LM89 0.75C Accurate, Remote Diode & Local Dig Temp Sensor w/2-Wire Interface (Rev. D)
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SNIS128,D]
- PDF pages: 37
Technical content
2.2nF* Core Voltage D- SMBData SMBCLK Shutdown Control 3.3V derived from Aux. Supply *Note: 2.2nF capacitor must be placed as close as possible to D+ and D- pins of the LM89. T_CRIT_A ALERT Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community LM89 SNIS128D –AUGUST 2002–REVISED JUNE 2014 LM89±0.75°CAccurate,RemoteDiodeAndLocalDigitalTemperatureSensor WithTwo-WireInterface
1 Features 3 Description
The LM89 is an 11-bit digital temperature sensor with 1• Accurately Senses Die Temperature of Remote a 2-wire System Management Bus (SMBus) serialICs or Diode Junctions interface. The LM89 accurately measures its own• Offset Register Allows Accurate Sensing of a temperature as well as the temperature of an external Variety of Thermal Diodes device, such as processor thermal diode or diode- connected transistor such as the 2N3904. The• On-Board Local Temperature Sensing temperature of any ASIC, GPU, FPGA or MCU can• 10-Bit Plus Sign Remote Diode Temperature Data be accurately determined using the LM89 as long asFormat, 0.125°C Resolution a dedicated diode (semiconductor junction) is• T_CRIT_A Output Useful for System Shutdown available on the target die. The LM89 has an Offset
- ALERT Output Supports SMBus 2.0 Protocol register to allow calibration for different nonideality factors without requiring software management.• SMBus 2.0 Compatible Interface, Supports TIMEOUT Activation of the ALERT occurs when any temperature goes outside a preprogrammed window• 8-Pin VSSOP and SOIC Packages set by the HIGH and LOW limit registers or exceeds• Key Specifications: the T_CRIT limit. Activation of the T_CRIT_A occurs – Supply Voltage: 3.0 V to 3.6 V when any temperature exceeds the T_CRIT programmed limit.– Local Temp Accuracy (includes quantization error) The LM89 is pin and register compatible with the – TA = 25°C to 125°C ±3.0 °C (max) LM86, LM90, LM99, On Semiconductor ADM1032 and Maxim MAX6657/8.– Remote Diode Temp Accuracy (includes quantization error) The LM89C and the LM89-1C have the same functions but different SMBus slave addresses,– TA = 30°C, TD = 80°C ±0.75 °C (max) allowing multiple LM89's on a bus. LM89-1D's default local T_CRIT temperature limit is 105°C; all other2 Applications versions are 85°C. (See Device Comparison Table.)• Processor/Computer System Thermal Management Device Information(1) (For Example, Laptop, Desktop, Workstations, PART NUMBER PACKAGE BODY SIZE (NOM) Server) LM89-1D VSSOP (8) 3.0 mm x 3.0 mm
- Electronic Test Equipment LM89C SOIC (8) 4.9 mm x 3.9 mm
- Office Electronics (1) For all available packages, see the orderable addendum at the end of the datasheet.
4 Remote Diode Temperature Sensor System Diagram
T_CRIT_A Temperature Response Diagram An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains ADVANCE INFORMATION for pre-production products; subject to change without notice.
SNIS128D –AUGUST 2002–REVISED JUNE 2014 www.ti.com Table of Contents
5 Revision History
Changes from Revision C (March 2013) to Revision D Page
- Changed data sheet flow and layout to conform with new Texas Instruments standards. Added the following sections: Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation
2 Submit Documentation Feedback Copyright © 2002–2014, Texas Instruments Incorporated
Product Folder Links: LM89
6 Device Comparison Table
7 Pin Configuration And Functions
D− 3 Diode Return Current Sink To Diode Cathode. Table 1. ESD Protection(1) (1) An “x”indicates that the component exists.
Table 1. ESD Protection(1) (continued) Figure 1. ESD Protection Input Structure
8 Specifications
8.1 Absolute Maximum Ratings(1)(2)
apply when operating the device beyond its rated operating conditions. conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. biasing the parasitic diode by more than 50 mV may corrupt a temperature measurements. (4) Visit www.ti.com/packaging for other recommendations and methods of soldering surface mount devices.
4 Submit Documentation Feedback Copyright © 2002–2014, Texas Instruments Incorporated
www.ti.com SNIS128D –AUGUST 2002–REVISED JUNE 2014
8.2 Handling Ratings
Tstg Storage temperature range -65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all -2000 2000 pins(1) Charged device model (CDM), per JEDEC specification -1000 1000V(ESD) Electrostatic discharge VJESD22-C101, all pins; Applies only to LM89-1DiMM(2) Machine model ESD stress voltage, per JEDEC specification -200 200 JESD22-A115.(3) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. (3) The machine model is a 200pF capacitor discharged directly into each pin.
