LPM013M091A

LPM013M091A DATAMODUL | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 50

Technical content

Datasheet sections

• 1.1 STRUCTURES …………………………………………………………………………… …
• 1.2 BLOCK DIAGRAM ……………………………………………………………………… …
• 1.3 I/O PINS ………………………………………………………………………………… …
• 3.1 Operating Conditions …………………………………………………………………… …
• 3.1.1 Input and output power supply voltage conditions ………………………………… …
• 3.1.2 Input signal voltage conditions (DC conditions) ……………………………… …
• 3.1.4 Backlight Operating Conditions ………………………………………………………
• 4.1 MIPI INTERFACE …………………………………………………………………… …
• 4.2 MIPI DC CHARACTERISTICS ……………………………………………………… …
• 4.3 MIPI AC CHARACTERISTICS ……………………………………………………… …
• 4.4 SPI ………………………………………………………………… … …………………
• 5.1 Power ON/OFF sequence ……………………………………………………………… …
• 5.2 Reset Timing Characteristics ……………………………………………………………… …
• 6.1 Status flow ……………………………………………………………………………… …
• 6.1.1 Sequence 1(A,B-1,B-2,N-1,N-2) ………………………………………………………
• 6.1.2 Sequence 2(C,D,E,F,L,M,N,O,Y,
• 6.1.3 Sequence 3(G-1,G-2,O-1,O-2) ………………………………………………………
• 6.1.4 Sequence 4(H-1,H-2,I-1,I-2) ………………………………………………………
• 6.2 ID read address …………………………………………………………………………
• 7.1 OPTICAL CHARACTERISTICS ………………………………………………………… …
• 7.1.1 Reflective mode ……………………………………………………………………… …
• 7.1.2 Transmissive mode ………………………………………………………………… …
• 7.2 DEFINITION AND CONDITION OF OPTICAL CHARACTERISTICS ……………… …
• 9.1 CONDITIONS OF RELIABILITY AND MECHANICAL TEST ……………………… …
• 9.2 CRITERIA FOR JUDGEMENT ………………………………………………………… …
• 10.1 MASTER CARTON ………………………………………………………………… …
• 10.2 INNER CARTON … ………………………………………………………………… …
• 12.1 HANDLING ………………………………………………………………………………
• 12.2 DESIGN OF APPLICATION …………………………………………………………… …
• 12.3 DISPLAY CHARACTERISTICS ……………………………………………………… …
• 12.4 KEEPING ………………………………………………………………………………
• 12.5 DISPOSAL ………………………………………………………………………………
• 12.6 OTHERS ………………………………………………………………………………

1.34” TFT - round Type - LTPS Version: 02 Date: 06.07.2017 Note: This specification is subject to change without prior notice SPECIFICATION www.data-modul.com

Revision History

Issued No. JDG010000677 Revision 02 Product Name LPM013M091A Customer Part No. - Date/Rev. Contents of change Reasons Remarks May 15,2017 - New Release - LPM013M091A(01) July 06,2017 02 p02,03 Clerical corrections C p27 Setting for not using MIPI A Setting for SPI's inactive period A P29 Trial use only D P31 (L),(M) D P33 Add note A P34 Add note A P38 Ver change C P40 Add note A Shipment inspection standard Add Confidential A (C): Changed (A): Appended (D): Deleted (F): Filled in

仕様書パターン2 CAS表紙 Ver.02 Date : July 06, 2017 JDG01-E-01E Specification [Product Name : LPM013M091A]

This product is the reflective display which can perform 2 types, super low power 8 colors of MIP (Memory In Pixel) mode and normal 262k colors by the command changes. Therefore, the specification is defined in reflective mode only unless otherwise specified in the specification sheet. JDG10000677-02Japan Display Inc. Date July 6, 2017 Page Analog(Normal) driving mode or Memory in Pixel mode 2.8(Typ.) LCD optical mode Light source type ECB normally black (Reflective type) Hard Coat type (*Pencil Hardness : 2H) Backlight with white LED (1chip) 2/46Sh. No. No. FACTOR

1 LCD structure

Outward (W x H x D) Weight

11 Polarizer

9 Number of colors

Dot pitch (Horizontal x Vertic a Screen size Number of dots Dot layout 34.08 (1.34 inch) *round type 77,782(320xRGBx300) dot mm UNIT mm g mm 0.0355×0.1065 RGB Stripe SPI / 1-lane MIPI DSI 8 colors at MIP mode or 262k colors at normal mode 1. BASIC SPECIFICATIONS

1.1 STRUCTURES

(*1-1) Excluding FPC and part of protruding. See attached drawing for details.

