LSH-020-01-G-D-A SAMTEC | Alldatasheet
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Technical content
(0.50 mm) .0197" LTH, LSH SERIES WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice. LTH Mates with: LSH LSH Mates with: LTH (No. of positions per row + 2) (No. of positions per row + 2) (0.89) .035 (6.50) .256 (0.76) .030 DIA (6.73) .265 (1.91) .075 (0.50) .01969 (0.15) .006 (1.22) .048 (0.74) .029 (No. of positions per row +2) (No. of positions per row +2) (0.50) .01969 (0.20) .008 (4.80) .189 (0.76) .030 DIA (0.89) .035 (5.05) .199 (1.55) .061 (1.68) .066 (0.76) .030 (1.27) .050 OTHER OPTIONLTH NO. OF POSITIONS PER ROW DPLATING OPTION = 10 µ" (0.25 µm) Gold 01 A Polyimide Film Pick & Place Pad –TR = Tape and Reel LSH NO. OF POSITIONS PER ROW DPLATING OPTION = 10 µ" (0.25 µm) Gold OTHER OPTIONA Polyimide Film Pick & Place Pad –TR = Tape and Reel F-217 Note: Some lengths, styles and options are non-standard, non-returnable. LOW PROFILE BLADE AND BEAM For complete specifications and recommended PCB layouts see www.samtec.com?LTH or www.samtec.com?LSH Insulator Material: Liquid Crystal Polymer Terminal Material: Phosphor Bronze Contact Material: BeCu Plating: Au over 50 µ" (1.27 µm) Ni Operating Temp Range: -55 °C to +125 °C RoHS Compliant: Ye s MATED HEIGHT SPECIFICATIONS –01 (2.31) .091 LEAD STYLE MATED HEIGHT* *Processing conditions will affect mated height. For complete scope of recognitions see www.samtec.com/quality RECOGNITIONS FILE NO. E111594 PROCESSING Lead-Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max Board Stacking: For applications requiring more than two connectors per board, contact ipg@samtec.com