8.3 Recommended Operating Conditions
Operating Temperature Range 0 125 °C Electrical Characteristics Temperature Range TMIN ≤ TA ≤ TMAX LM89 0°C ≤ TA ≤ +85°C Supply Voltage Range (VDD) 3.0 3.6 V
8.4 Thermal Information
THERMAL METRIC(1) VSSOP SOIC UNIT
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 158 116 RθJC(top) Junction-to-case (top) thermal resistance 52 63 RθJB Junction-to-board thermal resistance 78 57 °C/W ψJT Junction-to-top characterization parameter 5 11 ψJB Junction-to-board characterization parameter 77 57 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
8.5 Temperature-To-Digital Converter Characteristics
Unless otherwise noted, these specifications apply for VDD= +3.0Vdc to 3.6Vdc. Unless otherwise noted, MIN and MAX limits apply for TA = TJ = TMIN to TMAX and typical limits TA= TJ= +25°C. PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT Temperature Error Using Local Diode TA = +25°C to +125°C, (3) -3 ±1 3 °C Temperature Error Using Remote Diode of 0.13 TA = +30°C TDiode = +80°C -0.75 0.75 °C micron Pentium 4 or other devices with typical TA = +30°C TDiode = +60°C to -1 1 °Cnonideality of 1.0021 and series R= 3.64Ω. to +50°C +100°C TA = +0°C to TDiode = +25°C to -3 3 °C +85°C +125°C Remote Diode Measurement Resolution 11 Bits 0.125 °C Local Diode Measurement Resolution 8 Bits 1 °C (1) Limits are ensured to AOQL (Average Outgoing Quality Level). (2) Typical values are at TA = 25°C and represent most likely parametric norm. (3) Local temperature accuracy does not include the effects of self-heating. The rise in temperature due to self-heating is the product of the internal power dissipation of the LM89 and the thermal resistance. See Thermal Information for the thermal resistance to be used in the self-heating calculation. Copyright © 2002–2014, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM89
SNIS128D –AUGUST 2002–REVISED JUNE 2014 www.ti.com Temperature-To-Digital Converter Characteristics (continued) Unless otherwise noted, these specifications apply for VDD= +3.0Vdc to 3.6Vdc. Unless otherwise noted, MIN and MAX limits apply for TA = TJ = TMIN to TMAX and typical limits TA= TJ= +25°C. PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT Quiescent Current (4) SMBus Inactive, 16Hz conversion 0.8 1.7 mA rate Shutdown 315 µA D− Source Voltage 0.7 V Diode Source Current (D+ − D−) = +0.65V; high level 110 160 315 µA Low level 7 13 20 µA ALERT and T_CRIT_A Output Saturation IOUT = 6.0 mA 0.4 V Voltage Power-On Reset Threshold Measure on VDD input, falling 1.8 2.4 V edge Local and Remote HIGH Default Temperature (5) 70 °C settings Local and Remote LOW Default Temperature (5) 0 °C settings Local T_CRIT Default Temperature Setting for (5) 85 °C LM89-1C and LM89C Local T_CRIT Default Temperature Setting for (5) 105 °C LM89-1D Remote T_CRIT Default Temperature Setting (5) 110 °C (4) Limits are specific to TI's AOQL (Average Outgoing Quality Level). (5) Default values set at power up.
8.6 Digital DC Characteristics
Unless otherwise noted, these specifications apply for VDD = +3.0Vdc to 3.6Vdc. Unless otherwise noted, MIN and MAX limits apply for TA = TJ = TMIN to TMAX and typical limits TA= TJ= +25°C. SYMBOL PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT SMBData, SMBCLK INPUTS VIN(1) Logical “1”Input Voltage 2.1 V VIN(0) Logical “0”Input Voltage 0.8 V VIN(HYST) SMBData and SMBCLK Digital Input 400 mV Hysteresis IIN(1) Logical “1”Input Current VIN = VDD 0.005 10 µA IIN(0) Logical “0”Input Current VIN = 0 V -10 −0.005 µA CIN Input Capacitance 5 pF ALL DIGITAL OUTPUTS IOH High Level Output Current VOH = VDD 10 µA VOL SMBus Low Level Output Voltage IOL = 4mA 0.4 V IOL = 6mA 0.6 (1) Limits are specific to TI's AOQL (Average Outgoing Quality Level). (2) Typical values are at TA = 25°C and represent most likely parametric norm.
