LMC6008 NSC | Alldatasheet

Document overview

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Technical content

Features

Y High Output Current: High Speed Buffers 250 mA min Low Power Buffers 150 mA min Y Slew Rate: High Speed Buffers 1.7 V/ ms Low Power Buffers 0.85V/ ms Y Settling Time, C L e 0.1 mF1 6 ms max Y Wide Input/Output Range 0.1V to V CC b 0.1V min Y Supply Voltage Range 5V to 16V Y Supply Current 6.5 mA max Y Standby Mode Current 500 mA

Applications

TL/H/12321–1 Top View Note: Buffers 1, 3, 5 and 7 are High Speed and Buffers 2, 4, 6 and 8 are Low Speed.

Ordering Information

Package Temperature Range NSC Transport b40§Ct o a85§C Drawing Media 24-Pin LMC6008IM M24B Rail Surface Mount LMC6008IMX M24B Tape & Reel C1996 National Semiconductor Corporation RRD-B30M56/Printed in U. S. A.

Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. ESD Tolerance (Note 2) 2000V Voltage at Input Pin V a a 0.4V, V b b 0.4V Voltage at Output Pin V a a 0.4V, V b b 0.4V Supply Voltage (V a b Vb) 16V Lead Temperature (soldering, 10 sec.) 260 §C Storage Temperature Range b55§Ct o a150§C Junction Temperature (Note 4) 150 §C Power Dissipation (Note 4) Internally Limited Operating Ratings (Note 1) Supply Voltage 4.5V s Va s 16V Temperature Range b20§Ct o a100§C Thermal Resistance ( iJA) M Package, 24-Pin Surface Mount 50 §C/W Unless otherwise specified, all limits guaranteed for T J e 25§C, V CC e 14.5V and R L e 0. Symbol Parameter Conditions (Note 5) Typ LMC6008 UnitsLimit (Note 6) VOS Input Offset Voltage R S e 10 k X 25 mV max AV VO e 10 V PP 0.985 V/V IB Input Bias Current 300 nA max ILP Peak Load Current Hi Speed Buffers b250 mA max VO e 13 V PP a250 mA min ILP Peak Load Current Lo Speed Buffers b150 mA max VO e 13 V PP a150 mA min VERR Output Voltage Difference 35 mV max(Note 9) VIH Standby Logic 3.30 V minHIgh Voltage VIL ISTANDBY Logic 1.80 V maxLow Voltage IIH Standby High Input Current 1.0 mA max IIL Standby Low Input Current 1.0 mA max IO (STD-BY) Output Leakage Current V STD-BY e High 5 mA max ICC Supply Current V IL e Low, V IN e 7.25V 6.5 mA max ISTD-BY Standby Current V STD-BY e High 500 mA max PSRR Power Supply Rejection Ratio 5V k VCC k 14.5V 55 dB min VO Voltage Output Swing 0.1 V min VCC b 0.1 V max http:/ /www.national.com 2

Unless otherwise specified, all limits guaranteed for T J e 25§C, V CC e 14.5V and R L e 0X. Symbol Parameter Conditions (Note 5) Typ LMC6008 UnitsLimit (Note 6) SR Slew Rate Buffers 1, 3, 5, 7 (Note 3) 1.70 V/ ms min Buffers 2, 4, 6, 8 (Note 3) 0.85 V/ ms min tS Settling Time (Notes 3, 7) 16 ms max tON Standby Response Time ON 10 ms max tOFF Standby Response Time OFF 10 ms max PBW Power Bandwidth V O e 10 V PP for Hi-Speed 45VO e 5V PP for Lo-Speed KHz min (Note 3) CL Load Capacitance 0.1 mF max Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics. Note 2: Human body model, 1.5 k X in series with 100 pF. Note 3: The Load is a series connection of a 0.1 mF capacitor and a 1 X resistor. Note 4: The maximum power dissipation is a function of T J(max), iJA, and T A. The maximum allowable power dissipation at any ambient temperature is PD e (TJ(max) b TA)/iJA, where the junction-to-ambient thermal resistance iJA e 50§C/W. If the maximum allowable power dissipation is exceeded, the thermal limit circuit will limit the die temperature to approximately 160 §C. All numbers apply for packages soldered directly into a PC board. Note 5: Typical Values represent the most likely parametric norm. Note 6: All limits are guaranteed by testing or statistical analysis. Note 7: The settling time is measured from the input transition to a point 50 mV of the final value, for both rising and falling transitions. The input swing is 0.5V to Note 8: High-Speed Buffers are 1, 3, 5, 7 and Low-Speed Buffers are 2, 4, 6, 8. Note 9: Output Voltage Difference is the difference between the highest and lowest buffer output voltage when all buffer inputs are at identical voltages. http:/ /www.national.com3

Physical Dimensions inches (millimeters) unless otherwise noted 24-Lead (3.00 × Wide) Small Outline Molded Package (M) Order Number LMC6008IM or LMC6008IMX LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user. National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd. Japan Ltd.

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