LTC3026EDD

LTC3026_1 LINER | Alldatasheet

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DescripTion

1.5A Low Input Voltage VLDO Linear Regulator The L TC®3026 is a very low dropout (VLDO™) linear regula- tor that can operate at input voltages down to 1.14V . The device is capable of supplying 1.5A of output current with a typical dropout voltage of only 100mV . To allow opera- tion at low input voltages the L TC3026 includes a boost converter that provides the necessary headroom for the internal LDO circuitry. Output current comes directly from the input supply to maximize efficiency. The boost converter requires only a small chip inductor and ceramic capacitor for operation. Additionally, the boosted output voltage of one L TC3026 can supply the boost voltage for other L TC3026s, thus requiring a single inductor for multiple LDOs. A user supplied boost voltage can be used eliminating the need for an inductor altogether . The L TC3026 regulator is stable with 10µF or greater ceramic output capacitors. The device has a low 0.4V reference voltage which is used to program the output voltage via two external resistors. The device also has internal current limit, overtemperature shutdown, and reverse output current protection. The L TC3026 is avail- able in a small 10-lead MSOP or low profile (0.75mm) 10-lead 3mm × 3mm DFN package. 1.2V Output Voltage from 1.5V Input Supply n Input Voltage Range: 1.14V to 3.5V (with Boost Enabled) 1.14V to 5.5V (with External 5V Boost) n Low Dropout Voltage: 100mV at IOUT = 1.5A n Adjustable Output Range: 0.4V to 2.6V n Output Current: Up to 1.5A n Excellent Supply Rejection Even Near Dropout n Shutdown Disconnects Load from VIN and VBST n Low Operating Current: IIN = 950µA at VIN = 1.5V n Low Shutdown Current: IIN < 1µA (Typ), IBST = 0.1µA (Typ) n Stable with 10µF or Greater Ceramic Capacitors n Short-Circuit, Reverse Current Protected n Overtemperature Protected n Available in 10-Lead MSOP and 10-Lead (3mm × 3mm) DFN Packages n High Efficiency Linear Regulator n Post Regulator for Switching Supplies n Microprocessor Supply Dropout Voltage vs Output Current SW IN 0.4V OUT BST5V BOOST CONVERTER GND ADJ PG 10µH 4.7µF COUT 10µF VIN = 1.5V VOUT = 1.2V, 1.5A OFF ON 100k 8.06k 4.02kLTC3026

3026 TA01a

L1: MURATA LQH2MCN100K02 4.7µF IOUT (A) DROPOUT (mV) 100 150

3026 TA01b

0.5 1.0 1.5 1.2V 1.5V 2.0V 2.6V L, L T , L TC, L TM, Linear Technology, the Linear logo and Burst Mode are registered trademarks and ThinSOT , VLDO are trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners.

(Note 1) TOP VIEW DD PACKAGE 10-LEAD (3mm × 3mm) PLASTIC DFN

1 OUT

TJMAX = 125°C, θJA = 40°C/W EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB IN IN GND SW BST OUT OUT ADJ PG SHDN TOP VIEW MSE PACKAGE 10-LEAD PLASTIC MSOP GND TJMAX = 125°C, θJA = 40°C/W EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB pin conFiguraTion orDer inForMaTion LEAD FREE FINISH TAPE AND REEL PART MARKING PACKAGE DESCRIPTION TEMPERATURE RANGE L TC3026EDD#PBF L TC3026EDD#TRPBF LBHW 10-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C L TC3026EMSE#PBF L TC3026EMSE#TRPBF L TBJB 10-Lead Plastic MSOP –40°C to 125°C LEAD BASED FINISH TAPE AND REEL PART MARKING PACKAGE DESCRIPTION TEMPERATURE RANGE L TC3026EDD L TC3026EDD#TR LBHW 10-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C L TC3026EMSE L TC3026EMSE#TR L TBJB 10-Lead Plastic MSOP –40°C to 125°C Consult L TC Marketing for parts specified with wider operating temperature ranges. For more information on lead free part marking, go to: http://www.linear .com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear .com/tapeandreel/ Operating Junction Temperature Range

