LMC555 NSC | Alldatasheet

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Technical content

Features

n Less than 1 mW typical power dissipation at 5V supply n 3 MHz astable frequency capability n 1.5V supply operating voltage guaranteed n Output fully compatible with TTL and CMOS logic at 5V supply n Tested to −10 mA, +50 mA output current levels n Reduced supply current spikes during output transitions n Extremely low reset, trigger, and threshold currents n Excellent temperature stability n Pin-for-pin compatible with 555 series of timers n Available in 8 pin MSOP Package and 8-Bump micro SMD package Block and Connection Diagrams LMCMOS ™ is a trademark of National Semiconductor Corp. 8-Pin SOIC, MSOP, and MDIP Packages DS008669-1 Top View 8-Bump micro SMD DS008669-9 Top View (bump side down) February 2000 LMC555 CMOS Timer © 2000 National Semiconductor Corporation DS008669 www.national.com

Ordering Information

Package Temperature Range Package Marking Transport Media NSC DrawingIndustrial −40˚C to +85˚C 8-LeadSmall Outline (SO) LMC555CM LMC555CM Rails M08ALMC555CMX LMC555CM 2.5k Units Tape and Reel 8-Lead Mini Small Outline (MSOP) LMC555CMM ZC5 1k Units Tape and Reel MUA08ALMC555CMMX ZC5 3.5k Units Tape and Reel 8-Lead Molded Dip (MDIP) LMC555CN LMC555CN Rails N08E 8-Bump micro SMD LMC555CBP F1 250 Units Tape and Reel BPA08EFBLMC555CBPX F1 3k Units Tape and Reel Metronome Circuit LMC555CBPEVAL N/A N/A N/A micro SMD Marking Orientation Top View DS008669-23 Bumps are numbered counter-clockwise LMC555 www.national.com 2

Absolute Maximum Ratings(Notes 2, 3) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage, V + 15V Input Voltages, VTRIG ,V RES ,V CTRL , VTHRESH −0.3V to VS + 0.3V Output Voltages, VO ,V DIS 15V Output Current IO ,IDIS 100 mA Storage Temperature Range −65˚C to +150˚C Soldering Information MDIP Soldering (10 seconds) 260˚C SOIC, MSOP Vapor Phase (60 sec) 215˚C SOIC, MSOP Infrared (15 sec) 220˚C Note:See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices. Operating Ratings(Notes 2, 3) Termperature Range −40˚C to +85˚C Thermal Resistance (θJA) (Note 2) SO, 8-lead Small Outline 169˚C/W MSOP, 8-lead Mini Small Outline 225˚C/W MDIP, 8-lead Molded Dip 111˚C/W 8-Bump micro SMD 220˚C/W Maximum Allowable Power Dissipation @25˚C MDIP-8 1126mW SO-8 740mW MSOP-8 555mW

8 Bump micro SMD 568mW

Electrical Characteristics(Notes 1, 2) Test Circuit, T= 25˚C, all switches open, RESET to VS unless otherwise noted Symbol Parameter Conditions Min Typ Max Units (Limits) IS Supply Current V S = 1.5V VS = 5V VS = 12V 100 150 150 250 400 µA V CTRL Control Voltage V S = 1.5V VS = 5V VS = 12V 0.8 2.9 7.4 1.0 3.3 8.0 1.2 3.8 8.6 V V DIS Discharge Saturation Voltage VS = 1.5V, IDIS = 1m A VS = 5V, IDIS = 10 mA 150 150 300 mV VOL Output Voltage (Low) V S = 1.5V, IO = 1m A VS = 5V, IO = 8m A VS = 12V, IO = 50 mA 0.2 0.3 1.0 0.4 0.6 2.0 V V OH Output Voltage (High) VS = 1.5V, IO = −0.25 mA VS = 5V, IO = −2 mA VS = 12V, IO = −10 mA 1.0 4.4 10.5 1.25 4.7 11.3 V VTRIG Trigger Voltage V S = 1.5V VS = 12V 0.4 3.7 0.5 4.0 0.6 4.3 V ITRIG Trigger Current V S = 5V 10 pA VRES Reset Voltage V S = 1.5V (Note 4) VS = 12V 0.4 0.4 0.7 0.75 1.0 1.1 V IRES Reset Current V S = 5V 10 pA ITHRESH Threshold Current V S = 5V 10 pA IDIS Discharge Leakage V S = 12V 1.0 100 nA t Timing Accuracy SW 2, 4 Closed VS = 1.5V VS = 5V VS = 12V 0.9 1.0 1.0 1.1 1.1 1.1 1.25 1.20 1.25 ms Δt/ΔV S Timing Shift with Supply VS = 5V ± 1V 0.3 % /V Δt/ΔT Timing Shift with Temperature VS = 5V 75 ppm/˚C fA Astable Frequency SW 1, 3 Closed, V S = 12V 4.0 4.8 5.6 kHz fMAX Maximum Frequency Max. Freq. Test Circuit, V S = 5V 3.0 MHz tR ,tF Output Rise and Fall Times Max. Freq. Test Circuit VS = 5V, CL = 10 pF 15 ns LMC555 www.national.com3

Note 1:All voltages are measured with respect to the ground pin, unless otherwise specified. given, however, the typical value is a good indication of device performance. Note 3:See AN-450 for other methods of soldering surface mount devices, and also AN-1112 for micro SMD considerations. Note 4:If the RESET pin is to be used at temperatures of −20˚C and below VS is required to be 2.0V or greater. TABLE 1. Package Pinout Names vs. Pin Function

Physical Dimensionsinches (millimeters) unless otherwise noted Molded Small Outline (SO) Package (M) LMC555 www.national.com 8

Physical Dimensionsinches (millimeters) unless otherwise noted (Continued) 8-Lead (0.118” Wide) Molded Mini Small Outline Package LMC555 www.national.com9

Physical Dimensionsinches (millimeters) unless otherwise noted (Continued) Molded Dual-in-line Package (N) LMC555 www.national.com 10

Physical Dimensionsinches (millimeters) unless otherwise noted (Continued) NOTES: UNLESS OTHERWISE SPECIFIED 1. EPOXY COATING 2. 63Sn/37Pb EUTECTIC BUMP 3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 4. PIN 1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE NUMBERED COUNTERCLOCKWISE. 5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACK- AGE LENGTH AND X3 IS PACKAGE HEIGHT. 6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC. micro SMD Package X 1 = 1.387 X 2 = 1.412 X 3 = 0.850 LMC555 www.national.com11

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Corporation Americas Tel: 1-800-272-9959 Fax: 1-800-737-7018 Email: support@nsc.com National Semiconductor Europe Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 National Semiconductor Asia Pacific Customer Response Group Tel: 65-2544466 Fax: 65-2504466 Email: ap.support@nsc.com National Semiconductor Japan Ltd. Tel: 81-3-5639-7560 Fax: 81-3-5639-7507 www.national.com LMC555 CMOS Timer National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.