LMV1024

LMV1024 NSC | Alldatasheet

Document overview

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Technical content

Features

(Typical VDD = 1.8V, CLOCK = 1.2 MHz, f INPUT = 1 kHz, VINPUT =1 8m VPP, unless otherwise specified) n Enhanced high-performance, full PDM output from the element n Stereo chipset and array routing n SNR A-weighted 59 dB n Digital A-weighted noise floor −89 dBFS n Supply current 518 µA n Clock frequency 400 kHz to 2.4 MHz n Total harmonic distortion 0.03% n Power supply rejection ratio 100 dB n Adhesion technology >1k g n Highly integrated stereo or mono signaling n Maximized system performance n Reduced components and layout n RF (buzz noise) managed with 4 wire signaling n Thinnest 0.35 mm micro SMD packaging

Applications

n Digital output audio subsystems and stereo arrays n Electret condenser microphones with all digital output n Portable communications and small form factor n Digital audio computing or voice security n Automotive or array systems n Headphone and Headset accessories Typical Application 20133475 For a stereo application, see STEREO OPERATIONin the Application Section. November 2005 LMV1024/LMV1026 PDM Output with Pre-Amplifier for Electret Microphones © 2005 National Semiconductor Corporation DS201334 www.national.com

Absolute Maximum Ratings(Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. ESD Tolerance (Note 2) Human Body Model 2500V Machine Model 250V Supply Voltage V DD - GND 3.3V Storage Temperature Range −65˚C to 150˚C Junction Temperature (Note 6) 150˚C max Mounting Temperature Infrared or Convection (20 sec.) 235˚C Operating Ratings(Note 1) Supply Voltage 1.6V to 3.0V Input Clock Frequency 400 kHz to 2.4 MHz Duty Cycle 40% to 60% Operating Temperature Range −40˚C to 85˚C 1.8V Electrical Characteristics(Note 3) Unless otherwise specified, all limits are guaranteed for T J = 25˚C, VDD = 1.8V, VIN =1 8m VPP,f CLK = 1.2 MHz, Duty Cycle = 50% and 100 nF capacitor between V REF and GND. Boldface limits apply at the temperature extremes. Symbol Parameter Conditions Min (Note 4) Typ (Note 5) Max (Note 4) Units SNR Signal to Noise Ratio f IN = 1 kHz, A-Weighted 59 dB eN Digital Noise Floor (Integrated) f = 20 Hz to 10 kHz, A-Weighted, 4.7 pF Capacitor Connected from Input to GND to Simulate ECM, No Signal −89 dBFS(A) THD Total Harmonic Distortion f IN = 1 kHz, V IN =1 8m VPP 0.03 % IDD Supply Current V IN = GND, CLK = ON, High Impedance Load (Note 7) 518 µA VIN = GND, CLK = OFF 503 600 VIL CLOCK Input Logic Low Level 0.3 V VIH CLOCK Input Logic High Level 1.5 V VOL DATA Output Logic Low Level 0.1 V VOH DATA Output Logic High Level 1.7 V VIN Max Input Signal f IN = 1 kHz, THD < 1% 243 mV PP VOUT Max Output Signal f IN = 1 kHz, THD < 1% −6.8 dBFS PSRR Power Supply Rejection Ratio V IN = GND, Test Signal on V DD =

217 Hz, 100 mV PP

tA Time from CLOCK Transition to DATA Becoming High Impedance (See also Figure 10, Application Section) LMV1024: On Rising Edge of the CLOCK 65 nsLMV1026: On Falling Edge of the CLOCK t B Time from CLOCK Transition to DATA Becoming Valid (See also Figure 10, Application Section) LMV1024: On Falling Edge of the CLOCK 90 nsLMV1026: On Rising Edge of the CLOCK C IN Input Capacitance 2p F RIN Input Impedance 1000 M Ω LMV1024/LMV1026 www.national.com 2

