LMR62014 TI | Alldatasheet
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0 20 40 60 80 100 120 140 160 LOAD (mA) EFFICIENCY (%) EFFICIENCY (%) LOAD CURRENT (mA) 0 100 200 300 400 100 500 LMR62014 www.ti.com SNVS735B –OCTOBER 2011–REVISED APRIL 2013 LMR62014SIMPLESWITCHER® 20Vout,1.4AStep-UpVoltageRegulatorinSOT-23 Check forSamples: LMR62014 1FEATURES DESCRIPTION The LMR62014 switchingregulatorisa current-mode 23• InputVoltageRange of2.7Vto14V boost converteroperatingat fixed frequency of• Output Voltageup to20V 1.6MHz.
- Switch Currentup to1.4A The use of SOT-23 package,made possibleby the• 1.6MHz SwitchingFrequency minimalpower lossof the internal1.4A switch,and
- Low Shutdown Iq,<1 µA use of smallinductorsand capacitorsresultin the industry'shighestpower density.The LMR62014 is• Cycle-by-CycleCurrentLimiting capable of greaterthan 90% duty cycle,making it• InternallyCompensated idealforboostingtovoltagesup to20V.
- 5-PinSOT-23 Packaging (2.92x 2.84x 1.08mm) These partshave a logic-levelshutdown pinthatcan• FullyEnabled forWEBENCH ® Power Designer be used to reduce quiescentcurrentand extend batterylife. PERFORMANCE BENEFITS Protectionisprovidedthroughcycle-by-cyclecurrent
- ExtremelyEasy toUse limitingand thermalshutdown.Internalcompensation simplifiesdesignand reducescomponent count.• TinyOverallSolutionReduces System Cost
APPLICATIONS
- Boost Conversions from 3.3V,5V,and 12V Rails
- Space ConstrainedApplications
- Embedded Systems
- LCD Displays
- LED Applications System Performance Efficiencyvs Load Current Efficiencyvs Load Current VIN = 3.3V,VOUT = 12V VIN = 5V,VOUT = 12V Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2SIMPLE SWITCHER, WEBENCH areregisteredtrademarksofTexas Instruments. 3Allothertrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2011–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
2.2 PF L1/10 PH 13.3k CF 220 pF R1/117k 4.7 PF 12V OUT 500 mA (TYP) LMR62014 SNVS735B –OCTOBER 2011–REVISED APRIL 2013 www.ti.com Connection Diagram Figure1. 5-Lead SOT-23 (Top View) See DBV Package PIN DESCRIPTIONS Pin Name Function 1 SW DrainoftheinternalFET switch. 2 GND Analogand power ground. 3 FB Feedback pointthatconnectstoexternalresistivedivider. 4 SHDN Shutdown controlinput.ConnecttoVinifthefeatureisnotused. 5 VIN Analogand power input.
