TPS60231 TI | Alldatasheet

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C1− C2+ C2− EN1 EN2 GND PGND VOUT ISET 0.47 /C0109F 0.47 /C0109F 1 /C0109F 1 /C0109F VIN = 2.7 V to 6.5 V TPS60231 www.ti.com SLVS544A –OCTOBER 2004–REVISED FEBRUARY 2010 WHITELEDCHARGEPUMPCURRENTSOURCE WITHPWM BRIGHTNESSCONTROL Check forSamples: TPS60231 1FEATURES DESCRIPTION• RegulatedOutput CurrentWith 0.4% Matching The TPS60231 charge pump isoptimizedforwhite LED suppliesincolordisplaybacklightapplications.• Drivesup to3 LEDs at25 mA Each The deviceprovidesa constantcurrentforeach LED,• LED BrightnessControlThrough PWM which the initialvalue can be set by an externalControlSignal resistor.The supplyvoltageranges from 2.7 V to

  • High Efficiencyby FractionalConversion 6.5V and isideallysuitedforallapplicationspowered With 1x and 1.5xModes by a singleLI-Ionbatterycellor threeto fourNiCd, NiMH, oralkalinebatterycells.Over an inputvoltage• 1 MHz SwitchingFrequency rangefrom3.1V to6.5V, thedeviceprovidesa high• 2.7V to6.5V OperatingInputVoltageRange outputcurrentofup to25 mA perLED witha totalof
  • InternalSoftstartLimitsInrushCurrent 75 mA. High efficiencyis achieved by utilizinga 1x/1.5x fractional conversion technique in• Low InputRippleand Low EMI combinationwithverylow dropoutcurrentsources.In• Overcurrentand OvertemperatureProtected addition,thecurrentcontrolledchargepump ensures• UndervoltageLockout With Hysteresis low inputcurrentrippleand EMI. Only two external 1 µF and two 0.47µF capacitorsarerequiredtobuild• Ultra-Small3mm x 3mm QFN Package a completesmalland low costpower supplysolution. To reduce board space to a minimum, the deviceAPPLICATIONS switches at 1 MHz operatingfrequency and is• White LED BacklightforColorDisplaysin availableina small16-pinQFN (RGT) package.CellularPhones, Smart Phones, PDAs, Handheld PCs, DigitalCameras, and SPACER Camcorders
  • Keypad Backlight Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsofTexas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2004–2010,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SLVS544A –OCTOBER 2004–REVISED FEBRUARY 2010 www.ti.com This integratedcircuitcan be damaged by ESD. Texas Instrumentsrecommends thatallintegratedcircuitsbe handled with appropriateprecautions.Failuretoobserveproperhandlingand installationprocedurescan cause damage. ESD damage can rangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmay be more susceptibletodamage because verysmallparametricchanges couldcause thedevicenottomeet itspublishedspecifications.

ORDERING INFORMATION

PACKAGED DEVICE (1)(2) PACKAGE MARKING TPS60231RGTR QFN BKH (1) T indicatesshipmentintapeand reelon a minireelwith250 unitsperreel. (2) R indicatesshipmentintapeand reelwith3000 unitsperreel. ABSOLUTE MAXIMUM RATINGS overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) UNIT VI Supplyvoltage –0.3V to7 V VoltageatEN1, EN2, VOUT, ISET –0.3V toVI OutputcurrentatVOUT 150 mA TJ Maximum junctiontemperature 150°C TA Operatingfree-airtemperature –40°C to85°C Tst Storagetemperature –65°C to150°C (1) Stressesbeyond thoselistedunder"absolutemaximum ratings"may cause permanentdamage tothedevice.These arestressratings only,and functionaloperationofthedeviceattheseorany otherconditionsbeyond thoseindicatedunder"recommended operating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmay affectdevicereliability. DISSIPATION RATINGS (1) TA ≤ 25°C DERATING FACTOR TA = 70°C TA = 85°CPACKAGE POWER RATING ABOVE TA = 25°C POWER RATING POWER RATING 16-PinQFN (RGT) 1.9W 20 mW/ °C 1 W 760 mW (1) The thermalresistancejunctiontoambientoftheQFN package is52°C/W. RECOMMENDED OPERATING CONDITIONS MIN TYP MAX UNIT SupplyvoltageatVIN 2.7 6.5 V Maximum outputcurrentatVOUT 75 mA C I Inputcapacitor 1 µF C o Outputcapacitor 0.47 1 µF Flyingcapacitor,C1, C2 0.22 0.47 µF Operatingjunctiontemperature -40 125 °C

