Threshold Voltage (Positive-Going) V CC2 = 5V, –36V ≤ VCM ≤ 36V l 775 900 mV VCC2 = 3.3V, –25V ≤ VCM ≤ 25V l 775 900 mV VTH– Bus Input Differential Threshold Voltage (Negative-Going) V CC2 = 5V, –36V ≤ VCM ≤ 36V l 500 625 mV VCC2 = 3.3V, –25V ≤ VCM ≤ 25V l 500 625 mV ΔVTH Bus Input Differential Hysteresis Voltage V CC2 = 5V, –36V ≤ VCM ≤ 36V 150 mV VCC2 = 3.3V, –25V ≤ VCM ≤ 25V 150 mV RIN Input Resistance (CANH and CANL) to GND2 R IN = ΔV/ΔI; ΔI = ±20μA l 25 40 50 kΩ RID Differential Input Resistance RIN = ΔV/ΔI; ΔI = ±20μA l 50 80 100 kΩ ΔRIN Input Resistance Matching RIN (CANH) to RIN (CANL) ±1 % CIH Input Capacitance to GND2 (CANH) (Note 6) 32 pF CIL Input Capacitance to GND2 (CANL) (Note 6) 8 pF CID Differential Input Capacitance (Note 6) 8.4 pF IBL Bus Leakage Current (VCC2 = 0V) (I-Grade) CANH = CANL = 5V, T ≤ 85°C l ±10 μA Bus Leakage Current (VCC2 = 0V) (H-Grade) CANH = CANL = 5V, T ≤ 125°C l ±40 μA Bus Common Mode Stabilization Pin SPLIT VO_SPLIT SPLIT Output Voltage to GND2 –500μA ≤ I(SPLIT) ≤ 500μA VCC2 = 5V l 1.5 2.5 3.5 V VCC2 = 3.3V l 0.9 1.9 2.9 V IOS_SPLIT SPLIT Short-Circuit Current –60V ≤ SPLIT ≤ 60V to GND2 l ±3 mA Logic/Slew Control Input RS V IH_RS High Level Input Voltage to GND2 l 0.9 • VCC2 V VIL_RS Low Level Input Voltage to GND2 l 0.5 • VCC2 V IIN_RS Logic Input Current 0 ≤ RS ≤ VCC2 l –170 0 10 μA ESD (HBM) (Note 3) Isolation Boundary GND2 to GND ±10 kV CANH, CANL, SPLIT Referenced to GND2 or VCC2 ±25 kV All Other Pins Referenced to GND, GND2, or VCC2 ±4 kV