8.7 Timing Requirements
Unless otherwise noted, these specifications apply for VDD = +3.0Vdc to +3.6Vdc. Unless otherwise noted, MIN and MAX limits apply for TA = TJ = TMIN to TMAX and typical limits TA= TJ= +25°C. PARAMETER MIN(1) TYP(2) MAX(1) UNIT Conversion Time of All Temperatures at the Fastest Setting (3) 31.25 34.4 ms (1) Limits are specific to TI's AOQL (Average Outgoing Quality Level). (2) Typical values are at TA = 25°C and represent most likely parametric norm. (3) This specification is provided only to indicate how often temperature data is updated. The LM89 can be read at any time without regard to conversion state (and will yield last conversion result)
6 Submit Documentation Feedback Copyright © 2002–2014, Texas Instruments Incorporated
Product Folder Links: LM89
8.8 SMBus Digital Switching Characteristics
pF. Unless otherwise noted, MIN and MAX limits apply for TA = TJ = TMIN to TMAX and typical limits TA= TJ= +25°C. to but are not necessarily the SMBus bus specifications. (1) Limits are specific to TI's AOQL (Average Outgoing Quality Level). (2) Typical values are at TA = 25°C and represent most likely parametric norm. (3) The output rise time is measured from (VIN(0)max + 0.15V) to (VIN(1)min − 0.15V). (4) The output fall time is measured from (VIN(1)min - 0.15V) to (VIN(1)min + 0.15V). therefore setting SMBData and SMBCLK pins to a high impedance state. Figure 2. SMBus Communication
8.9 Typical Characteristics
Figure 3. Conversion Rate Effect On Power Supply Current
8 Submit Documentation Feedback Copyright © 2002–2014, Texas Instruments Incorporated
T_CRIT Limit & Hysteresis Registers Configuration and Status Registers Conversion Rate Registers Two-Wire Serial Interface Local/Remote Diode Selector Temperature Sensor Circuitry 10-Bit Plus Sign /c27-/c36 Converter Programable Level Filter Fault Queue Fault Queue Fault Queue S R 3.0V-3.6V T_Crit_A ALERT SMBData SMBClock Q LM89 www.ti.com SNIS128D –AUGUST 2002–REVISED JUNE 2014
9 Detailed Description
9.1 Overview
The LM89 temperature sensor incorporates a delta VBE based temperature sensor using a Local or Remote diode and a 10-bit plus sign ADC (Delta-Sigma Analog-to-Digital Converter). The LM89 is compatible with the serial SMBus version 2.0 two-wire interface. Digital comparators compare the measured Local Temperature (LT) to the Local High (LHS), Local Low (LLS) and Local T_CRIT (LCS) user-programmable temperature limit registers. The measured Remote Temperature (RT) is digitally compared to the Remote High (RHS), Remote Low (RLS) and Remote T_CRIT (RCS) user-programmable temperature limit registers. Activation of the ALERT output indicates that a comparison is greater than the limit preset in a T_CRIT or HIGH limit register or less than the limit preset in a LOW limit register. The T_CRIT_A output responds as a true comparator with built in hysteresis. The hysteresis is set by the value placed in the Hysteresis register (TH). Activation of T_CRIT_A occurs when the temperature is above the T_CRIT setpoint. T_CRIT_A remains activated until the temperature goes below the setpoint calculated by T_CRIT − TH. The hysteresis register impacts both the remote temperature and local temperature readings. The LM89 may be placed in a low power consumption (Shutdown) mode by setting the RUN/STOP bit found in the Configuration register. In the Shutdown mode, the LM89's SMBus interface remains while all circuitry not required is turned off. The Local temperature reading and setpoint data registers are 8-bits wide. The format of the 11-bit remote temperature data is a 16-bit left justified word. Two 8-bit registers, high and low bytes, are provided for each setpoint as well as the temperature reading. Two offset registers (RTOLB and RTOHB) can be used to compensate for nonideality error, discussed further in Diode Nonideality. The remote temperature reading reported is adjusted by subtracting from or adding to the actual temperature reading the value placed in the offset registers.
9.2 Functional Block Diagram
9.3 Feature Description
9.3.1 Conversion Sequence
The LM89 takes approximately 31.25 ms to convert the Local Temperature (LT), Remote Temperature (RT), and to update all of its registers. Only during the conversion process the busy bit (D7) in the Status register (02h) is high. These conversions are addressed in a round robin sequence. The conversion rate may be modified by the Conversion Rate Register (04h). When the conversion rate is modified a delay is inserted between conversions, the actual conversion time remains at 31.25 ms. Different conversion rates will cause the LM89 to draw different amounts of supply current as shown in Figure 4. Copyright © 2002–2014, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Links: LM89
Figure 4. Conversion Rate Effect On Power Supply Current
9.3.2 The ALERT Output
interrupt methods are different only in how the user interacts with the LM89. trigger an ALERT in all modes.
9.3.2.1 ALERT Output As A Temperature Comparator
was activated by the comparison of LT > LHS, when this condition is no longer true the ALERT will return HIGH. ALERT CONFIGURE REGISTER (BFh) must be set high. This is not the power-on-default state.
10 Submit Documentation Feedback Copyright © 2002–2014, Texas Instruments Incorporated
Figure 5. ALERT Comparator Temperature Response Diagram
9.3.2.2 ALERT Output As An Interrupt
must be set low. This is the power-on-default state.
- Master reads the LM89 STATUS REGISTER to determine what caused the ALERT
- LM89 clears STATUS REGISTER, resets the ALERT HIGH and sets the ALERT mask bit (D7 in the
- Master attends to conditions that caused the ALERT to be triggered. The fan is started, setpoint limits are
- Master resets the ALERT mask (D7 in the Configuration register).
