LMV1032 TI1 | Alldatasheet
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LMV1032-06/LMV1032-15/LMV1032-25 Amplifiers for 3-Wire Analog Electret Microphones Literature Number: SNAS233F
LMV1032-06/LMV1032-15/LMV1032-25 Amplifiers for 3-Wire Analog Electret Microphones General Description The LMV1032s are an audio amplifier series for small form factor electret microphones. They are designed to replace the JFET preamp currently being used. The LMV1032 series is ideal for extended battery life applications, such as a Bluetooth communication link. The addition of a third pin to an electret microphones that incorporates an LMV1032 al- lows for a dramatic reduction in supply current as compared to the JFET equipped electret microphone. Microphone sup- ply current is thus reduced to 60 µA, assuring longer battery life. The LMV1032 series is guaranteed for supply voltages from 1.7V to 5V, and has fixed voltage gains of 6 dB, 15 dB and 25 dB. The LMV1032 series offers low output impedance over the voice bandwidth, excellent power supply rejection (PSRR), and stability over temperature. The devices are offered in space saving 4-bump ultra thin micro SMD (TM) lead free packages and are thus ideally suited for the form factor of miniature electret microphone packages. These extremely miniature packages have the Large Dome Bump (LDB) technology. This micro SMD tech- nology is designed for microphone PCBs requiring 1 kg adhesion criteria.
Features
(Typical LMV1032-15, 1.7V Supply; Unless Otherwise Noted) n Output voltage noise (A-weighted) −89 dBV n Low supply current 60 µA n Supply voltage 1.7V to 5V n PSRR 70 dB n Signal to noise ratio 61 dB n Input capacitance 2 pF n Input impedance >100 MΩ n Output impedance <200Ω n Max input signal 170 mV PP n Temperature range −40˚C to 85˚C n Large Dome 4-Bump micro SMD package with improved adhesion technology.
Applications
n Mobile communications - Bluetooth n Automotive accessories n Cellular phones n PDAs n Accessory microphone products Block Diagram 20084201 Electret Microphone 20084202 November 2005 LMV1032-06/LMV1032-15/LMV1032-25 Amplifiers for 3-Wire Analog Electret Microphones © 2005 National Semiconductor Corporation DS200842 www.national.com
Absolute Maximum Ratings(Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. ESD Tolerance (Note 2) Human Body Model 2500V Machine Model 250V Supply Voltage V DD - GND 5.5V Storage Temperature Range −65˚C to 150˚C Junction Temperature (Note 6) 150˚C max Mounting Temperature Infrared or Convection (20 sec.) 235˚C Operating Ratings (Note 1) Supply Voltage 1.7V to 5V Temperature Range −40˚C to +85˚C 1.7V and 5V Electrical Characteristics(Note 3) Unless otherwise specified, all limits guaranteed for T J = 25˚C and VDD = 1.7V and 5V. Boldface limits apply at the tempera- ture extremes. Symbol Parameter Conditions Min (Note 4) Typ (Note 5) Max (Note 4) Units IDD Supply Current V IN = GND 60 85 100 µA SNR Signal to Noise Ratio V DD = 1.7V VIN =1 8m VPP f=1k H z LMV1032-06 58 dB LMV1032-15 61 LMV1032-25 61 VDD =5 V VIN =1 8m VPP f=1k H z LMV1032-06 59 LMV1036-15 61 LMV1032-25 62 PSRR Power Supply Rejection Ratio 1.7V < VDD < 5V LMV1032-06 65 dBLMV1032-15 60 LMV1032-25 55 VIN Max Input Signal f = 1 kHz and THD+N < 1% LMV1032-06 300 mVPPLMV1032-15 170 LMV1032-25 60 f LOW Lower −3 dB Roll Off Frequency R SOURCE =5 0Ω VIN =1 8m VPP 70 Hz fHIGH Upper −3 dB Roll Off Frequency R SOURCE =5 0Ω VIN =1 8m VPP LMV1032-06 120 kHzLMV1032-15 75 LMV1032-25 21 en Output Noise A-Weighted LMV1032-06 −97 dBVLMV1032-15 −89 LMV1032-25 −80 VOUT Output Voltage V IN = GND LMV1032-06 100 300 500 mVLMV1032-15 250 500 750 LMV1032-25 300 600 1000 RO Output Impedance f=1k H z <200 Ω IO Output Current V DD = 1.7V, VOUT = 1.7V, Sinking 0.9 0.5 2.3 mA VDD = 1.7V, VOUT = 0V, Sourcing 0.3 0.2 0.64 VDD = 5V, VOUT = 1.7V, Sinking 0.9 0.5 2.4 VDD = 5V, VOUT = 0V, Sourcing 0.4 0.1 1.46 LMV1032-06/LMV1032-15/LMV1032-25 www.national.com 2
1.7V and 5V Electrical Characteristics(Note 3) (Continued) Unless otherwise specified, all limits guaranteed for T J = 25˚C and VDD = 1.7V and 5V. Boldface limits apply at the tempera- ture extremes. Symbol Parameter Conditions Min (Note 4) Typ (Note 5) Max (Note 4) Units THD Total Harmonic Distortion f=1k H z VIN =1 8m VPP LMV1032-06 0.11 %LMV1032-15 0.13 LMV1032-25 0.35 CIN Input Capacitance 2p F ZIN Input Impedance >100 M Ω AV Gain f=1k H z VIN =1 8m VPP LMV1032-06 5.5 4.5 6.2 6.7 7.7 dBLMV1032-15 14.8 15.4 16 LMV1032-25 24.8 25.5 26.2 Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Ch aracteristics. Note 2: The Human Body Model (HBM) is 1.5 k Ω in series with 100 pF. The Machine Model is 0 Ω in series with 200 pF. Note 3: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited s elf-heating of the device such that TJ =T A. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where T J > TA. Note 4: All limits are guaranteed by design or statistical analysis. Note 5: Typical values represent the most likely parametric norm. Note 6: The maximum power dissipation is a function of T J(MAX) , θJA and TA. The maximum allowable power dissipation at any ambient temperature is P D = (TJ(MAX) -T A)/θJA. All numbers apply for packages soldered directly onto a PC board. LMV1032-06/LMV1032-15/LMV1032-25 www.national.com3
Large Dome 4-Bump micro SMD 20084203 Top View Note: - Pin numbers are referenced to package marking text orientation. - The actual physical placement of the package marking will vary slightly from part to part. The package will designate the date code and will vary considerably. Package marking does not correlate to device type in any way.
