LM9076 TI | Alldatasheet
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1.0 nF C OUT 10 PF 100 k: C IN 10 PF 0.1 PF Unregulated Voltage Input Regulated Voltage Output Delayed Reset OutputShutdown Control Input LM9076BMA-x.x ON OFF RESET VOUTVIN C DELAY GND 1.0 nF C OUT 10 PF 100 k: C IN 10 PF 0.1 PF Unregulated Voltage Input Regulated Voltage Output Delayed Reset Output LM9076S-x.x RESET LM9076 www.ti.com SNVS260L –NOVEMEBER 2003–REVISED MARCH 2013 LM9076150mAUltra-LowQuiescentCurrentLDORegulatorwithDelayedResetOutput Check forSamples: LM9076 1FEATURES DESCRIPTION The LM9076 is a ±3%, 150 mA logiccontrolled 2• Availablewith5.0Vor 3.3VOutput Voltage voltageregulator.The regulatorfeaturesan active• UltraLow Ground Pin Current,25 μA Typical low delayedresetoutputflagwhich can be used tofor100 μA Load reseta microprocessorsystem atturn-ONand inthe
- VOUT InitialAccuracy of±1.5% eventthatthe regulatoroutputvoltagefallsbelow a minimum value.An externalcapacitorprograms a• VOUT Accurateto±3% Over Load and delay time intervalbeforethe resetoutputpin canTemperature Conditions returnhigh.• Low Dropout Voltage,200 mV Typicalwith150 Designed forautomotiveand industrialapplications,mA Load theLM9076 containsa varietyofprotectionfeatures• Low OffStateGround Pin currentfor such as thermalshutdown,inputtransientprotectionLM9076BMA and a wide operatingtemperature range. The
- Delayed RESET Output Pin forLow VOUT LM9076 uses an PNP pass transistorwhich allows lowdrop-outvoltageoperation.Detection
- +70V/-50VVoltageTransients
- OperationalVIN up to+40V TypicalApplications Figure1. LM9076S-x.x in5 leadSFM package Figure2. LM9076BMA-x.x in8 leadSOIC package Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2003–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SNVS260L –NOVEMEBER 2003–REVISED MARCH 2013 www.ti.com Connection Diagram Figure3.Top View Figure4.Top View PartNumbers LM9076S-3.3 and LM9076S-5.0 PartNumbers LM9076BMA-3.3 and See SFM Package Number KTT0005B LM9076BMA-5.0 See SOIC Package Number D These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1) VIN(DC) -15V to+55V VIN(+Transient)t< 10ms, DutyCycle<1% +70V VIN(-Transient)t< 1ms, DutyCycle<1% -50V SHUTDOWN Pin -15V to+52V RESET Pin -0.3Vto20V C DELAY Pin -0.3VtoVOUT +0.3V StorageTemperature -65°C to+150°C JunctionTemperature(TJ ) +175C ESD, HBM, perAEC -Q100 -002 +/-2kV ESD, MM, perAEC -Q100 -003 +/-250V (1) AbsoluteMaximum Ratingsindicatethelimitsbeyond whichthedevicemay cease tofunction,and/ordamage tothedevicemay occur. OperatingRatings(1)(2) VIN Pin 5.35Vto40V VSHUTDOWN Pin 0V to40V JunctionTemperature −40°C < TJ < +125°C ThermalResistanceKTT0005B (3) θJA 75°C/W θJC 2.9°C/W ThermalResistanceD (3) θJA 156°C/W θJC 59°C/W (1) AbsoluteMaximum Ratingsindicatethelimitsbeyond whichthedevicemay cease tofunction,and/ordamage tothedevicemay occur. (2) OperatingRatingsindicateconditionsforwhichthedeviceisintendedtobe functional,butdoes notensurespecificperformancelimits. Forensuredspecificationsand conditionsrefertotheElectricalCharacteristics (3) Worstcase (FREE AIR)perEIA/JESD51–3.