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www.ti.com SLVS544A –OCTOBER 2004–REVISED FEBRUARY 2010

ELECTRICAL CHARACTERISTICS

VI = 3.6V,EN1 = EN2 = VI,TA = -40°C to85°C (unlessotherwisenoted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SUPPLY VOLTAGE AND CURRENT IO = 0 mA to75 mA 2.7 6.5 V VI Inputvoltagerange IO = 0 mA to45 mA, VLED ≤ 2.1V,T = 0°C to85°C 2.5 6.5 V VI= 4.2V,x1-mode,EN1 = EN2 = 1,ISET = 20 µA 200 µA IQ Operatingquiescentcurrent IO = 0 mA, x1.5-mode 2.1 mA ISD Shutdown current EN2 = EN1 = GND 0.1 1 µA CHARGE PUMP STAGE VOUT Overvoltagelimit LED1 unconnected,VI= 4.2V 5.5 V Startuptime C O = 1 µF,IDX ≥ 0.9IDX ,set 375 µs Softstartduration 160 µs f Switchingfrequency 0.75 1 1.25 MHz h Efficiency VI= 3.7V,ILED = 15 mA each,VDX = 3.1V 83% Shutdown temperature Temperaturerising 160 °C Shutdown temperaturehysteresis 20 °C Inputcurrentlimit EN2 = EN1 = 1,ISET = 100 µA 350 mA CURRENT SINKS Recommended maximum currentper 3.2V ≤ VI≤ 6.5VIDx 25 mAcurrentsink Currentintoeach currentsinkwhen ISETIDx 3.0V ≤ VI≤ 6.5V,ISET shortedtoGND 50 mAisshortedtoGND Currentmatchingbetween any two outputs VDx = 3.1V,TA = 25°C –2% 0.4% 2% 3.2V ≤ VI≤ 6.5V,VDx = 3.1V,EN1 = EN2 = 1,Lineregulation ±3%ISET = 80 µA EN2 = 0,EN1 = 1 200 VISET Referencevoltageforcurrentset EN2 = 1,EN1 = 0 400 mV EN2 = 1,EN1 = 1 580 600 620 Iset Recommended ISET pincurrentrange 4 130 µA K IDx toISET currentratio EN2 = EN1 = 1,ISET = 80 µA 230 260 280 EN2 = 0,EN1 = 1 200 Vsource VoltageatDx toGND EN2 = 1,EN1 = 0 300 mV EN2 = 1,EN1 = 1 400 ENABLE 1,ENABLE 2 VIH EN1, EN2 highlevelinputvoltage 1.3 V VIL EN1, EN2 lowlevelinputvoltage 0.3 V EN1, EN2 trippointhysteresis 50 mV IIKG EN2 inputleakagecurrent EN1, EN2 = GND orEN2 = VI,VI= 6.5V 0.01 1 µA IIKG EN1 inputleakagecurrent EN1 = VI,VI= 4.2V 11 15 µA UVLO Undervoltagelockoutthreshold Inputvoltagefalling 2.1 V Undervoltagelockouthysteresis 50 mV FrequencyrangeatPWM 0 50 kHz Recommended ON-timeforPWM signal 2.5 µs Delaytimewhen EN1 = EN2 go toGND afterwhichShutdown delaytime 0.5 0.85 1.5 mstheTPS60231 shutsdown completely Copyright© 2004–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):TPS60231

C2− C1− C1+ C2+ PGND VIN EN1 VOUT ISET GND NC NC 31 2 12 11 10 9 EN2 QFN P ACKAGE (TOP VIEW) TPS60231 SLVS544A –OCTOBER 2004–REVISED FEBRUARY 2010 www.ti.com PIN ASSIGNMENT Pin Functions PIN I/O DESCRIPTION NAME NO. C1+ 10 – ConnecttotheflyingcapacitorC1 C1 – 11 – ConnecttotheflyingcapacitorC1 C2+ 9 – ConnecttotheflyingcapacitorC2 C2 – 12 – ConnecttotheflyingcapacitorC2 D1-D3 6-4 I Currentsinkinput.ConnectthecathodeofthewhiteLEDs totheseinputs. Enableinput.A logichighenablestheconverter,logiclowforcesthedeviceintoshutdownmode reducingEN1 15 I thesupplycurrenttolessthan1 µA ifEN2 istiedtoGND. An appliedPWM signalreducestheLED currentas a functionofthedutycycleofthePWM signal.EN1 and EN2 can be tiedtogetherforPWM dimming between 0 mA and themaximum setwithISET.EN1 and EN2EN2 16 I can alsobe used fordigitaldimming with4 stepsfrom0 mA tothemaximum currentsetwithISET.See the applicationsectionformore details. GND 14 – Analogground ISET 1 I Connecta resistorbetween thispinand GND tosetthemaximum currentthroughtheLEDs. NC 2,3 – No internalconnection PGND 7 – Power ground VIN 13 I Supplyvoltageinput VOUT 8 0 Connecttheoutputcapacitorand theanode oftheLEDs tothispin. Power PAD – – ConnectwithPGND and GND