2889fa For more information www.linear .com/L TM2889 SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS T ransceiver Timing fMAX Maximum Data Rate l 4 Mbps tPTXBD TXD to Bus Dominant Propagation Delay (Figure 3) VCC2 = 3.3V l 55 105 165 ns VCC2 = 5V l 50 100 150 ns tPTXBR TXD to Bus Recessive Propagation Delay (Figure 3) VCC2 = 3.3V l 100 145 205 ns VCC2 = 5V l 80 115 155 ns tPTXBDS TXD to Bus Dominant Propagation Delay, Slow Slew RSL = 200k (Figure 3) VCC2 = 3.3V l 200 565 1255 ns VCC2 = 5V l 220 585 1225 ns tPTXBRS TXD to Bus Recessive Propagation Delay, Slow Slew RSL = 200k (Figure 3) V CC2 = 3.3V l 420 985 2035 ns VCC2 = 5V l 490 1065 2245 ns tPBDRX Bus Dominant to RXD Propagation Delay (Figure 3) l 40 65 100 ns tPBRRX Bus Recessive to RXD Propagation Delay (Figure 3) l 45 70 115 ns tPTXRXD TXD to RXD Dominant Propagation Delay (Figure 3) VCC2 = 3.3V l 120 170 240 ns VCC2 = 5V l 110 165 225 ns tPTXRXR TXD to RXD Recessive Propagation Delay (Figure 3) VCC2 = 3.3V l 160 215 275 ns VCC2 = 5V l 140 185 245 ns tPTXRXDS TXD to RXD Dominant Propagation Delay, Slow Slew RSL = 200k (Figure 3) V CC2 = 3.3V l 210 550 1170 ns VCC2 = 5V l 240 580 1150 ns tPTXRXRS TXD to RXD Recessive Propagation Delay, Slow Slew RSL = 200k (Figure 3) V CC2 = 3.3V l 450 990 1960 ns VCC2 = 5V l 500 1070 2150 ns tTOTXD TXD Timeout Time (Figure 4) l 0.5 2 4 ms tBIT(RXD),2M Receiver Output Recessive Bit Time, 2Mbps, Loop Delay Symmetry (Figure 8) V CC2 = 3.3V l 400 455 550 ns VCC2 = 5V l 400 475 550 ns tBIT(RXD),4M Receiver Output Recessive Bit Time, 4Mbps (Figure 8) VCC2 = 5V l 200 225 275 ns tZLR Receiver Output Enable Time (Figure 5) l 20 ns tLZR Receiver Output Disable Time (Figure 5) l 30 ns tENRSRX RXD Enable from Shutdown Time (Figure 6) l 40 µs tENRSTX TXD Enable from Shutdown TIme (Figure 7) (Note 5) l 40 µs tSHDNRX Time to Shutdown, Receiver (Figure 6) l 3 µs tSHDNTX Time to Shutdown, T ransmitter (Figure 7) l 250 ns Power Supply Generator tENPS VCC2 Supply Start-Up Time No load, ON ↑, VCC2 to 4.5V l 2.3 5 ms T ransmitter Drive Symmetry (Common Mode Voltage Fluctuation) V SYM Driver Symmetry (CANH + CANL – 2VO(R)) (Dynamic Peak Measurement) RL = 60Ω/Tol. < 1%, CSPLIT = 4.7nF/5%, fTXD = 250kHz, Input Impedance of Oscilloscope: ≤ 20pF/≥1MΩ (Figure 2) l ±500 mV SWITCHING CHARACTERISTICS The l denotes specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. Unless otherwise noted, the following conditions apply: PVCC = VCC = 3.3V for the LTM2883-3, PVCC = VCC = 5V for the LTM2883-5, VL = 3.3V, GND = GND2 = S = RE = RS = 0V, ON = VL. Figure 2 applies with RL = 60Ω, CL = 100pF, RSL = 0Ω. Figure 10 applies for VCC2 = 3.3V; otherwise ADJ is floating.

2889faFor more information www.linear .com/L TM2889 SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VISO Rated Dielectric Insulation Voltage 1 Second (Notes 7, 8, 9) 3000 VRMS

1 Minute, Derived from 1 Second Test (Note 9) 2500 VRMS

Common Mode T ransient Immunity LTM2889-3 VCC = 3.3V, LTM2889-5 VCC = 5.0V, VL = ON = 3.3V, ΔV(GND2-GND) = 1kV, Δt = 33ns (Note 3) 30 50 kV/µs VIORM Maximum Working Insulation Voltage (Notes 3,10) 560 400 VPEAK, VDC VRMS Partial Discharge VPD = 1060 VPEAK (Note 7) 5 pC CTI Comparative T racking Index IEC 60112 (Note 3) 600 VRMS Depth of Erosion IEC 60112 (Note 3) 0.017 mm DTI Distance Through Insulation (Note 3) 0.06 mm Input to Output Resistance (Notes 3, 7) 109 Ω Input to Output Capacitance (Notes 3, 7) 6 pF Creepage Distance (Notes 3, 7) 9.5 mm ISOLATION CHARACTERISTICS TA = 25°C Note 1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. Note 3. Not tested in production. Note 4. This module includes overtemperature protection that is intended to protect the device during momentary overload conditions. Junction temperature exceeds 150°C when overtemperature protection is active. Continuous operation above the specified maximum operating temperature may result in device degradation or failure. Note 5. TXD must make a high to low transition after this time to assert a bus dominant state. Note 6. Pin capacitance given for reference only and is not tested in production. Note 7. Device considered a 2-terminal device. Pin group A1 through B8 shorted together and pin group K1 through L8 shorted together. Note 8. The Rated Dielectric Insulation Voltage should not be interpreted as a continuous voltage rating. Note 9. In accordance with UL1577, each device is proof tested for the 2500V RMS rating by applying an insulation test voltage of 3000VRMS for 1 second. Note 10. Maximum Working Insulation Voltage is for continuous or repeated voltage applied across the isolation boundary. Refer also to relevant equipment level safety specifications which may reduce V IORM depending on application conditions.

