LMV1032 TI | Alldatasheet

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x x x xx x x x xxx xxxx IC VCC VOUT LMV1032 www.ti.com SNAS233G –DECEMBER 2003–REVISED MAY 2013 LMV1032-06/LMV1032-15/LMV1032-25Amplifiersfor3-WireAnalogElectretMicrophones Check forSamples: LMV1032 1FEATURES DESCRIPTION The LMV1032s arean audioamplifierseriesforsmall 2• (TypicalLMV1032-15, 1.7VSupply;Unless form factorelectretmicrophones.They are designedOtherwiseNoted) to replacethe JFET preamp currentlybeing used.• Output VoltageNoise (A-weighted)−89 dBV The LMV1032 seriesisidealforextendedbatterylife

  • Low Supply Current60 μA applications,such as a Bluetoothcommunicationlink. The additionofa thirdpintoan electretmicrophones• Supply Voltage1.7Vto5V thatincorporatesan LMV1032 allowsfora dramatic• PSRR 70 dB reductioninsupplycurrentas compared totheJFET
  • SignaltoNoise Ratio61 dB equipped electretmicrophone.Microphone supply currentis thus reduced to 60 µA, assuringlonger• InputCapacitance2 pF batterylife.The LMV1032 seriesis specifiedfor• InputImpedance >100 M Ω supply voltagesfrom 1.7V to 5V, and has fixed
  • Output Impedance <200Ω voltagegainsof6 dB,15 dB and 25 dB.
  • Max InputSignal170 mV PP The LMV1032 seriesofferslow outputimpedance
  • Temperature Range −40°C to85°C over the voice bandwidth,excellentpower supply rejection(PSRR),and stabilityovertemperature.• Large Dome 4-Bump DSBGA Package with Improved Adhesion Technology. The devicesareofferedinspace saving4-bump ultra thinDSBGA leadfreepackages and are thusideally APPLICATIONS suited for the form factorof miniatureelectret microphone packages. These extremelyminiature• MobileCommunications -Bluetooth packages have the Large Dome Bump (LDB)• Automotive Accessories technology.ThisDSBGA technologyisdesignedfor microphonePCBs requiring1 kg adhesioncriteria.• CellularPhones
  • PDAs
  • Accessory Microphone Products Block Diagram ElectretMicrophone These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2003–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SNAS233G –DECEMBER 2003–REVISED MAY 2013 www.ti.com AbsoluteMaximum Ratings(1)(2) ESD Tolerance(3) Human Body Model 2500V Machine Model 250V SupplyVoltage VDD -GND 5.5V StorageTemperatureRange −65°C to150°C JunctionTemperature(4) 150°C max MountingTemperature InfraredorConvection(20sec.) 235°C (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisintendedtobe functional,butspecificperformanceisnotensured.Forensuredspecificationsand thetest conditions,see theElectricalCharacteristics. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) The Human Body Model (HBM) is1.5kΩ inserieswith100 pF.The Machine Model is0Ω inserieswith200 pF. (4) The maximum power dissipationisa functionofTJ(MAX) ,θJA and TA.The maximum allowablepower dissipationatany ambient temperatureisPD = (TJ(MAX) -TA)/θJA.Allnumbers applyforpackagessoldereddirectlyontoa PC board. OperatingRatings(1) SupplyVoltage 1.7Vto5V TemperatureRange −40°C to+85°C (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisintendedtobe functional,butspecificperformanceisnotensured.Forensuredspecificationsand thetest conditions,see theElectricalCharacteristics. 1.7Vand 5V ElectricalCharacteristics(1) Unlessotherwisespecified,alllimitsensuredforTJ = 25°C and VDD = 1.7Vand 5V.Boldfacelimitsapplyatthetemperature extremes. Symbol Parameter Conditions Min (2) Typ (3) Max (2) Units IDD SupplyCurrent VIN = GND 60 85 μA100 SNR SignaltoNoiseRatio VDD = 1.7V LMV1032-06 58 VIN = 18 mV PP LMV1032-15 61f= 1 kHz LMV1032-25 61 dB VDD = 5V LMV1032-06 59 VIN = 18 mV PP LMV1036-15 61f= 1 kHz LMV1032-25 62 PSRR Power SupplyRejectionRatio 1.7V< VDD < 5V LMV1032-06 65 75 LMV1032-15 60 70 dB55 LMV1032-25 55 65 VIN Max InputSignal f= 1 kHz and THD+N < LMV1032-06 300 1% LMV1032-15 170 mV PP LMV1032-25 60 fLOW Lower −3 dB RollOffFrequency R SOURCE = 50Ω 70 HzVIN = 18 mV PP fHIGH Upper −3 dB RollOffFrequency R SOURCE = 50Ω LMV1032-06 120 kHzVIN = 18 mV PP LMV1032-15 75 LMV1032-25 21 (1) ElectricalTablevaluesapplyonlyforfactorytestingconditionsatthetemperatureindicated.Factorytestingconditionsresultinvery limitedself-heatingofthedevicesuch thatTJ = TA.No specificationofparametricperformanceisindicatedintheelectricaltablesunder conditionsofinternalself-heatingwhere TJ > TA. (2) Alllimitsarespecifiedby designorstatisticalanalysis. (3) Typicalvaluesrepresentthemost likelyparametricnorm.

