LM9036 Ultra-Low Quiescent Current Voltage Regulator (Rev. E)
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SNVS140,E]
- PDF pages: 15
Technical content
www.ti.com SNVS140E –AUGUST 2003–REVISED MARCH 2013 LM9036Ultra-LowQuiescentCurrentVoltageRegulator Check forSamples: LM9036 1FEATURES DESCRIPTION The LM9036 ultra-lowquiescentcurrentregulator 2• Ultralow Ground Pin Current(IGND ≤ 25µA for featureslow dropoutvoltageand low currentintheIOUT = 0.1mA) standby mode. With less than 25µA Ground Pin• Fixed5V,3.3V,50mA Output currentata 0.1mA load,theLM9036 isideallysuited
- Output Tolerance±5% Over Line,Load, and forautomotiveand otherbatteryoperatedsystems. The LM9036 retainsallof the featuresthat areTemperature common to low dropoutregulatorsincludinga low• Dropout VoltageTypically200mV @ IOUT = dropoutPNP pass device,shortcircuitprotection,50mA reversebatteryprotection,and thermalshutdown.
- −45V Reverse TransientProtection The LM9036 has a 40V maximum operatingvoltage limit,a −40°C to +125°C operatingtemperature• InternalShortCircuitCurrentLimit range,and ±5% outputvoltagetoleranceover the• InternalThermal Shutdown Protection entireoutputcurrent,inputvoltage,and temperature• 40V OperatingVoltageLimit range. TypicalApplication *Requiredifregulatorislocatedmore than2″ frompower supplyfiltercapacitor. **Requiredforstability.Must be ratedoverintendedoperatingtemperaturerange.Effectiveseriesresistance(ESR) iscritical,see ElectricalCharacteristics.Locatecapacitoras closeas possibletotheregulatoroutputand ground pins.Capacitancemay be increasedwithoutbound. Connection Diagram Figure1. PFM Top View Order Number LM9036DT-5.0,LM9036DTX-5.0, LM9036DT-3.3,LM9036DTX-3.3 See NS Package Number NDP0003B Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2003–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SNVS140E –AUGUST 2003–REVISED MARCH 2013 www.ti.com Figure2.8 Lead VSSOP Figure3.8 Lead SOIC Top View Top View LM9036MMX-5.0 LM9036MX-5.0 See NS Package Number DGK See NS Package Number D These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1)(2) InputVoltage(Survival) +55V, −45V ESD Susceptibility(3) ±1.9kV Power Dissipation(4) Internallylimited JunctionTemperature(TJmax ) 150°C StorageTemperatureRange −65°C to+150°C Lead Temperature(Soldering,10 sec.) 260°C (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.DC and AC electricalspecificationsdo not applywhen operatingthedevicebeyond itsspecifiedoperatingratings. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) Human body model,100pF dischargethrougha 1.5kΩ resistor. (4) The maximum power dissipationisa functionofTJmax ,θJA,and TA.The maximum allowablepower dissipationatany ambient temperatureisPD = (TJmax − TA)/θJA.Ifthisdissipationisexceeded,thedietemperaturewillriseabove 150°C and theLM9036 willgo intothermalshutdown. OperatingRatings OperatingTemperatureRange −40°C to+125°C Maximum InputVoltage(Operational) 40V SOIC-8 (D)θJA (1) 140°C/W PFM (NDP0003B) θJA (1) 125°C/W PFM (NDP0003B) θJA (2) 50°C/W PFM (NDP0003B) θJC (1) 11°C/W MSO-8 (DGK) θJA (1) 200°C/W (1) Worstcase (FreeAir)perEIA /JESD51-3. (2) TypicalθJA with1 squareinchof2oz copperpad areadirectlyunderthegroundtab.
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www.ti.com SNVS140E –AUGUST 2003–REVISED MARCH 2013 VIN = 14V,IOUT = 10 mA, TJ = 25°C, unlessotherwisespecified.Boldfacelimitsapplyoverentireoperatingtemperature range Min Typical MaxParameter Conditions Units(1) (2) (1) 4.80 5.00 5.20 IOUT = 0.1mA,8V ≤ VIN ≤ 24V 20 25 µA IOUT = 1mA, 8V ≤ VIN ≤ 24V 50 100 QuiescentCurrent(IGND ) IOUT = 10mA, 8V ≤ VIN ≤ 24V 0.3 0.5 mA IOUT = 50mA, 8V ≤ VIN ≤ 24V 2.0 2.5 LineRegulation(Δ VOUT ) 6V ≤ VIN ≤ 40V,IOUT = 1mA 10 30 mV Load Regulation(Δ VOUT ) 0.1mA ≤ IOUT ≤ 5mA 10 30 mV 5mA ≤ IOUT ≤ 50mA 10 30 mV DropoutVoltage(Δ VOUT ) IOUT = 0.1mA 0.05 0.10 V IOUT = 50mA 0.20 0.40 V ShortCircuitCurrent(ISC ) VOUT = 0V 65 120 250 mA RippleRejection(PSRR) Vripple= 1Vrms,Fripple= 120Hz −40 −60 dB OutputBypass Capacitance 0.3Ω ≤ ESR ≤ 8Ω 10 22 µF (COUT ) 0.1mA ≤ IOUT ≤ 50mA (1) TestedlimitsarespecifiedtoTI's AOQL (AverageOutgoingQualityLevel)and 100% tested. (2) Typicalsareat25°C (unlessotherwisespecified)and representthemost likelyparametricnorm. (3) To ensureconstantjunctiontemperature,pulsetestingisused. VIN = 14V,IOUT = 10 mA, TJ = 25°C, unlessotherwisespecified.Boldfacelimitsapplyoverentireoperatingtemperature range Min Typical MaxParameter Conditions Units(1) (2) (1) 3.168 3.30 3.432 IOUT = 0.1mA,8V ≤ VIN ≤ 24V 20 25 µA IOUT = 1mA, 8V ≤ VIN ≤ 24V 50 100 QuiescentCurrent(IGND ) IOUT = 10mA, 8V ≤ VIN ≤ 24V 0.3 0.5 mA IOUT = 50mA, 8V ≤ VIN ≤ 24V 2.0 2.5 LineRegulation(Δ VOUT ) 6V ≤ VIN ≤ 40V,IOUT = 1mA 10 30 mV Load Regulation(Δ VOUT ) 0.1mA ≤ IOUT ≤ 5mA 10 30 mV 5mA ≤ IOUT ≤ 50mA 10 30 mV DropoutVoltage(Δ VOUT ) IOUT = 0.1mA 0.05 0.10 V IOUT = 50mA 0.20 0.40 V ShortCircuitCurrent(ISC ) VOUT = 0V 65 120 250 mA RippleRejection(PSRR) Vripple= 1Vrms,Fripple= 120Hz −40 −60 dB OutputBypass Capacitance 0.3Ω ≤ ESR ≤ 8Ω 22 33 µF (COUT ) 0.1mA ≤ IOUT ≤ 50mA (1) TestedlimitsarespecifiedtoTI's AOQL (AverageOutgoingQualityLevel)and 100% tested. (2) Typicalsareat25°C (unlessotherwisespecified)and representthemost likelyparametricnorm. (3) To ensureconstantjunctiontemperature,pulsetestingisused. Copyright© 2003–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM9036