2889 TC01

2889 TC02

Figure 1. Electrical Characteristic Measurements of Bus Pins CANH, CANL Figure 2. All Bus Pin Switching Characteristic Measurements Except Receiver Enable/Disable Times

Figure 3. CAN T ransceiver Data Propagation Timing Diagram Figure 4. TXD Dominant Timeout Time

2889 TC03

2889 TC04

2889 TC06

Figure 6. RXD Enable and Disable Timing from Shutdown Figure 5. Receiver Output Enable and Disable Timing

2889 TC05

2889 TC07

Figure 7. TXD Enable and Disable Timing from Shutdown Figure 8. Loop Delay Symmetry

2889 TC08

2889fa For more information www.linear .com/L TM2889 Driver Output Current vs Differential Output Voltage (Dominant) Receiver Dominant Output Voltage vs Output Current Receiver Recessive Output Voltage vs Output Current TXD Timeout Time vs Temperature TXD to RXD Dominant Propagation Delay vs Temperature TXD to RXD Recessive Propagation Delay vs Temperature Driver Differential Output Voltage (Dominant) vs Temperature Common Mode Output Voltage (Dominant) vs Temperature Driver Differential Output Voltage (Dominant) vs Output Current Unless otherwise noted, the following conditions apply: TA = 25°C, PVCC = VCC = 3.3V for the LTM2889-3, PVCC = VCC = 5.0V for the LTM2889-5, VL = 3.3V, GND = GND2 = S = RE = 0V, ON = VL. TEMPERATURE (°C) VOD(D) (V) 2.9 2.7 2.5 2.1 2.3 1.9 1.7 1.5 25 50 75 100 125

2889 G01

–25 0–50 VCC = 5V VCC = 3.3V TEMPERATURE (°C) VOC(D) (V) 2.9 2.7 2.5 2.1 2.3 1.9 1.7 1.5 25 50 75 100 125

2889 G02

–25 0–50 VCC = 5V VCC = 3.3V OUTPUT CURRENT (mA) VOD(D) (V) 5.0 4.5 4.0 3.0 3.5 2.5 2.0 1.5 1.0 0.5 40 50 60 70

2889 G03

VCC = 5V VCC = 3.3V OUTPUT VOL TAGE (V) –60 IOS(D) (mA) 100 –50 –100 0 20 40

2889 G04

60–20 –40 CANL CANH V L = 5V V L = 3.3V V L = 2.5V V L = 1.8V OUTPUT CURRENT (ABS VALUE) (mA) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 RECEIVER OUTPUT VOL TAGE (V)

2889 G05

V L = 5V V L = 3.3V V L = 2.5V V L = 1.8V OUTPUT CURRENT (ABS VALUE) (mA) RECEIVER OUTPUT VOL TAGE (V)

2889 G06

TEMPERATURE (°C) tTOTXD (ms) 2.4 2.2 1.4 2.0 1.6 1.8 1.2 0.6 1.0 0.8 25 50 75 100 125

2889 G07

–25 0–50 VCC = 5V VCC = 3.3V V CC2 = 5V V CC2 = 3.3V TEMPERATURE (°C) –50 –25 100 125 150 155 160 165 170 175 180 185 190 t PTXRXD (ns)

2889 G08

V CC2 = 5V V CC2 = 3.3V TEMPERATURE (°C) –50 –25 100 125 170 180 190 200 210 220 230 240 250 t PTXRXR (ns)

2889 G09

TYPICAL PERFORMANCE CHARACTERISTICS

2889faFor more information www.linear .com/L TM2889 Bus Recessive to RXD Propagation Delay vs Temperature TXD to RXD Dominant Propagation Delay vs Temperature, Slow Slew TXD to RXD Recessive Propagation Delay vs Temperature, Slow Slew TXD to Bus Dominant Propagation Delay vs Temperature, Slow Slew TXD to Bus Recessive Propagation Delay vs Temperature, Slow Slew VCC2 Power Efficiency TXD to Bus Dominant Propagation Delay vs Temperature TXD to Bus Recessive Propagation Delay vs Temperature Bus Dominant to RXD Propagation Delay vs Temperature V CC2 = 5V V CC2 = 3.3V TEMPERATURE (°C) –50 –25 100 125 100 105 110 115 120 t PTXBD (ns)