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X OUTPUT LMV1032 www.ti.com SNAS233G –DECEMBER 2003–REVISED MAY 2013 1.7Vand 5V ElectricalCharacteristics(1)(continued) Unlessotherwisespecified,alllimitsensuredforTJ = 25°C and VDD = 1.7Vand 5V.Boldfacelimitsapplyatthetemperature extremes. Symbol Parameter Conditions Min (2) Typ (3) Max (2) Units en OutputNoise A-Weighted LMV1032-06 −97 LMV1032-15 −89 dBV LMV1032-25 −80 VOUT OutputVoltage VIN = GND LMV1032-06 100 300 500 LMV1032-15 250 500 750 mV LMV1032-25 300 600 1000 R O OutputImpedance f= 1 kHz <200 Ω IO OutputCurrent VDD = 1.7V,VOUT = 1.7V,Sinking 0.9 2.3 0.5 VDD = 1.7V,VOUT = 0V,Sourcing 0.3 0.64 0.2 mA VDD = 5V,VOUT = 1.7V,Sinking 0.9 2.4 0.5 VDD = 5V,VOUT = 0V,Sourcing 0.4 1.46 0.1 THD TotalHarmonicDistortion f= 1 kHz LMV1032-06 0.11 VIN = 18 mV PP LMV1032-15 0.13 % LMV1032-25 0.35 C IN InputCapacitance 2 pF ZIN InputImpedance >100 M Ω AV Gain f= 1 kHz LMV1032-06 5.5 6.2 6.7 VIN = 18 mV PP 4.5 7.7 LMV1032-15 14.8 15.4 16 dB14 17 LMV1032-25 24.8 25.5 26.2 24 27 Connection Diagram Large Dome 4-Bump DSBGA Figure1. Top View Note:

  • Pinnumbers arereferencedtopackage markingtextorientation.
  • The actualphysicalplacementofthepackage markingwillvaryslightlyfrom parttopart.The package will designatethedatecode and willvaryconsiderably.Package markingdoes notcorrelatetodevicetypeinany way. Copyright© 2003–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LMV1032

FREQUENCY (Hz) -15 GAIN (dB) 100k10k100 -10 PHASE GAIN 150 300 450 400 250 200 350 PHASE (° ) 10 1k 1M FREQUENCY (Hz) -15 GAIN (dB) 100k10k100 -10 150 450 400 350 200 300 250 PHASE (° ) GAIN PHASE SUPPLY VOLTAGE (V) SUPPLY CURRENT ( PA) -40°C 25°C 85°C 10.00 10 1k 1M FREQUENCY (Hz) -30.00 -15.00GAIN (dB) 100k10k100 0.00 -5.00 -20.00 -25.00 -10.00 5.00 180 -180 -45 -90 -135 135 PHASE (° ) GAIN PHASE SUPPLY VOLTAGE (V) SUPPLY CURRENT ( PA) 85°C 25°C -40°C SUPPLY VOLTAGE (V) SUPPLY CURRENT ( PA) 85°C 25°C -40°C LMV1032 SNAS233G –DECEMBER 2003–REVISED MAY 2013 www.ti.com TypicalPerformance Characteristics Unlessotherwisespecified,VS = 1.7V,singlesupply,TA = 25°C Supply Currentvs.Supply Voltage(LMV1032-06) Supply Currentvs.Supply Voltage(LMV1032-15) Figure2. Figure3.' Supply Currentvs.Supply Voltage(LMV1032-25) Closed Loop Gain and Phase vs.Frequency (LMV1032-06) Figure4. Figure5. Closed Loop Gain and Phase vs.Frequency (LMV1032-15) Closed Loop Gain and Phase vs.Frequency (LMV1032-25) Figure6. Figure7.