elecTrical characTerisTics

The l denotes the specifications which apply over the full operating junction temperature range, otherwise specifications are at (BOOST ENABLED, LSW = 10µH) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VIN Operating Voltage (Note 2) l 1.14 5.5 V IIN Operating Current IOUT = 100µA, VSHDN = VIN, 1.2V ≤ VIN ≤ 5V l 95 200 µA IINSHDN Shutdown Current VSHDN = 0V , VIN = 3.5V l 0.6 20 µA VBST Boost Operating Voltage (Note 7) VSHDN = VIN l 4.5 5 5.5 V VBSTUVLO Undervoltage Lockout l 4.0 4.25 4.4 V IBST Boost Operating Current IOUT = 100µA, VSHDN = VIN l 175 275 µA IBSTSHDN Boost Shutdown Current VSHDN = 0V 1 5 µA The l denotes the specifications which apply over the full operating junction temperature range, otherwise specifications are at TJ = 25°C. VIN = 1.5V , VOUT = 1.2V , VBST = 5V , CIN = CBST = 1µF , COUT = 10µF (all capacitors ceramic) unless otherwise noted. (BOOST DISABLED, VSW = 0V or Floating) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VADJ Regulation Voltage (Note 5) 1mA ≤ IOUT ≤ 1.5A, 1.14V ≤ VIN ≤ 3.5V , VBST = 5V , VOUT = 0.8V 1mA ≤ IOUT ≤ 1.5A, 1.14V ≤ VIN ≤ 3.5V , VBST = 5V , VOUT = 0.8V l 0.397 0.395 0.4 0.4 0.403 0.405 V V OUT Programming Range l 0.4 2.6 V Dropout Voltage (Note 6) VIN = 1.5V , VADJ = 0.38, IOUT = 1.5A l 100 250 mV IADJ ADJ Input Current VADJ = 0.4V l –100 100 nA IOUT Continuous Output Current VSHDN = VIN l 1.5 A ILIM Output Current Current Limit 3 A en Output Voltage Noise f = 10Hz to 100kHz, IL = 800mA Boost Disabled Boost Enabled 110 210 µVRMS µVRMS The l denotes the specifications which apply over the full operating junction temperature range, otherwise specifications are at TJ = 25°C. VIN = 1.5V , VOUT = 1.2V , CIN = CBST = 1µF , COUT = 10µF (all capacitors ceramic) unless otherwise noted. (BOOST ENABLED or DISABLED) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VIN Operating Voltage (Note 2) l 1.14 3.5 V IIN Operating Current IOUT = 0mA, VOUT = 0.8V , VSHDN = VIN, VIN = 1.2V IOUT = 0mA, VOUT = 1.2V , VSHDN = VIN, VIN = 1.5V IOUT = 0mA, VOUT = 1.2V , VSHDN = VIN, VIN = 2.5V IOUT = 0mA, VOUT = 1.2V , VSHDN = VIN, VIN = 3.5V 1160 950 640 400 µA µA µA µA IINSHDN Shutdown Current VSHDN = 0V , VIN = 3.5V l 0.6 20 µA Inductor Size Requirement Inductor Peak Current Requirement 4.7 150 10 40 µH mA VBST Boost Output Voltage Range VSHDN = VIN 4.8 5 5.2 V VBSTUVLO Boost Undervoltage Lockout l 4.0 4.2 4.4 V Boost Output Drive (Note 3) VIN < 1.4V VIN ≥ 1.4V mA mA

IN Supply Current with Boost Converter Enabled BST Supply Current with Boost Converter Disabled IN Supply Current with Boost Converter Disabled Typical perForMance characTerisTics Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. This IC has overtemperature protection that is intended to protect the device during momentary overload conditions. Junction temperatures will exceed 125°C when overtemperature is active. Continuous operation above the specified maximum operating junction temperature may impair device reliability. Note 2: Minimum Operating Voltage required for regulation is: VIN ≥ VOUT(MIN) + VDROPOUT Note 3: When using BST to drive loads other than L TC3026s, the load must be high impedance during start-up (i.e. prior to PG going high). Note 4: PG threshold expressed as a percentage difference from the “VADJ Regulation Voltage” as given in the table. Note 5: Operating conditions are limited by maximum junction temperature. The regulated output voltage specification will not apply for all possible combinations of input voltage and output current. When operating at maximum input voltage, the output current range must be limited. When operating at maximum output current, the input voltage range must be limited. Note 6: Dropout voltage is minimum input to output voltage differential needed to maintain regulation at a specified output current. In dropout, the output voltage will be equal to VIN – VDROPOUT. Note 7: To maintain correct regulation VOUT ≤ VBST – 2.4V Note 8: The L TC3026E is guaranteed to meet performance specifications from 0°C to 125°C. Specifications over the –40°C to 125°C operating junction temperature range are assured by design, characterization and correlation with statistical process controls. The L TC3026I is guaranteed over the full –40°C to 125°C operating junction temperature range. Note that the maximum ambient temperature is determined by specific operating conditions in conjunction with board layout, the rated package thermal resistance and other environmental factors.