2889 G10

V CC2 = 5V V CC2 = 3.3V TEMPERATURE (°C) –50 –25 100 125 105 115 125 135 145 155 165 175 t PTXBR (ns)

2889 G11

TEMPERATURE (°C) –50 –25 100 125 t PBDRX (ns)

2889 G12

TEMPERATURE (°C) –50 –25 100 125 t PBRRX (ns)

2889 G13

V CC2 = 5V V CC2 = 3.3V RSL = 200k TEMPERATURE (°C) –50 –25 100 125 490 510 530 550 570 590 t PTXRXDS (ns)

2889 G14

V CC2 = 5V V CC2 = 3.3V RSL = 200k TEMPERATURE (°C) –50 –25 100 125 940 960 980 1000 1020 1040 1060 1080 t PTXRXRS (ns)

2889 G15

V CC2 = 5V V CC2 = 3.3V RSL = 200k TEMPERATURE (°C) –50 –25 100 125 500 520 540 560 580 600 t PTXBDS (ns)

2889 G16

V CC2 = 5V V CC2 = 3.3V RSL = 200k TEMPERATURE (°C) –50 –25 100 125 950 975 1000 1025 1050 1075 1100 t PTXBRS (ns)

2889 G17

L TM2889–5 L TM2889–3 V CC2 = 5V I CC2 (mA) 100 125 150 175 200 0.10 0.20 0.30 0.40 0.50 0.60 0.70 POWER OUT/ POWER IN

2889 G18

Unless otherwise noted, the following conditions apply: TA = 25°C, PVCC = VCC = 3.3V for the LTM2889-3, PVCC = VCC = 5.0V for the LTM2889-5, VL = 3.3V, GND = GND2 = S = RE = 0V, ON = VL. TYPICAL PERFORMANCE CHARACTERISTICS

2889fa For more information www.linear .com/L TM2889 VCC Supply Current vs T ransmitting Data Rate PVCC Supply Current vs Temperature PVCC Supply Current vs T ransmitting Data Rate V CC2 Surplus Current vs Temperature VCC2 vs Temperature (3.3V) Derating for 125°C Maximum Internal Operating Temperature VL Supply Current vs T ransmitting Data Rate VCC2 vs Temperature (5V)

2889 G19

L TM2889–5 L TM2889–3 TRANSMITTING DATA RATE (Mbps) 0.1 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 I CC (mA) L TM2889–3; V CC2 = 3.3V L TM2889–3; V CC2 = 5V L TM2889–5; V CC2 = 5V L TM2889–5; V CC2 = 3.3V TRANSMITTING DATA RATE (Mbps) 0.1 50.0 60.0 70.0 80.0 90.0 100.0 PI CC (mA)

2889 G20

V L = 3.3V V L = 5V V L = 1.65V TRANSMITTING DATA RATE (Mbps) 0.1 100 200 300 400 500 600 I L (µA)

2889 G21

L TM2889–3; V CC2 = 3.3V L TM2889–3; V CC2 = 5V L TM2889–5; V CC2 = 5V L TM2889–5; V CC2 = 3.3V TRANSMITTING AT 1Mbps TEMPERATURE (°C) –50 –25 100 125 100 PI CC (mA)

2889 G22

L TM2889–3; V CC2 = 3.3V L TM2889–3; V CC2 = 5V L TM2889–5; V CC2 = 5V L TM2889–5; V CC2 = 3.3V TRANSMITTING AT 4Mbps TEMPERATURE (°C) –50 –25 100 125 100 120 140 160 180 200 220 240 I CC2 (mA)

2889 G23

I CC2 = 100mA I CC2 = 0mA TEMPERATURE (°C) –50 –25 100 125 4.92 4.94 4.96 4.98 5.00 5.02 V CC2 (V)

2889 G24

I CC2 = 100mA I CC2 = 0mA TEMPERATURE (°C) –50 –25 100 125 3.22 3.24 3.26 3.28 3.30 3.32 V CC2 (V)

2889 G25

Unless otherwise noted, the following conditions apply: TA = 25°C, PVCC = VCC = 3.3V for the LTM2889-3, PVCC = VCC = 5.0V for the LTM2889-5, VL = 3.3V, GND = GND2 = S = RE = 0V, ON = VL. TYPICAL PERFORMANCE CHARACTERISTICS CAN I CC2 = 20mA L TM2889–5 (CAN OFF) L TM2889–5(CAN ON) L TM2889–3 (CAN OFF) L TM2889–3 (CAN ON) TEMPERATURE (°C) 100 125 100 120 140 160 I CC2 LOAD CURRENT (mA)