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formula: Ifpower dissipationexceedsthemaximum specifiedabove,theinternalthermalprotection LMR62014 www.ti.com SNVS735B –OCTOBER 2011–REVISED APRIL 2013 These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1)(2) StorageTemperatureRange −65°C to+150°C OperatingJunctionTemperatureRange −40°C to+125°C Lead Temp. (Soldering,5 sec.) 300°C Power Dissipation(3) InternallyLimited FB PinVoltage −0.4Vto+6V SW PinVoltage −0.4Vto+22V InputSupplyVoltage −0.4Vto+14.5V SHDN PinVoltage −0.4VtoVIN + 0.3V θJ-A (SOT-23) 265°C/W ESD RatingHuman Body Model(4) 2 kV Forsolderingspecificationssee SNOA549 (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothecomponent may occur.Electricalspecificationsdo notapply when operatingthedeviceoutsideofthelimitssetforthundertheoperatingratingswhichspecifytheintendedrangeofoperating conditions. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) The maximum power dissipationwhichcan be safelydissipatedforany applicationisa functionofthemaximum junctiontemperature, TJ(MAX) = 125°C, thejunction-to-ambientthermalresistancefortheSOT-23 package,θJ-A = 265°C/W, and theambienttemperature, TA.The maximum allowablepower dissipationatany ambienttemperaturefordesignsusingthisdevicecan be calculatedusingthe circuitrywillprotectthedeviceby reducingtheoutputvoltageas requiredtomaintaina safejunctiontemperature. (4) The human body model isa 100 pF capacitordischargedthrougha 1.5kΩ resistorintoeach pin. Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LMR62014
SNVS735B –OCTOBER 2011–REVISED APRIL 2013 www.ti.com ElectricalCharacteristics LimitsinstandardtypefaceareforTJ = 25°C, and limitsinboldfacetypeapplyoverthefulloperatingtemperaturerange (−40°C ≤ TJ ≤ +125°C).Unlessotherwisespecified:VIN = 5V,VSHDN = 5V,IL = 0A. Symbol Parameter Conditions Min (1) Typical(2) Max (1) Units VIN InputVoltage 2.7 14 V VOUT (MIN) Minimum OutputVoltage R L = 43Ω(3) VIN = 2.7V 5.4 7 V Under Load VIN = 3.3V 8 10 VIN = 5V 13 17 R L = 15Ω(3) VIN = 2.7V 3.75 5 VIN = 3.3V 5 6.5 VIN = 5V 8.75 11 ISW SwitchCurrentLimit See (4) 1.8 2 A 1.4 R DS (ON) SwitchON Resistance ISW = 100 mA, Vin= 5V 260 400 m Ω 500 ISW = 100 mA, Vin= 3.3V 300 450 550 SHDN TH Shutdown Threshold DeviceON 1.5 V DeviceOFF 0.50 ISHDN Shutdown PinBiasCurrent VSHDN = 0 0 µA VSHDN = 5V 0 2 VFB Feedback PinReference VIN = 3V 1.205 1.230 1.255 VVoltage IFB Feedback PinBiasCurrent VFB = 1.23V 60 500 nA IQ QuiescentCurrent VSHDN = 5V,Switching 2 3.0 mA VSHDN = 5V,Not Switching 400 500 µA VSHDN = 0 0.024 1 ΔVFB FB VoltageLineRegulation 2.7V≤ VIN ≤ 14V 0.02 %/VΔVIN FSW SwitchingFrequency(5) 1 1.6 1.85 MHz D MAX Maximum DutyCycle(5) 86 93 % IL SwitchLeakage Not SwitchingVSW = 5V 1 µA (1) Limitsareensuredby testing,statisticalcorrelation,ordesign. (2) Typicalvaluesarederivedfromthemean valueofa largequantityofsamplestestedduringcharacterizationand representthemost likelyexpectedvalueoftheparameteratroom temperature. (3) L = 10 µH, C OUT = 4.7µF,dutycycle= maximum (4) Switchcurrentlimitisdependenton dutycycle(seeTypicalPerformanceCharacteristics). (5) Specifiedlimitsarethesame forVin= 3.3Vinput.