3026 G01

VIN (V) 1.0 INPUT CURRENT (mA) 1.50 1.25 1.00 0.75 0.50 0.25 –40°C 25°C 85°C

3026 G02

VIN (V) 1.0 IBST (µA) 200 150 100 –40°C 25°C 85°C 125°C VBST = 5V

3026 G03

VIN (V) IIN (µA) 200 150 100 –40°C 25°C 85°C 125°C VBST = 5V The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TJ = 25°C. VIN = 1.5V , VOUT = 1.2V , CIN = CBST = 1µF , COUT = 10µF (all capacitors ceramic) unless otherwise noted. (BOOST ENABLED or DISABLED) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VIHSHDN SHDN Input High Voltage 1.14V ≤ VIN ≤ 3.5V 3.5V ≤ VIN ≤ 5.5V l l 1.0 1.2 V V VILSHDN SHDN Input Low Voltage 1.14V ≤ VIN ≤ 5.5V l 0.4 V IIHSHDN SHDN Input High Current SHDN = VIN –1 1 µA IILSHDN SHDN Input Low Current SHDN = 0V –1 1 µA VOLPG PG Output Low Voltage IPG = 2mA l 0.1 0.4 V IOHPG PG Output High Leakage Current VPG = 5.5V 0.01 1 µA PG Output Threshold (Note 4) PG High to Low PG Low to High –12 –10

ADJ Voltage vs Temperature IN Shutdown Current BST Voltage vs Temperature Typical perForMance characTerisTics Dropout Voltage vs Input Voltage Ripple Rejection Ripple Rejection Shutdown Threshold Output Current Limit BST to OUT Headroom Voltage

3026 G04

TEMPERATURE (°C) –50 –25 404 403 402 401 400 399 398 397 396 75 1000 5025 125 ADJUST VOLTAGE (mV) 1mA 1.5A VBST = 5V VIN = 1.5V VOUT =1.2V

3026 G05

–50 –25 75 1000 5025 125 TEMPERATURE (°C) INPUT CURRENT (µA) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 1.2V 2.5V 3.5V

3026 G06

–50 –25 75 1000 5025 125 TEMPERATURE (°C) 5.050 5.025 5.000 4.975

4.950 BST VOLTAGE (V)

VIN = 1.5V

3026 G07

VIN (V) 1.2 200 180 160 140 120 100 DROPOUT (mV) –40°C 25°C 85°C 125°C VFB = 0.38V IOUT =1.5A

3026 G08

VIN (V) 1.2 RIPPLE REJECTION (dB) 1MHz 100kHz 10kHz VBST = 5V VOUT =1.2V IOUT = 800mA COUT = 10µF

3026 G09

FREQUENCY (Hz) 100 1000001000 10000 1000000 1E+07 RIPPLE REJECTION (dB) VBST = 5V VIN = 1.5V VOUT =1.2V IOUT = 800mA COUT = 10µF

3026 G10

VIN (V) VSHDN THRESHOLD (mV) 1200 900 600 300 2 3 4 5 6 –40°C 25°C 125°C RISE RISE RISE FALL FALL FALL

3026 G11

VIN (V) 1.0 IOUT (A) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 CURRENT LIMIT THERMAL LIMIT VOUT = 0V TA = 25°C