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FREQUENCY (Hz) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 THD + N (%) VIN = 18 mVPP 10 100 1k 10k 100k FREQUENCY (Hz) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 THD+N (%) VIN = 18 mVPP 10 100 1k 10k 100k FREQUENCY (Hz) 100 120 PSRR (dB) 10 100 1k 10k 100k FREQUENCY (Hz) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 THD+N (%) VIN = 18 mVPP 10 100 1k 10k 100k FREQUENCY (Hz) 100 120 PSRR (dB) 10 100 1k 10k 100k FREQUENCY (Hz) 100 120 PSRR (dB) LMV1032 www.ti.com SNAS233G –DECEMBER 2003–REVISED MAY 2013 TypicalPerformance Characteristics(continued) Unlessotherwisespecified,VS = 1.7V,singlesupply,TA = 25°C Power Supply RejectionRatiovs.Frequency (LMV1032-06) Power Supply RejectionRatiovs.Frequency (LMV1032-15) Figure8.\\ Figure9. Power Supply RejectionRatiovs.Frequency (LMV1032-25) TotalHarmonic Distortionvs.Frequency (LMV1032-06) Figure10. Figure11. TotalHarmonic Distortionvs.Frequency (LMV1032-15) TotalHarmonic Distortionvs.Frequency (LMV1032-25) Figure12. Figure13. Copyright© 2003–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LMV1032

NOISE (dBV/ Hz) 10 100 1k 10k 100k FREQUENCY (Hz) -150 -140 -130 -120 -110 -100 -90 -80 NOISE (dBV/ Hz) 10 100 1k 10k 100k FREQUENCY (Hz) -150 -140 -130 -120 -110 -100 -90 -80 0 20 40 60 80 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 THD+N (%) INPUT VOLTAGE (mV PP ) f = 1 kHz 10 100 1k 10k 100k FREQUENCY (Hz) -105 -100 -150 -145 -140 -135 -130 -125 -120 -115 -110 NOISE (dBV/ Hz) 0 50 100 150 200 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 THD+N (%) INPUT VOLTAGE (mV PP ) f = 1 kHz 0 50 100 150 200 250 300 350 400 INPUT VOLTAGE (mV PP ) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 THD+N (%) f = 1 kHz LMV1032 SNAS233G –DECEMBER 2003–REVISED MAY 2013 www.ti.com TypicalPerformance Characteristics(continued) Unlessotherwisespecified,VS = 1.7V,singlesupply,TA = 25°C TotalHarmonic Distortionvs.InputVoltage(LMV1032-06) TotalHarmonic Distortionvs.InputVoltage(LMV1032-15) Figure14. Figure15. TotalHarmonic Distortionvs.InputVoltage(LMV1032-25) Output VoltageNoise vs.Frequency (LMV1032-06) Figure16. Figure17. Output VoltageNoise vs.Frequency (LMV1032-15) Output VoltageNoise vs.Frequency (LMV1032-25) Figure18. Figure19.

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FREQUENCY (Hz) -70 -60 -50 -40 -30 -20 -10 dBV GND DIAPHRAGM AIRGAP BACKPLATEELECTRET CONNECTOR LMV1032 x x x xx x x x xxx xxxx IC VCC VOUT LMV1032 www.ti.com SNAS233G –DECEMBER 2003–REVISED MAY 2013 APPLICATION SECTION LOW CURRENT The LMV1032 has a low supplycurrentwhich allowsfora longerbatterylife.The low supplycurrentof60µA makes thisamplifieroptimalformicrophoneapplicationswhichneed tobe alwayson. BUILT-INGAIN The LMV1032 isofferedinthespace savingsmallDSBGA package which fitsperfectlyintothemetalcan ofa microphone.ThisallowstheLMV1032 tobe placedon thePCB insidethemicrophone. The bottomsideofthePCB has thepinsthatconnectthesupplyvoltagetotheamplifierand make theoutput available.The inputoftheamplifierisconnectedtothemicrophoneviathePCB. Figure20. Built-inGain A-WEIGHTED FILTER The human earhas a frequencyrangefrom20 Hz toabout20 kHz.Withinthisrangethesensitivityofthehuman ear isnotequalforeach frequency.To approachthehearingresponseweightingfiltersare introduced.One of thosefiltersistheA-weightedfilter. The A-weightedfilterisusuallyused insignal-to-noiseratiomeasurements,where sound iscompared todevice noise.Itimprovesthecorrelationofthemeasured datatothesignal-to-noiseratioperceivedby thehuman ear. Figure21. A-Weighted Filter Copyright© 2003–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LMV1032