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FEEDBACK VOLTAGE (V) 1.222 1.223 1.224 1.225 1.226 1.227 1.228 1.229 1.23 1.231 -40 -25 0 25 50 75 100 125 TEMPERATURE ( oC) TEMPERATURE ( oC) FEEDBACK BIAS CURRENT ( PA) 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 -50 -25 0 25 50 75 100 125 150 MAX DUTY CYCLE (%) 92.1 92.2 92.3 92.4 92.5 92.6 92.7 92.8 92.9 TEMPERATURE ( oC) VIN = 5V VIN = 3.3V -50 -25 0 25 50 75 100 125 150 IQ VIN (IDLE) (PA) TEMPERATURE ( oC) 340 345 350 355 360 365 370 375 380 -50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150 TEMPERATURE ( oC) 1.8 1.85 1.9 1.95 2.05 2.1 2.15 2.2 IQ VIN ACTIVE (mA) OSCILLATOR FREQUENCY (MHz) 1.4 1.42 1.44 1.46 1.48 1.5 1.52 1.54 1.56 1.58 TEMPERATURE ( oC) VIN = 5V VIN = 3.3V -50 -25 0 25 50 75 100 125 150 LMR62014 www.ti.com SNVS735B –OCTOBER 2011–REVISED APRIL 2013 TypicalPerformance Characteristics Unlessotherwisespecified:VIN = 5V,SHDN pintiedtoVIN. IqVin (Active)vs Temperature OscillatorFrequency vs Temperature Figure2. Figure3. Max. Duty Cycle vs Temperature IqVin (Idle)vs Temperature Figure4. Figure5. Feedback Bias Currentvs Temperature Feedback Voltagevs Temperature Figure6. Figure7. Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LMR62014
00 100 200 300 400 500 600 LOAD (mA) EFFICIENCY (%) 100 14000 200 400 600 800 1000 1200 LOAD (mA) EFFICIENCY (%) 100 VIN (V) 100 150 200 250 300 350 R DS_ON (m:) 0 50 100 150 200 250 300 LOAD (mA) EFFICIENCY (%) 100 R DS(ON) (:) -40 -25 0 25 50 75 100 125 TEMPERATURE ( oC) 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 Vin = 5V Vin = 3.3V CURRENT LIMIT (A) 2.1 2.2 2.3 2.4 2.5 2.6 -40 -25 0 25 50 75 100 125 TEMPERATURE ( oC) LMR62014 SNVS735B –OCTOBER 2011–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics(continued) Unlessotherwisespecified:VIN = 5V,SHDN pintiedtoVIN. R DS (ON) vs Temperature CurrentLimitvs Temperature Figure8. Figure9. Efficiencyvs Load Current R DS (ON) vs VIN VIN = 2.7V,VOUT = 5V Figure10. Figure11. Efficiencyvs Load Current Efficiencyvs Load Current VIN = 3.3V,VOUT = 5V VIN = 4.2V,VOUT = 5V Figure12. Figure13.
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3500 50 100 150 200 250 300 LOAD (mA) EFFICIENCY (%) 100 6000 100 200 300 400 500 LOAD (mA) EFFICIENCY (%) 100 0 20 40 60 80 100 120 140 160 LOAD (mA) EFFICIENCY (%) 0 10 20 30 40 50 EFFICIENCY (%) LOAD (mA) LMR62014 www.ti.com SNVS735B –OCTOBER 2011–REVISED APRIL 2013 TypicalPerformance Characteristics(continued) Unlessotherwisespecified:VIN = 5V,SHDN pintiedtoVIN. Efficiencyvs Load Current Efficiencyvs Load Current VIN = 2.7V,VOUT = 12V VIN = 3.3V,VOUT = 12V Figure14. Figure15. Efficiencyvs Load Current Efficiencyvs Load Current VIN = 5V,VOUT = 12V VIN = 5V,VOUT = 18V Figure16. Figure17. Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LMR62014
SNVS735B –OCTOBER 2011–REVISED APRIL 2013 www.ti.com Block Diagram
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www.ti.com SNVS735B –OCTOBER 2011–REVISED APRIL 2013 THEORY OF OPERATION The LMR62014 is a switchingconverterIC thatoperatesat a fixedfrequency(1.6MHz) forfasttransient responseovera wide inputvoltagerange and incorporatespulse-by-pulsecurrentlimitingprotection.Because thisiscurrentmode control,a 33 m Ω sense resistorinserieswiththeswitchFET isused toprovidea voltage (whichisproportionaltotheFET current)toboththeinputofthepulsewidthmodulation(PWM) comparatorand thecurrentlimitamplifier. At the beginningof each cycle,the S-R latchturnson the FET. As the currentthroughthe FET increases,a voltage(proportionaltothiscurrent)issummed withtheramp coming fromtheramp generatorand thenfedinto theinputofthePWM comparator.When thisvoltageexceeds thevoltageon theotherinput(comingfrom the Gm amplifier),thelatchresetsand