2889 G26

2889faFor more information www.linear .com/L TM2889 PIN FUNCTIONS LOGIC SIDE: (I/O pins referenced to VL and GND) RE (Pin A1): Receiver Output Enable. A logic low enables the receiver output, RXD. A logic high disables the receiver output. RE has a weak pull-down to GND. In typical usage, RE is tied to ground. RXD (Pin A2): Receiver Output. When the CAN bus is in the dominant state, RXD is low. When the CAN bus is in the recessive state, RXD is high. When the receiver output is disabled, RXD is high-Z and has a weak pull-up to V Under the condition of an isolation communication failure, the receiver output is disabled. TXD (Pin A3): T ransmit Driver Input. When S is low, a low on TXD puts the driver into the dominant state, driv- ing CANH high and CANL low. A high on TXD forces the driver into the recessive state, with both CANH and CANL in a high impedance state. If TXD and S are both held low for longer than tTOTXD, the driver reverts to the recessive state. TXD has a weak pull-up to VL. S (Pin A4): T ransmit Driver Silent. A high on S forces the driver into the recessive state, with both CANH and CANL in a high impedance state. S has a weak pull-down to GND. ON (Pin A5): Enable. Enables the power and data com - munications through the isolation barrier. If ON is high the LTM2889 is enabled and power and communications are functional to the isolated side. If ON is low, the logic side is held in reset and the isolated side is unpowered. ON has a weak pull-down to GND. V L (Pin A6): Logic Supply. Interface supply voltage for pins RE, RXD, TXD, S, and ON. Operating voltage is 1.62V to 5.5V. Internally bypassed to GND with 1µF. V CC (Pins A7, B7): Supply Voltage. Operating voltage is 3V to 5.5V for both LTM2889-3 and LTM2889-5. Internally bypassed to GND with 1µF. PVCC (Pins A8, B8): Isolated Power Supply Input. Operat- ing voltage is 3V to 3.6V for LTM2889-3 and 4.5V to 5.5V for LTM2889-5. Internally bypassed to GND with 2.2µF. In typical usage, PVCC is tied to VCC. GND (Pins B1-B8): Logic Side Circuit Ground ISOLATED SIDE: (I/O pins referenced to VCC2 and GND2) CANL (Pin L1): Low Level CAN Bus Line. ±60V tolerant, 25kV ESD. SPLIT (Pin L2): Common Mode Stabilization Output for Optional Split Termination. ±60V tolerant, 25kV ESD. If un- used, leave open. Internally bypassed to GND2 with 4.7nF. CANH (Pin L3): High Level CAN Bus Line. ±60V tolerant, 25kV ESD. GND2 (Pins L4, K1-K4, K6-K8): Isolated Side Circuit Ground. RS (Pin L5): Shutdown Mode/Slew Control Input. A voltage on RS higher than V IH_RS puts the CAN transceiver in a low power shutdown state. The CAN bus and RXD will be in the recessive state, the CAN receiver will be disconnected from the bus, and the power converter will continue to operate. A voltage on RS lower than V IL_RS enables the CAN transceiver. A resistor between RS and GND2 can be used to control the slew rate. See Applications Information section for details. ADJ (Pin L6): Adjust pin to override the default 5V regula- tion voltage of the isolated power supply. May be used to set VCC2 to 3.3V in either the LTM2889-3 or LTM2889-5 versions. Leave floating for 5V output. See Applications Information section for details. V CC2 (Pin L7-L8): I solated Power Supply Output. Internally generated from PVCC by an isolated DC/DC converter and regulated to 5V. Internally bypassed to GND2 with 10µF. DNC (Pin K5): Do not make electrical connection to this pin. Do not connect to GND2.

2889 BD01

Figure 9. LTM2889 Simplified Block Diagram

networks where grounds can take on different voltages. greater than 30kV/μs providing excellent noise isolation. translate signals and power across an isolation barrier. a powerful isolated DC/DC converter in one small package. dropout regulator (LDO) to provide a regulated 5V output. and current delivered to the CAN driver and line load. used, and the ADJ pin should be left unconnected. Figure 10. Adjusting VCC2 for 3.3V Output.

