LP211_14 TI1 | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 14
Technical content
LP211, LP311 LOW-POWER DIFFERENTIAL COMPARATORS WITH STROBES SLCS003D − JUNE 1987 − REVISED SEPTEMBER 2003 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068Low Power Drain . . . 900 μW Typical With 5-V Supply /C0068Operates From ±15 V or From a Single Supply as Low as 3 V /C0068Output Drive Capability of 25 mA /C0068Emitter Output Can Swing Below Negative Supply /C0068Response Time . . . 1.2 μs Typ /C0068Low Input Currents: Offset Current ...2 n A T y p Bias Current . . . 15 nA Typ /C0068Wide Common-Mode Input Range: −14.5 V to 13.5 V Using ±15-V Supply /C0068Offset Balancing and Strobe Capability /C0068Same Pinout as LM211, LM311 /C0068Designed To Be Interchangeable With Industry-Standard LP311 description/ordering information The LP211 and LP311 devices are low-power versions of the industry-standard LM211 and LM311 devices. They take advantage of stable, high-value, ion-implanted resistors to perform the same function as the LM311 series, with a 30:1 reduction in power consumption, but only a 6:1 slowdown in response time. They are well suited for battery-powered applications and all other applications where fast response times are not needed. They operate over a wide range of supply voltages, from ±18 V down to a single 3-V supply with less than 300-μA current drain, but are still capable of driving a 25-mA load. The LP211 and LP311 are quite easy to apply free of oscillation if ordinary precautions are taken to minimize stray coupling from the output to either input or to the trim pins. In addition, offset balancing is available to minimize input offset voltage. Strobe capability also is provided to turn off the output (regardless of the inputs) by pulling the strobe pin low. The LP211 is characterized for operation from −25°C to 85°C. The LP311 is characterized for operation from 0°C to 70°C.
ORDERING INFORMATION
AT 25°C PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING PDIP (P) Tube of 50 LP311P LP311P 0°Ct o7 0°C 75m V SOIC (D) Tube of 75 LP311D LP311−0°C to 70°C 7.5 mV SOIC (D) Reel of 2500 LP311DR LP311 SOP (PS) Reel of 2000 LP311PSR L311 25°Ct o8 5°C 75m V SOIC (D) Tube of 75 LP211D LP211−25°C to 85°C 7.5 mV SOIC (D) Reel of 2500 LP211DR LP211 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Copyright © 2003, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. EMIT OUT IN+ IN− VCC− VCC+ COL OUT BAL/STRB BALANCE LP211 ...D P ACKAGE LP311 . . . D, P, OR PS PACKAGE (TOP VIEW)
LP211, LP311 LOW-POWER DIFFERENTIAL COMPARATORS WITH STROBES SLCS003D − JUNE 1987 − REVISED SEPTEMBER 2003
2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IN− BAL/STRB BALANCE absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the recommended operating conditions section of this specification is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, unless otherwise noted, are with respect to the midpoint between V CC+ and VCC−. 2. Differential input voltages are at IN+ with respect to IN−. 3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage of ±15 V, whichever is less. 4. The output may be shorted to ground or to either power supply. 5. Maximum power dissipation is a function of T J(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 6. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions MIN MAX UNIT (|VCC±| ≤ 15 V) Input voltage VCC− + 0.5 VCC+ − 1.5 V VCC+ − VCC− Supply voltage 3.5 30 V