SNVS140E –AUGUST 2003–REVISED MARCH 2013 www.ti.com TypicalPerformance Characteristics Dropout Voltage QuiescentCurrent Figure4. Figure5. QuiescentCurrent QuiescentCurrent Figure6. Figure7. Peak Output Current Figure8.
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www.ti.com SNVS140E –AUGUST 2003–REVISED MARCH 2013 APPLICATIONS INFORMATION UnlikeotherPNP low dropoutregulators,the LM9036 remains fullyoperationalto 40V. Owing to power dissipationcharacteristicsofthepackage,fulloutputcurrentcannotbe ensuredforallcombinationsofambient temperatureand inputvoltage. The junctiontoambientthermalresistanceθJA ratinghas two distinctcomponents:thejunctiontocase thermal resistanceratingθJC;and thecase toambientthermalresistanceratingθCA .The relationshipisdefinedas:θJA = θJC + θCA . On thePFM package thegroundtabisthermallyconnectedtothebacksideofthedie.Adding1 squareinchof2 oz.copperpad areadirectlyunderthegroundtabwillimprovetheθJA ratingtoapproximately50°C/W. WhiletheLM9036 has an internallysetthermalshutdown pointoftypically150°C, thisisintendedas a safety featureonly.Continuousoperationnearthethermalshutdown temperatureshouldbe avoidedas itmay have a negativeaffecton thelifeofthedevice. Using the θJA fora LM9036DT mounted on a circuitboard as definedat,see(1), and usingthe formulafor maximum allowabledissipationgivenin,see(2),foran ambienttemperature(TA)of+85°C, we findthatPDMAX = 1.3W. Includingthe smallcontributionof the quiescentcurrentIQ to the totalpower dissipation,the maximum inputvoltage(whilestilldelivering50mA outputcurrent)is29.5V.The LM9036DT willgo intothermalshutdown when attemptingtodeliverthefulloutputcurrentof50mA, withan ambienttemperatureof+85°C, and theinput voltageis greaterthan 29.5V.Similarly,withan ambient temperatureof 25°C the PDMAX = 2.5W, and the LM9036DT can deliverthefulloutputcurrentof50mA withan inputvoltageofup to40V. WhiletheLM9036 maintainsregulationto55V, itwillnotwithstanda shortcircuitabove 40V because ofsafe operatingarea limitationsin the internalPNP pass device.Above 55V the LM9036 willbreak down with catastrophiceffectson theregulatorand possiblytheloadas well.Do notuse thisdeviceina designwhere the inputoperatingvoltagemay exceed 40V,orwhere transientsarelikelytoexceed 55V. (1) TypicalθJA with1 squareinchof2oz copperpad areadirectlyunderthegroundtab. (2) The maximum power dissipationisa functionofTJmax ,θJA,and TA.The maximum allowablepower dissipationatany ambient temperatureisPD = (TJmax − TA)/θJA.Ifthisdissipationisexceeded,thedietemperaturewillriseabove 150°C and theLM9036 willgo intothermalshutdown. Copyright© 2003–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM9036
SNVS140E –AUGUST 2003–REVISED MARCH 2013 www.ti.com
REVISION HISTORY
Changes from RevisionD (March 2013)toRevisionE Page
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www.ti.com 8-Oct-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM9036DT-5.0/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM9036D T-5.0 LM9036DTX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM9036D T-5.0 LM9036M-3.3/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM903 6M-3 LM9036M-5.0 NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 LM903 6M-5 LM9036M-5.0/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM903 6M-5 LM9036MM-3.3/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 KDB LM9036MM-5.0/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 KDA LM9036MX-3.3/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM903 6M-3 LM9036MX-5.0/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM903 6M-5 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
www.ti.com 8-Oct-2015 Addendum-Page 2 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 2-Sep-2015 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM9036DTX-5.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM9036MM-3.3/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM9036MM-5.0/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM9036MX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM9036MX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 2-Sep-2015 Pack Materials-Page 2
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