Ordering Information
Package Part Number Package Marking Transport Media NSC Drawing Product Status 4-Bump Ultra Thin micro SMD (LDB) Lead Free LMV1032UR-15 Date Code 250 Units Tape and Reel URA04JJA Full ProductionLMV1032URX-15 3k Units Tape and Reel LMV1032UR-25 Date Code 250 Units Tape and Reel Full ProductionLMV1032URX-25 3k Units Tape and Reel 4-Bump Ultra Thin micro SMD (Small Bump) Lead Free LMV1032UP-06 Date Code 250 Units Tape and Reel UPA04QQA Full ProductionLMV1032UPX-06 250 Units Tape and Reel LMV1032UP-15 Date Code 250 Units Tape and Reel Life Time BuyLMV1032UPX-15 3k Units Tape and Reel LMV1032UP-25 Date Code 250 Units Tape and Reel Life Time BuyLMV1032UPX-25 3k Units Tape and Reel Note: The LMV1032 series is offered only with lead free (NOPB) solder bumps. The LMV1032 series replaces the LMV1014. LMV1032-06/LMV1032-15/LMV1032-25 www.national.com 4
Typical Performance Characteristics Unless otherwise specified, V S = 1.7V, single supply, T A = 25˚C Supply Current vs. Supply Voltage (LMV1032-06) Supply Current vs. Supply Voltage (LMV1032-15) 20084204 20084213 Supply Current vs. Supply Voltage (LMV1032-25) Closed Loop Gain and Phase vs. Frequency (LMV1032-06) 20084214 20084205 Closed Loop Gain and Phase vs. Frequency (LMV1032-15) Closed Loop Gain and Phase vs. Frequency (LMV1032-25) 20084215 20084216 LMV1032-06/LMV1032-15/LMV1032-25 www.national.com5
Typical Performance CharacteristicsUnless otherwise specified, V S = 1.7V, single supply, T A = 25˚C (Continued) Power Supply Rejection Ratio vs. Frequency (LMV1032-06) Power Supply Rejection Ratio vs. Frequency (LMV1032-15) 20084206 20084217 Power Supply Rejection Ratio vs. Frequency (LMV1032-25) Total Harmonic Distortion vs. Frequency (LMV1032-06) 20084218 20084207 Total Harmonic Distortion vs. Frequency (LMV1032-15) Total Harmonic Distortion vs. Frequency (LMV1032-25) 20084219 20084220 LMV1032-06/LMV1032-15/LMV1032-25 www.national.com 6
Typical Performance CharacteristicsUnless otherwise specified, V S = 1.7V, single supply, T A = 25˚C (Continued) Total Harmonic Distortion vs. Input Voltage (LMV1032-06) Total Harmonic Distortion vs. Input Voltage (LMV1032-15) 20084208 20084221 Total Harmonic Distortion vs. Input Voltage (LMV1032-25) Output Voltage Noise vs. Frequency (LMV1032-06) 20084222 20084223 Output Voltage Noise vs. Frequency (LMV1032-15) Output Voltage Noise vs. Frequency (LMV1032-25) 20084224 20084225 LMV1032-06/LMV1032-15/LMV1032-25 www.national.com7
Physical Dimensions inches (millimeters) unless otherwise noted NOTE: UNLESS OTHERWISE SPECIFIED. 1. FOR SOLDER BUMP COMPOSITION, SEE "SOLDER INFORMATION" IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB PAGE (www.national.com). 2. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 3. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. 4. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 5. NO JEDEC REGISTRATION AS OF MAY 2005. 4-Bump Ultra Thin micro SMD with Large Dome Bump Technology LMV1032-06/LMV1032-15/LMV1032-25 www.national.com 10
Physical Dimensions inches (millimeters) unless otherwise noted (Continued) NOTE: UNLESS OTHERWISE SPECIFIED. 1. FOR SOLDER BUMP COMPOSITION, SEE "SOLDER INFORMATION" IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB PAGE (www.national.com). 2. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 3. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. 4. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 5. REFERENCE JEDEC REGISTRATION MO-211. VARIATION CA. 4-Bump Ultra Thin micro SMD National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. For the most current product information visit us at www.national.com. LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. BANNED SUBSTANCE COMPLIANCE National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2. Leadfree products are RoHS compliant. National Semiconductor Americas Customer Support Center Email: new.feedback@nsc.com Tel: 1-800-272-9959 National Semiconductor Europe Customer Support Center Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 National Semiconductor Asia Pacific Customer Support Center Email: ap.support@nsc.com National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507 Email: jpn.feedback@nsc.com LMV1032-06/LMV1032-15/LMV1032-25 Amplifiers for 3-Wire Analog Electret Microphones
Tel: 81-3-5639-7560www.national.com LMV1032-06/LMV1032-15/LMV1032-25 Amplifiers for 3-Wire Analog Electret Microphones
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