LP211, LP311 LOW-POWER DIFFERENTIAL COMPARATORS WITH STROBES SLCS003D − JUNE 1987 − REVISED SEPTEMBER 2003 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 electrical characteristics at specified free-air temperature, VCC± = ±15 V (unless otherwise noted) PARAMETER TEST CONDITIONS TA MIN TYP† MAX UNIT V Input offset voltage RS 100 k Ω See Note 7 25°C 2 7.5 mVVID Input offset voltage RS < 100 k Ω, See Note 7 Full range 10 mV VID < −10 mV, IOL = 25 mA, 25°C 04 15VID < 10 mV, See Note 8 IOL = 25 mA, 25°C 0.4 1.5 VOL Low-level output voltage VCC = 4.5 V, V <1 0 m V VCC− = 0, I 16m A Full range 01 04 V VID < −10 mV, See Note 8 IOL = 1.6 mA, Full range 0.1 0.4 I Input offset current See Note 7 25°C 2 25 nAIIO Input offset current See Note 7 Full range 35 nA I Input bias current 25°C 15 100 nAIIB Input bias current Full range 150 nA Low level strobe current V(strobe) = 0.3 V, VID < −10 mV, 25°C 100 300 ALow-level strobe current V(strobe) = 0.3 V, See Note 9 VID < 10 mV, 25°C 100 300 μA IO(off) Output off-state current VID > 10 mV, VCE = 35 V 25°C 0.2 100 nA A Large-signal differential-voltage R 5k Ω 25°C 40 100 V/mVAVD Large signal differential voltage amplification RL = 5 kΩ 25°C 40 100 V/mV ICC+ Supply current from VCC+ VID = −50 mV, RL = ∞ Full range 150 300 μA ICC− Supply current from VCC− VID = 50 mV, RL = ∞ Full range − 80 − 180 μA † All typical values are at VCC± = ±15 V, TA = 25°C. NOTES: 7. The offset voltages and offset currents given are the maximum values required to drive the output within 1 V of either supply with a 1-mA load. Thus, these parameters define an error band and take into account the worst-case effects of voltage gain and input impedance. 8. Voltages are with respect to EMIT OUT and V CC− tied together. 9. The strobe should not be shorted to ground; it should be current driven at 100 μA to 300 μA. switching characteristics, VCC± = ±5 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS TYP UNIT Response time See Note 10 1.2 μs NOTE 10: The response time is specified for a 100-mV input step with 5-mV overdrive.
4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
pins should be shorted together. Figure 1. Offset Balancing Figure 2. Strobing
www.ti.com 24-Jan-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Top-Side Markings (4) Samples LP211D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LP211 LP211DE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LP211 LP211DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LP211 LP211DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LP211 LP211DRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LP211 LP211DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LP211 LP211P OBSOLETE PDIP P 8 TBD Call TI Call TI -25 to 85 LP311D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LP311 LP311DE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LP311 LP311DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LP311 LP311DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LP311 LP311DRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LP311 LP311DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LP311 LP311P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 LP311P LP311PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 LP311P LP311PWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI 0 to 70 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
www.ti.com 24-Jan-2013 Addendum-Page 2 PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Only one of markings shown within the brackets will appear on the physical device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LP211DR SOIC D 8 2500 340.5 338.1 20.6 LP311DR SOIC D 8 2500 340.5 338.1 20.6 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 Pack Materials-Page 2
Texas InstrumentsIncorporatedand itssubsidiaries(TI)reservetherighttomake corrections,enhancements,improvementsand other changes toitssemiconductorproductsand servicesperJESD46, latestissue,and todiscontinueany productorserviceperJESD48, latest issue.Buyersshouldobtainthelatestrelevantinformationbeforeplacingordersand shouldverifythatsuch informationiscurrentand complete.Allsemiconductorproducts(alsoreferredtohereinas “components”)aresoldsubjecttoTI’s termsand conditionsofsale suppliedatthetimeoforderacknowledgment. TIwarrantsperformanceofitscomponents tothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI’s terms and conditionsofsaleofsemiconductorproducts.Testingand otherqualitycontroltechniquesareused totheextentTIdeems necessary tosupportthiswarranty.Exceptwhere mandated by applicablelaw,testingofallparametersofeach component isnotnecessarily performed. TIassumes no