[dBPa] -94dB SENSITIVITY [dBV/Pa] SOUND PRESSURE [dB SPL] VOLTAGE [dBV] A-WEIGHTED FILTER 5pF LMV1032 SNAS233G –DECEMBER 2003–REVISED MAY 2013 www.ti.com MEASURING NOISE AND SNR The overallnoiseof the LMV1032 ismeasured withinthe frequencyband from 10 Hz to 22 kHz usingan A- weightedfilter.The inputoftheLMV1032 isconnectedtogroundwitha 5 pF capacitor. Figure22. Noise Measurement Setup The signal-to-noiseratio(SNR) ismeasured witha 1 kHz inputsignalof18 mV PP usingan A-weightedfilter.This representsa sound pressurelevelof94 dB SPL. No inputcapacitorisconnected. SOUND PRESSURE LEVEL The volume ofsound appliedtoa microphoneisusuallystatedas thepressurelevelwithrespecttothethreshold ofhearingofthehuman ear.The sound pressurelevel(SPL)indecibelsisdefinedby: Sound pressurelevel(dB)= 20 logPm /PO Where, Pm isthemeasured sound pressure PO isthethresholdofhearing(20μPa) In orderto be able to calculatethe resultingoutputvoltageof the microphone fora givenSPL, the sound pressureindB SPL needs tobe convertedtotheabsolutesound pressureindBPa. Thisisthesound pressure levelindecibelswhichisreferredtoas 1 Pascal(Pa). The conversionisgivenby: dBPa = dB SPL + 20*log20 μPa dBPa = dB SPL -94 dB Translationfrom absolutesound pressureleveltoa voltageisspecifiedby thesensitivityofthemicrophone.A conventionalmicrophonehas a sensitivityof−44 dBV/Pa. Figure23. dB SPL todBV Conversion

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FREQUENCY (Hz) -15 GAIN (dB) 100k10k100 -10 PHASE GAIN 150 300 450 400 250 200 350 PHASE (° ) LMV1032 www.ti.com SNAS233G –DECEMBER 2003–REVISED MAY 2013 Example:Busy trafficis70 dB SPL VOUT = 70 −94 −44 = −68 dBV Thisisequivalentto1.13mV PP SincetheLMV1032-15 has a gainof5.6(15 dB) overtheJFET, theoutputvoltageofthemicrophoneis6.35 mV PP .By replacingtheJFET withtheLMV1032-15, thesensitivityofthemicrophoneis−29 dBV/Pa (−44 + 15). LOW FREQUENCY CUT OFF FILTER To reducenoiseon theoutputofthemicrophonea low cutfilterhas been implementedintheLMV1032. This filterreducestheeffectofwindand handlingnoise. It'salsohelpfulto reduce the proximityeffectindirectionalmicrophones.Thiseffectoccurswhen the sound sourceisverycloseto the microphone.The lowerfrequenciesare amplifiedwhich givesa bass sound.This amplificationcan cause an overload,whichresultsina distortionofthesignal. Figure24. Gain vs.Frequency The LMV1032 isoptimizedtobe used inaudioband applications.The LMV1032 providesa flatgainresponse withintheaudioband and offerslinearityand excellenttemperaturestability. ADVANTAGE OF THREE PINS The LMV1032 ECM solutionhas threepinsinsteadofthetwo pinsprovidedinthecase ofa JFET solution.The thirdpin providesthe advantage of a low supplycurrent,high PSRR and eliminatesthe need foradditional components. Noisepick-upby a microphoneina cellphone isa well-knownproblem.A conventionalJFET circuitissensitive fornoisepick-upbecause of itshighoutputimpedance.The outputimpedance isusuallyaround 2.2 kΩ. By providingseparateoutputand supplypinsa much loweroutputimpedance isachievedand thereforeisless sensitivetonoisepick-up. RF noise is among othercaused by non-linearbehavior.The non-linearbehaviorof the amplifierat high frequencies,wellabove theusablebandwidthofthedevice,causes AM demodulationofhighfrequencysignals. The AM modulationcontainedinsuch signalsfoldsback intothe audioband, therebydisturbingthe intended microphonesignal.The GSM signalofa cellphone issuch an AM-modulated signal.The modulationfrequency of216 Hz and itsharmonicscan be observedintheaudioband.Thistypeofnoiseiscalledbumblebee noise. EXTERNAL PRE-AMPLIFIER APPLICATION The LMV1032 can alsobe used outsideofan ECM as a space savingexternalpre-amplifier.Inthisapplication, theLMV1032 followsa phantom biasedJFET microphoneinthecircuit.Thisisshown inFigure25.The inputof theLMV1032 isconnectedtothemicrophoneviathe2.2µF capacitor.The advantageofthiscircuitoverone withonlya JFET microphonearetheadditionalgainand thehighpass filtersuppliedby theLMV1032. The high pass filtermakes the outputsignalmore robustand lesssensitiveto low frequencydisturbances.In this configurationtheLMV1032 shouldbe placedas closeas possibletothemicrophone. Copyright© 2003–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LMV1032

2.2 k: 2.2 PF VOUT GND LMV1032 SNAS233G –DECEMBER 2003–REVISED MAY 2013 www.ti.com Figure25. LMV1032 as ExternalPre-Amplifier

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www.ti.com SNAS233G –DECEMBER 2003–REVISED MAY 2013

REVISION HISTORY

Changes from RevisionF (May 2013)toRevisionG Page Copyright© 2003–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LMV1032

www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LMV1032UP-06/NOPB Active Production DSBGA (YPC) | 4 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM - LMV1032UP-06/NOPB.A Active Production DSBGA (YPC) | 4 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 LMV1032UP-15/NOPB Active Production DSBGA (YPC) | 4 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM - LMV1032UP-15/NOPB.A Active Production DSBGA (YPC) | 4 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 LMV1032UP-25/NOPB Active Production DSBGA (YPC) | 4 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM - LMV1032UP-25/NOPB.A Active Production DSBGA (YPC) | 4 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 LMV1032UPX-06/NOPB Active Production DSBGA (YPC) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 LMV1032UPX-06/NOPB.A Active Production DSBGA (YPC) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 LMV1032UR-15/NOPB Active Production DSBGA (YPD) | 4 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM - LMV1032UR-15/NOPB.A Active Production DSBGA (YPD) | 4 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 LMV1032UR-25/NOPB Active Production DSBGA (YPD) | 4 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM - LMV1032UR-25/NOPB.A Active Production DSBGA (YPD) | 4 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 LMV1032URX-15/NOPB Active Production DSBGA (YPD) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 LMV1032URX-15/NOPB.A Active Production DSBGA (YPD) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 LMV1032URX-25/NOPB Active Production DSBGA (YPD) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 LMV1032URX-25/NOPB.A Active Production DSBGA (YPD) | 4 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. Addendum-Page 1

www.ti.com 23-May-2025 (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 5-Nov-2022 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 5-Nov-2022 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMV1032UP-06/NOPB DSBGA YPC 4 250 208.0 191.0 35.0 LMV1032UP-15/NOPB DSBGA YPC 4 250 208.0 191.0 35.0 LMV1032UP-25/NOPB DSBGA YPC 4 250 208.0 191.0 35.0 LMV1032UPX-06/NOPB DSBGA YPC 4 3000 208.0 191.0 35.0 LMV1032UR-15/NOPB DSBGA YPD 4 250 208.0 191.0 35.0 LMV1032UR-25/NOPB DSBGA YPD 4 250 208.0 191.0 35.0 LMV1032URX-15/NOPB DSBGA YPD 4 3000 208.0 191.0 35.0 LMV1032URX-25/NOPB DSBGA YPD 4 3000 208.0 191.0 35.0 Pack Materials-Page 2

www.ti.com UPA04XXX (Rev C) 0.350±0.045 D E 4215139/A 12/12 A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994. B. This drawing is subject to change without notice. NOTES: D: Max = E: Max = 1.184 mm, Min = 1.184 mm, Min = 1.123 mm 1.123 mm

www.ti.com PACKAGE OUTLINE C0.395 MAX 0.155 0.115 0.5 0.5 4X 0.295 0.255 B E A D 4215141/B 08/2016 DSBGA - 0.395 mm max heightYPD0004 DIE SIZE BALL GRID ARRAY NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. SYMM SYMM BALL A1 CORNER SEATING PLANE BALL TYP 0.05 C 1 2

0.015 C A B

A B SCALE 14.000 D: Max = E: Max = 1.184 mm, Min = 1.184 mm, Min = 1.123 mm 1.123 mm

www.ti.com EXAMPLE BOARD LAYOUT 4X ( 0.265) ( 0.265) METAL

0.05 MAX

( 0.265) SOLDER MASK OPENING

0.05 MIN

(0.5) (0.5) 4215141/B 08/2016 DSBGA - 0.395 mm max heightYPD0004 DIE SIZE BALL GRID ARRAY NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009). SOLDER MASK DETAILS NOT TO SCALE 1 2 A B SYMM SYMM LAND PATTERN EXAMPLE SCALE:40X NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN 4X ( 0.25) (R0.05) TYP METAL TYP (0.5) TYP (0.5) TYP 4215141/B 08/2016 DSBGA - 0.395 mm max heightYPD0004 DIE SIZE BALL GRID ARRAY NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. 1 2 A B SYMM SYMM SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:50X

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