LT10.7MS2 TGS | Alldatasheet
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Technical content
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 1. SCOPE This specification shall cover the characteristics of the ceramic filter with the type LT10.7MS2. 2. PART NO.: PART NUMBER CUSTOMER PART NO SPECIFICATION NO LT10.7MS2 3. OUTLINE DRAWING AND STRUCTURE: Appearance: No visible damage and dirt. Construction: Leads are soldered on electrode and body is molded by resin. Dimensions: TIGER ELECTRONIC CO.,LTD
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD.
3.4 STRUCTURE
Lead Wore Solder plating copper wire Mold Resin epoxy resin Solder High-melting solder (No Pb) Ceramic Substrate Lead titanate-zirconate Over coating Clear Epoxy Resin 4. RATING AND ELECTRICAL SPECIFICATIONS:
4.1 RATING
Withstand DC Voltage max 50V 1minute Applied DC voltage max 10V Operating temperature -20 ℃～80℃ Temp. Coefficient of Frequency (%) max ±0.5（Center Frequency drift， -20℃～80℃） Storage temperature range -40 ℃～80℃ Lead Wire Solder Ceramic Substrate Mold Resin Over coating
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD.
4.2 ELECTRICAL SPECIFICATIONS
Center Frequency fo (MHz) 10.700±0.030 (Red) 10.670±0.030(Blue) 10.730±0.030(Orange) 3dB Band Width (kHz) 230 ±50 20dB Band Width (kHz) max 570 Insertion Loss (dB) max 6.0 Ripple (within 3dB bandwidth) % max 1.0 Spurious Response (dB) min 40 (9 MHz ~12MHz) Input/Output Impedance ( Ω) 330 5. MEASUREMENT: Measurement Conditions: Parts shall be measured under a condition ( Temp. ：20℃ ±15 ℃ ,Humidity ： 65%±20% R.H.) unless the standard condition(Temp.：25℃±3℃,Humidity ：65%±5% R.H.) is regulated to measure. Test Circuit: Rg+R1=R2=330Ω C=10pF(Including stray capacitance and input capacitance of RF voltmeter)
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD.
6 PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS
No Item Condition of Test Performance Requirements
6.1 Humidity
Subject the filter at (60 ± 2) ℃ and 90%~95% R.H. for 100 hours, filter shall be measured after being placed in natural conditions for 1 hour. It shall fulfill the specifications in Table 1. 6.2 High Temperature Exposure Subject the filter to (85 ±5)℃ for 100 hours, filter shall be measured after being placed in natural conditions for 1 hour. It shall fulfill the specifications in Table 1. 6.3 Low Temperature Exposure Subject the filter to (–-40 ±5)℃ for 100 hours, filter shall be measured after being placed in natural conditions for 1 hour. It shall fulfill the specifications in Table 1.
6.4 Thermal
After temperature cycling of blow table was performed 5 times, filter shall be measured after being placed in natural conditions for 1 hour. Temperature Time 2 Room temp. 5 S 4 Room temp. 5 S It shall fulfill the specifications in Table 1.
6.5 Vibration
Subject the filter to vibration for 2 hours each in x y and z axis with the amplitude of 1.5mm, the frequency shall be varied uniformly between the limits of 10Hz~55Hz and then filter shall be measured. It shall fulfill the specifications in Table 1.
6.6 Mechanical
Apply the half-sine shock pulses: 981m/s 2,6ms for 3 times in each direction of three mutually perpendicular planes. No visible damage and it shall fulfill the specifications in Table 1.
6.7 Drop test
Filter shall be measured after 3 times random dropping from the height of 1m on concrete floor. No visible damage and it shall fulfill the specifications in Table 1.
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. (Continued from the preceding page) No Item Condition of Test Performance Requirements 6.8 Resistance to Soldering Heat Lead terminals are immersed up to 2 mm from filter’s body in soldering bath of (+260±5)℃ for (10 ±1) seconds and then filter shall be measured after being placed in natural conditions for 1 hour. It shall fulfill the specifications in Table 1. 6.9 Short time heat resistance Store in (+160±2) ℃ for 2 min and then filter shall be measured after being placed in natural conditions for 1 hour. It shall fulfill the specifications in Table 1.
6.10 Solderability
Lead terminals are immersed up to 2mm from filter’s body in soldering bath of (+250±5)℃ for (2 ±0.5 )seconds. More than 95% of the terminal surface of the filter shall be covered with fresh solder. 6.11 6.11.1 6.11.2 Terminal Strength Terminal Pulling Terminal Bending Force of 4.9N is applied to each lead in axial direction for (10±1) seconds. When force of 4.9N is applied to each lead in axial direction, the lead shall folded up 90°from the axial direction and folded back to the axial direction. The speed of folding shall be each 3 seconds. No visible damage and it shall fulfill the specifications in Table 1. Table 1 Item Specification after test Center Frequency drift ±30kHz max Insertion Loss drift ±2dB max. 3dB Band Width drift ±20kHz max. 20dB Band Width drift ±30kHz max. Spurious Response 25 dB min Note ： The limits in the above table are referenced to the initial measurements.
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD.
7 PACKAGE
To protect the products in storage and transportation ，it is necessary to pack them（outer and inner package）.On paper pack, the following requirements are requested.
7.1 Dimensions and Mark
At the end of package, the warning (moisture proof, upward put) should be stick to it. Dimensions and Mark (see below) NO. Name Quantity Notes
1 Inner Box 40
2 Box 2
3 Package 1
4 Adhesive tape 1.2m
5 Label 1
6 Belt 2.9m
7 Certificate of approval 1
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD.
7.2 Section of package
Package is made of corruga ted paper with thickness of 0.8cm.Package has 2 inner boxes, each has 20 inner boxes (each box for plastic bag).
7.3 Quantity of package
Per plastic bag 500 pieces Per inner box 3 plastic bag Per package 40 inner boxes （ 60000 pieces of piezoelectric ceramic part ）
7.4 Inner box Dimensions
1 Label
2 QC Label
3 Inner Box
Pars shall be packaged in box w ith hold down tape upside. Part No., quantity and lot No. UNIT: mm
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD.
8 OTHER
8.1 Caution of use
8.1.1 Do not use this product w ith bend. Please don’t apply excess mechanical stress to the compone nt and terminals at soldering.
8.1.2 The component may be damage d when an excess stress will be
applied.
8.1.3 This specification mentions the quality of the component as a
single unit. Please insure the compone nt is thoroughly evaluated in your application circuit.
8.2 Notice
8.2.1 Please return one of this specification after your signature of
acceptance.
8.2.2 When something gets doubtful w ith this specifications, we shall
jointly work to get an agreement.