Figure 6. ALERT Output As An Interrupt Temperature Response Diagram
SNIS128D –AUGUST 2002–REVISED JUNE 2014 www.ti.com Feature Description (continued)
9.3.2.3 ALERT Output As An SMBus Alert
When the ALERT output is connected to one or more ALERT outputs of other SMBus compatible devices and to a master, an SMBus alert line is created. Under this implementation, the LM89's ALERT should be operated using the ARA (Alert Response Address) protocol. The SMBus 2.0 ARA protocol, defined in the SMBus specification 2.0, is a procedure designed to assist the master in resolving which part generated an interrupt and service that interrupt while impeding system operation as little as possible. The SMBus alert line is connected to the open-drain ports of all devices on the bus thereby AND'ing them together. The ARA is a method by which with one command the SMBus master may identify which part is pulling the SMBus alert line LOW and prevent it from pulling it LOW again for the same triggering condition. When an ARA command is received by all devices on the bus, the devices pulling the SMBus alert line LOW, first, send their address to the master and second, release the SMBus alert line after recognizing a successful transmission of their address. The SMBus 1.1 and 2.0 specification state that in response to an ARA (Alert Response Address) “after acknowledging the slave address the device must disengage its SMBALERT pulldown”. Furthermore, “if the host still sees SMBALERT low when the message transfer is complete, it knows to read the ARA again”. This SMBus “disengaging of SMBALERT” requirement prevents locking up the SMBus alert line. Competitive parts may address this “disengaging of SMBALERT” requirement differently than the LM89 or not at all. SMBus systems that implement the ARA protocol as suggested for the LM89 will be fully compatible with all competitive parts. The LM89 fulfills “disengaging of SMBALERT” by setting the ALERT mask bit (bit D7 in the Configuration register, at address 09h) after successfully sending out its address in response to an ARA and releasing the ALERT output pin. Once the ALERT mask bit is activated, the ALERT output pin will be disabled until enabled by software. In order to enable the ALERT the master must read the STATUS REGISTER, at address 02h, during the interrupt service routine and then reset the ALERT mask bit in the Configuration register to 0 at the end of the interrupt service routine. The following sequence describes the ARA response protocol. 1. Master Senses SMBus alert line low 2. Master sends a START followed by the Alert Response Address (ARA) with a Read Command. 3. Alerting Device(s) send ACK. 4. Alerting Device(s) send their Address. While transmitting their address, alerting devices sense whether their address has been transmitted correctly. (The LM89 will reset its ALERT output and set the ALERT mask bit once its complete address has been transmitted successfully.) 5. Master/slave NoACK 6. Master sends STOP 7. Master attends to conditions that caused the ALERT to be triggered. The STATUS REGISTER is read and fan started, setpoint limits adjusted, etc. 8. Master resets the ALERT mask (D7 in the Configuration register). The ARA, 000 1100, is a general call address. No device should ever be assigned this address. Bit D0 (the ALERT configure bit) in the FILTER and ALERT CONFIGURE REGISTER (BFh) must be set low in order for the LM89 to respond to the ARA command. The ALERT output can be disabled by setting the ALERT mask bit, D7, of the Configuration register. The power- on-default is to have the ALERT mask bit and the ALERT configure bit low.
12 Submit Documentation Feedback Copyright © 2002–2014, Texas Instruments Incorporated
Product Folder Links: LM89
Figure 7. ALERT Output As An Smbus Alert Temperature Response Diagram
9.3.3 T_CRIT_A Output And T_CRIT Limit
T_CRIT setpoint temperature and caused the alarm, see Status Register (SR). T_CRIT setpoint, as shown in Figure 8. Figure 8. T_CRIT_A Temperature Response Diagram
9.3.4 Smbus Interface
SNIS128D –AUGUST 2002–REVISED JUNE 2014 www.ti.com Version A6 A5 A4 A3 A2 A1 A0 LM89CIM, LM89CIMM 1 0 0 1 1 0 0 LM89-1CIMM, LM89- 1 0 0 1 1 0 1 1DIMM
9.3.5 Temperature Data Format
Temperature data can only be read from the Local and Remote Temperature registers; the setpoint registers (T_CRIT, LOW, HIGH) are read/write. Remote temperature data is represented by an 11-bit, two's complement word with an LSB (Least Significant Bit) equal to 0.125°C. The data format is a left justified 16-bit word available in two 8-bit registers: Temperature Digital Output Binary Hex +125°C 0111 1101 0000 0000 7D00h +25°C 0001 1001 0000 0000 1900h +1°C 0000 0001 0000 0000 0100h +0.125°C 0000 0000 0010 0000 0020h 0°C 0000 0000 0000 0000 0000h −0.125°C 1111 1111 1110 0000 FFE0h −1°C 1111 1111 0000 0000 FF00h −25°C 1110 0111 0000 0000 E700h −55°C 1100 1001 0000 0000 C900h Local Temperature data is represented by an 8-bit, two's complement byte with an LSB (Least Significant Bit) equal to 1°C: Temperature Digital Output Binary Hex +125°C 0111 1101 7Dh +25°C 0001 1001 19h +1°C 0000 0001 01h 0°C 0000 0000 00h −1°C 1111 1111 FFh −25°C 1110 0111 E7h −55°C 1100 1001 C9h
9.3.6 Open-Drain Outputs
The SMBData, ALERT and T_CRIT_A outputs are open-drain outputs and do not have internal pull-ups. A “high” level will not be observed on these pins until pull-up current is provided by some external source, typically a pull- up resistor. Choice of resistor value depends on many system factors but, in general, the pull-up resistor should be as large as possible. This will minimize any internal temperature reading errors due to internal heating of the LM89. The maximum resistance of the pull-up to provide a 2.1V high level, based on LM89 specification for High Level Output Current with the supply voltage at 3.0V, is 82kΩ(5%) or 88.7kΩ(1%).