turnstheFET off.Sincethesignalcoming from theGm amplifierisderived fromthefeedback(whichsamples thevoltageattheoutput),theactionofthePWM comparatorconstantlysets thecorrectpeak currentthroughtheFET tokeep theoutputvoltageinregulation. Q1 and Q2 alongwithR3 -R6 forma bandgap voltagereferenceused by theIC toholdtheoutputinregulation. The currentsflowingthroughQ1 and Q2 willbe equal,and thefeedbackloopwilladjusttheregulatedoutputto maintainthis.Because ofthis,theregulatedoutputisalwaysmaintainedata voltagelevelequaltothevoltageat theFB node "multipliedup"by theratiooftheoutputresistivedivider. The currentlimitcomparatorfeedsdirectlyintotheflip-flopthatdrivestheswitchFET. IftheFET currentreaches the limitthreshold,the FET isturnedoffand the cycleterminateduntilthe nextclockpulse.The currentlimit inputterminatesthepulseregardlessofthestatusoftheoutputofthePWM comparator. ApplicationHints SELECTING THE EXTERNAL CAPACITORS The bestcapacitorsforuse withtheLMR62014 are multi-layerceramiccapacitors.They have thelowestESR (equivalentseriesresistance)and highestresonancefrequencywhich makes them optimum foruse withhigh frequencyswitchingconverters. When selectinga ceramiccapacitor,onlyX5R and X7R dielectrictypesshouldbe used.Other typessuch as Z5U and Y5F have such severelossofcapacitancedue toeffectsoftemperaturevariationand appliedvoltage, theymay provideas littleas 20% of ratedcapacitanceinmany typicalapplications.Always consultcapacitor manufacturer’s datacurvesbeforeselectinga capacitor. SELECTING THE OUTPUT CAPACITOR A singleceramic capacitorof value 4.7 µF to 10 µF willprovidesufficientoutputcapacitanceformost applications.Iflargeramounts of capacitanceare desiredforimproved linesupportand transientresponse, tantalumcapacitorscan be used.Aluminum electrolyticswithultralow ESR such as Sanyo Oscon can be used, butareusuallyprohibitivelyexpensive.TypicalAIelectrolyticcapacitorsarenotsuitableforswitchingfrequencies above 500 kHz due tosignificantringingand temperaturerisedue toself-heatingfromripplecurrent.An output capacitorwithexcessiveESR can alsoreducephase marginand cause instability. Ingeneral,ifelectrolyticsareused,itisrecommended thattheybe paralleledwithceramiccapacitorstoreduce ringing,switchinglosses,and outputvoltageripple. SELECTING THE INPUT CAPACITOR An inputcapacitorisrequiredtoserveas an energyreservoirforthecurrentwhichmust flowintothecoileach time the switchturnsON. This capacitormust have extremelylow ESR, so ceramicisthe best choice.We recommend a nominalvalueof2.2µF,butlargervaluescan be used.Sincethiscapacitorreducestheamount of voltagerippleseen at the inputpin,italsoreducesthe amount of EMI passed back alongthatlineto other circuitry. Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LMR62014
SNVS735B –OCTOBER 2011–REVISED APRIL 2013 www.ti.com FEED-FORWARD COMPENSATION Althoughinternallycompensated,the feed-forwardcapacitorCf isrequiredforstability(see BasicApplication Circuit).Addingthiscapacitorputsa zerointheloopresponseoftheconverter.The recommended frequencyfor thezerofzshouldbe approximately6 kHz.Cf can be calculatedusingtheformula: Cf = 1 /(2X π X R1 X fz) (1) SELECTING DIODES The externaldiodeused inthetypicalapplicationshouldbe a Schottkydiode.Thediodemust be ratedtohandle themaximum outputvoltageand loadcurrent.A 20V diodesuch as theMBR0520 isrecommended. The MBR05XX seriesofdiodesare designedtohandlea maximum averagecurrentof0.5A.For applications exceeding0.5Aaverage,a ToshibaCRS08 can be used. LAYOUT HINTS High frequencyswitchingregulatorsrequireverycarefullayoutofcomponents inordertogetstableoperation and low noise.Allcomponents must be as closeas possibletotheLMR62014 device.Itisrecommended thata 4-layerPCB be used so thatinternalgroundplanesareavailable. As an example,a recommended layoutofcomponents isshown: Figure18. Recommended PCB Component Layout Some additionalguidelinestobe observed: 1. Keep thepathbetween L1,D1, and C2 extremelyshort.ParasitictraceinductanceinserieswithD1 and C2 willincreasenoiseand ringing. 2. The feedbackcomponents R1, R2 and CF must be keptclosetotheFB pinofU1 topreventnoiseinjection on theFB pintrace. 3. Ifinternalgroundplanesareavailable(recommended) use viastoconnectdirectlytogroundatpin2 ofU1, as wellas thenegativesidesofcapacitorsC1 and C2.