JDG10000677-02 3/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

1.2 BLOCK DIAGRAM

The block diagram is shown below. (NT35350) Selector 1.342inch(Round) 77,782 dots (320 x RGB x 300 pixels) Dot Pitch 35.5um x 106.5um(238.5ppi) V-Driver V-Driver Scan Direction (Normal) FPCLED

23 LED_K I Power Power supply for LED backlight cathode

22 LED_A I Power Power supply for LED backlight anode

21 N.C. - - LCD TEST Pin (Please open)

20 TE O Signal Frame Head Signal

19 LEDPWM O Signal PWM feedback Signal for LED Driver

18 LCD_TEST(GND) - - LCD TEST Pin(Please connect to GND)

16 RESX I Signal Reset pin (Active Low)

GND for 3 wires mode,or connect to VDDI for 4 wires mode in SPI.17 IM0 I Signal

12 SCL I Signal

13 DCX I Signal

15 GND - -

14 CSX I Signal

11 SDI I/O Signal Serial data input/output

10 GND - -

HSSI_D0_P I/O Signal

9 HSSI_CLK_P I Signal

8 HSSI_CLK_N I Signal

Pin No. LCD_TEST(GND) I/O Power/Signal

3 VDDI I Power

4/46Sh. No. Japan Display Inc. Date July 6, 2017 Page 1N . C . - -

5 HSSI_D0_N I/O Signal

4 GND - - GND

7 GND - -

Description

Connect to VDDI for 3 wires mode, or data command select signal for 4 wires mode in SPI. LCD TEST Pin (Please open) Power Supply for Analog Circuit Power Supply for I/O MIPI negative data signal MIPI positive data signal GND MIPI negative clock signal MIPI positive clock signal GND Synchronous clock signal

1.3 I/O PINS

Note) (*2-1): Maximum humidity is defined as follows: Ta≦40°C : 85%RH Max. Ta> 40°C : Absolute humidity needs to be equal or less than the numeric value at the condition of Ta=40°C, 85%RH. Don't condense dew. (*2-2): Ambient Temperature vs Allowable Forward Current is due to the following graph. JDG10000677-02 Digital input terminal voltage VIN VO Operating temperature voltage Differential input Item Power Supply for I/O Analog Circuit Power Supply for VCI 5/46Sh. No.Japan Display Inc. Date July 6, 2017 Page range (LCD panel surface) Storage temperature range LED Forward current DescriptionRated valueSymbol HSSI_CLK_P/N HSSI_D0_P/N -0.3~+1.45 V VDDI -0.3 ~ +4.0 V V V V -0.3 ~ +5.5 -0.3 ~ VDDI+0.3 -0.3 ~ VDDI+0.3 (*2-1) (*2-1) +35Iled mA Topr -20 ~ +70 Tstg -30 ~ +80 2. ABSOLUTE MAXIMUM RATING

terminalHigh level current leakage uA uA Item Symbol Min. Typ. Max. Unit Low level current leakage ILIL -10 - - VVSS - 0.2xVDDI ILIH - - 10 6/46Sh. No. V Max. Unit 1.7 1.8 1.9 V 3.0 3.1 3.2 V 0.8xVDDI - VDDI Japan Display Inc. Date July 6, 2017 Page Symbol Min. Typ. Power Supply for Analog Circuit Power Supply for I/O VDDI VCI Item High level threshold voltage VIH Low level threshold voltage VIL 3.1. Operating Conditions (GND=0V)

3.1.2 Input signal voltage conditions (DC conditions)

3.1.1 Input and output power supply voltage conditions

1. ELECTRICAL SPECIFICATIONS

Max. Unit Application Terminal VDDI VCI VDDI VCI 0.005 VDDI VCI mA0.34 0.200 0.22 1.11 1.75 1.40 2.70 Ivci - - Symbol Measurement condition Min. Typ.Item Ivci - 0.13 Ivvdi Ivci Ta=25℃,White raster display MIP Mode consumption current Ivvdi Ta=25℃,White raster display -0 . 2 3 V Normal Mode consumption current Backlight forward voltage Vfbl - 2.9 3.2 Item Symbol Min. Typ. Max. Unit Sleep Mode consumption current Ivvdi Ta=25℃ 7/46Sh. No. Japan Display Inc. Date July 6, 2017 Page VDDI=1.8V , VCI=3.1V

3.1.3 DC characteristic power consumption characteristics, input threshold

3.1.4 Backlight Operating Conditions (Iled=20mA)

JDG10000677-02 8/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

4.1 MIPI INTERFACE

1. INTERFACE Follow the MIPI Standerd. D-PHY: V1.0 DSI:1.01.00 DCS:1.01.00 MIPI I/F Supported 1 data lane (MIPI CLK speed up to 300Mbps). MIPI I/F Supported only command mode.

JDG10000677-02 9/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

JDG10000677-02 10/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

JDG10000677-02 11/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

JDG10000677-02 12/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

4.2 MIPI DC CHARACTERISTICS

JDG10000677-02 13/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

4.3 MIPI AC CHARACTERISTICS

JDG10000677-02 14/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

JDG10000677-02 15/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

JDG10000677-02 16/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

JDG10000677-02 17/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

JDG10000677-02 18/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

JDG10000677-02 19/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

JDG10000677-02 20/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

JDG10000677-02 21/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

JDG10000677-02 22/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

4.4 SPI

The host CPU drives the CSX pin low and starts by setting the D/CX-bit on SDI or by DCX pin. The bit is read by the display on the first rising edge of SCL. For 4-Wires Mode, first bit is data bit (D7) is set on SDI by the CPU. Then on the next falling edge of SCL the MSB data bit (D6) is set on SDI by the CPU and so on. For 3-Wires Mode, the next falling edge of SCL the MSB data bit (D7) is set on SDI by the CPU. On the next falling edge of SCL the next bit (D6) is set on SDI and so on. This continues until all 8 Data bits have been transmitted as shown in below figures: Command Write. Command/GRAM Write for 3-Wires Mode 9-bit Type SPI Command/GRAM Write for 4-Wires Mode 8-bit Type SPI Note: (*4-1)The GRAM write command should be 2Ch/3Ch. (*4-2)When using SPI,differential input voltage for MIPI,such as HSSI_D0_N,HSSI_D0_P,HSSI_CLK_N, HSSI_CLK_P,should be fixed 1.2V,which is the high level of the differential input voltage. The power on sequence for these pins should follow LP11(See Page.27) even if not using MIPI.

JDG10000677-02 23/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

JDG10000677-02 24/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

JDG10000677-02 25/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

JDG10000677-02 26/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

JDG10000677-02 27/47Sh. No.Japan Display Inc. Date July 6, 2017 Page Initial setting ※If you don't use MIPI , please fix the MIPI pin to LP11 (1.2 V ) at the timing of the power ON / OFF sequence. ※During the period that the SPI is not active, If CSX = H, SCL and SDI and DCX should set H or L. (Hi‐z is prohibited.) However, recommendations are CSX = H, SCL = H, SDI = L and DC X = H. *If t9 over than 2ms, please add right command in front of "Ini tinal setting" FF 10 t12 - - 10 ms Wait more than 10ms -1 0 m s 2 8 0 t10 1 - 10 ms ms 28 40 t9 - - 2* ms t11 1 t4 0 5 - ms t8 0 - - ms Wait more than 10ms t3 10 50 - ms t2 10 - - ms t6 E0t7 0 - - ms FF 0-- m s t 5 Min Typ Max 10 80 - VDDI t1 t8 SDI SCL / CSX DCX(*) Min Typ Max unit RESET unit Command (HEX) Address (HEX)0-- m s t4 t5 t12 VCI t2 t7 t10 t11 HSSI_D0_P/N HSSI_CLK_P/N LP-11 LP-11 LP-11 10% 90% Lower line Upper line

5.1 Power ON/OFF sequence

1. POWER SEQUENCE

JDG10000677-02 28/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

5.2 Reset Timing Characteristics

JDG10000677-02 29/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

6.1 Status flow

1. CHANGE STATUS AM= Analog Mode DSTB= Deep Standby =N o r m a l M o d e STB= Standby MM= Memory Mode = MIP Mode BL= Back Light BACKLIGHT OFF BACKLIGHT ON Deep Standby Mode MM (Memory Mode) Standby ModeSleep Mode Power OFF AM (Analog Mode) (A)Power ON (B‐1)ON Sequence to AM by MIPI (B‐2)ON Sequence to AM by SPI (G‐1)Enter MIP by MIPI (G‐2)Enter MIP by SPI (C)OFF Sequence (D)Power OFF (E)Enter DSTB (F)Exit DSTB (I‐1)Exit MIP by MIPI (I‐2)Exit MIP by SPI (H‐1)MM Write new image by MIPI (H‐2)MM Write new image by SPI *trial use only (L)Frame rate 30Hz in AM (M)Frame rate 60Hz in AM (N‐1)ON Sequence to MM by MIPI (N‐2)ON Sequence to MM by SPI (N)Enter STB (O)Exit STB (O‐1)AM Write new image by MIPI (O‐2)AM Write new image by SPI (Y)BL ON(Z)BL OFF 1

JDG10000677-02 30/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

6.1.1 Sequence 1 (A,B-1,B-2,N-1,N-2)

(A)Power ON Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) DSI input should be at GND level while VDDI/VCI off. DSI input should be at GND level while VDDI/VCI off. Refer to "Power ON_OFF sequence" (B-1)ON Sequence to AM by MIPI Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) Write DCS 05 - 01 - Soft reset Write DCS 15 1 B3 02 Write DCS 15 1 BB 10 Write xx xx xx xx xx Optional setting (Refer to "Register list") Write DCS 15 1 3A 06 Set the color format (18bit:06h 16bit:05h) Write DCS 05 - 11 - Sleep out Write DCS 39 - 2C/3C - Transfer image data ※note1 Write DCS 05 - 29 - Display On ※note2 (B-2)ON Sequence to AM by SPI Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) Write - - - 01 - Soft reset Write - - - B3 02 Write - - - BB 10 Write - - - F3 02 SPI GRAM access enable Write xx xx xx xx xx Optional setting (Refer to "Register list") Write - - - 3A 06 Set the color format (18bit:06h 16bit:05h) Write - - - 11 - Sleep out Write DCS 39 - 2C/3C - Transfer image data ※note1 Write DCS 05 - 29 - Display On ※note2 (N-1)ON Sequence to MM by MIPI Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) Write DCS 05 - 01 - Soft reset Write DCS 15 1 B3 15 Write DCS 15 1 BB 10 Write xx xx xx xx xx Optional setting (Refer to "Register list") Write DCS 15 1 3A 06 Set the color format (18bit:06h 16bit:05h) Write DCS 05 - 11 - Sleep out Write DCS 05 - 29 - Display On ※note2 Write DCS 39 - 2C/3C - Transfer image data ※note1 Write DCS 15 1 BB 00 Write DCS 15 1 B3 35 Write GenericSP 23 1 FF 20 Write GenericSP 23 1 0B 00 Write GenericSP 23 1 6D 74 (N-2)ON Sequence to MM by SPI Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) Write - - - 01 - Soft reset Write - - - B3 15 Write - - - BB 10 Write - - - F3 02 SPI GRAM access enable Write - - - xx xx Optional setting (Refer to "Register list") Write - - - 3A 06 Set the color format (18bit:06h 16bit:05h 3bit_Type 1:01h 3bit_Type2:08h , Refer to "JD35350 Draft Spec") Write - - - 11 - Sleep out Write - - - 29 - Display On ※note2 Write - - - 2C/3C - Transfer image data ※note1 Write - - - BB 00 Write - - - B3 35 Write - - - FF 20 Write - - - 0B 00 Write - - - 6D 74 Wait more than 10ms Set MIPI-DSI to LP-11, SPI to halt state Wait more than 10m s Wait more than 10ms Sleep Mode Wait more than 10ms Wait more than 10ms Wait more than 120ms Memory Mode Sleep Mode Wait more than 10ms Wait more than 10ms Wait more than 10ms Wait more than 100ms Wait more than 10ms Pwer OFF Wait more than 50ms Sleep Mode Sleep Mode Power supply on VDDI Wait more than 0ms Power supply on VCI Wait more than 5ms Hard Reset L=>H Wait more than 120ms Analog Mode Sleep Mode Memory Mode Wait more than 120ms Analog Mode

JDG10000677-02 31/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

6.1.2 Sequence 2 (C,D,E,F,L,M,N,O,Y ,Z)

(C)OFF Sequence Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) Write - - - FF 10 Select CMD1 (If already setted CMD1, skip this comm and) Write DCS 05 - 28 - Display Off Write DCS 05 - 10 - Sleep In (D)Power OFF Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) DSI input should be at GND level while VDDI off. (E)Enter DSTB Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) Write DCS 15 1 4F 01 Enter DSTB (F)Exit DSTB Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) (L)Frame rate 30Hz Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) Write GenericSP 23 1 FF 24 Write GenericSP 23 1 D8 C1 Write GenericSP 23 1 D9 3E (M)Frame rate 60Hz Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) Write GenericSP 23 1 FF 24 Write GenericSP 23 1 D8 41 Write GenericSP 23 1 D9 1E (N)Enter STB Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) (O)Exit STB Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) (Y)BL ON Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) Write DCS 15 1 FF 10 Select CMD1 (If already setted CMD1, skip this c ommand) Write DCS 15 1 53 24 BACKLIGHT ON Write DCS 15 1 51 xx LEDPWMduty setting(00h:0% 〜 FFh:100%） (Z)BL OFF Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) Write DCS 15 1 FF 10 Select CMD1 (If already setted CMD1, skip this c ommand) Write DCS 15 1 53 00 BACKLIGHT OFF Sleep Mode Set MIPI-DSI to LP-11, SPI to halt state Analog Mode Wait more than 50ms Hard Reset H=>L Wait more than 10ms Deep Standby Mode Deep Standby Mode Power supply off VCI Power supply off VDDI Pwer OFF Sleep Mode Sleep Mode Set MIPI-DSI to ULPM, SPI to halt state Hard Reset H=>L Wait more than 3ms Hard Reset L=>H Wait more than 20ms Wait more than 100ms Sleep Mode Sleep Mode Power supply off VCI Standby Mode Analog Mode Analog Mode Analog Mode Analog Mode Analog Mode Analog Mode Standby Mode Power supply on VCI Sleep Mode

JDG10000677-02 32/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

6.1.3 Sequence 3 (G-1,G-2,O-1,O-2)

(G-1)Enter MIP by MIPI Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) Write DCS 15 1 FF 10 Select CMD1 (If already setted CMD1, skip this c ommand) Write DCS 15 1 B3 17 Write DCS 15 1 BB 10 Write DCS 15 1 F3 00 MIPI GRAM access enable Write DCS 15 1 3A 06 Set the color format (18bit:06h 16bit:05h) Write DCS 39 1 2A 00 Set X-direction display address 20 0 30 1 43 F Write DCS 39 1 2B 00 Set Y-direction display address 20 0 30 1 42 B Write DCS 39 - 2C/3C - Transfer image data ※note1 Write DCS 15 1 BB 00 Write DCS 15 1 B3 35 Write GenericSP 23 1 FF 20 Write GenericSP 23 1 0B 00 Write GenericSP 23 1 6D 74 (G-2)Enter MIP by SPI Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) Write - - - FF 10 Select CMD1 (If already setted CMD1, skip this comm and) Write - - - B3 17 Write - - - F3 02 SPI GRAM access enable Write - - - BB 10 Write - - - 3A 09 Set the color format (18bit:06h 16bit:05h 3bit_Type 1:01h 3bit_Type2:08h , Refer to "JD35350 Draft Spec") Write - - - 2A 00 Set X-direction display address Write - - - 2B 00 Set Y-direction display address Write - - - 2C/3C - Transfer image data ※note1 Write - - - BB 00 RM=0, DM[1:0]=0 Write - - - B3 35 Write - - - FF 20 Write - - - 0B 00 Write - - - 6D 74 (O-1)AM Write new image by MIPI Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) Write DCS 15 1 FF 10 Select CMD1 (If already setted CMD1, skip this c ommand) Write DCS 15 1 3A 06 Set the color format (18bit:06h 16bit:05h) Write DCS 39 1 2A 00 Set X-direction display address 20 0 30 1 43 F Write DCS 39 1 2B 00 Set Y-direction display address 20 0 30 1 42 B Write DCS 39 - 2C/3C - Transfer image data ※note1 (O-2)AM Write new image by SPI Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) Write - - - FF 10 Select CMD1 (If already setted CMD1, skip this comm and) Write - - - BB 10 Write - - - F3 02 SPI GRAM access enable Write - - - 3A 06 Set the color format (18bit:06h 16bit:05h) Write - - - 2A 00 Set X-direction display address Write - - - 2B 00 Set Y-direction display address Write - - - 2C/3C - Transfer image data ※note1 Write - - - BB 00 Analog Mode Analog Mode Memory Mode Memory Mode Analog Mode Analog Mode Analog Mode Analog Mode It can set the range of partial update area. It can set the range of partial update area. It can set the range of partial update area. It can set the range of partial update area.