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www.ti.com SNVS260L –NOVEMEBER 2003–REVISED MARCH 2013 ElectricalCharacteristicsforLM9076 –3.3 The followingspecificationsapplyforVIN = 14V;ILOAD = 10 mA; TJ = +25C; C OUT = 10 μF,0.5Ω < ESR < 4.0Ω;unless otherwisespecified.Bold valuesindicate−40°C ≤ TJ ≤ +125°C .(1)(2)(3)Minimum and Maximum limitsarespecifiedthrough test,designorstatisticalcorrelation. Symbol Parameter Conditions Min Typ Max Units LM9076 –3.3REGULATOR CHARACTERISTICS 3.251 3.30 3.349 V −20°C ≤ TJ ≤ 85°C 3.234 3.30 3.366 V1 mA ≤ ILOAD ≤ 150 mA OutputVoltage 1mA ≤ ILOAD ≤ 150 mA 3.201 3.30 3.399 V VIN = 60V,VOUT 2.970 3.30 3.630 VR LOAD = 1 kΩ,t≤ 40ms OutputVoltageOff VSHUTDOWN ≥ 2V, – 0 250 mVLM9076 BMA only R LOAD = 1 kΩ VIN = -15V,ReverseBattery −300 0 – mVR LOAD = 1 kΩ 9.0V≤ VIN ≤ 16V, – 4 25 mVILOAD = 10 mA LineRegulation ΔVOUT 16V ≤ VIN ≤ 40V, – 17 35 mVILOAD = 10 mA Load Regulation 1 mA ≤ ILOAD ≤ 150 mA – 42 60 mV ILOAD = 10 mA – 30 50 mV VDO DropoutVoltage ILOAD = 50 mA – 80 – mV ILOAD = 150 mA – 150 250 mV 9V ≤ VIN ≤ 16V, – 25 45 μAILOAD = 100 uA 9V ≤ VIN ≤ 40V, – 125 160 μAILOAD = 10 mA IGND Ground PinCurrent 9V ≤ VIN ≤ 40V, – 0.6 – mAILOAD = 50 mA 9V ≤ VIN ≤ 16V, – 3.6 4.5 mAILOAD = 150 mA VOUT ShortCircuit VIN = 14V,ISC 200 400 750 mACurrent R LOAD = 1Ω VIN = (14VDC )+ (1VRMS PSRR RippleRejection @ 120Hz) 50 60 – dB ILOAD = 50 mA RESET PIN CHARACTERISTICS Minimum VIN forvalidVOR (Note3) – 1.3 2.0 VRESET Status VOUT Thresholdfor X VOUTVTHR (Note3) 0.83 0.89 0.94RESET Low (Nom) Externalpull-upresistorVOH RESET pinhighvoltage VOUT X 0.90 VOUT X 0.99 VOUT VtoVOUT = 100 kΩ C DELAY < 4.0V,VOL RESET pinlowvoltage – 0.2 0.3 VISINK = 250 µA (1) The regulatedoutputvoltagespecificationisnotensuredfortheentirerangeofVIN and outputloads.Deviceoperationalrangeislimited by themaximum junctiontemperature(TJ ).The junctiontemperatureisinfluencedby theambienttemperature(TA ),package selection,inputvoltage(VIN ),and theoutputloadcurrent.When operatingwithmaximum loadcurrentstheinputvoltageand/orambient temperaturewillbe limited.When operatingwithmaximum inputvoltagetheloadcurrentand/ortheambienttemperaturewillbe limited. (2) Pulsetestingused maintainconstantjunctiontemperature(TJ ). (3) Not Productiontested,Specifiedby Design.Minimum, Typical,and/orMaximum valuesareprovidedforinformationalpurposesonly. Copyright© 2003–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM9076