2889 F10

isolated CAN transceiver instead of the internal converter.

VCC2 pin. The ADJ pin should be left unconnected. Figure 11. Simply connect the desired logic supply to their specified operating ranges and sequence in any order. VL is bypassed internally with a 1µF capacitor. perturbations and electromagnetic emissions (EME). into the data path of the LTM2889. ESD tolerance, and a wide common mode operating range. Figure 11. VCC and VL Are Independent

2889 F11

Table 1. Operating Modes*

1 X 1 0 RECESSIVE 1 SILENT

0 X X X HI-Z HI-Z OFF

remain in the high impedance state. damage in competing products. to GND (VCC, PVCC, VL, GND). is disconnected from the bus by a FET switch.

2889 F12

the driver current limit with increasing output fault voltage. Figure 12. T ransmitter Dominant Timeout Function

operations at approximately 170°C. an internal pull-up resistor. symmetric around VCC2/2 = 2.5V with respect to GND2. match the dominant state output common mode voltage. 2.5V (when a CAN transceiver on a 5V supply is dominant). in series with the RS pin (Figure 1). Figure 13. RSL ≤ 4k is recommended for high data rate

Figure 13. Slew Rate vs Slew Control Resistor RSL

2889 F13

transmitter to the minimum slew rate. current drawn from it remains at ~ –100µA down to 0V. resistor current IRS and the slew control current ISC. drawn from the RS pin and sets the transmitter slew rate. Figure 14. Equivalent Circuit of RS Pin

2889 F14

while the common mode emissions of the two lines add. Figure 15. Low Perturbation of Common

2889 F15

slew rate when operating at 200kbps. Figure 16. Power Spectrum of Common Mode Voltage Showing

2889 F16

the recessive common mode voltage. mon mode impedance of the single resistor termination. age to bias the mid-point of the split termination resistors. ESD discharges as CANH and CANL.

2889faFor more information www.linear .com/L TM2889 APPLICATIONS INFORMATION Ideal Passive Behavior to CAN Bus With Supply Off When the power supply is removed or the chip is in shut- down, the CANH and CANL pins are in a high impedance state. The receiver inputs are isolated from the CANH and CANL nodes by FET switches which open in the absence of power, thereby preventing the resistor dividers on the receiver input from loading the bus. The high impedance state of the receiver is limited by ESD clamps inboard of the 40k input resistors to a typical range of –0.5V to 11V. For bus voltages outside this range, the current flowing into the receiver is governed by the conduction voltages of the ESD device and the 40k nominal receiver input resistance. DeviceNet Compatibility DeviceNet is a network standard based on the CAN bus. The DeviceNet standard places requirements on the trans- ceiver that exceed those of the ISO 11898-2 standard. The LTM2889 meets the DeviceNet requirements listed in Table 2. DeviceNet employs a 5-pin connector with conductors for Power+, Power–, CANH, CANL, and Drain. The power is 24VDC, and the Drain wire is connected to the cable shield for shielded cables. The Power– pin may be connected to LTM2889 GND2, but the Power+ must not be connected to the LTM2889 V CC2 pin. Table 2: DeviceNet Requirements PARAMETER DeviceNet REQUIREMENT ISO 11898-2 REQUIREMENT LTM2889 Number of Nodes 64 N/A 166 Minimum Differential Input Resistance 20k 10k 50k Differential Input Capacitance 25pF (Max) 10pF (Nom) 8.4pF (Typ ) (Note 6) Bus Pin Voltage Range (Survivable) –25V to 18V –3V to 16V (for 12 V Battery) –60V to 60V Bus Pin Voltage Range (Operation) –5V to 10V –2V to 7V –36V to 36V (VCC = 5V) Connector Mis-Wiring Tests, All Pin-Pin Combinations ±18V N/A ±60V (See Below) The DeviceNet mis-wiring tests involve connecting an 18V supply to each of the 20 possible pin pair/polarity combinations on the 5-pin connector. The ±60V tolerance of the LTM2889 with respect to GND2 ensures that the LTM2889 will pass all the mis-wiring tests without damage. PCB Layout Considerations The high integration of the LTM2889 makes PCB layout very simple. However, to optimize its electrical isolation characteristics, EMI, and thermal performance, some layout considerations are necessary. Under heavily loaded conditions PVCC and GND current can exceed 300mA. Sufficient copper must be used on the PCB to insure resistive losses do not cause the supply voltage to drop below the minimum allowed level. Similarly, the V CC2 and GND2 conductors must be sized to support any external load current. These heavy copper traces will also help to reduce thermal stress and improve the thermal conductivity.