2.7V Electrical Characteristics(Note 3) Unless otherwise specified, all limits are guaranteed for T J = 25˚C, VDD = 2.7V, VIN =1 8m VPP,f CLK = 1.2 MHz, Duty Cycle = 50% and 100 nF capacitor between V REF and GND. Boldface limits apply at the temperature extremes. Symbol Parameter Conditions Min (Note 4) Typ (Note 5) Max (Note 4) Units SNR Signal to Noise Ratio f IN = 1 kHz, A-Weighted 59 dB en Digital Noise Floor (Integrated) f = 20 Hz to 10 kHz, A-Weighted, 4.7 pF Capacitor Connected from Input to GND to Simulate ECM, No Signal −89 dBFS(A) THD Total Harmonic Distortion f IN = 1 kHz, V IN =1 8m VPP 0.03 % IDD Supply Current V IN = GND, CLK = ON, High Impedance Load (Note 7) 535 µA VIN = GND, CLK = OFF 519 650 VLOW CLOCK Logic Low Level 0.3 V VHIGH CLOCK Logic High Level 2.4 V VOL DATA Output Logic Low Level 0.1 V VOH DATA Output Logic High Level 2.6 V VIN Max Input Signal f IN = 1 kHz, THD < 1% 249 mV PP VOUT Max Output Signal f IN = 1 kHz, THD < 1% −6.6 dBFS PSRR Power Supply Rejection Ratio V IN = GND, Test Signal on V DD = tA Time from CLOCK Transition to DATA Becoming High Impedance (See also Figure 10, Application Section) LMV1024: On Rising Edge of the CLOCK 65 nsLMV1026: On Falling Edge of the CLOCK t B Time from CLOCK Transition to DATA Becoming Valid (See also Figure 10, Application Section) LMV1024: On Falling Edge of the CLOCK 90 nsLMV1026: On Rising Edge of the CLOCK C IN Input Capacitance 2p F RIN Input Impedance 1000 M Ω Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Ch aracteristics. Note 2: The Human Body Model (HBM) is 1.5 k Ω in series with 100 pF. The Machine Model is 0 Ω in series with 200 pF. Note 3: Electrical table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited s elf-heating of the device such that TJ =T A. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where T J > TA. Note 4: All limits are guaranteed by design or statistical analysis. Note 5: Typical values represent the most likely parametric norm. Note 6: The maximum power dissipation is a function of T J(MAX) , θJA and T A. The maximum allowable power dissipation at any ambient temperature is PD =( TJ(MAX) -T A)/θJA. All numbers apply for packages soldered directly into a PC board. Note 7: The Supply Current depends on the applied Clock Frequency and the load on the DATA output. LMV1024/LMV1026 www.national.com3

Large Dome 6-Bump Ultra Thin micro SMD 20133427 Top View Pin Description Pin Name Description Power Supply A2 V DD Positive supply voltage C1 GND Ground Input C2 Input The microphone is connected to this input pin. Reference B1 V REF A capacitor of 100 nF is connected between V REF and ground. This capacitor is used to filter the internal converter reference voltage. Clock Input A1 Clock The user adjustable clock frequency ranges from 400 kHz to 2.4 MHz. Data Output B2 Data Over sampled bitstream output. Data is valid if clock is LOW (LMV1024). The data of the LMV1026 data is valid when clock is HIGH. When the data is not valid the data output is Hi-Z. For exact specifications see application section.

Ordering Information

Package Part Number Package Marking Transport Media NSC Drawing 6-Bump Ultra Thin micro SMD lead free only LMV1024UR IE 250 Units Tape and Reel URA06GGALMV1024URX 3k Units Tape and Reel LMV1026UR IF 250 Units Tape and Reel LMV1026URX 3k Units Tape and Reel Block Diagram 20133426 LMV1024/LMV1026 www.national.com 4

Typical Performance CharacteristicsUnless otherwise specified, measurements are performed on an LMV1024 with V DD = 1.8V, Clock Duty Cycle = 50% and a 100 nF capacitor is placed between V REF and GND, TJ = 25˚C. Supply Current vs. Supply Voltage @ CLOCK = 1.2 MHz Supply Current vs. Supply Voltage @ CLOCK = 2.4 MHz 20133446 20133430 Supply Current vs. Supply Voltage CLOCK = OFF SNR, SINAD and -THD vs. Input Amplitude @ CLOCK = 408 kHz, 3.4 kHz Audio BW 20133431 20133447 SNR, SINAD and -THD vs. Input Amplitude @ CLOCK = 960 kHz, 8 kHz Audio BW SNR, SINAD and -THD vs. Input Amplitude @ CLOCK = 1.2 MHz, 10 kHz Audio BW 20133448 20133449 LMV1024/LMV1026 www.national.com5

Typical Performance CharacteristicsUnless otherwise specified, measurements are performed on an LMV1024 with V DD = 1.8V, Clock Duty Cycle = 50% and a 100 nF capacitor is placed between V REF and GND, TJ = 25˚C. (Continued) SNR, SINAD and -THD vs. Input Amplitude @ CLOCK = 1.92 MHz, 16 kHz Audio BW SNR, SINAD and -THD vs. Input Amplitude @ CLOCK = 2.4 MHz, 20 kHz Audio BW 20133450 20133432 SNR, SINAD and -THD vs. Output @ CLOCK = 408 kHz, 3.4 kHz Audio BW SNR, SINAD and -THD vs. Output @ CLOCK = 960 kHz, 8 kHz Audio BW 20133451 20133452 SNR, SINAD and -THD vs. Output @ CLOCK = 1.2 MHz, 10 kHz Audio BW SNR, SINAD and -THD vs. Output @ CLOCK = 1.92 MHz, 16 kHz Audio BW 20133453 20133454 LMV1024/LMV1026 www.national.com 6