JDG10000677-02 33/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

6.1.4 Sequence 4 (H-1,H-2,I-1,I-2)

(H-1)MM Write new image by MIPI(※note3) Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) Write DCS 15 1 FF 10 Select CMD1 (If already setted CMD1, skip this c ommand) Write DCS 15 1 BB 10 Write DCS 15 1 3A 06 Set the color format (18bit:06h 16bit:05h) Write DCS 39 1 2A 00 Set X-direction display address 20 0 30 1 43 F Write DCS 39 1 2B 00 Set Y-direction display address 20 0 30 1 42 B Write DCS 39 - 2C/3C - Transfer image data ※note1 Write DCS 15 1 BB 00 Write DCS 15 1 B3 35 (H-2)MM Write new image by SPI(※note3) Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) Write - - - FF 10 Select CMD1 (If already setted CMD1, skip this comm and) Write - - - BB 10 Write - - - 3A 09 Set the color format (18bit:06h 16bit:05h 3bit_Type 1:01h 3bit_Type2:08h , Refer to "JD35350 Draft Spec") Write - - - 2A 00 Set X-direction display address Write - - - 2B 00 Set Y-direction display address Write - - - 2C/3C - Transfer image data ※note1 Write - - - BB 00 Write - - - B3 35 (I-1)Exit MIP by MIPI Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) Write GenericSP 23 1 FF 20 Write GenericSP 23 1 6D 04 Write GenericSP 23 1 0B 88 Write DCS 15 1 FF 10 Select CMD1 (If already setted CMD1, skip this c ommand) Write DCS 15 1 BB 10 Write DCS 15 1 F3 00 MIPI GRAM access enable Write DCS 15 1 3A 06 Set the color format (18bit:06h 16bit:05h) Write DCS 39 1 2A 00 Set X-direction display address 20 0 30 1 43 F Write DCS 39 1 2B 00 Set Y-direction display address 20 0 30 1 42 B Write DCS 39 - 2C/3C - Transfer image data ※note1 Write DCS 15 1 B3 02 (I-2)Exit MIP by SPI Write/ Read DCS/ Generic Data Type (HEX) Para. Num. (DEC) Command address (HEX) Parameter value (HEX) Write - - - FF 10 Select CMD1 (If already setted CMD1, skip this comm and) Write - - - F3 02 SPI GRAM access enable Write - - - BB 10 Write - - - 3A 06 Set the color format (18bit:06h 16bit:05h) Write - - - 2A 00 Set X-direction display address Write - - - 2B 00 Set Y-direction display address Write - - - 2C/3C - Transfer image data ※note1 Write - - - BB 00 Write - - - B3 02 Write DCS 15 1 F3 00 MIPI GRAM access enable Write - - - BB 10 Memory Mode Memory Mode Memory Mode Memory Mode Analog Mode Memory Mode Analog Mode Memory Mode It can set the range of partial update area. It can set the range of partial update area.

JDG10000677-02 34/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

6.2 ID read address

(CMD１_DAh) : Read ID1 D A h D 7D 6D 5D 4D 3D 2D 1D 0 1st parameter 0 0 ◆Prototype Level (2bit) ◆Prototype Number (2bit) Prototype Level Bit Prototype No. Bit WS 00 1 0000 ES 01 2 0001 CS 10 3 0010 14 1101 15 1110 16 1111 Prototype Level Prototype No. note1：If the communication is interrupted during transmission of the 2Ch/3Ch command, please re-send 2Ch/3Ch command from the beginning of the frame. 【example】 ・18bit/16bit mode 2Ch(ADD), xxh(data),…,xxh(data) ⇒ Data is transmitted for 320 pixels.（1st line） 3Ch(ADD), xxh(data),…,xxh(data) ⇒ Data is transmitted for 320 pixels.（2nd line） （repeat 3Ch command） 3Ch(ADD), xxh(data),…,xxh(data) ⇒ Data is transmitted for 320 pixels.（320th line） ・RGB1-1-1 mode（RGB 1-1-1-bits is only supported on 3-Wire mode 9-bit SPI interface.） 2Ch(ADD), xxh(data),…,xxh(data) ⇒ Data is transmitted for 320 x 320 pixels.（1frame data） note2： After Display on, TE signal is output. Timing is as belows. TE：Frequency 15.84ms(1V=63.1Hz)、H width 0.56ms 15.84ms(1V=63.1Hz) 0.56ms

JDG10000677-02 35/46Sh. No.Japan Display Inc. Date July 6, 2017 Page Symbol CR tr td Temp. (℃) Item Contrast Response Definition (Measurement setup) Black → White White → Black Remark Min. Typ. Max. Rating Unit -6 1 025 ms 10 20 - - -36 By Wx Wy Color Coordinates 25 Rx Ry Gx Gy Bx - 0.300 - - 0.445 - - 0.170 - - 0.335 - NTSC ratio - 25 - 23 - % 4 - 0.175 - - 0.315 - - 0.505 - - 0.315 Reflectance - 25 - 21 - % - 45 60 - Viewing Angle (CR>2) θL θR θT θB deg. 5 Horizontal Vertical Item Symbol Temp. Rating Unit Definition Remark(℃) Min. Typ. Max. 45 60 - 50 65 - 50 65 (Measurement setup) Brightness B 25 - 10 - cd/㎡ 7. OPTICAL SPECIFICATION

7.1 OPTICAL CHARACTERISTICS

7.1.1 Reflective mode

*Vcom frequency :60Hz±10% *VCI=3.1V / VDDI=1.8V

7.1.2 Transmissive mode

*VCI=3.1V / VDDI=1.8V / ILED=20mA *Analog(Normal) driving mode *Analog(Normal) driving mode, White raster *Vcom frequency :60Hz±10%

JDG10000677-02 36/47Sh. No.Japan Display Inc. Date July 6, 2017 Page

7.2 DEFINITION AND CONDITION OF OPTICAL CHARACTERISTICS

This is a ratio between the screen surface reflectance of the white raster and the black raster Contrast ratio (CR) = Reflection intensity on all pixels Black Reflection intensity on all pixels White Definition 2 tr：Response time from Black to White tf：Response time from White to Black Whi t e Black tr Brightness tf 90% 10% ・Normally Black mode Time The response time is defined as the following figure and shall be measured by matching the input signal for “Black” and “White”. This is the x-y coordinate of Red, Green, Blue and White colors specified on the CIE1931 chromaticity Diagram. (* It is not a guaranteed value) Definition 4 This is an area of a triangle shaped by R, G, B coordinates on the CIE1931 chromaticity diagram. Definition 5 This is a maximum angle θ from the normal direction that keeps having the contrast more than 2. θ=0 RightLeft Top Bottom θR θT θL θB *FPC side Definition 3

JDG10000677-02 37/47Sh. No.Japan Display Inc. Date July 6, 2017 Page - Measurement method of optical characteristics - < Basic measurement conditions > a) Driving voltage VCI = 3.1V VDDI= 1.8V b) Measurement temperature 25°C unless otherwise specified c) Measurement point Center of the Active area (one point) unless otherwise specified Light source: Parallel light source ・Light source input direction : from opposite side of FPC (30°) ・Light source receive direction : at LCD center (0 °) < Measurement system-I for reflective mode> Driving Circuit LCD Module 30° LCD center Measurment equipment Light source FPC side Light source 30° < Measurement system-II for transparent mode> LCD Module Receiver lens Optical fiber Stage A side Measurement equipment CS-2000A or equivalent ・D65 / 2 degree viewing angle LCD-5200 or equivalent

JDG10000677-02 38/47Sh. No.Japan Display Inc. Date July 6, 2017 Page 8. INSPECTION Please refer to the shipment inspection standard for LPM013M091A ver.02.1

Note) If a nonconformance is found, both parties will have a discussion to solve it. JDG10000677-02 39/46Sh. No.Japan Display Inc. Date July 6, 2017 Page No. TEST ITEM CONDITION REMARK

1 High Temperature Storage Ta=80℃ 240h

2 Low Temperature Storage Ta=-30℃ 240h

3 High Temperature &

Ta=60℃/90%RH (No condensation) 240h

4 High Temperature &

Ta=40℃/90%RH (No condensation) 240h

5 High Temperature Operation Ta=70℃ 240h

7 Thermal shock

(non-operating) Ta=-30℃ to 80℃ (30min each) 50cycles

6 Low Temperature Operation Ta=-20℃ 240h

HBM IEC 61340-3-1, ESD STM5.1 V=±1.0kV(contact) R=1.5kΩ,C=100pF 1 time each terminalESD

9 Shock 100G,6ms

±X,±Y,±Z 3 times Each direction

11 Packing Drop Height 60cm,1 corner

3 edges,6 surfaces 1 time Each direction Random Vibration10 Packing Vibration 101min Direction:Z 9. RELIABILITY TEST

9.1 CONDITIONS OF RELIABILITY AND MECHANICAL TEST

After the above tests, return samples to the normal temperature and moisture environment in the thermostat chamber room over 30 minutes not to condense. Inspect samples kept for more than 1 hour after pulling them out of the thermostat chamber room. (1) There shall be no abnormality in the functions (Ex. No display, abnormal display, line defects). (2) There shall be no serious degradation (Ex. Brightness uniformity, reversible changes, optical changes. The degradation due to backlight or polarizer is ignored).

9.2 CRITERIA FOR JUDGEMENT

Note) Tray orientation must be alternately arranged. If you do not stack trays alternately, it will lead to panel damaged. JDG10000677-02 40/46Sh. No. Japan Display Inc. Date July 6, 2017 Page 10. PACKING SPECIFICATIONS

10.1 INNER CARTON

20pcs LCD modules per tray 10 trays with products + empty tray as cover = 11 trays Tray is inverted 180 degrees and piled up. Empty TrayModule Bag Inner Carton

JDG10000677-02 41/46Sh. No.Japan Display Inc. Date July 6, 2017 Page Insert four (4) inner cartons within a master carton. Maximum quantity per a master carton : 20 × 10 × 4 = 800pcs

10.2 MASTER CARTON

(Notes) Master carton size : W395 × L596 ×H223 (mm). Gap is filled if necessary. Tape is applied if necessary. Tied if necessary. Indication onto [A] [B] [C] [D] on master carton are shown as below. [B] [C] ≪Outer label≫

Lot mark is printed on the rear of the LCD module. JDG10000677-02 42/46Sh. No.Japan Display Inc. Date July 6, 2017 Page 11. DESIGNATION OF LOT MARK Printing Area Printing Area

JDG10000677-02 43/46Sh. No.Japan Display Inc. Date July 6, 2017 Page (1) The display panel is made of glass. Do not subject it to mechanical shock such as dropping it from a high position, etc. (2) If the display panel is damaged and internal liquid crystal substance leaks out, be sure not to inhale or consume it. If the internal liquid crystal substance come s into contact with skin or clothing, promptly wash it off using soap and running water. (3) Do not apply excessive force on the surface, perimeter or adjoining areas of LCD module since this may cause display panel color tone to vary. (4) The polarizer covering the display panel surface of the LC D module is soft and can be easily scratched. Handle the LCD module carefully. (5) If the surface polarizer becomes contaminated, use the following recommended or equivalent adhesive tape for contaminants removal.

• Scotch‐brand mending tape (No. 810) (6) Do not breathe on the display surface or use solvents such as Et hyl Alcohol to remove contaminants. Those may cause polarizer discoloration. Additionally, the following liquids can damage the polarizer.
• Water
• Ketones
• Aromatic solvents (7) When mounting the LCD Module, be sure that it is free from twisting, warping, or distortion. Any stress can bring great influence on the display quality. Be sure to sec ure sufficient stiffness on the outer case and the frame for a robust design. (8) Do not apply pressure at or around the FPC bonding area and the surrounding area. (9) Do not attempt to disassemble or rework the LCD module. (10) To prevent destruction of the elements by sta tic electricity, be careful to maintain an optimum working environment.
• Be sure to ground your body before handling the LCD module.
• Make sure that solder guns and all other tools required for assembly have been grounded.
• To reduce occurrence of static electricity, avoid using this product in dry environments.
• A pro tective film has been attached to the surface of the LCD panel. When peeling off the protective film, be careful to prevent electrostatic discharges. (11) To minimize performance degradation of the LCD module caused by destructive forces such as static electricity, etc., avoid direct contact to the following sections w hen handling the LCD module.
• Terminal electrodes of connector
• Wiring pattern on FPC (12) The protective film attached on the LCD panel must be removed before final product installation. After removal of protective film, some adhesive residues may be left on the LCD panel, especially after a long storage period. Please refer to section (5) listed ab ove for proper contaminant removal procedure. (13) Take precaution to minimize corrosion of electrodes. Corrosion of electrodes is accelerated by moisture, condensation or a current flow in a high‐humidity environment. (14) Do not apply excessive pressure to the FPC part. Force type such as twist, warp, etc., may cause FP C patterning damage and/or peeling FPC. (15) Keep the LCD module away from rigid objects such as a tool. Don't put any heavy object on the display surface. Don't stack or pile up the LCD modules. As the polarizer material tends to be easily scratched, the LCD module must be handled wi th due care to avoid being touched, pressed or rubbed with any rigid object. 12. LCD MODULE USAGE AND PRECAUTIONS

12.1 HANDLING

JDG10000677-02 44/46Sh. No.Japan Display Inc. Date July 6, 2017 Page (16) Do not touch or handle the LCD module directly with bare hands. Residue of dirt, oil or water may have the possibility to cause corrosion. Be sure to wear finger sacks or gloves when handling LCD modules. When holding an LCD panel module, carefully hold the panel by the edges of the glass pla te. (17) Avoid using LCD module under condensation or high humidity environment because polarizer etc. maybe damaged in these conditions. (18) Trays are used to package LCD modules for shipment. If LCD modules scratch the tray during shipment, material of the scratched tray may be left on LCD modules. In suc h case, clean up LCD modules after removal from trays. (19) When installing LCD module, don't apply excess stress of bending or stretching to the input cable (FPC). (20) Keep NC terminals open electrically unless otherwise specified. (21) After storage under high humidity or condensation environment, keep LCD module under r oom temperature more than 30 minutes before operation. (22) Take precautions to handle LCD module because the glass plate has very keen edges. (1) The absolute maximum ratings represent the rated values which LCD module cannot exceed. When LCD modules are used beyond these rated values, the operating characteristics may be adversely affected. (2) To prevent the occurrence of erroneous operation caused by noise, special attention on satisfying VIL, VIH specified values is required. This includes taking the precautionary measures of using short cables for signal transferring. (3) An inherent characteristic of liquid crystal display is its temperature dependency. Be sure to use the LCD modules within the specified operating temperature range. Recognition of the display becomes difficult when the LCD module is used outside its range. Also, keep in mind that the voltage levels necessary for clear display images will vary according to temperature. (4) It is recommended that power supply lines (V_SYS, V_INTERFACE, LED+) include current surge protection. (Fuse etc. recommend value: 0.5A) (5) Note the peripheral devices can cause mutual noise interference with LCD modules. Especially, input devices such as Touch Panel, etc., may output operational level by radiation noise even when these devices are not in operation. Actual performance confirmation and verification under actual usage environment by actual final product are highly recommended. (6) To avoid EMI, preventive measures should be implemented for the final product. (7) Display abnormality may occur with sudden removal of the battery pack. Electric design should be well studied so that sudden electric power interruption will not occur. LCD module quality cannot be guaranteed under the condition that unexpected power shutdown can possibly occur. (8) Ensure sufficient light shading measures during design phase and then mount the LCD module. (9) Ensure sufficient light shading measures in the inspection process. (10) As well as general electronic components, ESD may cause the LCD IC to malfunction. Provide ESD prevention measures entirely around the LCD module. (11) While display data may be kept, the data can be easily changed by external noise. Noise can be minimized at device or system level. (12) Unexpected external noise may cause abnormal display and/or IC malfunction. Periodic refresh operation such as resending commands and display data is highly recommended as a part of the software routine. (13) When logic circuit power is off, do not apply any signals to the input terminals. (14) As the pressure bonding of the FPC tends to be easily peeled by mechanical stress, never hold the LCD module by the FPC when handling. Additionally, when mounting the LCD Module and/or fixing the FPC, keep them free from twisting or bending. Those may cause wiring pattern breaks and/or bonding separation. Remember not to bend/pull them toward the direction in which the bonding goes separate because there is a high possibility of wiring pattern breaks.

12.2 DESIGN OF APPLICATION

JDG10000677-02 45/46Sh. No.Japan Display Inc. Date July 6, 2017 Page

12.3 DISPLAY CHARACTERISTECS

12.4 KEEPING

12.5 DISPOSAL

12.6 OTHERS

(1) When keeping LCD modules, avoid the following condition or environment.

• Exposure to direct sunlight or fluorescent lamp lighting.
• High‐temperature/high‐humidity or very low‐temperature (below 0°C) environments.
• Exposure to water droplets, condensation, etc. Furthermore, keep LCD modules in anti‐static bags to prevent static electricity charge ups. W henever possible, LCD modules should be stored in the same conditions in which they were shipped from Japan Display Inc. (2) Take precaution to minimize corrosion of electrodes. Corrosion of electrodes is accelerated by moisture, condensation or a current flow in a high‐humidity environment. (3) Recommended keeping conditions.
• Keeping environment : +15°C to 35°C, less than 65% RH
• Duration: up to 2 months after shipping date (4) Excessive load can damage or destroy the carton boxes. Please follow the printed instruction on the carton for maximum number of stacks of cartons for both storage and transportation. (1) Because the optimum LC D driving voltage depends on the ambient temperature, display may slightly flicker at the environment of high temperature. (2) One of the special characteristics of liquid crystal is that it freezes when stored at the temperature below the storage temperature range. Such freezing may cause orientation defects or bubbles (black or wh ite) to appear in the LCD panel. Bubbles may also occur if the panel receives an impact in a low‐temperature environment. (3) If the LCD module is left operating for a long time with the same display showing, the displayed pattern may leave traces on the screen or the con trast may become inconsistent. These issues will usually recover in time, but the phenomenon may persist in significant cases. It is unavoidable with the current technology. The final product must be designed with this property in mind and need to avoid displaying a fixed pattern for a long period. Any afterimage issue is exc luded from the LCD Module appearance specifications that we warrant. (1) Abide by national laws, legislation and local regulations when disposing of this LCD module. (2) Consult a company specialized in industrial waste treatment which is permitted by the government or local authority. When incineration is the method of LC D module disposal, law of environmental hygienic must be obeyed. (1) This product is designed to be used in ordinary electronic devices. Do not use this product in other applications, especially in devices that may directly affect end users (such as weapons, military purposes, aerospace equipment, life‐support system equipment, or safety equipm ent). (2) Japan Display Inc. shall not be responsible for defects that occur in this product if the product is used in an environment that exceeds the ranges specified in this document, or in an environment not described in this document.

Note: (*13-1)Unit:mm (*13-2)No specified size tolerance:±0.2 (*13-3)Example of suitable FPC connector : FH35C-23S-0.3SHW(50) 23pin / Hirose (*13-4)Do not bend FPC around area where mounted components and solder are located, in addtion to around FPC crimping area, so that these areas on the FPC do not have any stress. (*13-5)Viewing Direction is the direction to get the best reflective performance. JDG10000677-02 46/46Sh. No.Japan Display Inc. Date July 6, 2017 Page 13. OUTLINE DRAWING

ALL TECHNOLOGIES. ALL COMPETENCIES. ONE SPECIALIST. www.data-modul.com More information and worldwide locations can be found at DATA MODUL AG Landsberger Straße 322 DE-80687 Munich Phone: +49-89-56017-0 DATA MODUL WEIKERSHEIM GMBH Lindenstraße 8 DE-97990 Weikersheim Phone: +49-7934-101-0