LTH-010-01-G-D-A SAMTEC | Alldatasheet
Document overview
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Technical content
(0,50 mm) .0197" LTH, LSH SERIES WWW.SAMTEC.COM Mates with: LSH Mates with: LTH (No. of positions per row + 2) (No. of positions per row + 2) (0,76) .030 (6,50) .256 (0,76) .030 DIA (6,73) .265 (1,91) .075 (0,50) .01969 (0,15) .006 (1,22) .048 (0,74) .029 (No. of positions per row +2) (No. of positions per row +2) (0,50) .01969 (0,20) .008 (4,80) .189 (1,27) .050 (0,76) .030 DIA (0,76) .030 (5,05) .199 (1,55) .061 (1,68) .066 (0,76) .030 (1,91) .075 OTHER OPTIONLTH NO. OF POSITIONS PER ROW DPLATING OPTION = 10µ" (0,25 µm) Gold 01 A Polyimide Film Pick & Place Pad –TR = Tape and Reel LSH NO. OF POSITIONS PER ROW DPLATING OPTION = 10µ" (0,25 µm) Gold OTHER OPTIONA Polyimide Film Pick & Place Pad –TR = Tape and Reel For complete specifi cations and recommended PCB layouts see www.samtec.com?LTH or www.samtec.com?LSH Insulator Material: Liquid Crystal Polymer Terminal Material: Phosphor Bronze Contact Material: BeCu Plating: Au over 50µ" (1,27 µm) Ni Current Rating: 1.5A per contact @ 80°C ambient Operating Temp Range: -55°C to +125°C RoHS Compliant: Ye s Processing: Lead-Free Solderable: No SMT Lead Coplanarity: (0,10 mm) .004" max Board Stacking: For applications requiring more than two connectors per board, contact ipg@samtec.com MATED HEIGHT F-213 Note: Samtec recommends right-side-up, single-pass 63/37 Tin/Lead refl ow soldering for these connectors. This product is not compatible with lead-free refl ow soldering. Note: Some lengths, styles and options are non-standard, non-returnable. SPECIFICATIONS LOW PROFILE BLADE AND BEAM –01 (2,31) .091 LEAD STYLE MATED HEIGHT* *Processing conditions will affect mated height.