9.3.7 Diode Fault Detection
The LM89 is equipped with operational circuitry designed to detect fault conditions concerning the remote diode. In the event that the D+ pin is detected as shorted to VDD or floating, the Remote Temperature High Byte (RTHB) register is loaded with +127°C, the Remote Temperature Low Byte (RTLB) register is loaded with 0, and the OPEN bit (D2) in the status register is set. As a result, if the Remote T_CRIT setpoint register (RCS) is set to a value less than +127°C the ALERT and T_Crit output pins will be pulled low, if the Alert Mask and T_Crit Mask are disabled. If the Remote HIGH Setpoint High Byte Register (RHSHB) is set to a value less than +127°C then ALERT will be pulled low, if the Alert Mask is disabled. The OPEN bit itself will not trigger and ALERT.
14 Submit Documentation Feedback Copyright © 2002–2014, Texas Instruments Incorporated
Product Folder Links: LM89
www.ti.com SNIS128D –AUGUST 2002–REVISED JUNE 2014 In the event that the D+ pin is shorted to ground or D−, the Remote Temperature High Byte (RTHB) register is loaded with −128°C (1000 0000) and the OPEN bit (D2) in the status register will not be set. Since operating the LM89 at −128°C is beyond it's operational limits, this temperature reading represents this shorted fault condition. If the value in the Remote Low Setpoint High Byte Register (RLSHB) is more than −128°C and the Alert Mask is disabled, ALERT will be pulled low. Remote diode temperature sensors that have been previously released and are competitive with the LM89 output a code of 0°C if the external diode is short-circuited. This change is an improvement that allows a reading of 0°C to be truly interpreted as a genuine 0°C reading and not a fault condition.
9.3.8 Communicating With The LM89
The data registers in the LM89 are selected by the Command Register. At power-up the Command Register is set to “00”, the location for the Read Local Temperature Register. The Command Register latches the last location it was set to. Each data register in the LM89 falls into one of four types of user accessibility: 1. Read only 2. Write only 3. Read/Write same address 4. Read/Write different address A Write to the LM89 will always include the address byte and the command byte. A write to any register requires one data byte. Reading the LM89 can take place either of two ways: 1. If the location latched in the Command Register is correct (most of the time it is expected that the Command Register will point to one of the Read Temperature Registers because that will be the data most frequently read from the LM89), then the read can simply consist of an address byte, followed by retrieving the data byte. 2. If the Command Register needs to be set, then an address byte, command byte, repeat start, and another address byte will accomplish a read. The data byte has the most significant bit first. At the end of a read, the LM89 can accept either acknowledge or No Acknowledge from the Master (No Acknowledge is typically used as a signal for the slave that the Master has read its last byte). It takes the LM89 31.25 ms to measure the temperature of the remote diode and internal diode. When retrieving all 11 bits from a previous remote diode temperature measurement, the master must insure that all 11 bits are from the same temperature conversion. This may be achieved by reading the MSB (most significant byte first) followed by the LSB (least significant byte). Reading the MSB first will lock the LSB, thus synchronizing the two bytes. One-shot mode can also be used without any restrictions on the MSB and LSB reading sequence. Copyright © 2002–2014, Texas Instruments Incorporated Submit Documentation Feedback 15 Product Folder Links: LM89
9.3.8.1 SMBus Timing Diagrams
Figure 9. LM89 Timing Diagram Figure 10. LM89 Timing Diagram Figure 11. LM89 Timing Diagram
9.3.9 Serial Interface Reset
- When SMBData is LOW, the LM89 SMBus state machine resets to the SMBus idle state if either SMBData
- When SMBData is HIGH, have the master initiate an SMBus start. The LM89 will respond properly to an
16 Submit Documentation Feedback Copyright © 2002–2014, Texas Instruments Incorporated
9.3.10 Digital Filter
filter can be set according to the following table. Level 2 sets maximum filtering. Figure 12. Filter Output Response To A Step Input Figure 13. Filter Output Response To A Step Input
A. The filter on and off curves were purposely offset to better show noise performance. Figure 14. Digital Filter Response In A Pentium 4 Processor System
9.3.11 Fault Queue
Figure 15. Fault Queue Temperature Response Diagram
9.3.12 One-Shot Register
always be read from this register.