3026 G12

TEMPERATURE (°C) –50 VBST – VOUT (V) 2.22 2.20 2.18 2.16 2.14 2.12 2.10 2.08 2.06 2.04 2.02 0 50 75–25 25 100 125

Typical perForMance characTerisTics IN Supply T ransient Response BST/OUT Start-Up BST Ripple and Feedthrough to OUT

3026 G16

1.5V VOUT AC 10mV/DIV 10µs/DIV VOUT = 1.2V IOUT = 800mA COUT = 10µF VBST = 5V TA = 25°C

3026 G17

200µs/DIVTA = 25°C ROUT = 1/uni03A9 VIN = 1.7V 1.5V

3026 G18

20µs/DIV VOUT = 1.2V VIN = 1.5V IOUT = 1A COUT = 10µF LSW = 10µH TA = 25°C Delay from Enable to PG with Boost Disabled Delay from Enable to PG with Boost Enabled Output Load T ransient Response

3026 G13

VIN (V) 1.0 DELAY (µs) 400 375 350 325 300 275 250 –40°C 25°C 85°C VOUT = 0.8V ROUT = 8/uni03A9

3026 G14

VIN (V) 1.0 DELAY (ms) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 –40°C 25°C 85°C VOUT = 0.8V ROUT = 8/uni03A9

3026 G15

1.5A 2mA OUT AC 20mV/DIV 50µs/DIVVOUT = 1.5V COUT = 10µF VIN = 1.7V VBST = 5V

IN (Pins 1, 2): Input Supply Voltage. Output load current is supplied directly from IN. The IN pin should be locally bypassed to ground if the L TC3026 is more than a few inches away from another source of bulk capacitance. In general, the output impedance of a battery rises with frequency, so it is usually advisable to include an input bypass capacitor when supplying IN from a battery. A capacitor in the range of 0.1µF to 4.7µF is usually sufficient. GND (Pin 3, Exposed Pad Pin 11): Ground and Heat Sink. Connect the exposed pad to the PCB ground plane or large pad for optimum thermal performance. SW (Pin 4): Boost Switching Pin. This is the boost converter switching pin. A 4.7µH to 40µH inductor able to handle a peak current of 150mA is connected from this pin to VIN. The boost converter can be disabled by floating this pin or shorting this pin to GND. This allows the use of an external boosted supply from a second L TC3026 or other source. See Operating with Boost Converter Disabled section for more information. BST (Pin 5): Boost Output Voltage Pin. With boost con - verter enabled bypass the BST pin with a ≥4.7µF low ESR ceramic capacitor to GND (CBST). BST does not load VIN when in shutdown, but is diode connected to IN through the external inductor , thus, will not go to ground with VIN present. Users should not present any loads to the BST pin (with boost enabled) until PG signals that regulation has been achieved. When providing an external BST volt- age (i.e. boost converter disabled) a 1µF low ESR ceramic capacitor can be used. SHDN (Pin 6): Shutdown Input Pin, Active Low. This pin is used to put the L TC3026 into shutdown. The SHDN pin current is typically less than 10nA. The SHDN pin cannot be left floating and must be tied to a valid logic level (such as IN) if not used. PG (Pin 7): Power Good Pin. When PG is high impedance OUT is in regulation, and low impedance when OUT is in shutdown or out of regulation. ADJ (Pin 8): Output Adjust Pin. This is the input to the error amplifier . It has a typical bias current of 0.1nA flowing into the pin. The ADJ pin reference voltage is 0.4V referenced to ground. The output voltage range is 0.4V to 2.6V and is typically set by connecting ADJ to a resistor divider from OUT to GND. See Figure 2. OUT (Pins 9, 10): Regulated Output Voltage. The OUT pins supply power to the load. A minimum output capacitance of 5µF is required to ensure stability. Larger output capaci- tors may be required for applications with large transient loads to limit peak voltage transients. See the Applica - tions Information section for more information on output capacitance.