SNVS260L –NOVEMEBER 2003–REVISED MARCH 2013 www.ti.com ElectricalCharacteristicsforLM9076 –3.3(continued) The followingspecificationsapplyforVIN = 14V;ILOAD = 10 mA; TJ = +25C; C OUT = 10 μF,0.5Ω < ESR < 4.0Ω;unless otherwisespecified.Bold valuesindicate−40°C ≤ TJ ≤ +125°C .(1)(2)(3)Minimum and Maximum limitsarespecifiedthrough test,designorstatisticalcorrelation. Symbol Parameter Conditions Min Typ Max Units C DELAY PIN CHARACTERISTICS C DELAY Charging VIN = 14V,IDELAY -0.70 -0.42 -0.25 uACurrent VDELAY = 0V VOUT < 4.0V,VOL C DELAY pinlowvoltage – 0.100 – VISINK = IDELAY VIN = 14V,C DELAY = 0.001uF tDELAY ResetDelayTime VOUT risingfrom0V,Δt 4.7 7.8 13.2 ms fromVOUT > VOR to RESET pinHIGH ElectricalCharacteristicsforLM9076 –5.0 The followingspecificationsapplyforVIN= 14V;VSHUTDOWN = Open; ILOAD = 10 mA; TJ = +25°C; C OUT = 10 µF,0.5Ω < ESR < 4.0Ω;unlessotherwisespecified.Bold Values indicate−40°C ≤ TJ ≤ 125°C .(1)(2)(3)Minimum and Maximum limitsare specifiedthroughtest,design,orstatisticalcorrelation. Symbol Parameter Conditions Min Typ Max Units LM9076 –5.0REGULATOR CHARACTERISTICS 4.925 5.00 5.075 V −20°C ≤ TJ ≤ 85°C 4.900 5.00 5.100 V1 mA ≤ ILOAD ≤ 150 mA OutputVoltage 1 mA ≤ ILOAD ≤ 150 mA 4.850 5.00 5.150 V VIN = 60V,VOUT 4.500 5.00 5.500 VR LOAD = 1 kΩ,t≤ 40ms OutputVoltageOff VSHUTDOWN ≥ 2V, – 0 250 mVLM9076 BMA only R LOAD = 1 kΩ VIN = -15V,ReverseBattery −300 0 – mVR LOAD = 1 kΩ 9.0V≤ VIN ≤ 16V, – 4 25 mVILOAD = 10 mA LineRegulation ΔVOUT 16V ≤ VIN ≤ 40V, – 17 35 mVILOAD = 10 mA Load Regulation 1 mA ≤ ILOAD ≤ 150 mA – 42 60 mV ILOAD = 10 mA – 30 50 mV VDO DropoutVoltage ILOAD = 50 mA – 80 – mV ILOAD = 150 mA – 150 250 mV 9V ≤ VIN ≤ 16V, – 25 45 μAILOAD = 100 uA 9V ≤ VIN ≤ 40V, – 125 160 μAILOAD = 10 mA Ground PinCurrent 9V ≤ VIN ≤ 40V,IGND – 0.6 – mAILOAD = 50 mA 9V ≤ VIN ≤ 16V, – 3.6 4.5 mAILOAD = 150 mA Ground PinCurrentin 9V ≤ VIN ≤ 40V, – 15 25 μAShutdown Mode VSHUTDOWN = 2V (1) Pulsetestingused maintainconstantjunctiontemperature(TJ ). (2) The regulatedoutputvoltagespecificationisnotensuredfortheentirerangeofVIN and outputloads.Deviceoperationalrangeislimited by themaximum junctiontemperature(TJ ).The junctiontemperatureisinfluencedby theambienttemperature(TA ),package selection,inputvoltage(VIN ),and theoutputloadcurrent.When operatingwithmaximum loadcurrentstheinputvoltageand/orambient temperaturewillbe limited.When operatingwithmaximum inputvoltagetheloadcurrentand/ortheambienttemperaturewillbe limited. (3) Not Productiontested,Specifiedby Design.Minimum, Typical,and/orMaximum valuesareprovidedforinformationalpurposesonly.