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Duty Cycle = VOUT + VDIODE - VIN VOUT + VDIODE - VSW LMR62014 www.ti.com SNVS735B –OCTOBER 2011–REVISED APRIL 2013 SETTING THE OUTPUT VOLTAGE The outputvoltageisset usingthe externalresistorsR1 and R2 (see Basic ApplicationCircuit).A valueof approximately13.3 kΩ isrecommended forR2 to establisha dividercurrentof approximately92 µA. R1 is calculatedusingtheformula: Figure19. Basic ApplicationCircuit DUTY CYCLE The maximum duty cycleof the switchingregulatordeterminesthe maximum boost ratioof output-to-input voltagethatthe convertercan attainin continuousmode of operation.The duty cyclefora given boost applicationisdefinedas: (3) Thisappliesforcontinuousmode operation. INDUCTANCE VALUE The firstquestionwe are usuallyasked is:“How smallcan Imake theinductor?” (becausetheyare thelargest sizedcomponent and usuallythemost costly).The answer isnotsimpleand involvestrade-offsinperformance. Largerinductorsmean lessinductorripplecurrent,which typicallymeans lessoutputvoltageripple(fora given sizeof outputcapacitor).Largerinductorsalsomean more loadpower can be deliveredbecause the energy storedduringeach switchingcycleis: E = L/2X (lp)2 where
- “lp”isthepeak inductorcurrent. (4) An importantpointto observeisthatthe LMR62014 willlimititsswitchcurrentbased on peak current.This means thatsincelp(max)isfixed,increasingL willincreasethemaximum amount ofpower availabletotheload. Conversely,usingtoolittleinductancemay limittheamount ofloadcurrentwhichcan be drawn fromtheoutput. Best performanceisusuallyobtainedwhen theconverterisoperatedin“continuous” mode attheloadcurrent rangeofinterest,typicallygivingbetterloadregulationand lessoutputripple.Continuousoperationisdefinedas notallowingtheinductorcurrenttodroptozeroduringthecycle.Itshouldbe notedthatallboostconvertersshift overtodiscontinuousoperationas theoutputloadisreducedfarenough,buta largerinductorstays“continuous” overa widerloadcurrentrange. Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LMR62014
SNVS735B –OCTOBER 2011–REVISED APRIL 2013 www.ti.com To betterunderstandthesetrade-offs,a typicalapplicationcircuit(5V to12V boostwitha 10 µH inductor)willbe analyzed.We willassume: VIN = 5V,VOUT = 12V,VDIODE = 0.5V,VSW = 0.5V (5) Sincethefrequencyis1.6MHz (nominal),theperiodisapproximately0.625µs.The dutycyclewillbe 62.5%, whichmeans theON timeoftheswitchis0.390µs.Itshouldbe notedthatwhen theswitchisON, thevoltage acrosstheinductorisapproximately4.5V. Usingtheequation: V = L (di/dt) (6) We can thencalculatethedi/dtrateoftheinductorwhich isfoundtobe 0.45A/µs duringtheON time.Using thesefacts,we can thenshow what theinductorcurrentwilllooklikeduringoperation: Figure20. 10 µH InductorCurrent, 5V–12V Boost (LMR62014X) Duringthe0.390µs ON time,theinductorcurrentramps up 0.176Aand ramps down an equalamount duringthe OFF time.Thisisdefinedas theinductor“ripplecurrent”.Itcan alsobe seen thatiftheloadcurrentdropsto about33 mA, theinductorcurrentwillbegintouchingthezeroaxiswhichmeans itwillbe indiscontinuousmode. A similaranalysiscan be performedon any boostconverter,tomake suretheripplecurrentisreasonableand continuousoperationwillbe maintainedatthetypicalloadcurrentvalues.