liabilityforapplicationsassistanceorthedesignofBuyers’products.Buyersareresponsiblefortheirproductsand applicationsusingTIcomponents.To minimizetherisksassociatedwithBuyers’productsand applications,Buyersshouldprovide adequatedesignand operatingsafeguards. TIdoes notwarrantorrepresentthatany license,eitherexpressorimplied,isgrantedunderany patentright,copyright,mask work right,or otherintellectualpropertyrightrelatingtoany combination,machine,orprocessinwhichTIcomponents orservicesareused.Information publishedby TIregardingthird-partyproductsorservicesdoes notconstitutea licensetouse such productsorservicesora warrantyor endorsementthereof.Use ofsuch informationmay requirea licensefroma thirdpartyunderthepatentsorotherintellectualpropertyofthe thirdparty,ora licensefromTIunderthepatentsorotherintellectualpropertyofTI. ReproductionofsignificantportionsofTIinformationinTIdatabooks ordatasheetsispermissibleonlyifreproductioniswithoutalteration and isaccompaniedby allassociatedwarranties,conditions,limitations,and notices.TIisnotresponsibleorliableforsuch altered documentation.Informationofthirdpartiesmay be subjecttoadditionalrestrictions. ResaleofTIcomponents orserviceswithstatementsdifferentfromorbeyond theparametersstatedby TIforthatcomponent orservice voidsallexpressand any impliedwarrantiesfortheassociatedTIcomponent orserviceand isan unfairand deceptivebusinesspractice. TIisnotresponsibleorliableforany such statements. Buyeracknowledgesand agreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryand safety-relatedrequirements concerningitsproducts,and any use ofTIcomponents initsapplications,notwithstandingany applications-relatedinformationorsupport thatmay be providedby TI.Buyerrepresentsand agreesthatithas allthenecessaryexpertisetocreateand implementsafeguardswhich anticipatedangerousconsequencesoffailures,monitorfailuresand theirconsequences,lessenthelikelihoodoffailuresthatmightcause harm and takeappropriateremedialactions.BuyerwillfullyindemnifyTIand itsrepresentativesagainstany damages arisingoutoftheuse ofany TIcomponents insafety-criticalapplications. Insome cases,TIcomponents may be promotedspecificallytofacilitatesafety-relatedapplications.Withsuch components,TI’s goalisto helpenablecustomerstodesignand createtheirown end-productsolutionsthatmeet applicablefunctionalsafetystandardsand requirements.Nonetheless,such components aresubjecttotheseterms. No TIcomponents areauthorizedforuse inFDA ClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersoftheparties have executeda specialagreementspecificallygoverningsuch use. OnlythoseTIcomponents whichTIhas specificallydesignatedas militarygradeor“enhanced plastic”aredesignedand intendedforuse in military/aerospaceapplicationsorenvironments.Buyeracknowledgesand agreesthatany militaryoraerospaceuse ofTIcomponents whichhave not been so designatedissolelyattheBuyer's risk,and thatBuyerissolelyresponsibleforcompliancewithalllegaland regulatoryrequirementsinconnectionwithsuch use. TIhas specificallydesignatedcertaincomponents as meetingISO/TS16949 requirements,mainlyforautomotiveuse.Inany case ofuse of non-designatedproducts,TIwillnotbe responsibleforany failuretomeet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotiveand Transportationwww.ti.com/automotive Amplifiers amplifier.ti.com Communicationsand Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP ® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energyand Lighting www.ti.com/energy Clocksand Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space,Avionicsand Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Videoand Imaging www.ti.com/video RFID www.ti-rfid.com OMAP ApplicationsProcessors www.ti.com/omap TIE2E Community e2e.ti.com WirelessConnectivity www.ti.com/wirelessconnectivity MailingAddress:Texas Instruments,PostOfficeBox 655303,Dallas,Texas 75265 Copyright© 2013,Texas InstrumentsIncorporated
Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: LP311P LP311D LP311DR LP211D LP211DE4 LP211DR LP211DRE4 LP311DE4 LP311DG4 LP311DRE4 LP311DRG4 LP311PE4 LP211DG4 LP211DRG4