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www.ti.com SNVS260L –NOVEMEBER 2003–REVISED MARCH 2013 ElectricalCharacteristicsforLM9076 –5.0(continued) The followingspecificationsapplyforVIN= 14V;VSHUTDOWN = Open; ILOAD = 10 mA; TJ = +25°C; C OUT = 10 µF,0.5Ω < ESR < 4.0Ω;unlessotherwisespecified.Bold Values indicate−40°C ≤ TJ ≤ 125°C .(1)(2)(3)Minimum and Maximum limitsare specifiedthroughtest,design,orstatisticalcorrelation. Symbol Parameter Conditions Min Typ Max Units VOUT ShortCircuit VIN = 14V,ISC 200 400 750 mACurrent R LOAD = 1Ω VIN = (14VDC )+ (1VRMS PSRR RippleRejection @ 120Hz) 50 60 – dB ILOAD = 50 mA RESET PIN CHARACTERISTICS Minimum VIN forvalidVOR (Note3) – 1.3 2.0 VRESET Status VOUT Thresholdfor X VOUTVTHR (Note3) 0.83 0.89 0.94RESET Low (Nom) Externalpull-upresistorVOH RESET pinhighvoltage VOUT X 0.90 VOUT X 0.99 VOUT VtoVOUT = 100 kΩ C DELAY < 4.0V,VOL RESET pinlowvoltage – 0.2 0.3 VISINK = 250 µA C DELAY PIN CHARACTERISTICS C DELAY Charging VIN = 14V,IDELAY -0.70 -0.42 -0.25 uACurrent VDELAY = 0V VOUT < 4.0V,VOL C DELAY pinlowvoltage – 0.100 – VISINK = IDELAY VIN = 14V,C DELAY = 0.001uF tDELAY ResetDelayTime VOUT risingfrom0V,Δt 7.1 11.9 20.0 ms fromVOUT > VOR to RESET pinHIGH SHUTDOWN CONTROL LOGIC — LM9076BMA-5.0 Only VSHUTDOWN pinfallingSHUTDOWN PinLowVIL(SD) from5.0VuntilVOUT 1 1.5 – VThresholdVoltage >4.5V(VOUT = On) VSHUTDOWN pinrisingSHUTDOWN PinHighVIH(SD) from0V untilVOUT < – 1.5 2 VThresholdVoltage 0.5V(VOUT = Off) VSHUTDOWN = 40V – 35 – μA SHUTDOWN PinHighIIH(SD) VSHUTDOWN = 5V – 15 35 μABiasCurrent VSHUTDOWN = 2V – 6 10 μA SHUTDOWN PinLowIIL(SD) VSHUTDOWN = 0V – 0 – μABiasCurrent Copyright© 2003–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM9076
SNVS260L –NOVEMEBER 2003–REVISED MARCH 2013 www.ti.com TypicalPerformance Characteristics Output CapacitorESR Output CapacitorESR Figure5. Figure6. Output Voltagevs Low InputVoltage Output Voltagevs Low InputVoltage Figure7. Figure8. Ground Pin Currentvs Low InputVoltage Ground Pin Currentvs Low InputVoltage Figure9. Figure10.
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www.ti.com SNVS260L –NOVEMEBER 2003–REVISED MARCH 2013 TypicalPerformance Characteristics(continued) Ground Pin Currentvs Load Current Ground Pin Currentvs Load Current Figure11. Figure12. Output Voltagevs InputVoltage Output Voltagevs InputVoltage Figure13. Figure14. Output Voltagevs JunctionTemperature Output Voltagevs JunctionTemperature Figure15. Figure16. Copyright© 2003–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM9076
SNVS260L –NOVEMEBER 2003–REVISED MARCH 2013 www.ti.com TypicalPerformance Characteristics(continued) Dropout Voltagevs Load Current Load TransientResponse Figure17. Figure18. Load TransientResponse LineTransientResponse Figure19. Figure20. Delayed Reset Time vs Vin LineTransientResponse NormalizedtoVIN = 14V Figure21. Figure22.