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C1− C2+ C2− EN2 VOUT ISET GND EN1 Control R SET VIN Reference 0.47 /C0109F 0.47 /C0109F 1 /C0109F Charge Pump Current Sinks 1 /C0109F PGND TPS60231 www.ti.com SLVS544A –OCTOBER 2004–REVISED FEBRUARY 2010 FUNCTIONAL BLOCK DIAGRAM SPACER TYPICAL CHARACTERISTICS TableofGraphs FIGURE vs Inputvoltage(ILED = 25 mA, 15 mA, 10 mA, 5 mA perLED), 1EN2 = 0,EN1 = 1 vs Inputvoltage(ILED = 25 mA, 15 mA, 10 mA, 5 mA perLED),h Efficiency 2EN2 = 1,EN1 = 0 vs Inputvoltage(ILED = 25 mA, 15 mA, 10 mA, 5 mA perLED), 3EN2 = EN1 = 1 IQ Quiescentcurrent vs Inputvoltage(TA = –40°C, 25°C, 85°C) (measuredwithID1 = 5 mA) 4 Maximum outputcurrentfromchargepump vs Inputvoltage(TA = –40°C, 25°C, 85°C) 5stage fs Switchingfrequency vs Free-AirTemperature(TA = -40°C to85°C, VI= 3.6V) 6 vs Dutycycleon PWM (ILED max setto20 mA)LED current,ILED 7Forf= 32 kHz and f= 1 kHz,DC = 1% to100%, VI= 3.6V VIand ID1 vs timeon scope,LED currentatD1 withLinetransientresponse 8VI= 4.2V to3.6V to4.2V withEN2 = EN1 = 11,3 x 20 mA PWM signaland currentatD1 vs timeon scope Dimming response f= 32 kHz and f= 1 kHz,VI= 3.6V,dutycycle= 50%, 9,10 EN1 = EN2 = PWM VI= 3.6V,3 x 20 mA, EN1 = EN2 = 00 changed to 11Startuptiming EN2 = EN1 = 11 Copyright© 2004–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):TPS60231

ILED = 25 mA VI − Input Voltage − V Efficiency − % ILED = 15 mA ILED = 10 mA ILED = 5 mA 100 VI − Input Voltage − V Efficiency − % ILED = 25 mA ILED = 10 mA ILED = 15 mA ILED = 5 mA VI − Input Voltage − V IQ − Quiescent Current − mA 0.2 0.4 0.6 0.8 1.2 1.4 1.6 1.8 2.2 2.4 2.6 2.8 TA = −40/C0053C TA = 25/C0053C TA = 85/C0053C VI − Input Voltage − V Efficiency − % ILED = 25 mA ILED = 10 mA ILED = 5 mA ILED = 15 mA TPS60231 SLVS544A –OCTOBER 2004–REVISED FEBRUARY 2010 www.ti.com EFFICIENCY EFFICIENCY vs vs INPUT VOLTAGE INPUT VOLTAGE Figure1. Figure2. EFFICIENCY QUIESCENT CURRENT vs vs INPUT VOLTAGE INPUT VOLTAGE Figure3. Figure4.