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ILOAD (max) = (1 - DC) x (ISW (max) - DC (VIN - VSW )) 2fL 20 30 40 50 60 70 80 90 100 DUTY CYCLE (%) = [1 - EFF*(VIN / VOUT )] 500 1000 1500 2000 2500 3000SW CURRENT LIMIT (mA) VIN = 5V VIN = 3.3V VIN = 2.7V VIN = 3V LMR62014 www.ti.com SNVS735B –OCTOBER 2011–REVISED APRIL 2013 MAXIMUM SWITCH CURRENT The maximum FET switchcurrentavailablebeforethecurrentlimitercutsinisdependenton dutycycleofthe application.Thisisillustratedinthegraphsbelow which show typicalvaluesofswitchcurrentas a functionof effective(actual)dutycycle: Figure21. Switch CurrentLimitvs Duty Cycle CALCULATING LOAD CURRENT As shown inFigure20 whichdepictsinductorcurrent,theloadcurrentisrelatedtotheaverageinductorcurrent by therelation: ILOAD = IIND(AVG) x (1-DC) where
- "DC" isthedutycycleoftheapplication. (7) The switchcurrentcan be foundby: ISW = IIND(AVG) + ½ (IRIPPLE ) (8) Inductorripplecurrentisdependenton inductance,dutycycle,inputvoltageand frequency: IRIPPLE = DC x (VIN-VSW )/(fx L) (9) combiningallterms,we can developan expressionwhich allowsthe maximum availableload currentto be calculated: (10) The equationshown tocalculatemaximum loadcurrenttakesintoaccountthelossesintheinductororturn-OFF switchinglossesof the FET and diode.For actualloadcurrentintypicalapplications,we tookbench data for variousinputand outputvoltagesthatdisplayedthemaximum loadcurrentavailablefora typicaldeviceingraph form: Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:LMR62014
VIN (V) MAX LOAD CURRENT (mA) 200 400 600 800 1000 1200 2 3 4 5 6 7 8 9 10 11 VOUT = 5V VOUT = 8V VOUT = 10V VOUT = 12V VOUT = 18V LMR62014 SNVS735B –OCTOBER 2011–REVISED APRIL 2013 www.ti.com Figure22. Max. Load Current(typ)vs VIN DESIGN PARAMETERS VSW AND ISW The valueoftheFET "ON" voltage(referredtoas VSW intheequations)isdependenton loadcurrent.A good approximationcan be obtainedby multiplyingthe "ON Resistance"of the FET times the average inductor current. FET on resistanceincreasesatVIN valuesbelow 5V, sincetheinternalN-FET has lessgatevoltageinthisinput voltagerange (see TypicalPerformance Characteristicscurves).Above VIN = 5V, the FET gate voltageis internallyclamped to5V. The maximum peak switchcurrentthedevicecan deliverisdependenton dutycycle.For higherdutycycles,see TypicalPerformanceCharacteristicscurves. THERMAL CONSIDERATIONS At higherdutycycles,theincreasedON timeoftheFET means themaximum outputcurrentwillbe determined by power dissipationwithintheLMR62014 FET switch.The switchpower dissipationfromON-stateconductionis calculatedby: P(SW) = DC x IIND(AVE)2 x R DS (ON) (11) There willbe some switchinglossesas well,so some deratingneeds tobe appliedwhen calculatingIC power dissipation. INDUCTOR SUPPLIERS Recommended suppliersofinductorsforthisproductinclude,butarenotlimitedtoSumida,Coilcraft,Panasonic, TDK and Murata.When selectingan inductor,make certainthatthecontinuouscurrentratingishighenough to avoidsaturationatpeak currents.A suitablecoretypemust be used tominimizecore(switching)losses,and wirepower lossesmust be consideredwhen selectingthecurrentrating. SHUTDOWN PIN OPERATION The deviceisturnedoffby pullingtheshutdownpinlow.Ifthisfunctionisnotgoingtobe used,thepinshouldbe tieddirectlytoVIN.IftheSHDN functionwillbe needed,a pull-upresistormust be used toVIN (approximately 50k-100kΩ recommended).The SHDN pinmust notbe leftunterminated.