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www.ti.com SNVS260L –NOVEMEBER 2003–REVISED MARCH 2013 TypicalPerformance Characteristics(continued) RippleRejection Figure23. Copyright© 2003–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM9076
SNVS260L –NOVEMEBER 2003–REVISED MARCH 2013 www.ti.com
APPLICATION INFORMATION
The LM9076 regulatorissuitableforAutomotiveand Industrialapplicationswhere continuousconnectionto a batterysupplyisrequired(refertoTypicalApplications). The pass elementoftheregulatorisa PNP devicewhich requiresan outputbypass capacitorforstability.The minimum bypass capacitancefortheoutputis10 μF (refertoESR limitations).A 22 μF,orlarger,outputbypass capacitorisrecommended fortypicalapplications INPUT CAPACITOR The LM9076 requiresa low source impedance to maintainregulatorstabilitybecause criticalportionsof the internalbiascircuitryareconnectedtodirectlytoVIN.Ingeneral,a 10 μF electrolyticcapacitor,locatedwithintwo inchesof the LM9076, isadequate fora majorityof applications.Additionally,and at a minimum, a 0.1 μF ceramiccapacitorshouldbe locatedbetween the LM9076 VIN and Ground pin,and as closeas isphysically possibletotheLM9076 itself. OUTPUT CAPACITOR An outputbypass capacitorisrequiredforstability.Thiscapacitancemust be placedbetween theLM9076 VOUT pinand Ground pin,as closeas isphysicallypossible,usingtracesthatarenotpartoftheloadcurrentpath. The outputcapacitormust meet the requirementsforminimum capacitanceand alsomaintainthe appropriate ESR valueacrossthe entireoperatingambienttemperaturerange.There isno limitto the maximum output capacitanceas longas ESR ismaintained. The minimum bypass capacitancefortheoutputis10 μF (refertoESR limitations).A 22 μF, or larger,output bypasscapacitorisrecommended fortypicalapplications. Solidtantalumscapacitorsare recommended as theygenerallymaintaincapacitanceand ESR ratingsover a wide temperaturerange.Ceramic capacitortypesXR7 and XR5 may be used ifa seriesresistorisadded to simulatetheminimum ESR requirement.See Figure24. Aluminum electrolyticcapacitorsarenotrecommended as theyaresubjecttowide changes incapacitanceand ESR acrosstemperature. Figure24. Using Low ESR Capacitors DELAY CAPACITOR The capacitoron theDelaypinmust be a low leakagetypesincethechargecurrentisminimal(420nA typical) and the pin must fullycharge to VOUT . Ceramic, Mylar,and polystyrenecapacitortypes are generally recommended, althoughchanges incapacitancevaluesacrosstemperaturechanges willhave some effecton thedelaytiming. Any leakageoftheIDELAY current,be itthroughthedelaycapacitororany otherpath,willextendthedelaytime, possiblytothepointthattheResetpinoutputdoes notgo high. SHUTDOWN PIN -LM9076BMA ONLY The basicOn/OffcontroloftheregulatorisaccomplishedwiththeSHUTDOWN pin.By pullingtheSHUTDOWN pinhightheregulatoroutputisswitchedOff.When theregulatorisswitchedOfftheloadon thebatterywillbe primarilydue totheSHUTDOWN pincurrent.
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www.ti.com SNVS260L –NOVEMEBER 2003–REVISED MARCH 2013 When theSHUTDOWN pinislow,orleftopen,theregulatorisswitchedOn. When an unregulatedsupply,such as V BATTERY , isused to pullthe SHUTDOWN pinhigha seriesresistorinthe range of 10KΩ to 50KΩ is recommended toprovidereversevoltagetransientprotectionoftheSHUTDOWN pin.Adding a smallcapacitor (0.001uFtypical)fromtheSHUTDOWN pintoGround willadd noiseimmunitytopreventaccidentalturnon due tonoiseon thesupplyline. RESET FLAG The RESET pinisan open collectoroutputwhichrequiresan externalpull-upresistortodeveloptheresetsignal. The externalpull-upresistorshouldbe