9.4 Device Functional Modes
9.4.1 Power-On-Default States
- Command Register set to 00h
18 Submit Documentation Feedback Copyright © 2002–2014, Texas Instruments Incorporated
www.ti.com SNIS128D –AUGUST 2002–REVISED JUNE 2014 Device Functional Modes (continued) 2. Local Temperature set to 0°C 3. Remote Diode Temperature set to 0°C until the end of the first conversion. 4. Status Register set to 00h. 5. Configuration register set to 00h; ALERT enabled, Remote T_CRIT alarm enabled and Local T_CRIT alarm enabled 6. 85°C Local T_CRIT temperature setpoint for LM89C and LM89-1C; 105°C Local T_CRIT temperature setpoint for LM89-1D 7. 110°C Remote T_CRIT temperature setpoint 8. 70°C Local and Remote HIGH temperature setpoints 9. 0°C Local and Remote LOW temperature setpoints 10. Filter and Alert Configure Register set to 00h; filter disabled, ALERT output set as an SMBus ALERT 11. Conversion Rate Register set to 8h; conversion rate set to 16 conv./sec.
9.5 Programming
9.6 Register Maps
9.6.1 Command Register
Selects which registers will be read from or written to. Data for this register should be transmitted during the Command Byte of the SMBus write communication. P7 P6 P5 P4 P3 P2 P1 P0 Command Select P0-P7: Command Select Command Select Address Power-On-Default State Register Register Function NameRead Address Write Address <D7:D0> binary <D7:D0> <P7:P0> hex <P7:P0> hex decimal 00h NA 0000 0000 0 LT Local Temperature 01h NA 0000 0000 0 RTHB Remote Temperature High Byte 02h NA 0000 0000 0 SR Status Register 03h 09h 0000 0000 0 C Configuration 04h 0Ah 0000 1000 8 (16 CR Conversion Rate conv./sec) 05h 0Bh 0100 0110 70 LHS Local HIGH Setpoint 06h 0Ch 0000 0000 0 LLS Local LOW Setpoint 07h 0Dh 0100 0110 70 RHSHB Remote HIGH Setpoint High Byte 08h 0Eh 0000 0000 0 RLSHB Remote LOW Setpoint High Byte NA 0Fh One Shot Writing to this register will initiate a one shot conversion 10h NA 0000 0000 0 RTLB Remote Temperature Low Byte 11h 11h 0000 0000 0 RTOHB Remote Temperature Offset High Byte 12h 12h 0000 0000 0 RTOLB Remote Temperature Offset Low Byte 13h 13h 0000 0000 0 RHSLB Remote HIGH Setpoint Low Byte 14h 14h 0000 0000 0 RLSLB Remote LOW Setpoint Low Byte 19h 19h 0110 1110 110 RCS Remote T_CRIT Setpoint 20h 20h LM89C 0101 0101 85 LCS Local T_CRIT Setpoint LM89-1C 0101 0101 85 LM89-1D 0110 1001 105 Copyright © 2002–2014, Texas Instruments Incorporated Submit Documentation Feedback 19 Product Folder Links: LM89
9.6.2 Local And Remote Temperature Registers (LT, RTHB, RTLB)
Table 2. Local And Remote Temperature Registers (LT, RTHB) (Read Only Address 00h, 01h): For LT and RTHB D7–D0: Temperature Data. LSB = 1°C. Two's complement format. Table 3. Local And Remote Temperature Registers (RTLB) (Read Only Address 10h): For RTLB D7–D5: Temperature Data. LSB = 0.125°C. Two's complement format. 127.875; the minimum value available from the Remote Temperature registers is −128.875.
9.6.3 Status Register (SR)
Table 4. Status Register (SR) (Read Only Address 02h): Power up default is with all bits “0”(zero). D7: Busy: When set to “1”ADC is busy converting. D6: LHIGH: When set to “1”indicates a Local HIGH Temperature alarm. D5: LLOW: When set to “1”indicates a Local LOW Temperature alarm. D4: RHIGH: When set to “1”indicates a Remote Diode HIGH Temperature alarm. D2: OPEN: When set to “1”indicates a Remote Diode disconnect. D1: RCRIT: When set to “1”indicates a Remote Diode Critical Temperature alarm. D0: LCRIT: When set to “1”indicates a Local Critical Temperature alarm.
9.6.4 Configuration Register
Table 5. Configuration Register (Read Address 03h /Write Address 09h):
20 Submit Documentation Feedback Copyright © 2002–2014, Texas Instruments Incorporated
D7: ALERT mask: When set to “1”ALERT interrupts are masked. D6: RUN/STOP: When set to “1”SHUTDOWN is enabled. D5: is not defined and defaults to “0”. D3: is not defined and defaults to “0”. D1: is not defined and defaults to “0”.
9.6.5 Conversion Rate Register
Table 6. Conversion Rate Register (Read Address 04h
9.6.6 Local And Remote High Setpoint Registers (LHS, RHSHB, And RHSLB)
Table 7. Local And Remote High Setpoint Registers (LHS, RHSHB) (Read Address 05h, 07h /Write 1°C. Two's complement format. Table 8. Local And Remote High Setpoint Registers (RHSLB) (Read/Write Address 13h): For RHSLB: Remote HIGH Setpoint Low Byte temperature data. Power up default is 0°C. 1 LSB = 0.125°C.
9.6.7 Local And Remote Low Setpoint Registers (LLS, RLSHB, And RLSLB)
Table 9. Local And Remote Low Setpoint Registers (LLS, RLSHB) (Read Address 06h, 08h, /Write For LLS and RLSHB: HIGH setpoint temperature data. Power up default is LHIGH = RHIGH = 0°C. 1 LSB = 1°C. Table 10. Local And Remote Low Setpoint Registers (RLSLB) (Read/Write Address 14h): For RLSLB: Remote HIGH Setpoint Low Byte temperature data. Power up default is 0°C. 1 LSB = 0.125°C.