SHDN 0.4V REFERENCE BOOST CONVERTER 4 5 UVLO 1,2 SW IN OUT BST SHDN ADJ PG 9,10 0.372V 3026 BD GND 3,11 OVERSHOOT DETECT VOFF block DiagraM

The L TC3026 is a VLDO (very low dropout) linear regulator which operates from input voltages as low as 1.14V . The LDO uses an internal NMOS transistor as the pass device in a source-follower configuration. The BST pin provides the higher supply necessary for the LDO circuitry while the output current comes directly from the IN input for high efficiency regulation. The BST pin can either be supplied off-chip by an external 5V source or it can be generated through the internal boost converter of the L TC3026. Boost Converter Operation For applications where an external 5V supply is not avail- able, the L TC3026 contains an internal boost converter to produce the necessary 5V supply for the LDO. The boost converter utilizes Burst Mode® operation to achieve high efficiency for the relatively low current levels needed for the LDO circuitry. The boost converter requires only a small chip inductor between the IN and SW pins and a small 4.7µF capacitor at BST . The operation of the boost converter is described as fol- lows. During the first half of the switching cycle, an internal NMOS switch between SW and GND turns on, ramping the inductor current. A peak comparator senses when the inductor current reaches 100mA, at which point the NMOS is turned off and an internal PMOS between SW and BST turns on, transferring the inductor current to the BST pin. The PMOS switch continues to deliver power to BST until the inductor current approaches zero, at which point the PMOS turns off and the NMOS turns back on, repeating the switching cycle. A burst comparator with hysteresis monitors the voltage on the BST pin. When BST is above the upper threshold of the comparator , no switching occurs. When BST falls below the comparator’s lower threshold, switching commences and the BST pin gets charged. The upper and lower thresholds of the burst comparator are set to maintain a 5V supply at BST with approximately 40mV to 50mV of ripple. Care must be taken not to short the BST pin to GND, since the body diode of the internal PMOS transistor connects the BST and SW pins. Shorting BST to GND with an induc- tor connected between IN and SW can ramp the inductor current to destructive levels, potentially destroying the inductor and/or the part. Operating with Boost Converter Disabled The L TC3026 has an option to disable the internal boost converter . With the boost converter disabled, the L TC3026 becomes a bootstrapped device and the BST pin must be driven by an external 5V supply, or driven by the BST pin of a second L TC3026 with the boost converter enabled. The recommended method for disabling the boost converter is to simply float the SW pin. With the SW pin floating no energy can be transferred to BST which effectively disables the boost converter . A second method for disabling the boost converter is to short SW to GND. Shorting SW to GND to disable the boost converter should only be used in cases where IN is in its specified operating range when the L TC3026 is enabled. Enabling the part before V IN is in its operating range can cause current to be pulled off BST with the SW pin grounded. This can cause current limited supplies to hang under the right conditions. Connecting SHDN to IN will enable the part before IN is in its specified operating range. With SHDN connected to IN the SW pin should be floated to disable the boost converter . Either method of disabling the boost converter may be used if the signal driving the SHDN pin is high only when IN is in its specified operating range. Connecting SHDN to the power good pin of the supply driving IN is one method that allows both disable methods to be used. A single L TC3026 boost converter can be used to drive multiple bootstrapped L TC3026s with the internal boost converters disabled. Thus a single inductor can be used to power two (or possibly more) functioning L TC3026s. In cases where all L TC3026s have the same input supply (IN) the internal boost converters of the bootstrapped L TC3026s can be disabled by shorting SW to GND or float- ing the SW pin. If the L TC3026s are not all connected to the same input supply then the internal boost converters of the bootstrapped L TC3026s are disabled by floating the SW pin. If there is ever a doubt about which method to use re - member that it is always safe to float the SW pin to dis - able the boost converter . There is no noticeable difference in performance of the part regardless of which disable method is used. operaTion

Figure 1. Output Load Step Response pulled to GND through the external divider . small as 10µF is all that is required for output bypassing. common LDOs (range of 0.4V to 2.6V). Figure 2. Soft-Start with Boost Disable Figure 3. Programming the L TC3026 of approximately 200µs, see Figure 2.