intherangeof10 kΩ to200 kΩ. At VIN valuesoflessthantypically2V theRESET pinvoltagewillbe high.For VIN valuesbetween typically2V and approximatelyVOUT + VBE the RESET pinvoltagewillbe low.For VIN valuesgreaterthan approximately VOUT + VBE the RESET pinvoltagewillbe dependent on the statusof the VOUT pinvoltageand the Delayed Reset circuitry.The valueofVBE istypically600 mV at25°C and willdecreaseapproximately2 mV forevery1°C increaseinthejunctiontemperature.DuringnormaloperationtheRESET pinvoltagewillbe high. Any load conditionthatcauses the VOUT pin voltageto drop below typically89% of normal willactivatethe DelayedResetcircuitand theRESET pinwillgo lowforthedurationofthedelaytime. Any lineconditionthatcauses VIN pinvoltagetodropbelow typicallyVOUT + VBE willcause theRESET pintogo lowwithoutactivatingtheDelayedResetcircuitry. Excessivethermaldissipationwillraisethe junctiontemperatureand could activatethe Thermal Shutdown circuitrywhich,inturn,willcause theRESET pintogo low. For theLM9076BMA devices,pullingtheSHUTDOWN pinhighwillturnofftheoutputwhich,inturn,willcause theRESET pintogo low once theVOUT voltagehas decayed toa valuethatislessthantypically89% ofnormal. See Figure25. RESET DELAY TIME When theregulatoroutputisswitchedOn, orafterrecoveryfrombriefVOUT faultcondition,theRESET flagcan be can be programmed toremainlow foran additionaldelaytime.Thiswillgivetimeforany system reference voltages,clocksignals,etc.,tostabilizebeforethemicro-controllerresumes normaloperation. This delaytime iscontrolledby the capacitorvalueon the C DELAY pin.Duringnormal operationthe C DELAY capacitorischargedtonearVOUT .When a VOUT faultcauses theRESET pintogo low,theC DELAY capacitoris quicklydischargedtoground.When theVOUT faultisremoved,and VOUT returnstothenormaloperatingvalue, the C DELAY capacitorbeginschargingat a typicalconstant0.420 uA rate.When the voltageon the C DELAY capacitorreachesthesame potentialas theVOUT pintheRESET pinwillbe allowedtoreturnhigh. The typicalRESET delaytimecan be calculatedwiththefollowingformula: tDELAY = VOUT X (CDELAY /IDELAY ) (1) For theLM9076 –3.3witha C DELAY valueof0.001uF and a IDELAY valueof0.420uA thetypicalRESET delay timeis: tDELAY =3.3V × (0.001uF /0.420uA) = 7.8ms (2) For theLM9076 –5.0witha C DELAY valueof0.001uF and a IDELAY valueof0.420uA thetypicalRESET delay timeis: tDELAY = 5.0VX (0.001uF/0.420uA)= 11.9ms (3) Copyright© 2003–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM9076
SNVS260L –NOVEMEBER 2003–REVISED MARCH 2013 www.ti.com THERMAL PROTECTION Device operationalrange is limitedby the maximum junctiontemperature(TJ).The junctiontemperatureis influencedby theambienttemperature(TA),package selection,inputvoltage(VIN),and theoutputloadcurrent. When operatingwithmaximum loadcurrentstheinputvoltageand/orambienttemperaturewillbe limited.When operatingwithmaximum inputvoltagetheloadcurrentand/ortheambienttemperaturewillbe limited. Even thoughtheLM9076 isequippedwithcircuitrytoprotectitselffrom excessivethermaldissipation,itisnot recommended thattheLM9076 be operatedat,or near,themaximum recommended diejunctiontemperature (TJ)as thismay impairlongtermdevicereliability. The thermalprotectioncircuitymonitorsthe temperatureat the dielevel.When the dietemperatureexceeds typically160°C thevoltageregulatoroutputwillbe switchedoff. Figure25. TypicalReset Pin OperationalWaveforms
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REVISION HISTORY
Changes from RevisionK (March 2013)toRevisionL Page Copyright© 2003–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:LM9076