9.6.8 Remote Temperature Offset Registers (RTOHB And RTOLB)
Table 11. Remote Temperature Offset Registers (RTOHB)(Read/Write Address 11h): For RTOHB: Remote Temperature Offset High Byte. Power up default is LHIGH = RHIGH = 0°C. 1 LSB = 1°C. Table 12. Remote Temperature Offset Registers (RTOLB) (Read/Write Address 12h): temperature measurement that will be reported in the Remote Temperature registers.
9.6.9 Local And Remote T_crit Registers (RCS And LCS)
Table 13. Local And Remote T_CRIT Registers (RCS And LCS) (Read/Write Address 20h, 19h): 105°C (LM89-1D), and Remote T_CRIT=110°C. 1 LSB = 1°C, two's complement format.
9.6.10 T_CRIT Hysteresis Register (TH)
Table 14. T_CRIT Hysteresis Register (TH) (Read And Write Address 21h):
22 Submit Documentation Feedback Copyright © 2002–2014, Texas Instruments Incorporated
D7–D0: T_CRIT Hysteresis temperature. Power up default is TH = 10°C. 1 LSB = 1°C, maximum value = 31.
9.6.11 Filter And Alert Configure Register
Table 15. Filter And Alert Configure Register (Read And Write Address BFh): D7-D3: is not defined defaults to "0". Level 2 sets maximum filtering. D0: when set to "1" comparator mode is enabled.
9.6.12 Manufacturers Id Register
(Read Address FEh) The default value is 01h.
9.6.13 Die Revision Code Register
increment by 1 every time there is a revision to the die by Texas Instruments.
2.2nF* Core Voltage D- SMBData SMBCLK Shutdown Control 3.3V derived from Aux. Supply *Note: 2.2nF capacitor must be placed as close as possible to D+ and D- pins of the LM89. T_CRIT_A ALERT LM89 SNIS128D –AUGUST 2002–REVISED JUNE 2014 www.ti.com
10.1 Application Information
The LM89 can be applied easily in the same way as other integrated-circuit temperature sensors, and its remote diode sensing capability allows it to be used in new ways as well. It can be soldered to a printed circuit board, and because the path of best thermal conductivity is between the die and the pins, its temperature will effectively be that of the printed circuit board lands and traces soldered to the LM89's pins. This presumes that the ambient air temperature is almost the same as the surface temperature of the printed circuit board; if the air temperature is much higher or lower than the surface temperature, the actual temperature of the LM89 die will be at an intermediate temperature between the surface and air temperatures. Again, the primary thermal conduction path is through the leads, so the circuit board temperature will contribute to the die temperature much more strongly than will the air temperature. To measure temperature external to the LM89's die, use a remote diode. This diode can be located on the die of a target IC, allowing measurement of the IC's temperature, independent of the LM89's temperature.
10.2 Typical Application
The LM89 has been optimized to measure the remote thermal diode of a 0.13 micron Pentium 4, a Mobile Pentium 4 Processor-M processor or other embedded thermal diodes that have similar characteristics. A discrete diode can also be used to sense the temperature of external objects or ambient air. Remember that a discrete diode's temperature will be affected, and often dominated, by the temperature of its leads. Most silicon diodes do not lend themselves well to this application. It is recommended that a MMBT3904 transistor base emitter junction be used with the collector tied to the base (diode-connected). An LM89 with a diode-connected MMBT3904 will have a typical -1°C offset. T2N3904 = TLM89 +1°C
10.2.1 Design Requirements
10.2.1.1 Diode Nonideality
10.2.1.1.1 Diode Nonideality Factor Effect On Accuracy
When a transistor is connected as a diode, the following relationship holds for variables VBE, T and If:
24 Submit Documentation Feedback Copyright © 2002–2014, Texas Instruments Incorporated
Product Folder Links: LM89
Vbe = /c4b ln (N) k T q IF = IS e Vbe /c4bVt Vt = k T q IF = IS e - 1 Vbe /c4bVt LM89 www.ti.com SNIS128D –AUGUST 2002–REVISED JUNE 2014 Typical Application (continued) where (1) where
- q = 1.6×10−19 Coulombs (the electron charge),
- T = Absolute Temperature in Kelvin
- k = 1.38×10−23joules/K (Boltzmann's constant),
- η is the nonideality factor of the process the diode is manufactured on,
- IS = Saturation Current and is process dependent,
- If= Forward Current through the base emitter junction
- VBE = Base Emitter Voltage drop (2) In the active region, the -1 term is negligible and may be eliminated, yielding the following equation (3) In the above equation, η and IS are dependant upon the process that was used in the fabrication of the particular diode. By forcing two currents with a very controlled ratio (N) and measuring the resulting voltage difference, it is possible to eliminate the IS term. Solving for the forward voltage difference yields the relationship: (4) The voltage seen by the LM89 also includes the IFRS voltage drop of the series resistance. The nonideality factor, η, is the only other parameter not accounted for and depends on the diode that is used for measurement. Since ΔVBE is proportional to both η and T, the variations in η cannot be distinguished from variations in temperature. Since the nonideality factor is not controlled by the temperature sensor, it will directly add to the inaccuracy of the sensor. For the Pentium 4 and Mobile Pentium Processor-M Intel specifies a ±0.1% variation in η from part to part. As an