3026 F01

3026 F02

3026 F03

tiply by the gain of the feedback network (i.e. 1 + R2/R1). ESR of 0.05Ω or less is recommended to ensure stability. is available in higher values. times on the L TC3026 LDO output. Figure 4. Ceramic Capacitor DC Bias Characteristics Figure 5. Ceramic Capacitor Temperature Characteristics

3026 F04

3026 F05

for a list of component suppliers. Table 1. Inductor Vendor Information used in parallel for correct operation. by the maximum rated junction temperature (125°C). consumption can be ignored for thermal calculations. protect the device during momentary overload conditions. heat sources mounted nearby must also be considered. power dissipation is only about 1mW, thus can be ignored.

junction temperature drops back to approximately 140°C. and VIN varied, IN current flow will follow Figure 6’s curves. VOUT is held below the regulation voltage. to the switching inductor with as short a trace as possible. other stray capacitance to the ADJ pin. Figure 6. Input Current vs Input Voltage Figure 7. Suggested Layout

3026 F07

3026 F06

Using 1 Boost with Multiple Regulators 2.5V Output from 3.3V Supply with External 5V Bias IN SW OUT BST GND ADJ PG 10µH 4.7µF COUT1 10µF VIN = 2.5V VOUT1 1.8V , 1.5A PG1 PG2 100k 14k 4.02k L TC3026

3026 TA02

L TC3026 WITH BOOST ENABLED FANOUT: 3-L TC3026 FOR VIN <1.4V 5-L TC3026 FOR VIN >1.4V * THE SW PIN OF BOOTSTRAPPED L TC3026 SHOULD BE FLOATED (DISCONNECTED FROM GND) IN CASES WHERE THE BOOTSTRAPPED L TC3026 DOES NOT SHARE THE SAME INPUT SUPPL Y (IN) AS THE BOOSTING L TC3026. BOOT STRAPPED L TC3026 (BOOST DISABLED) 4.7µF IN SW* OUT BST GND ADJ PG 1µF COUT2 10µF VOUT2 1.5V , 1.5A 100k 11k 4.02k L TC3026 SHDN 1µF TO ADDITIONAL REGULATORS PG

3026 TA03

SW* OUT BST GND ADJ PG 1µF COUT 10µF VOUT 2.5V , 1.5A 100k 21k 4.02k L TC3026 SHDN 1µF VBIAS = 5V N/C VIN = 3.3V * SEE OPERATING WITH BOOST CONVERTER DISABLED SECTION FOR INFORMATION ON DISABLING BOOST CONVERTER.

10-Lead Plastic MSOP , Exposed Die Pad (Reference L TC DWG # 05-08-1664 Rev C) MSOP (MSE) 0908 REV C 0.53 p 0.152 (.021 p .006) SEATING PLANE 0.18 (.007) 1.10 (.043) MAX 0.17 – 0.27 (.007 – .011) TYP 0.86 (.034) REF 0.50 (.0197) BSC 1 2 3 4 5 4.90 p 0.152 (.193 p .006) 0.497 p 0.076 (.0196 p .003) REF8910 7 6 3.00 p 0.102 (.118 p .004) (NOTE 3) 3.00 p 0.102 (.118 p .004) (NOTE 4) NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 0.254 (.010) 0o – 6o TYP DETAIL “A” DETAIL “A” GAUGE PLANE 5.23 (.206) MIN 3.20 – 3.45 (.126 – .136) 0.889 p 0.127 (.035 p .005) RECOMMENDED SOLDER PAD LAYOUT 0.305 p 0.038 (.0120 p .0015) TYP 2.083 p 0.102 (.082 p .004) 2.794 p 0.102 (.110 p .004) 0.50 (.0197) BSC BOTTOM VIEW OF EXPOSED PAD OPTION 1.83 p 0.102 (.072 p .004) 2.06 p 0.102 (.081 p .004) 0.1016 p 0.0508 (.004 p .002) DETAIL “B” DETAIL “B” CORNER TAIL IS PART OF THE LEADFRAME FEATURE. FOR REFERENCE ONL Y NO MEASUREMENT PURPOSE

0.05 REF

0.29 REF

10-Lead Plastic DFN (3mm × 3mm) (Reference L TC DWG # 05-08-1669 Rev B) 3.00 p0.10 (4 SIDES) NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2). CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 0.40 p 0.10 BOTTOM VIEW—EXPOSED PAD 1.65 p 0.10 (2 SIDES) 0.75 p0.05 R = 0.125 TYP 2.38 p0.10 (2 SIDES) 106 PIN 1 TOP MARK (SEE NOTE 6)

