LMC555_06 NSC | Alldatasheet

Document overview

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Technical content

Features

n Less than 1 mW typical power dissipation at 5V supply n 3 MHz astable frequency capability n 1.5V supply operating voltage guaranteed n Output fully compatible with TTL and CMOS logic at 5V supply n Tested to −10 mA, +50 mA output current levels n Reduced supply current spikes during output transitions n Extremely low reset, trigger, and threshold currents n Excellent temperature stability n Pin-for-pin compatible with 555 series of timers n Available in 8-pin MSOP Package and 8-Bump micro SMD package Pulse Width Modulator 00866920 00866915

Ordering Information

Package Temperature Range Package Marking Transport Media NSC Drawing Industrial −40˚C to +85˚C 8-Pin Small Outline (SO) LMC555CM LMC555CM Rails M08ALMC555CMX 2.5k Units Tape and Reel 8-Pin Mini Small Outline (MSOP) LMC555CMM ZC5 1k Units Tape and Reel MUA08ALMC555CMMX 3.5k Units Tape and Reel 8-Pin Molded Dip (MDIP) LMC555CN LMC555CN Rails N08E 8-Bump micro SMD LMC555CBP F1 250 Units Tape and Reel BPA08EFBLMC555CBPX 3k Units Tape and Reel 8-Bump micro SMD NOPB LMC555CTP F02 250 Units Tape and Reel TPA08EFALMC555CTPX 3k Units Tape and Reel Note: See Mil-datasheet MNLMC555-X for specifications on the military device LMC555J/883. LMCMOS™ is a trademark of National Semiconductor Corp. May 2006 LMC555 CMOS Timer © 2006 National Semiconductor Corporation DS008669 www.national.com

8-Pin SOIC, MSOP, MDIP 00866901 Top View 8-Bump micro SMD 00866909 Top View (Bump Side Down) LMC555 www.national.com 2

Absolute Maximum Ratings(Notes 2, 3) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage, V + 15V Input Voltages, VTRIG,V RES,V CTRL, VTHRESH −0.3V to V S + 0.3V Output Voltages, VO,V DIS 15V Output Current IO,I DIS 100 mA Storage Temperature Range −65˚C to +150˚C Soldering Information MDIP Soldering (10 seconds) 260˚C SOIC, MSOP Vapor Phase (60 sec) 215˚C SOIC, MSOP Infrared (15 sec) 220˚C Note: See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices. Operating Ratings(Notes 2, 3) Termperature Range −40˚C to +85˚C Thermal Resistance (θJA) (Note 2) SO, 8-Pin Small Outline 169˚C/W MSOP, 8-Pin Mini Small Outline 225˚C/W MDIP, 8-Pin Molded Dip 111˚C/W 8-Bump micro SMD 220˚C/W Maximum Allowable Power Dissipation @25˚C MDIP-8 1126 mW SO-8 740 mW MSOP-8 555 mW

8 Bump micro

Electrical Characteristics (Notes 1, 2) Test Circuit, T = 25˚C, all switches open, RESET to V S unless otherwise noted Symbol Parameter Conditions Min Typ Max Units (Limits) IS Supply Current V S = 1.5V VS =5 V VS = 12V 100 150 150 250 400 µA V CTRL Control Voltage V S = 1.5V VS =5 V VS = 12V 0.8 2.9 7.4 1.0 3.3 8.0 1.2 3.8 8.6 V V DIS Discharge Saturation Voltage V S = 1.5V, IDIS =1m A VS = 5V, IDIS =1 0m A 150 150 300 mV VOL Output Voltage (Low) V S = 1.5V, IO =1m A VS = 5V, IO =8m A VS = 12V, IO =5 0m A 0.2 0.3 1.0 0.4 0.6 2.0 V V OH Output Voltage (High) VS = 1.5V, IO = −0.25 mA VS = 5V, IO =− 2m A VS = 12V, IO = −10 mA 1.0 4.4 10.5 1.25 4.7 11.3 V VTRIG Trigger Voltage V S = 1.5V VS = 12V 0.4 3.7 0.5 4.0 0.6 4.3 V ITRIG Trigger Current V S =5 V 1 0 p A VRES Reset Voltage V S = 1.5V (Note 4) VS = 12V 0.4 0.4 0.7 0.75 1.0 1.1 V IRES Reset Current V S =5 V 1 0 p A ITHRESH Threshold Current V S =5 V 1 0 p A IDIS Discharge Leakage V S = 12V 1.0 100 nA t Timing Accuracy SW 2, 4 Closed VS = 1.5V VS =5 V VS = 12V 0.9 1.0 1.0 1.1 1.1 1.1 1.25 1.20 1.25 ms ∆t/∆V S Timing Shift with Supply V S =5 V ± 1V 0.3 %/V LMC555 www.national.com3

Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified. is given, however, the typical value is a good indication of device performance. Note 3: See AN-450 for other methods of soldering surface mount devices, and also AN-1112 for micro SMD considerations. Note 4: If the RESET pin is to be used at temperatures of −20˚C and below V S is required to be 2.0V or greater. TABLE 1. Package Pinout Names vs. Pin Function

Physical Dimensions inches (millimeters) unless otherwise noted Molded Small Outline (SO) Package (M) 8-Pin (0.118” Wide) Molded Mini Small Outline Package LMC555 www.national.com 8

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) Molded Dual-in-line Package (N) LMC555 www.national.com9

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) NOTES: UNLESS OTHERWISE SPECIFIED 1. EPOXY COATING 2. 63Sn/37Pb EUTECTIC BUMP 3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE NUMBERED COUNTERCLOCKWISE. 5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC. 8-Bump micro SMD Package X1 = 1.387 X 2 = 1.412 X 3 = 0.850 LMC555 www.national.com 10

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) NOTES: UNLESS OTHERWISE SPECIFIED 1. EPOXY COATING 2. FOR SOLDER BUMP COMPOSITION, SEE “SOLDER INFORMATION” IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB PAGE (www.national.com). 3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. 5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC. 8-Bump micro SMD Package X1 = 1.387 X 2 = 1.412 X 3 = 0.500 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. For the most current product information visit us at www.national.com. LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. BANNED SUBSTANCE COMPLIANCE National Semiconductor follows the provisions of the Product Stewardship Guide for Customers (CSP-9-111C2) and Banned Substances and Materials of Interest Specification (CSP-9-111S2) for regulatory environmental compliance. Details may be found at: www.national.com/quality/green. Lead free products are RoHS compliant. National Semiconductor Americas Customer Support Center Email: new.feedback@nsc.com Tel: 1-800-272-9959 National Semiconductor Europe Customer Support Center Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 National Semiconductor Asia Pacific Customer Support Center Email: ap.support@nsc.com National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507 Email: jpn.feedback@nsc.com LMC555 CMOS Timer

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