LM9071 TI1 | Alldatasheet
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www.ti.com SNVS131D –DECEMBER 1999–REVISED APRIL 2013 LM9071Low-DropoutSystemVoltageRegulatorwithDelayedReset Check forSamples: LM9071 1FEATURES DESCRIPTION The LM9071 is a 5V, 250 mA low-dropoutvoltage 2• Automotive ApplicationReliability regulator.The regulatorfeaturesan active low• 3% Output VoltageTolerance delayedresetoutputflagwhich can be used toreset
- InsensitivetoRadiatedRFI a microprocessorsystem on turn-ONand intheevent thattheregulatoroutputfallsoutofregulationforany• Dropout VoltageLess than 800 mV with250 reason.An externalcapacitorprograms a delaytimemA Output Current intervalbeforetheresetoutputcan returnhigh.• ExternallyProgrammed Reset Delay Interval Designed for automotiveapplicationthe LM9071• Thermal Shutdown containsa varietyof protectionfeaturessuch as• ShortCircuitProtection reverse battery,over-voltageshutdown, thermal
- Reverse BatteryProtection shutdown, input transientprotectionand a wide operatingtemperaturerange.• Wide OperatingTemperature Range −40°C to +125°C Design techniqueshave been employed toallowthe regulatortoremainoperationaland notgeneratefalse• TO-220 and TO-263 Power SurfaceMount resetsignalswhen subjectedto high levelsof RFPower Packages energy(300V/m from2 MHz to400 MHz).• Pin forPin Compatible withtheLM2927, L4947 and TLE4260 TypicalApplicationand Connection Diagrams (TopView) Figure1. Figure2.5-Lead TO-220 Package Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1999–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SNVS131D –DECEMBER 1999–REVISED APRIL 2013 www.ti.com Tab and Backsidemetalon allpackagesinternallyconnectedto ground. Figure3.5-Lead TO-220 Package Figure4. 5-Lead TO-263 SurfaceMount Package These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings (1) DC InputVoltage −26V to+40V PositiveInputTransient(t<100 ms) 60V NegativeInputTransient(t<1 ms) −50V ResetOutputSinkCurrent 5 mA Power Dissipation InternallyLimited JunctionTemperature 150°C ESD Susceptibility(2) 12 kV,2 kV Lead Temperature(Soldering,10 seconds) 260°C StorageTemperature −50°C to+150°C (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisintendedtobe functional,butdo notensurespecificperformancelimits.Forensuredspecificationsand conditions, see theElectricalCharacteristics. (2) Allpinswillsurvivean ESD impulseof±2000V usingthehuman body model of100 pF dischargedthrougha 1.5kΩ resistor.Inaddition theinputvoltagepinwillwithstandtenpulsesof±12 kV froma 150 pF capacitordischargedthrougha 560Ω resistorwhen bypassed witha 22 nF,100V capacitor. OperatingRatings (1) InputVoltage 6V to26V AmbientTemperature −40°C to+125°C TO-220 ThermalResistance,θJ-C 3°C/W TO-220 ThermalResistance,θJ-A (2) 73°C/W TO-263 ThermalResistance,θJ-C 3°C/W TO-263 ThermalResistance,θJ-A (3) 80°C/W (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisintendedtobe functional,butdo notensurespecificperformancelimits.Forensuredspecificationsand conditions, see theElectricalCharacteristics. (2) ExceedingtheMaximum Allowablepower dissipationwillcause excessivedietemperature,and thedevicewillgo intothermal shutdown.The θJ-A valuefortheTO-220 package (stillair,no additionalheatsink)is73°C/W. The effectiveθJ-A valueoftheTO-220 package can be reducedby usingconventionalheatsinkmethods. (3) ExceedingtheMaximum Allowablepower dissipationwillcause excessivedietemperature,and thedevicewillgo intothermal shutdown.The θJ-A valuefortheTO-263 package (stillair,no additionalheatsink)is80°C/W. The effectiveθJ-A valueoftheTO-263 package can be reducedby increasingtheprintedcircuitboardareathatisconnected(soldered)tothepackage tab.Using1 ounce (1.4 milsthick)coppercladwithno soldermask, an areaof0.5squareincheswillreduceθJ-A to50°C/W, an areaof1.0squareincheswill reduceθJ-Ato37°C/W, ad an areaof1.6squareincheswillreduceθJ-A to32°C/W. Iftheprintedcircuitboarduses a soldermask, the coppercladareashouldbe increasedby atleast50% tomaintaina similarθJ-A rating.
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www.ti.com SNVS131D –DECEMBER 1999–REVISED APRIL 2013 ElectricalCharacteristics(1) The followingspecificationsapplyforVCC = 6V to26V,−40°C ≤ TA≤+125°C, unlessotherwisespecified.C OUT = 47µF withan ESR < 3Ω.C IN=1µF. Symbol Parameter Conditions Min Max Units REGULATOR OUTPUT VOUT OutputVoltage 5 mA ≤ IOUT ≤ 250 mA 4.85 5.15 V ΔVOUT Line LineRegulation IOUT = 5 mA, 9V ≤ VIN ≤ 16.5V 25 mV IOUT = 250 mA 50 mV ΔVOUT Load Load Regulation VIN = 14.4V,5 mA ≤ IOUT ≤ 250 mA 60 mV Iq QuiescentCurrent IOUT = 5 mA 4 mA IOUT = 250 mA, VIN ≥ 8V 25 mA IOUT = 5 mA, VIN = 5V 10 mA IOUT = 250 mA, VIN = 6V 50 mA Vdo DropoutVoltage IOUT = 5 mA 300 mV IOUT = 250 mA 800 mV Isc ShortCircuitCurrent R L = 1Ω 0.35 1.5 A PSRR RippleRejection VIN = (14VDC )+ (1VRMS @ 120Hz) 60 dBIOUT = 50 mA OVthr OvervoltageShutdown Threshold 27 V VO Transient VOUT duringTransients VIN Peak ≤ 60V,R L = 100Ω,τ = 100 ms 7 V VO Rev Batt VOUT duringReverseBattery VIN = −15V −0.8 0.0 V RESET OUTPUT Vth ThresholdVoltage ΔVOUT RequiredtoGeneratea ResetOutput −300 −500 mV4.8V≤ VOUT ≤ 5.2V Vlow ResetOutputLow Voltage Isink= 1.6mA, VOUT > 3.2V 0.4 V 1.4V≤ VOUT ≤ 3.2V 0.8 V Vhigh ResetOutputHighVoltage 0.8VOUT V tDELAY DelayTime C DELAY = 0.1µF 7.6 35 ms IDELAY ChargingCurrentforC DELAY 10 30 µA Rpu InternalPull-upResistance 12 80 kΩ (1) Datasheetmin/max specificationsareensuredby design,test,and/orstatisticalanalysis. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM9071
SNVS131D –DECEMBER 1999–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics (TA = 25°C unlessindicatedotherwise) Turn ON Characteristics Turn OFF Characteristics Figure5. Figure6. NormalizedOutput Voltage Output Voltageat vs Temperature InputVoltageExtremes Figure7. Figure8. QuiescentCurrentvs ShortCircuitCurrent InputVoltage vs Temperature Figure9. Figure10.
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www.ti.com SNVS131D –DECEMBER 1999–REVISED APRIL 2013 TypicalPerformance Characteristics(continued) (TA = 25°C unlessindicatedotherwise) Dropout Voltagevs Reset Delay Time Temperature vs Temperature Figure11. Figure12. Maximum Power Dissipation Output CapacitorESR (TO-220Package) Figure13. Figure14. Maximum Power Dissipation (TO-263Package) Figure15. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM9071
SNVS131D –DECEMBER 1999–REVISED APRIL 2013 www.ti.com Reset Operationand ProtectionFeatures Block Diagram APPLICATION HINTS The LM9071 voltageregulatorhas been optimizedforuse inmicroprocessorbased automotivesystems.Several uniquedesignfeatureshave been incorporatedtoaddressmany FMEA (FailureMode EffectsAnalysis)concerns forfail-safesystemperformance. FAULT TOLERANT FEATURES Whilenotspecificallyensureddue toproductiontestinglimitations,theLM9071 has been testedand shown to continuetoprovidea regulatedoutputand,notgeneratean erroneoussystem resetsignalwhilesubjectedto highlevelsofRF electricfieldenergy(upto300 V/m signalstrengthovera 2 MHz to400 MHz frequencyrange). Thisisveryimportantinvehiclesafetyrelatedapplicationswhere thesystem must continuetooperatenormally. To maintainthisimmunitytoRFI theoutputbypasscapacitorisimportant(47μF isrecommended).
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www.ti.com SNVS131D –DECEMBER 1999–REVISED APRIL 2013 An outputbypass capacitorofatleast10 μF isrequiredforstability(47 μF isrecommended). The ESR ofthis capacitorshouldbe lessthan3Ω.An inputcapacitorof1 μF orlargerisrecommended toimprovelinetransient and noiseperformance. Conventionalloaddump protectionisbuiltintowithstandup to+60V and −50V transients.Protectionagainst reversepolaritybatteryconnectionsisalsobuiltin.Witha reversedbatteryconnectiontheoutputoftheLM9071 willnotgo more negativethanone diodedrop below ground.Thiswillpreventdamage toany ofthe5V load circuits. RESET FLAG Excessiveloadingoftheoutputtothepointwhere theoutputvoltagedropsby 300 mV to500 mV willsignala resetflagtothemicro.Thiswillwarn ofa VCC supplythatmay produceunpredictableoperationofthesystem. On power-upand recoveryfroma faultconditionthedelaycapacitorisused toholdthemicroina resetcondition fora programmable timeintervaltoallowthesystem operatingvoltagesand clocktostabilizebeforeexecuting code.The delaytimeintervalcan be estimatedby thefollowingequation: (1) INPUT STABILITY Low dropoutvoltageregulatorswhich utilizea PNP power transistorusuallyexhibita largeincreaseincurrent when indropout(VIN < 5.5V).Thisincreaseiscaused by thesaturationcharacteristics(β reduction)ofthePNP transistor.To significantlyminimizethisincreaseincurrenttheLM9071 detectswhen thePNP enterssaturation and reducestheoperatingcurrent. Thisreductionininputcurrentcan createa stabilityprobleminapplicationswithhigherloadcurrent(> 100 mA) where the inputvoltageisappliedthrougha longlengthof wire,which ineffectadds a significantamount of inductanceinserieswiththeinput.The dropininputcurrentmay createa positiveinputvoltagetransientwhich may takethePNP outofsaturation.Iftheinputvoltageisheldconstantatthethresholdwhere thePNP isgoing inand outofsaturation,an oscillationmay be created. Thisisonlyobservedwhere a largeseriesinductanceispresentintheinputsupplylineand when theriseand falltimeoftheinputsupplyisveryslow.Iftheapplicationand removaloftheinputvoltagechanges ata rate greaterthan500 mV/μs itwillmove throughthedropoutregionoftheregulator(VIN of3V to5.5V)tooquicklyfor an oscillationtobe established. THERMAL MANAGEMENT The LM9071 ispackaged in both a TO-263 surfacemount power package and a narrow lead-pitchTO-220 package.To obtainoperationover the highestpossibleloadcurrentand inputvoltageranges,care must be takentocontroltheoperatingtemperatureofthedevice.Thermalshutdown protectionisbuiltin,witha threshold above 150°C. Conventionalheat-sinkingtechniquescan be used withtheTO-220 package.When applyingthe TO-263 package,on board heat-sinkingisimportanttopreventprematurethermalshutdown.More copperfoil areaunderthetabofthedevicewilldirectlyimprovetheoperatingθJ-A oftheTO-263 package,whichwillreduce thejunctiontemperatureofthedevice. The θJ-A valuefortheTO-263 package (stillair,no additionalheatsink)isratedat80°C/W. The effectiveθJ-A valueof the TO-263 package can be reduced by increasingthe printedcircuitboard area thatisconnected (soldered)tothepackage tab.Using 1 ounce (1.4milsthick)coppercladwithno soldermask, an area of0.5 squareincheswillreduceθJ-A to50°C/W, an areaof1.0squareincheswillreduceθJ-Ato37°C/W, and an areaof 1.6squareincheswillreduceθJ-A to32°C/W. Iftheprintedcircuitboarduses a soldermask, thecoppercladarea underthesoldermask shouldbe increasedby atleast50% tomaintaina similarθJ-A rating. The use of a double sidedPC board withsolderedfilledviasbetween two planesof copper,as shown in Figure16, willimprovethermalperformancewhileoptimizingthe PC board surfacearea required.Using the doublesidedPC boardarrangementshown inFigure16,with1 ounce (1.4milsthick)coppercladwithno solder mask and solderfilledvias,an areaof0.5squareincheson bothsideswillreduceθJ-A to43°C/W. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM9071
SNVS131D –DECEMBER 1999–REVISED APRIL 2013 www.ti.com Figure16. TypicalTO-263 PC Board Heatsinking
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www.ti.com SNVS131D –DECEMBER 1999–REVISED APRIL 2013
REVISION HISTORY
Changes from RevisionC (April2013)toRevisionD Page Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM9071
www.ti.com 4-Mar-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM9071S/NOPB ACTIVE DDPAK/ TO-263 KTT 5 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM9071S LM9071SX NRND DDPAK/ TO-263 KTT 5 TBD Call TI Call TI -40 to 125 LM9071SX/NOPB ACTIVE DDPAK/ TO-263 KTT 5 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM9071S (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
www.ti.com 4-Mar-2015 Addendum-Page 2 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant LM9071SX/NOPB DDPAK/ TO-263 PACKAGE MATERIALS INFORMATION www.ti.com 5-Dec-2014 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM9071SX/NOPB DDPAK/TO-263 KTT 5 500 367.0 367.0 45.0 PACKAGE MATERIALS INFORMATION www.ti.com 5-Dec-2014 Pack Materials-Page 2
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