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Efficiency vs Load Current EFFICIENCY (%) LOAD (mA) 0 50 100 150 200 250 100 300 3.3 - 9V Boost LMR62014 SW FB GND VIN SHDN 51kSHDN GND
3.3 VIN
2.2 PF R2
13.3k CF 330 pF R1/84k L1/10 PH 4.7 PF R4 R5 9V OUT 240 mA (typ) LMR62014 www.ti.com SNVS735B –OCTOBER 2011–REVISED APRIL 2013 Figure23. FlashLED Application Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:LMR62014
SNVS735B –OCTOBER 2011–REVISED APRIL 2013 www.ti.com
REVISION HISTORY
Changes from RevisionA (April2013)toRevisionB Page
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www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LMR62014XMF/NOPB Active Production SOT-23 (DBV) | 5 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 SH1B LMR62014XMF/NOPB.A Active Production SOT-23 (DBV) | 5 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 SH1B LMR62014XMF/NOPB.B Active Production SOT-23 (DBV) | 5 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 SH1B LMR62014XMFE/NOPB Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 SH1B LMR62014XMFE/NOPB.A Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 SH1B LMR62014XMFE/NOPB.B Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 SH1B LMR62014XMFX/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 SH1B LMR62014XMFX/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 SH1B LMR62014XMFX/NOPB.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 SH1B (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative Addendum-Page 1
www.ti.com 23-May-2025 and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 25-Sep-2024 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 25-Sep-2024 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMR62014XMF/NOPB SOT-23 DBV 5 1000 208.0 191.0 35.0 LMR62014XMFE/NOPB SOT-23 DBV 5 250 208.0 191.0 35.0 LMR62014XMFX/NOPB SOT-23 DBV 5 3000 208.0 191.0 35.0 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE C 0.22
0.08 TYP
0.25 3.0 2.6 2X 0.95 1.9 1.45 0.90 0.15
0.00 TYP
5X 0.5 0.3 0.6
0.3 TYP
0 TYP
1.9 (0.1) (0.15) 4X 0 -15 4X 4 -15 A 3.05 2.75 B1.75 1.45 (1.1) SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR 4214839/K 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25 mm per side. 5. Support pin may differ or may not be present.
0.2 C A B
0.1 C SCALE 4.000
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
0.07 MIN
5X (1.1) 5X (0.6) (2.6) (1.9) 2X (0.95) (R0.05) TYP 4214839/K 08/2024 SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X PKG 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN (2.6) (1.9) 2X(0.95) 5X (1.1) 5X (0.6) (R0.05) TYP SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR 4214839/K 08/2024 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X SYMM PKG 3 4
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