www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM9076BMA-3.3/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 125 9076B MA3.3 LM9076BMA-3.3/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 125 9076B MA3.3 LM9076BMA-5.0/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 125 9076B MA5.0 LM9076BMA-5.0/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 125 9076B MA5.0 LM9076BMAX-3.3/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 9076B MA3.3 LM9076BMAX-5.0/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 9076B MA5.0 LM9076S-3.3/NOPB Active Production DDPAK/ TO-263 (KTT) | 5 45 | TUBE ROHS Exempt SN Level-3-245C-168 HR -40 to 125 LM9076S -3.3 LM9076S-3.3/NOPB.B Active Production DDPAK/ TO-263 (KTT) | 5 45 | TUBE ROHS Exempt SN Level-3-245C-168 HR -40 to 125 LM9076S -3.3 LM9076S-5.0/NOPB Active Production DDPAK/ TO-263 (KTT) | 5 45 | TUBE ROHS Exempt SN Level-3-245C-168 HR -40 to 125 LM9076S -5.0 LM9076S-5.0/NOPB.B Active Production DDPAK/ TO-263 (KTT) | 5 45 | TUBE ROHS Exempt SN Level-3-245C-168 HR -40 to 125 LM9076S -5.0 LM9076SX-3.3/NOPB Active Production DDPAK/ TO-263 (KTT) | 5 500 | LARGE T&R ROHS Exempt SN Level-3-245C-168 HR -40 to 125 LM9076S -3.3 LM9076SX-3.3/NOPB.B Active Production DDPAK/ TO-263 (KTT) | 5 500 | LARGE T&R ROHS Exempt SN Level-3-245C-168 HR -40 to 125 LM9076S -3.3 LM9076SX-5.0/NOPB Active Production DDPAK/ TO-263 (KTT) | 5 500 | LARGE T&R ROHS Exempt SN Level-3-245C-168 HR -40 to 125 LM9076S -5.0 LM9076SX-5.0/NOPB.B Active Production DDPAK/ TO-263 (KTT) | 5 500 | LARGE T&R ROHS Exempt SN Level-3-245C-168 HR -40 to 125 LM9076S -5.0 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. Addendum-Page 1
www.ti.com 23-May-2025 (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant LM9076SX-3.3/NOPB DDPAK/ TO-263 LM9076SX-5.0/NOPB DDPAK/ TO-263 Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM9076BMAX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM9076BMAX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM9076SX-3.3/NOPB DDPAK/TO-263 KTT 5 500 356.0 356.0 45.0 LM9076SX-5.0/NOPB DDPAK/TO-263 KTT 5 500 356.0 356.0 45.0 Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) LM9076BMA-3.3/NOPB D SOIC 8 95 495 8 4064 3.05 LM9076BMA-3.3/NOPB.B D SOIC 8 95 495 8 4064 3.05 LM9076BMA-5.0/NOPB D SOIC 8 95 495 8 4064 3.05 LM9076BMA-5.0/NOPB.B D SOIC 8 95 495 8 4064 3.05 LM9076S-3.3/NOPB KTT TO-263 5 45 502 25 8204.2 9.19 LM9076S-3.3/NOPB.B KTT TO-263 5 45 502 25 8204.2 9.19 LM9076S-5.0/NOPB KTT TO-263 5 45 502 25 8204.2 9.19 LM9076S-5.0/NOPB.B KTT TO-263 5 45 502 25 8204.2 9.19 Pack Materials-Page 3
www.ti.com BOTTOM SIDE OF PACKAGE TS5B (Rev D)
www.ti.com PACKAGE OUTLINE C .228-.244 TYP [5.80-6.19] .069 MAX [1.75] 6X .050 [1.27] 8X .012-.020 [0.31-0.51] .150 [3.81] .005-.010 TYP [0.13-0.25] 0 - 8 .004-.010 [0.11-0.25] .010 [0.25].016-.050 [0.41-1.27] 4X (0 -15 ) A .189-.197 [4.81-5.00] NOTE 3 B .150-.157 [3.81-3.98] NOTE 4 4X (0 -15 ) (.041) [1.04] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. 1 8 .010 [0.25] C A B PIN 1 ID AREA SEATING PLANE .004 [0.1] C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800
www.ti.com EXAMPLE BOARD LAYOUT .0028 MAX [0.07] ALL AROUND .0028 MIN [0.07] ALL AROUND (.213) [5.4] 6X (.050 ) [1.27] 8X (.061 ) [1.55] 8X (.024) [0.6] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM 4 5 SEE DETAILS SYMM
www.ti.com EXAMPLE STENCIL DESIGN 8X (.061 ) [1.55] 8X (.024) [0.6] 6X (.050 ) [1.27] (.213) [5.4] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X SYMM SYMM 4 5
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