LMV1031-20 NSC | Alldatasheet
Document overview
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Technical content
Features
(Typical LMV1031-20, 2V Supply; Unless Otherwise Noted) n Signal to noise ratio 62 dB n Output voltage noise (A-weighted) −86 dBV n Low supply current 72 µA n Supply voltage 2V to 5V n Input impedance >100 MΩ n Max input signal 108 mV PP n Output voltage 1.09V n Temperature range −40˚C to 85˚C n Large Dome 4-Bump micro SMD package with improved adhesion technology.
Applications
n Mobile communications - Bluetooth n Accessory microphone products n Cellular phones n PDAs Block Diagram 20150801 Electret Microphone 20150804 October 2005 LMV1031-20 Amplifiers for Internal 3-Wire Analog Microphones and External Preamplifier © 2005 National Semiconductor Corporation DS201508 www.national.com
Absolute Maximum Ratings(Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. ESD Tolerance (Note 2) Human Body Model 2500V Machine Model 250V Supply Voltage V DD - GND 5.5V Storage Temperature Range −65˚C to 150˚C Junction Temperature (Note 6) 150˚C max Mounting Temperature Infrared or Convection (20 sec.) 235˚C Operating Ratings(Note 1) Supply Voltage 2V to 5V Temperature Range −40˚C to +85˚C 2V and 5V Electrical Characteristics(Note 3) Unless otherwise specified, all limits are guaranteed for T J = 25˚C and VDD = 2V and 5V. Boldface limits apply at the tempera- ture extremes. Symbol Parameter Conditions Min (Note 4) Typ (Note 5) Max (Note 4) Units IDD Supply Current V IN = GND 72 90 100 µA SNR Signal to Noise Ratio f = 1 kHz, V IN =1 8m VPP 62 dB THD Total Harmonic Distortion f = 1 kHz, V IN =1 8m VPP 0.18 % en Output Noise A-Weighted −86 dBV AV Gain f = 1 kHz, V IN =1 8m VPP 19.18 19.00 20.1 20.90 21.00 dB fLOW Lower −3 dB Roll Off Frequency R SOURCE =5 0Ω,V IN =1 8m VPP 72 Hz fHIGH Upper −3 dB Roll Off Frequency R SOURCE =5 0Ω,V IN =1 8m VPP 52 kHz VIN Max Input Signal f = 1 kHz and THD+N < 1% 108 mV PP ZIN Input Impedance >100 M Ω CIN Input Capacitance 2p F VOUT Output Voltage V IN = GND 890 875 1090 1310 1325 mV RO Output Impedance f=1k H z <200 Ω PSRR Power Supply Rejection Ratio 2V < VDD < 5V 56 dB Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Ch aracteristics. Note 2: The human body model (HBM) is 1.5 k Ω in series with 100 pF. The machine model is 0 Ω in series with 200 pF. Note 3: Electrical table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited s elf-heating of the device such that TJ =T A. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where T J > TA. Note 4: All limits are guaranteed by design or statistical analysis. Note 5: Typical values represent the most likely parametric norm at the time of characterization. Note 6: The maximum power dissipation is a function of T J(MAX) , θJA and TA. The maximum allowable power dissipation at any ambient temperature is P D = (TJ(MAX) -T A)/θJA. All numbers apply for packages soldered directly onto a PC board. LMV1031-20 www.national.com 2
4-Bump Ultra Thin micro SMD 20150803 Top View Note: - Pin numbers are referenced to package marking text orientation. - The actual physical placement of the package marking will vary slightly from part to part. The package will designate the date code and will vary considerably. Package marking does not correlate to device type in any way.
Ordering Information
Package Part Number Package Marking Transport Media NSC Drawing 4-Bump Ultra Thin micro SMD lead free LMV1031UR-20 Date Code 250 Units Tape and Reel URA04JJALMV1031URX-20 3k Units Tape and Reel LMV1031-20 www.national.com3
Typical Performance CharacteristicsUnless otherwise specified, V S = 2V, single supply, T A = 25˚C Supply Current vs. Supply Voltage Output Voltage vs. Supply Voltage 20150815 20150823 Gain vs. Supply Voltage Closed Loop Gain and Phase vs. Frequency 20150824 20150816 Power Supply Rejection Ratio vs. Frequency Total Harmonic Distortion vs. Frequency 20150817 20150818 LMV1031-20 www.national.com 4
Typical Performance CharacteristicsUnless otherwise specified, V S = 2V, single supply, T A = 25˚C (Continued) Total Harmonic Distortion vs. Input Voltage Output Voltage Noise vs. Frequency 20150819 20150820 LMV1031-20 www.national.com5
FIGURE 7. Gain vs. Frequency
Physical Dimensions inches (millimeters) unless otherwise noted NOTE: UNLESS OTHERWISE SPECIFIED. 1. FOR SOLDER BUMP COMPOSITION, SEE "SOLDER INFORMATION" IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB PAGE (www.national.com). 2. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 3. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. 4. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 5. NO JEDEC REGISTRATION AS OF NOVEMBER 2004. 4-Bump Ultra Thin micro SMD with Large Dome Bump Technology X1 = 1.179 mm X2 = 1.179 mm X3 = 0.35 mm National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. For the most current product information visit us at www.national.com. LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. BANNED SUBSTANCE COMPLIANCE National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2. Leadfree products are RoHS compliant. National Semiconductor Americas Customer Support Center Email: new.feedback@nsc.com Tel: 1-800-272-9959 National Semiconductor Europe Customer Support Center Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 National Semiconductor Asia Pacific Customer Support Center Email: ap.support@nsc.com National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507 Email: jpn.feedback@nsc.com LMV1031-20 Amplifiers for Internal 3-Wire Analog Microphones and External Preamplifier
Tel: 81-3-5639-7560www.national.com LMV1031-20 Amplifiers for Internal 3-Wire Analog Microphones and External Preamplifier