• Input and Output decoupling is not required, since these components are integrated within the package. An additional bulk capacitor with a value of 6.8μF to 22μF with 1Ω to 3Ω of ESR is recommended. The high ESR of this capacitor reduces board resonances and minimizes voltage spikes caused by hot plugging of the supply voltage. For EMI sensitive applications, an additional low ESL ceramic capacitor of 1μF to 4.7μF, placed as close to the power and ground terminals as possible, is recommended. Alternatively, a number of smaller value parallel capacitors may be used to reduce ESL and achieve the same net capacitance.
• Do not place copper on the PCB between the inner col- umns of pads. This area must remain open to withstand the rated isolation voltage.
• The use of solid ground planes for GND and GND2 is recommended for non-EMI critical applications to optimize signal fidelity, thermal performance, and to minimize RF emissions due to uncoupled PCB trace conduction. The drawback of using ground planes, where EMI is of concern , is the creation of a dipole antenna structure which can radiate differential voltages formed between GND and GND2. If ground planes are used it is recommended to minimize their area, and use contiguous planes as any openings or splits can exacerbate RF emissions.

2889fa For more information www.linear .com/L TM2889

• For large ground planes a small capacitance (≤ 330pF) from GND to GND2, either discrete or embedded within the substrate, provides a low impedance current return path for the module parasitic capacitance, minimizing any high frequency differential voltages and substantially reducing radiated emissions. Discrete capacitance will not be as effective due to parasitic ESL. In addition, volt- age rating, leakage, and clearance must be considered for component selection. Embedding the capacitance within the PCB substrate provides a near ideal capacitor and eliminates component selection issues; however, the PCB must be 4 layers. Care must be exercised in applying either technique to insure the voltage rating of the barrier is not compromised. The PCB layout in Figures 17-21 show the low EMI demo board for the LTM2889. The demo board uses a combination of EMI mitigation techniques, including both embedded PCB bridge capacitance and discrete GND to GND2 capaci- tors (C3 + C4). Two safety rated type Y2 capacitors are used in series, manufactured by Murata, part number GA342QR7GF471KW01L. The embedded capacitor effectively suppresses emissions above 400MHz, whereas the discrete capacitors are more effective be- low 400MHz. EMI performance is shown in Figure 22, measured using a Gigahertz T ransverse Electromagnetic (GTEM) cell and method detailed in IEC 61000-4-20, “Testing and Measurement Techniques – Emission and Immunity Testing in T ransverse Electromagnetic Waveguides.” RF, MAGNETIC FIELD IMMUNITY The isolator μModule technology used within the LTM2889 has been independently evaluated, and successfully passed the RF and magnetic field immunity testing requirements per European Standard EN 55024, in accordance with the following test standards: APPLICATIONS INFORMATION EN 61000-4-3 Radiated, Radio-Frequency,Electromagnetic Field Immunity EN 61000-4-8 Power Frequency Magnetic Field Immunity EN 61000-4-9 Pulse Magnetic Field Immunity Tests were performed using an unshielded test card de - signed per the data sheet PCB layout recommendations. Specific limits per test are detailed in T able 3. Table 3. TEST FREQUENCY FIELD STRENGTH EN61000-4-3 Annex D 80MHz to 16Hz 10V/m 1.4MHz to 2Hz 3V/m 2MHz to 2.7Hz 1V/m EN61000-4-8 Level 4 50MHz to 60Hz 30A/m EN61000-4-8 Level 5 60Hz 100A/m* EN61000-4-9 Level 5 Pulse 100A/m *Non IEC method Operation Above 105°C (LTM2889H) Operation of the H temperature grade LTM2889H above 105°C is limited by the internal power dissipation of the module, and depends on the PV CC voltage range option, the external ICC2 load current, and whether the CAN transceiver is on or off. Refer to the Typical Performance Character- istics chart labeled Derating for 125°C Maximum Internal Operating Temperature on page 13. The CAN transceiver of the LTM2889H may operate up to 125°C if V CC2 is supplied by an external power supply and the PVCC pins are grounded. Refer to PVCC Power Supply on page 16.