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VI − Input Voltage − V 0.05 0.10 0.15 VLED = 3 V VLED = 3.4 V VLED = 3.6 V VLED = 3.8 V IO − Maximum Output Current − A VLED = 3.2 V TA = 25/C0053C 980 990 1000 1010 1020 1030 1040 −40 −30 −20 −10 0 10 20 30 40 50 60 70 80 TA − Free-Air Temperature − /C0053C Switching Frequency − kHz VI = 3.6 V 1 mA/div 500 mV/div VI ILED(D1) 3.6 V AC EN1 = 1, EN2 = 1, VI = 3.6 V to 4.2 V, ILED = 20 mA, 3 LEDs Connected, ILED(D1) Measured With 1 /C0087 Resistor, TA = 25/C0053C 100 /C0109s/div 0 10 20 30 40 50 60 70 80 90 100 Duty Cycle − % f = 32 kHz f = 1 kHz VI = 3.6 V, ILED max set to 20 mA ILED(D1) − D1 LED Current − mA TPS60231 www.ti.com SLVS544A –OCTOBER 2004–REVISED FEBRUARY 2010 MAXIMUM OUTPUT CURRENT SWITCHING FREQUENCY vs vs INPUT VOLTAGE FREE-AIR TEMPERATURE Figure5. Figure6. D1 LED CURRENT vs DUTY CYCLE LINE TRANSIENT Figure7. Figure8. Copyright© 2004–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):TPS60231

ILED(D1) 0 V PWM Into EN1 and EN2, VI = 3.6 V, ILED = 20 mA, 3 LEDs Connected, f = 1 kHz, TA = 25/C0053C 200 /C0109s/div 0 A 10 mA/div 2 V/div PWM ILED(D1) 0 V PWM Into EN1 and EN2, VI = 3.6 V, ILED = 20 mA, 3 LEDs Connected, f = 32 kHz, TA = 25/C0053C 5 /C0109s/div 0 A EN1 + EN2 VO ILED 0 V 0 A 0 V 20 mA/div 5 V/div1 V/div 20 /C0109s/div VI = 3.6 V , ILED = 20 mA,

3 LED's Connected,

TA = 25/C0053C TPS60231 SLVS544A –OCTOBER 2004–REVISED FEBRUARY 2010 www.ti.com DIMMING RESPONSE DIMMING RESPONSE Figure9. Figure10. STARTUP TIMING Figure11. DETAILED DESCRIPTION OPERATION The TPS60231 uses a fractionalconversionchargepump togeneratea supplyvoltagefortheintegratedcurrent sinks.These currentsinksareused toensurea constantcurrentforeach LED. Depending on theinputvoltage and programmed LED current,the charge pump eitheroperatesin the 1x mode or in the 1.5x mode. By switchingautomaticallybetween thesetwo modes, thecircuitoptimizespower conversionefficiencyas wellas extendsoperatingtimeby allowingthedischargeofthebatterycompletely. The chargepump can generate75 mA ofoutputcurrent,so each ofthe3 LED outputscan be powered withup to 25 mA of current.The maximum LED currentissetby a resistorconnectedto the ISET pin.Thisresistor programsa referencecurrent,whichiscurrentmirroredtosettheLED current.

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/C0032K TPS60231 www.ti.com SLVS544A –OCTOBER 2004–REVISED FEBRUARY 2010 Applyinga PWM signalto the EN1 pin and/orthe EN2 pin controlsthe LED brightness.See a detailed descriptioninthesectionAnalogDimming UsingISET Pin. LED CURRENT ADJUSTMENT (ISET) A resistorprograms a referencecurrent,which iscurrentmirroredto setthe LED current.The voltageat the ISET pindepends on the statusof EN1 and EN2. The currentineach LED istypically260 timesthe current throughtheresistoratISET. VISET — VoltagefromISET pin(0.2V,0.4V or0.6V) toGND, see Table1 ILED — CurrentperLED fromDx pintoGND K — Dx toISET currentratio(typically260) The LED currentvarieslinearlyfrom0 mA toILED(max) mA by applyinga PMW signalwith0% to100% dutycycle. The LED brightnesscan however alsobe controlledby an analogcontrolsignalthatisfedintotheISET pin. SOFT START The TPS60231 has an internalsoftstartcircuittolimittheinrushcurrentduringstartup.Thispreventspossible voltagedropsoftheinputvoltageifa highimpedance power sourceisconnectedtotheinputoftheTPS60231. When thedevicestartsup withan outputvoltagethatisbelow theinputvoltage,theoutputcapacitorischarged directlyfromtheinputwitha currentsource.The outputcurrentincreaseslinearlyuntiltheoutputreacheswithin 300 mV of the inputvoltage.When the programmed outputcurrentcan be reached withthe 1x mode, the TPS60231 terminatesthe softstartand beginsnormal operation.When the desiredoutputcurrentcannotbe reached,thechargepump beginsoperationin1.5xmode and pumps theoutputvoltageup totheneeded level toreachtheprogrammed outputcurrent. ENABLE (EN1,EN2) The enablepinsEN1 and EN2 areused toenablethedeviceorsetitintoshutdown.The TPS60231 isenabledif one oftheenablepinsispulledhigherthantheenabletrippointof1.3V. The devicestartsup by goingthrough thesoftstartroutineas describedinthesectionSoftStart.PullingbothpinstoGND, aftera delay,programsthe devicetoshutdown.Inshutdown,thechargepump, currentsources,voltagereference,oscillator,and allother functionsareturnedoffand thesupplycurrentisreducedto0.1µA. EN1 and EN2 can alsobe used fordimming.The logiclevelsatEN1 and EN2 settheminimum voltageatthe currentmirrorsand thevoltageattheISET pintoGND. ThissetsthecurrentattheLEDs tobe eitherthefull currentora fractionofthefullcurrent.See Table1 forfurtherdetails.The maximum currentthroughtheLEDs is setby a resistorconnectedbetween ISET and GND. EN1 and EN2 can alsobe used forPWM dimming.The PWM signalcan eitherbe appliedtoEN1 or EN2, or both inputscan be tiedtogetherand the PWM signalcan be appliedto both pins.Depending on the configuration,the currentduringPWM dimming isswitchedbetween 0 mA and itsmaximum (EN1 and EN2 connectedtothePWM signal)orbetween 0 mA and 1/3ofthefullLED currentifEN2 = 0 and EN1 istoggled. When EN1 = 0 and EN2 istoggled,theoutputcurrentcan be changed between 0 mA and 2/3ofthefullrange. Table1.Enable Levels ENABLE LEVEL MODE LED CURRENT EN2 EN1 0 0 SHUTDOWN 0 0 1 VISET = 200 mV 1/3 1 0 VISET = 400 mV 2/3 1 1 VISET = 600 mV Full Copyright© 2004–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLink(s):TPS60231

SLVS544A –OCTOBER 2004–REVISED FEBRUARY 2010 www.ti.com UNDERVOLTAGE LOCKOUT The undervoltagelockoutcircuitshutsdown thedevicewhen thevoltageatVIN dropsbelow a typicalthreshold of2.15V. Thispreventsdamage tothedevice.The UVLO circuitallowsthedevicetostartup againafterthe voltageon theVIN pinhas increasedby about50 mV above theUVLO lockoutthreshold. SHORT CIRCUIT AND OVERTEMPERTURE PROTECTION The currentattheVOUT pinislimitedtypicallyto250 mA. When thejunctiontemperatureexceeds 160°C, the deviceshutsdown to protectthe devicefrom damage. Afterthe temperaturedecreasesto about 140°C, the devicestartsup againifitisenabled. OVERVOLTAGE PROTECTION AT VOUT The deviceuses thevoltageatD1 toregulatevoltageatVOUT. Incase D1 isnotconnected,an overvoltage protectioncircuitensuresthattheoutputvoltageatVOUT does notexceed itslimits.The connectionoftheLEDs must be startedusingD1 first.For allotherLEDs thereisno restrictioninthesequence.For example,ifthere areonly2 LEDs used,thefirstLED isconnectedtoD1 and theotherLED can be connectedtoany otherofthe D2 toD3 pins. THEORY OF OPERATION/DESIGN PROCEDURE CapacitorSelection Ceramic capacitorssuch as X5R or X7R are recommended tobe used withtheTPS60231. For thetwo flying capacitorsC1 and C2, itisimportantto use low ESR capacitorsto avoidunnecessaryefficiencylosses.Low ESR capacitorson VOUT reducetheripplevoltageon thesupplyofthecurrentsources.Table2 listscapacitor typesthathave been testedwiththeTPS60231. Table2.Capacitors PART VALUE VOLTAGE MANUFACTURER SIZE WEBSITE C1608X5R1A105M 1 mF 10 V 0603 C1608X5R1A474M 0.47mF 10 V TDK 0603 www.componnent.tdk.com C2012X7R1C105M 1m F 16 V 0805 LMK107BJ105MA 1 mF 10 V 0603 LMK107BJ474MA 0.47mF 10 V TaiyoYuden 0603 www.t-yuden.com LMK212BJ105MG 1m F 10 V 0805 Power Efficiency The power conversionefficiencyof the TPS60231 can be calculatedby addingup the productsof each LED currentand voltageand dividingitby theproductoftheinputvoltageand current.With a fullychargedbattery where theinputvoltageistypicallyabove theLED forwardvoltage,thechargepump operatesinthe1x mode and efficiencyisveryhigh.As thebatterydischarges,thereisa pointwhere thecurrentsourcesno longerhave enough voltageoverheadtomaintaina constantcurrentregulation.At thatpoint,thechargepump switchesinto the 1.5x mode. The conversionefficiencyislowestat the crossover.As the batterydischargesfurther,the efficiencyagainincreasesuntilatabout3.1V where itreachesa second maximum. Below 3.1V inputvoltage, themaximum currentperLED islessthan25 mA. Power Dissipation The maximum power dissipationinsidetheTPS60231 can be calculatedbased on thefollowingequation: PD max = [(1.5× VI)– VO + 0.4V]× IO The maximum power dissipationoccurswhen theinputvoltageisjustlow enough tooperatein1.5xmode, with a forwardvoltageofthewhiteLED atmaximum. ThisistypicallyforVI = 4.2V and a forwardvoltageof3.6V. Thisneeds tobe lowerthanthemaximum allowedpower dissipationofthepackage,which can be calculated usingthefollowingequation:

