LSP1000 MICROSEMI | Alldatasheet
Document overview
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Technical content
Microwave Products Division 75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748 Page 1Copyright 2000 MSC1618.PDF 2000-11-06 WWW.Microsemi .COM LSP1000 thru LSP1012 ENHANCED PERFORMANCE SURFACE MOUNT "EPSM" PACKAGED DEVICES PRODUCT PREVIEW MICROWAVE PRODUCTS DIVISION
DESCRIPTION
Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistency of performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high performance wireless applications including VCO's, limiters, pin switches and pin attenuators. Select PIN diodes for switching, attenuation or limiting through 6 GHz. They are available in multiple chip configuration as well as outlines which directly replace SOT- 23 and SOD-323 devices. Other devices and values are always available - contact our applications engineering department for more details. IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com PIN DIODE DEVICES FOR WIRELESS ATTENUATORS, SWITCHES AND LIMITERS ABSOLUTE MAXIMUM RATINGS AT 25 °° °°C Forward Current (I F): 1 Amp (1 µµ µµs Pulse) Power Dissipation (P D): 500 mW (Derate to 0 at max T J) Peak Inverse Volts (PIV): Same as V B Junction Temp. (Operating): -65 °° °°C to + 125°° °°C Storage Temp. (Non-Operating): -65 °° °°C to + 125°° °°C Leakage: <50 nA @ 80 %% %% VB@ 25°° °°C TEST CONDITIONS: V B @ 10 µµ µµA R S @ 100 MHz C T @ 1 MHz T L @ IF = 10 mA IR = 6 mA KEY FEATURES KEY FEATURES KEY FEATURES KEY FEATURES !"Frequencies from VHF to 6 GHz !"Lower Parasitics !"Mil Grade Ceramic/Epoxy Amalgam Construction !"Dense SiO2 Junction Passivation !"Superior Consistency/Repeatability !"Footprints Available for SOT-23/SOD-323/SOD-123 !"Priced for Commercial Products !"Tape & Reel for Volume Pick & Place APPLICATIONS/BENEFITAPPLICATIONS/BENEFIT APPLICATIONS/BENEFITAPPLICATIONS/BENEFITSS SS !"High performance wireless surface mounting including: !"GSM !"TAGS !"WANS !"PCS !"AMPS !"DECT !"CELLULAR LLSSPP11000000 tthhrruu LLSSPP11001122 TABLE 1 MODEL VB CT @ VR MAX. RS @ IF MAX. TL TYP. APPLIC -TION LSP1000 > 35 .28 @ 5V 2.5ΩΩ ΩΩ @ 5 mA 80nS SWITCH LSP1002 > 100 .32 @ 50V 4ΩΩ ΩΩ @ 100 mA 1500nS ATTENU- ATOR LSP1004 > 35 .75 @ 20V 0.6ΩΩ ΩΩ @ 10 mA 150nS SWITCH LSP1011 > 200V .35 @ 50V 2ΩΩ ΩΩ @ 100 mA 2000nS ATTENU- ATOR LSP1012 > 20V .35pF @ 10V 1.8ΩΩ ΩΩ @ 10 mA 5nS LIMITER
Microwave Products Division 75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748 Page 3Copyright 2000 MSC1618.PDF 2000-11-06 WWW.Microsemi .COM LSP1000 thru LSP1012 ENHANCED PERFORMANCE SURFACE MOUNT "EPSM" PACKAGED DEVICES PRODUCT PREVIEW MICROWAVE PRODUCTS DIVISION NNOOTTEESS