Typical Performance CharacteristicsUnless otherwise specified, measurements are performed on an LMV1024 with V DD = 1.8V, Clock Duty Cycle = 50% and a 100 nF capacitor is placed between V REF and GND, TJ = 25˚C. (Continued) SNR, SINAD and -THD vs. Output @ CLOCK = 2.4 MHz, 20 kHz Audio BW SINAD vs. Frequency @ CLOCK = 408 kHz, 3.4 kHz Audio BW 20133433 20133455 SINAD vs. Frequency @ CLOCK = 960 kHz, 8 kHz Audio BW SINAD vs. Frequency @ CLOCK = 1.2 MHz, 10 kHz Audio BW 20133456 20133457 SINAD vs. Frequency @ CLOCK = 1.92 MHz, 16 kHz Audio BW SINAD vs. Frequency @ CLOCK = 2.4 MHz, 20 kHz Audio BW 20133458 20133434 LMV1024/LMV1026 www.national.com7

Typical Performance CharacteristicsUnless otherwise specified, measurements are performed on an LMV1024 with V DD = 1.8V, Clock Duty Cycle = 50% and a 100 nF capacitor is placed between V REF and GND, TJ = 25˚C. (Continued) Noise vs. Frequency @ CLOCK = 408 kHz, 3.4 kHz Audio BW Noise vs. Frequency @ CLOCK = 960 kHz, 8 kHz Audio BW 20133459 20133460 Noise vs. Frequency @ CLOCK = 1.2 MHz, 10 kHz Audio BW Noise vs. Frequency @ CLOCK = 1.92 MHz, 16 kHz Audio BW 20133461 20133462 Noise vs. Frequency @ CLOCK = 2.4 MHz, 20 kHz Audio BW PSRR vs. Frequency @ CLOCK = 1.2 MHz 20133444 20133463 LMV1024/LMV1026 www.national.com 8

Typical Performance CharacteristicsUnless otherwise specified, measurements are performed on an LMV1024 with V DD = 1.8V, Clock Duty Cycle = 50% and a 100 nF capacitor is placed between V REF and GND, TJ = 25˚C. (Continued) PSRR vs. Frequency @ CLOCK = 2.4 MHz Output vs. Input Amplitude @ CLOCK = 408 kHz, 3.4 kHz Audio BW 20133436 20133464 Output vs. Input Amplitude @ CLOCK = 960 kHz, 8 kHz Audio BW Output vs. Input Amplitude @ CLOCK = 1.2 MHz, 10 kHz Audio BW 20133465 20133466 Output vs. Input Amplitude @ CLOCK = 1.92 MHz, 16 kHz Audio BW Output vs. Input Amplitude @ CLOCK = 2.4 MHz, 20 kHz Audio BW 20133467 20133437 LMV1024/LMV1026 www.national.com9

Typical Performance CharacteristicsUnless otherwise specified, measurements are performed on an LMV1024 with V DD = 1.8V, Clock Duty Cycle = 50% and a 100 nF capacitor is placed between V REF and GND, TJ = 25˚C. (Continued) Output vs. Frequency @ CLOCK = 408 kHz, 3.4 kHz Audio BW Output vs. Frequency @ CLOCK = 960 kHz, 8 kHz Audio BW 20133468 20133469 Output vs. Frequency @ CLOCK = 1.2 MHz, 10 kHz Audio BW Output vs. Frequency @ CLOCK = 1.92 MHz, 16 kHz Audio BW 20133470 20133471 Output vs. Frequency @ CLOCK = 2.4 MHz, 20 kHz Audio BW 20133438 LMV1024/LMV1026 www.national.com 10

amplifier inside an ECM is given in Figure 5. the microphone and the baseband. FIGURE 5. Microphone Sensitivity

resulting DATA output as function of the input. Bandwidth) relates directly the applied clock frequency. and a couple of common Audio Bandwidths. TABLE 1. Audio Bandwidth vs. Clock Frequency

1.2 MHz 10 kHz

1.92 MHz 16 kHz

2.4 MHz 20 kHz

sampling ratio (OSR) of this particular ADC is chosen at 60. desired, the clock frequency needs to be 1.2 MHz or higher. spectrum plot, where a 1 kHz signal is applied. FIGURE 6. DATA Output versus Input Amplitude

FIGURE 11. PCB Layout

Physical Dimensions inches (millimeters) unless otherwise noted NOTE: UNLESS OTHERWISE SPECIFIED. 1. FOR SOLDER BUMP COMPOSITION, SEE “SOLDER INFORMATION” IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB PAGE (www.national.com). 2. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 3. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. 4. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 5. NO JEDEC REGISTRATION AS OF MARCH 2003 6-Bump Ultra Thin micro SMD X1 = 1.128 mm, X2 = 1.628 mm, X3 = 0.35 mm National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. For the most current product information visit us at www.national.com. LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. BANNED SUBSTANCE COMPLIANCE National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2. Leadfree products are RoHS compliant. National Semiconductor Americas Customer Support Center Email: new.feedback@nsc.com Tel: 1-800-272-9959 National Semiconductor Europe Customer Support Center Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 National Semiconductor Asia Pacific Customer Support Center Email: ap.support@nsc.com National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507 Email: jpn.feedback@nsc.com Tel: 81-3-5639-7560 www.national.com LMV1024/LMV1026 PDM Output with Pre-Amplifier for Electret Microphones