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P D max, package/C0043 TJmax /C0042TA R /C0113ja VIN C1+ C1− C2+ C2− EN1 EN2 GND VOUT ISET 0.47 /C0109F 0.47 /C0109F 1 /C0109F 1 /C0109F VIN = 2.7 V to 6.5 V Typical Smartphone Display PGND TPS60231 www.ti.com SLVS544A –OCTOBER 2004–REVISED FEBRUARY 2010 For example,theworstcase power dissipationoccursattheinputvoltagelevelwhere thechargepump switches from the1x mode tothe1.5xmode. At thisoperatingpoint,thesupplyvoltagetothecurrentsourcesisatits maximum and thecurrentsourcesmust drop themost voltageinordertomaintaina regulatedoutputcurrent. The worstcase power dissipationoccurswhen all3 LED outputsarefullyloadedwith25 mA ofLED current.

  • With:VI= 4.2V,Vf= 3.6V,IO = 75 mA (1.5xmode)
  • PD max = 0.23W

APPLICATION INFORMATION

TYPICAL APPLICATION OF A SMART PHONE DISPLAY WITH RESISTORS CONNECTED IN PARALLEL Ifmore than 25 mA of outputcurrentisneeded, then the inputpinsto the currentsinkscan be connectedin parallelas shown inthefollowingapplicationfigure.Thismethod can alsobe used toconnecta LC displaywith onlytwo connectionsforthewhiteLEDs. Figure12. TypicalApplicationWith ResistorsinParallel ANALOG DIMMING USING ISET PIN The ISET pincan be used toconnectan analogdc signalintherangeof0 mV to600 mV (EN1 = EN2 = 1)for analogdimming ofthewhiteLEDs. Foran inputvoltageof0 V atISET,thecurrentisatitsmaximum, whereas at 600 mV, theLED currentiszero.The maximum currentis:

  • ForEN2 = EN1 = 1:ILED = Vset/Rset× K = 0.6V/6kR× 260 = 26 mA perLED
  • ForEN2 = 1,EN0 = 1:ILED = Vset/Rset× K = 0.4V/6kR× 260 = 17 mA perLED
  • ForEN2 = 0,EN1 = 1:ILED = Vset/Rset× K = 0.2V/6kR× 260 = 8.6mA perLED
  • WithEN2, EN1 setto10 or01,a voltageof400 mV or200 mV isrequiredtosettheLED currenttozero. Copyright© 2004–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLink(s):TPS60231