Figure 20. Low EMI Demo Board Layout (DC1746A), Inner Layer 2 Figure 21. Low EMI Demo Board Layout (DC1746A), Bottom Layer Figure 22. Low EMI Demo Board Emissions

2889 F22

Figure 23. Point-to-Point Isolated CAN Communications on an Unshielded T wisted Pair Figure 24. Using the LTM2889 as a Dedicated Isolated 5V Supply

2889 F23

2889 F24

Figure 25. Supplying VCC2 From an External Supply

2889 F25

2889fa For more information www.linear .com/L TM2889 PACKAGE DESCRIPTION Please refer to http://www.linear.com/product/LTM2889#packaging for the most recent package drawings. 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu

7 PACKAGE ROW AND COLUMN LABELING MAY VARY

AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULL Y NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS BALL DESIGNATION PER JESD MS-028 AND JEP95 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE PACKAGE TOP VIEW PIN “A1” CORNER X Y aaa Z aaa Z PACKAGE BOTTOM VIEW SEE NOTES SUGGESTED PCB LAYOUT TOP VIEW BGA 32 1112 REV D L TMXXXXXX µModule TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION COMPONENT PIN “A1” DETAIL A PIN 1 0.000 0.635 0.635 1.905 1.905 3.175 3.175 4.445 4.445 6.350 6.350 5.080 5.080 0.000 DETAIL A Øb (32 PLACES) F G H L J K E A B C D 2 14 35 6 7 8 DETAIL B SUBSTRATE 0.27 – 0.37 2.45 – 2.55 // bbb Z D A ccc Z DETAIL B PACKAGE SIDE VIEW MOLD CAP Z M X Y Z ddd M Z eee 0.630 ±0.025 Ø 32x SYMBOL A b D E e F G aaa bbb ccc ddd eee MIN 3.22 0.50 2.72 0.60 0.60 NOM 3.42 0.60 2.82 0.75 0.63 15.0 11.25 1.27 12.70 8.89 MAX 3.62 0.70 2.92 0.90 0.66 0.15 0.10 0.20 0.30 0.15 NOTES DIMENSIONS TOTAL NUMBER OF BALLS: 32 E b e e b F G 32-Lead (15mm × 11.25mm × 3.42mm) (Reference LTC DWG # 05-08-1851 Rev D) SEE NOTES

2889faFor more information www.linear .com/L TM2889 Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

REVISION HISTORY

REV DATE DESCRIPTION PAGE NUMBER A 03/17 Added UL-CSA File Number 1

2889fa For more information www.linear .com/L TM2889  LINEAR TECHNOLOGY CORPORATION 2016 LT 0317 REV A • PRINTED IN USA www.linear.com/LTM2889 RELATED PARTS TYPICAL APPLICATION PART NUMBER DESCRIPTION COMMENTS LTC2875 ±60V, ±25kV ESD, Fault Protected 3.3V or 5V 25kV ESD High Speed CAN T ransceiver Protected from Overvoltage Line Faults to ±60V, ±25kV ESD, up to 4Mbps LTM2881 Complete Isolated RS485/RS422 µModule T ransceiver + Power Integrated Selectable Termination, 20Mbps, ±15kV ESD, 2500V RMS Isolation with Power LTM2882 Dual Isolated RS232 µModule T ransceiver + Power 1Mbps, ±10kV ESD, 2500V RMS Isolation with Power LTM2883 SPI/Digital or I2C µModule Isolator with Integrated DC/DC Converter 2500VRMS Isolation with Adjustable ±12.5V and 5V Power in BGA Package

2889 TA02

S RE VCC, PVCC VLVDD VCCA GND2GND A GND CANH 120/uni03A9 CANL ISOLATION BARRIER BUS MASTER µC CAN 120/uni03A9 L TM2889-3 TXD RXD ON S RE VCC, PVCC VLVDD VCCB GND2GND B GND CANH CANL ISOLATION BARRIER SENSOR OR ACTUATOR µC CAN L TM2889-5 TXD RXD ON S RE VCC, PVCC VLVDD VCCC GND2GND C GND CANH CANL CABLE SHIELD OR GND WIRE ISOLATION BARRIER SENSOR OR ACTUATOR µC CAN