0.200 REF

0.00 – 0.05 (DD) DFN REV B 0309 0.25 p 0.05 2.38 p0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 1.65 p0.05 (2 SIDES)2.15 p0.05 0.50 BSC 0.70 p0.05 3.55 p0.05 PACKAGE OUTLINE 0.25 p 0.05

0.50 BSC

Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However , no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

revision hisTory

REV DATE DESCRIPTION PAGE NUMBER D 3/10 Addition to Absolute Maximum Ratings Changes to Electrical Characteristics Changes to Pin Functions Changes to Operation Section Changes to Typical Applications Additions to Related Parts 3, 4 14, 18 (Revision history begins at Rev D)

Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear .com  LINEAR TECHNOLOGY CORPORATION 2005 LT 0310 REV D • PRINTED IN USA relaTeD parTs Typical applicaTion PART NUMBER DESCRIPTION COMMENTS L T1761 100mA, Low Noise LDO in ThinSOT™ 300mV Dropout Voltage, Low Noise: 20µVRMS, VIN = 1.8V to 20V , ThinSOT Package L T1762 150mA, Low Noise LDO 300mV Dropout Voltage, Low Noise: 20µVRMS, VIN = 1.8V to 20V , MS8 Package L T1763 500mA, Low Noise LDO 300mV Dropout Voltage, Low Noise: 20µVRMS, VIN = 1.8V to 20V , SO-8 Package L T1764A 3A, Fast T ransient Response, Low Noise LDO 340mV Dropout Voltage, Low Noise: 40µVRMS, VIN = 2.7V to 20V , TO-220 and DD Packages L T1844 150mA, Very Low Dropout LDO 80mV Dropout Voltage, Low Noise <30µVRMS, VIN = 1.6V to 6.5V , Stable with 1µF Output Capacitors, ThinSOT Package L T1962 300mA, Low Noise LDO 270mV Dropout Voltage, Low Noise 20µVRMS, VIN = 1.8V to 20V , MS8 Package L T1963A 1.5A Low Noise, Fast T ransient Response LDO 340mV Dropout Voltage, Low Noise: 40µVRMS, VIN = 2.5V to 20V , TO-220, DD, SOT-223 and SO-8 Packages L T1964 200mA, Low Noise, Negative LDO 340mV Dropout Voltage, Low Noise 30µVRMS, VIN = –1.8V to –20V , ThinSOT Package L T1965 1.1A, Low Noise, Low Dropout Linear Regulator 290mV Dropout Voltage, Low Noise 40µVRMS, VIN = 1.8V to 20V , TO-220, DDPak, MSOP and 3mm × 3mm DFN Packages L TC3025 300mA Micropower VLDO Linear Regulator 45mV Dropout Voltage, Low Noise 80µVRMS, VIN = 0.9V to 5.5V , Low IQ: 54µA, 2mm × 2mm 6-Lead DFN Package L T3080/L T3080-1 1.1A, Parallelable, Low Noise, Low Dropout Linear Regulator 300mV Dropout Voltage (2 Supply), Low Noise 40µVRMS, VIN = 1.2V to 36V , VOUT = 0V to 35.7V , Directly Parallelable, TO-220, SOT-223, MSOP-8 and 3mm × 3mm DFN Packages L T3150 Fast T ransient Response, VLDO Regulator Controller 0.035mV Dropout Voltage via External FET , VIN = 1.3V to 10V Efficient, Low Noise 1.5V Output from 1.8V DC/DC Buck Converter (L TC3026 Boost Converter Disabled) ITH RUN/SS SYNC/FCB VFB GND SW IN SHDN GND BST OUT ADJ PG SW SENSE– VIN TG BG L TC1773 RSENSE 0.04/uni03A9 33pF 200pF30k 0.1µF 1µF 1µF 80.6k 100k CIN 47µF 10V COUT 10µF CBUCK 47µF 10V VBUCK 1.8V 4.5V ≤ VIN ≤ 5.5V Si9942DY L TC3026 11k 100k 4.02k VOUT 1.5V 1.5A PG 2.5µH

3026 TA04

CIN, CBUCK: TAIYO YUDEN LMK550BJ476MM L1: CDRH5D28 RSENSE: IRC LR1206-01-R040-F N/C