example, assume a temperature sensor has an accuracy specification of ±1°C at room temperature of 25 °C and the process used to manufacture the diode has a nonideality variation of ±0.1%. The resulting accuracy of the temperature sensor at room temperature will be: The additional inaccuracy in the temperature measurement caused by η, can be eliminated if each temperature sensor is calibrated with the remote diode that it will be paired with. Processor Family η, nonideality MIN TYP MAX Pentium III CPUID 67h 1 1.0065 1.0125 Pentium III CPUID 68h/PGA370Socket/Celeron 1.0057 1.008 1.0125 Pentium 4, 423 pin 0.9933 1.0045 1.0368 Pentium 4, 478 pin 0.9933 1.0045 1.0368 0.13 micron, Pentium 4 1.0011 1.0021 1.0030 MMBT3904 1.003 AMD Athlon MP model 6 1.002 1.008 1.016 Copyright © 2002–2014, Texas Instruments Incorporated Submit Documentation Feedback 25 Product Folder Links: LM89
10.2.2 Detailed Design Procedure
10.2.2.1 Compensating For Diode Nonideality
particular processor. The LM89 is calibrated for the nonideality of a 0.13 micron, Mobile Pentium 4, 1.0021. given processor type has a nonideality that strays from the typical, errors are introduced. through use of the offset registers (11h and 12h).
10.2.3 Application Curves
LM89 is connected to diode-connected MMBT3904. Figure 17. Remote Temperature AccuracyFigure 16. Local Temperature Accuracy
10.3 Do's and Don'ts
speed data communications cross at right angles to the SMBData and SMBCLK lines.
26 Submit Documentation Feedback Copyright © 2002–2014, Texas Instruments Incorporated
www.ti.com SNIS128D –AUGUST 2002–REVISED JUNE 2014
11 Power Supply Recommendations
VDD should be bypassed with a 0.1µF capacitor in parallel with 100pF. The 100pF capacitor should be placed as close as possible to the power supply pin. A bulk capacitance of approximately 10µF needs to be in the near vicinity of the LM89. The ideal place to connect the LM89's GND pin is as close as possible to the Processors GND associated with the sense diode. Copyright © 2002–2014, Texas Instruments Incorporated Submit Documentation Feedback 27 Product Folder Links: LM89
12 Layout
12.1 Layout Guidelines
- VDD should be bypassed with a 0.1µF capacitor in parallel with 100pF. The 100pF capacitor should be placed
- A 2.2nF diode bypass capacitor is required to filter high frequency noise. Place the 2.2nF capacitor as close
as possible to the LM89's D+ and D− pins. Make sure the traces to the 2.2nF capacitor are matched.
- Ideally, the LM89 should be placed within 10cm of the Processor diode pins with the traces being as straight,
will automatically be subtracted from or added to the remote temperature reading.
- Diode traces should be surrounded by a GND guard ring to either side, above and below if possible. This
lines it would be ideal if it is coupled common mode. That is equally to the D+ and D− lines.
- Avoid routing diode traces in close proximity to power supply switching or filtering inductors.
- Avoid running diode traces close to or parallel to high speed digital and bus lines. Diode traces should be
kept at least 2cm apart from the high speed digital traces.
- If it is necessary to cross high speed digital traces, the diode traces and the high speed digital traces should
- The ideal place to connect the LM89's GND pin is as close as possible to the Processors GND associated
- Leakage current between D+ and GND should be kept to a minimum. One nanoampere of leakage can
as possible will minimize leakage current.
12.2 Layout Example
Figure 18. Ideal Diode Trace Layout
28 Submit Documentation Feedback Copyright © 2002–2014, Texas Instruments Incorporated
www.ti.com SNIS128D –AUGUST 2002–REVISED JUNE 2014
13 Device and Documentation Support
13.1 Trademarks
All trademarks are the property of their respective owners.
13.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
13.3 Glossary
SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2002–2014, Texas Instruments Incorporated Submit Documentation Feedback 29 Product Folder Links: LM89
www.ti.com 1-Nov-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM89-1CIMM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 T19C LM89-1CIMMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 T19C LM89-1DIMM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 T19D LM89-1DIMMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 T19D LM89CIMM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 T15C LM89CIMMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 T15C LM89CIMX NRND SOIC D 8 TBD Call TI Call TI 0 to 125 LM89 CIM LM89CIMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 LM89 CIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
www.ti.com 1-Nov-2015 Addendum-Page 2 (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 2-Sep-2015 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM89-1CIMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM89-1CIMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LM89-1DIMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM89-1DIMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LM89CIMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM89CIMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LM89CIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 2-Sep-2015 Pack Materials-Page 2
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic”are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated