LM9070 TI1 | Alldatasheet
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www.ti.com SNVS130E –DECEMBER 1999–REVISED APRIL 2013 LM9070Low-DropoutSystemVoltageRegulatorwithKeep-AliveON/OFFControl Check forSamples: LM9070 1FEATURES DESCRIPTION The LM9070 is a 5V, 3% accurate,250 mA low- 2• Automotive ApplicationReliability dropoutvoltageregulator.The regulatorfeaturesan• 3% Output VoltageTolerance activelow delayed resetoutputflagwhich can be
- InsensitivetoRadiatedRFI used to reseta microprocessorsystem on turn-ON and intheeventthattheregulatoroutputfallsoutof• Dropout VoltageLess than 800 mV with250 regulationfor any reason. An externalcapacitormA Output Current programsa delaytimeintervalbeforetheresetoutput• ExternallyProgrammed Reset Delay Interval can returnhigh.
- Keep-AliveFeaturewith2 Logic ControlInputs Designed for automotiveapplicationthe LM9070• 60V Load Dump TransientProtection containsa varietyof protectionfeaturessuch as
- Thermal Shutdown reverse battery,over-voltageshutdown, thermal shutdown, input transientprotectionand a wide• ShortCircuitProtectionand DisableSafety operatingtemperaturerange.Features A unique two-inputlogiccontrolscheme isused to• Reverse BatteryProtection enable or disablethe regulatoroutput.An ON/OFF• Low OFF QuiescentCurrent,50 μA Maximum inputcan be providedby an ignitionswitchderived
- Wide OperatingTemperature Range −40°C to signalwhilea second,Keep-Aliveinput,isgenerated +125°C by a system controller.This allowsfora system to remainON afterignitionhas been switchedOFF. The• TO-263 and 20-PinPower SurfaceMount system controllercan then execute a power-downPackages routineand afterwhich command the regulatorOFF• Lead Form Compatible withTLE4267 TO-220 toa lowquiescentcurrentstate(60μA max).Regulator Design techniqueshave been employed toallowthe regulatortoremainoperationaland notgeneratefalse resetsignalswhen subjectedto high levelsof RF energy(300V/m from2 MHz to400 MHz). Connection Diagrams and OrderingInformation Backsidemetalisinternallyconnectedtoground. Figure1.7 Lead TO-263 (Top View) Figure2.20-PinSOIC Package Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1999–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SNVS130E –DECEMBER 1999–REVISED APRIL 2013 www.ti.com Tab isinternallyconnectedtoground. Tab isinternallyconnectedtoground. Figure3.7-Lead TO-220 Package Figure4.7-Lead TO-220 Package (Odd numbered pinsbent forwardaway from (Even numbered pinsbent forwardaway from package body) package body) These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings (1) InputVoltage,DC −26V to+40V ON/OFF, Keep-AliveInputs (through1kΩ) −26V to+26V PositiveInputTransient(t<100 ms) 60V NegativeInputTransient(t<1 ms) −50V ResetOutputSinkCurrent 5 mA Power Dissipation InternallyLimited JunctionTemperature 150°C ESD Susceptibility(2) 12 kV,2 kV Lead Temperature (Soldering,10 seconds) 260°C StorageTemperature −50°C to+150°C (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisintendedtobe functional,butdo notensurespecificperformancelimits.Forensuredspecificationsand conditions, see theElectricalCharacteristics. (2) Allpinswillsurvivean ESD impulseof±2000V usingthehuman body model of100 pF dischargedthrougha 1.5kΩ resistor.Inaddition, inputpinsVIN and theON/OFF inputwillwithstandtenpulsesof±12 kV froma 150 pF capacitordischargedthrougha 560Ω resistor witheach pinbypassedwitha 22 nF,100V capacitor. OperatingRatings (1) InputVoltage 6V to26V AmbientTemperature −40°C to+125°C TO-220 ThermalResistance,θJ-C 3°C/W TO-220 ThermalResistance,θJ-A (2) 73°C/W TO-263 ThermalResistance,θJ-C 3°C/W TO-263 ThermalResistance,θJ-A (3) 80°C/W SO20 ThermalResistance,θJ-PINS 25°C/W SO20 ThermalResistance,θJ-A 85°C/W (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisintendedtobe functional,butdo notensurespecificperformancelimits.Forensuredspecificationsand conditions, see theElectricalCharacteristics. (2) ExceedingtheMaximum Allowablepower dissipationwillcause excessivedietemperature,and thedevicewillgo intothermal shutdown.The θJ-A valuefortheTO-220 package (stillair,no additionalheatsink)is73°C/W. The effectiveθJ-A valueoftheTO-220 package can be reducedby usingconventionalheatsinkmethods. (3) ExceedingtheMaximum Allowablepower dissipationwillcause excessivedietemperature,and thedevicewillgo intothermal shutdown.The θJ-A valuefortheTO-263 package (stillair,no additionalheatsink)is80°C/W. The effectiveθJ-A valueoftheTO-263 package can be reducedby increasingtheprintedcircuitboardareathatisconnected(soldered)tothepackage tab.Using1 ounce (1.4 milsthick)coppercladwithno soldermask, an areaof0.5squareincheswillreduceθJ-A to50°C/W, an areaof1.0squareincheswill reduceθJ-Ato37°C/W, ad an areaof1.6squareincheswillreduceθJ-A to32°C/W. Iftheprintedcircuitboarduses a soldermask, the coppercladareashouldbe increasedby atleast50% tomaintaina similarθJ-A rating.
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www.ti.com SNVS130E –DECEMBER 1999–REVISED APRIL 2013 ElectricalCharacteristics(1) The followingspecificationsapplyforVCC = 6V to26V,−40°C ≤ TA≤ 125°C, unlessotherwisespecified.C OUT =47µF withan ESR < 3Ω.C IN= 1µF. Symbol Parameter Conditions Min Max Units REGULATOR OUTPUT VOUT OutputVoltage 5 mA ≤ IOUT ≤ 250 mA 4.85 5.15 V ΔVOUT Line LineRegulation IOUT = 5 mA, 9V ≤ VIN ≤ 16.5V 25 mV IOUT = 5 mA, 6V ≤ VIN ≤ 26V 50 mV ΔVOUT Load Load Regulation VIN = 14.4V,5 mA ≤ IOUT ≤ 250 mA 50 mV Iq QuiescentCurrent VON/OFF ≤ VIN IOUT = 5 mA 4 mA IOUT = 250 mA, VIN ≥ 8V 25 mA IOUT = 5 mA, VIN = 5V 10 mA IOUT = 250 mA, VIN = 6V 50 mA Ioff OFF QuiescentCurrent VIN ≤ 16.5V,RegulatorOFF −40°C ≤ TJ ≤ 60°C 20 μA 60°C ≤ TJ ≤ 135°C 60 µA Vdo DropoutVoltage IOUT = 5 mA 300 mV IOUT = 250 mA 800 mV Isc ShortCircuitCurrent R L = 1Ω 0.4 1.5 A PSRR RippleRejection VIN = (14VDC )+ 1VRMS @ 120H Z) IOUT = 50 mA 60 dB VothOFF SafetyVOUT Latch-OFFThreshold InKeep-Alivemode VON/OFF = 0V,VKA = 0V 4 4.5 V OVthr OvervoltageShutdown Threshold 27 V Vo Transient VOUT duringTransients VIN Peak ≤ 60V, 7 VR L = 100Ω,τ = 100 ms RESET OUTPUT Vth ThresholdVoltage ΔVOUT RequiredtoGeneratea Reset Output −300 −500 mV 4.85V≤ VOUT ≤ 5.15V Vlow ResetOutputLow Voltage Isink= 1.6mA, VOUT > 3.2V 0.4 V 1.4V≤ VOUT ≤ 3.2V 0.8 V Vhigh ResetOutputHighVoltage 0.9VOUT VOUT V tDELAY DelayTime C DELAY = 0.1µF 7 31 ms IDELAY ChargingCurrentforC DELAY 10 30 µA Rpu InternalPull-upResistance 12 80 kΩ CONTROL LOGIC VKA low Low InputThresholdVoltage, 3.5V≤ VOUT ≤ 5.25V 0.3VOUT 0.5VOUT VKeep-AliveInput VKA high HighInputThresholdVoltage, 3.5V≤ VOUT ≤ 5.25V 0.6VOUT 0.8VOUT VKeep-AliveInput VON/OFF low Low InputVoltage,ON/OFF Input Rseries= 1 kΩ −2 2 V VON/OFF high HighInputVoltage,ON/OFF Input Rseries= 1 kΩ 4 26 V ION/OFF InputCurrent,ON/OFF Input VON/OFF ≤ 4V 330 μA 4V < VON/OFF < 7V 670 μA VON/OFF ≥ 7V 10 mA Rpu KA InternalPull-upResistance,Keep-Alive0V ≤ VIN ≤ 26V 20 100 kΩInput Rpd ON/OFF InternalPull-downResistanceON/OFF 0V ≤ VON/OFF ≤ 26V 50 210 kΩInput (1) Datasheetmin/max specificationsareensuredby design,test,and/orstatisticalanalysis. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM9070
SNVS130E –DECEMBER 1999–REVISED APRIL 2013 www.ti.com Reset Operationand ProtectionFeatures
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www.ti.com SNVS130E –DECEMBER 1999–REVISED APRIL 2013 TypicalPerformance Characteristics (TA = 25°C unlessindicatedotherwise) Turn ON Characteristics Turn OFF Characteristics Figure5. Figure6. NormalizedOutput Voltage Output Voltageat vs Temperature InputVoltageExtremes Figure7. Figure8. InputCurrentvs QuiescentCurrentvs InputVoltage InputVoltage RegulatorSwitched OFF Figure9. Figure10. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM9070
SNVS130E –DECEMBER 1999–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics(continued) (TA = 25°C unlessindicatedotherwise) Dropout Voltagevs Reset Delay Time Temperature vs Temperature Figure11. Figure12. ShortCircuitCurrent vs Temperature Output CapacitorESR Figure13. Figure14. Maximum Power Dissipation Maximum Power Dissipation (TO-220Package) (TO-263and SO-20 Packages) Figure15. Figure16.
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www.ti.com SNVS130E –DECEMBER 1999–REVISED APRIL 2013 ON/OFF, KEEP-ALIVE AND SAFETY LATCH-OFF CONTROL DIAGRAMS Note:IfKeep-Aliveisprovidedby a microprocessorpowered by theoutputvoltageoftheLM9070, thelogic“1” voltagelevelwilltrackVOUT as theregulatorturnsOFF. (Keep-Aliveinputmust be hightoturnOFF output) TurnON withON/OFF control,Keep outputbiasedwithKeep-Alive input,TurnOFF withKeep-Alive(Keep-Alivelowkeeps outputON, Keep-AlivegoinghighturnsoutputOFF) Figure17.Simple ON/OFF control Figure18.Keep-AliveMode Keep outputbiasedwithKeep-Alive;HoldouputON withON/OFF; (ON/OFF goinghighrequiredtoturnOutputback ON) TurnOFF withON/OFF input.(TemporaryKeep-AliveMode) Figure19.Switch ON withON/OFF input Figure20.SafetyLatch OFF ofVOUT when inKeep- AliveMode ControlLogic TruthTable ON/OFF Keep-Alive Output Reset OperatingConditionInput Input Voltage Output L X 0V L Low quiescentcurrentstandby(OFF) condition ↑ X 5V ↑ afterdelay OutputturnsON H X 5V H Normal ON condition ↓ H 0V L OutputturnsOFF ↓ L 5V H OutputkeptON by Keep-AliveInput ↑ L 5V H OutputremainsON (orturnsON) H X ΔVOUT ≥ −300 mV L Outputpulledoutofregulation,resetflaggenerated L L VOUT ≤ 4V L OutputlatchesOFF Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM9070
SNVS130E –DECEMBER 1999–REVISED APRIL 2013 www.ti.com Block Diagram
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www.ti.com SNVS130E –DECEMBER 1999–REVISED APRIL 2013
APPLICATION INFORMATION
The LM9070 voltageregulatorhas been optimizedforuse inmicroprocessorbased automotivesystems.Several uniquedesignfeatureshave been incorporatedtoaddressmany FMEA (FailureMode EffectsAnalysis)concerns forfail-safesystemperformance. FAULT TOLERANT FEATURES Whilenotspecificallyensureddue toproductiontestinglimitations,theLM9070 has been testedand shown to continuetoprovidea regulatedoutputand,notgeneratean erroneoussystem resetsignalwhilesubjectedto highlevelsofRF electricfieldenergy(upto300 V/m signalstrengthovera 2 MHz to400 MHz frequencyrange). Thisisveryimportantinvehiclesafetyrelatedapplicationswhere thesystem must continuetooperatenormally. To maintainthisimmunitytoRFI theoutputbypasscapacitorisimportant(47μF isrecommended). Thisregulatorissuitableforapplicationswhere continuousconnectionto the batteryisrequired(Referto the Figure21).ON/OFF controloftheregulatorand system can be accomplishedby switchingtheON/OFF inputto thebatteryorignitionsupplyVIN supplythrougha SPST switch.Ifthisinputbecomes open circuited,an internal pull-downresistorensuresthattheregulatorturnsOFF. When theregulatorisswitchedOFF thecurrentloadon thebatterydropstolessthan60 μA. Withthepossibilityinmany applicationsforVIN and theON/OFF inputpins tobe connectedina system throughlonglengthsofwire,theESD protectionofthesepinshas been increased to12 kV withtheadditionofsmallinputbypasscapacitors. Figure21. TypicalApplicationCircuit An outputbypass capacitorofatleast10 μF isrequiredforstability(47 μF isrecommended). The ESR ofthis capacitorshouldbe lessthan3Ω.An inputcapacitorof1 μF orlargerisrecommended toimprovelinetransient and noiseperformance. WiththeKeep-Aliveinput,a system microprocessorhas theabilitytokeep theregulatorON (witha logic“0”on Keep-Alive)afterthe ON/OFF inputhas been commanded OFF. A power-down sequence, when system variablesaretypicallystoredinprogrammablememory, can be executedand takeas much timeas necessary. At the end of the operationthe microthen pullsKeep-Alivehighand the regulatorand system turnOFF and reverttothelowquiescentcurrentstandbymode. For additionalsystem reliability,considerationhas been made forthepossibilityofa shortcircuitedloadatthe outputoftheregulator.When theregulatorisswitchedON, conventionalcurrentlimitingand thermalshutdown protecttheregulator.When theregulatorisswitchedOFF however,a groundedVCC supplytothemicro(dueto the shortedregulatoroutput)willforcethe Keep-Aliveinputto be low and thustryto maintainthe Keep-Alive mode ofoperation.With a shortedload,thedrainon thebatterycouldbe as highas 1.5A.A separateinternal circuitmonitorstheoutputvoltageoftheregulator.IfVOUT islessthan4V, as would be thecase witha shorted load,theKeep-AlivefunctionislogicallydisabledtoensurethattheregulatorturnsOFF and revertstoonlya 50 μA loadon thebattery. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM9070
SNVS130E –DECEMBER 1999–REVISED APRIL 2013 www.ti.com Figure22. ControlLogic Not Used Conventionalloaddump protectionisbuiltintowithstandup to+60V and −50V transients.A 1 kΩ resistorin serieswith the ON/OFF and Keep-Aliveinputsare recommended to providethe same levelof transient protectionforthesepinsifrequired.Protectionagainstreversepolaritybatteryconnectionsisalsobuiltin.Witha reversedbatterytheoutputoftheLM9070 willnotgo more negativethanone diodedropbelow ground.Thiswill preventdamage toany ofthe5V loadcircuits. Forapplicationswhere thecontrollogicisnotrequiredthelogicpinsshouldbe configuredas shown inFigure22. A separatedevice,calledtheLM9071, can be used.The LM9071 isavailableina 5-leadTO-220 package and does notprovidecontrollogicfunctions,butstillretainsalloftheprotectionfeaturesoftheLM9070. RESET FLAG Excessiveloadingoftheoutputtothepointwhere theoutputvoltagedropsby 300 mV to500 mV willsignala resetflagtothemicro.Thiswillwarn ofa VCC supplythatmay produceunpredictableoperationofthesystem. On power-upand recoveryfroma faultconditionthedelaycapacitorisused toholdthemicroina resetcondition fora programmabletimeintervaltoallowthesystemoperatingvoltagesand clockto stabilizebeforeexecutingcode.The typicaldelaytimeintervalcan be estimatedusingthe following equation: (1) INPUT STABILITY Low dropoutvoltageregulatorswhich utilizea PNP power transistorusuallyexhibita largeincreaseincurrent when indropout(VIN < 5.5V).Thisincreaseiscaused by thesaturationcharacteristics(β reduction)ofthePNP transistor.To significantlyminimizethisincreaseincurrenttheLM9070 detectswhen thePNP enterssaturation and reducestheoperatingcurrent. Thisreductionininputcurrentcan createa stabilityprobleminapplicationswithhigherloadcurrent(> 100 mA) where the inputvoltageisappliedthrougha longlengthof wire,which ineffectadds a significantamount of inductanceinserieswiththeinput.The dropininputcurrentmay createa positiveinputvoltagetransientwhich may takethePNP outofsaturation.Iftheinputvoltageisheldconstantatthethresholdwhere thePNP isgoing inand outofsaturation,an oscillationmay be created. Thisisonlyobservedwhere significantseriesinductanceispresentintheinputsupplylineand when therise and falltimeoftheinputsupplyisveryslow.Iftheapplicationand removaloftheinputvoltagechanges ata rate greaterthan500 mV/μs,theinputvoltagemoves throughthedropoutregionofoperation(VIN of3V to5.5V)too quicklyforan oscillationtobe established. MICROPROCESSOR SYSTEM REGULATOR WITH KEEP-ALIVE INTERVAL AT TURN-OFF Figure23 illustratesa system applicationcircuitutilizingbothofthelogiccontrolinputsoftheLM9070. Closing theON/OFF switchpowers ON thesystem.Once powered,thesystem controllersetstheKeep-Alivelinelow. The NPN transistorisused onlytosignalthecontrollerthattheON/OFF switchhas been opened and thesystem isto be turnedOFF. Upon detectingthishighlevelat the ON/OFF Sense inputline,the controllercan then performa power down routine.The system willremain fullypowered untilthe controllercommands totalshut down by takingthe Keep-Alivelinehigh.The system then shutsOFF and revertsto a verylow currentdrain standbyconditionuntilswitchedback on.
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www.ti.com SNVS130E –DECEMBER 1999–REVISED APRIL 2013 Figure23. System ApplicationCircuitand ControlWaveforms THERMAL MANAGEMENT The LM9070 ispackaged in both a TO-263 surfacemount power package and a narrow lead-pitchTO-220 package.To obtainoperationover the highestpossibleloadcurrentand inputvoltageranges,care must be takentocontroltheoperatingtemperatureofthedevice.Thermalshutdown protectionisbuiltin,witha threshold above 150°C. Conventionalheat-sinkingtechniquescan be used withtheTO-220 package.When applyingthe TO-263 package,on board heat-sinkingisimportanttopreventprematurethermalshutdown.More copperfoil areaunderthetabofthedevicewilldirectlyimprovetheoperatingθJ-A oftheTO-263 package,whichwillreduce thejunctiontemperatureofthedevice. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM9070
SNVS130E –DECEMBER 1999–REVISED APRIL 2013 www.ti.com The θJ-A valuefortheTO-263 package (stillair,no additionalheatsink)isratedat80°C/W. The effectiveθJ-A valueof the TO-263 package can be reduced by increasingthe printedcircuitboard area thatisconnected (soldered)tothepackage tab.Using 1 ounce (1.4milsthick)coppercladwithno soldermask, an area of0.5 squareincheswillreduceθJ-A to50°C/W, an areaof1.0squareincheswillreduceθJ-Ato37°C/W, and an areaof 1.6squareincheswillreduceθJ-A to32°C/W. Iftheprintedcircuitboarduses a soldermask, thecoppercladarea underthesoldermask shouldbe increasedby atleast50% tomaintaina similarθJ-A rating. The use of a double sidedPC board withsolderedfilledviasbetween two planesof copper,as shown in Figure24, willimprovethermalperformancewhileoptimizingthe PC board surfacearea required.Using the doublesidedPC boardarrangementshown inFigure24,with1 ounce (1.4milsthick)coppercladwithno solder mask and solderfilledvias,an areaof0.5squareincheson bothsideswillreduceθJ-A to43°C/W. Figure24. TypicalTO-263 PC Board Heatsinking
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www.ti.com SNVS130E –DECEMBER 1999–REVISED APRIL 2013
REVISION HISTORY
Changes from RevisionD (April2013)toRevisionE Page Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:LM9070
www.ti.com 16-Oct-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM9070S/NOPB LIFEBUY DDPAK/ TO-263 KTW 7 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM9070S LM9070SX/NOPB ACTIVE DDPAK/ TO-263 KTW 7 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM9070S (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
www.ti.com 16-Oct-2015 Addendum-Page 2 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant LM9070SX/NOPB DDPAK/ TO-263 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM9070SX/NOPB DDPAK/TO-263 KTW 7 500 367.0 367.0 45.0 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 2
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