C1− C2+ C2− EN1 EN2 GND VOUT ISET 0.47 /C0109F 0.47 /C0109F 1 /C0109F 1 /C0109F VIN = 2.7 V to 6.5 V 6 k/C0087V = 0 mV to 600 mV PGND VOUT = VD1 + VFLEDD1 R g /C0043 V FLEDD1 /C0042V Fg Ig TPS60231 SLVS544A –OCTOBER 2004–REVISED FEBRUARY 2010 www.ti.com Figure13. Analog Dimming Connections Using ISET Pin TYPICAL APPLICATION USING 2 WHITE LEDs AND 6 GREEN LEDs FOR LCD BACKLIGHT AND KEYBOARD LIGHTING The TPS60231 can be used topower any kindofLED. Itisalsopossibletomix whiteLEDs withcolorLEDs whichhave a lowerforwardvoltage.The LED withthehighestforwardvoltage(typicallythewhiteLED) has tobe connectedtoD1, because theoutputvoltageofthechargepump isregulatedinsuch a way tokeep thevoltage drop from D1 to GND at 400mV (withEN1 = EN2 = 1).Thereforethe outputvoltageof the charge pump is regulatedto: VOUT — OutputvoltageatVOUT VD1 — VoltagefromD1 toGND (VsourceatD1 pin,see electricalcharacteristics) VFLEDD1 — ForwardvoltageoftheLED connectedtoD1 ResistorR g isused toprovidecurrentsharingbetween the6 greenLEDs. The uppervalueiscalculatedusing: VFg — Forwardvoltageofa greenLED Ig — CurrentpergreenLED

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C1− C2+ C2− EN1 EN2 GND VOUT ISET 0.47 /C0109F 0.47 /C0109F 1 /C0109F 1 /C0109F VIN = 2.7 V to 6.5 V

6 Green

2 White

6.2 k/C0087 Sets Current to 25 mA Per Current Sink (With EN2 = EN1 = 1) R g = 220 /C0087 TPS60231 www.ti.com SLVS544A –OCTOBER 2004–REVISED FEBRUARY 2010 Figure14. LED Connections forLCD Backlightand Keyboard Lighting PROPOSED LAND PATTERN FOR PCB PRODUCTION See theapplicationnoteSLUA271 fortheproposedlandpatternoftheQFN package.

REVISION HISTORY

Changes from Original(October2004)toRevisionA Page

  • Added a TestConditiontotheInputvoltagerangeoftheELECTRICAL CHARACTERISTICS -IO = 0 mA to45 mA, Copyright© 2004–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLink(s):TPS60231

www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TPS60231RGTR Active Production VQFN (RGT) | 16 3000 | LARGE T&R Yes NIPDAU | NIPDAU Level-2-260C-1 YEAR -40 to 85 BKH TPS60231RGTR.B Active Production VQFN (RGT) | 16 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 BKH TPS60231RGTRG4.B Active Production VQFN (RGT) | 16 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 BKH TPS60231RGTT Active Production VQFN (RGT) | 16 250 | SMALL T&R Yes NIPDAU | NIPDAU Level-2-260C-1 YEAR -40 to 85 BKH TPS60231RGTT.B Active Production VQFN (RGT) | 16 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 BKH (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 13-Jun-2024 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 13-Jun-2024 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS60231RGTR VQFN RGT 16 3000 346.0 346.0 33.0 TPS60231RGTR VQFN RGT 16 3000 356.0 356.0 35.0 TPS60231RGTT VQFN RGT 16 250 210.0 185.0 35.0 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C 16X 0.30 0.18 1.45 0.1 16X 0.5 0.3

1 MAX

(0.2) TYP 0.05 0.00 12X 0.5 1.5 A 3.1 2.9 B 3.1 2.9 VQFN - 1 mm max heightRGT0016A PLASTIC QUAD FLATPACK - NO LEAD 4219032/A 02/2017 PIN 1 INDEX AREA 0.08 SEATING PLANE 5 8 16 13 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD SYMM SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. 4. Reference JEDEC registration MO-220 SCALE 3.600

www.ti.com EXAMPLE BOARD LAYOUT

0.07 MIN

0.07 MAX

16X (0.24) 16X (0.6) ( 0.2) TYP VIA 12X (0.5) (2.8) (2.8) (0.475) TYP ( 1.45) (R0.05) ALL PAD CORNERS (0.475) TYP VQFN - 1 mm max heightRGT0016A PLASTIC QUAD FLATPACK - NO LEAD 4219032/A 02/2017 SYMM 5 8 1316 SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:20X NOTES: (continued) 5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 6. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METAL SOLDER MASK OPENINGSOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) EXPOSED METAL

www.ti.com EXAMPLE STENCIL DESIGN 16X (0.6) 16X (0.24) 12X (0.5) (2.8) (2.8) ( 1.34) (R0.05) TYP VQFN - 1 mm max heightRGT0016A PLASTIC QUAD FLATPACK - NO LEAD 4219032/A 02/2017 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SYMM ALL AROUND METAL SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 17: 86% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:25X SYMM 5 8 1316

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