LM8801 TI | Alldatasheet

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OUTPUT CURRENT (mA) EFFICIENCY (%) 100 0.1 1 10 100 1000 2.7V 3.6V 2.3V 4.2V C OUT = 4.7 µF, TDK L = 0.5 µH, FDK LM8801 www.ti.com SNVS597H –APRIL 2009–REVISED MAY 2013 LM8801HighPrecision6MHz,600mA SynchronousStep-DownDC-DCConverterfor MobileApplications Check forSamples: LM8801 1FEATURES APPLICATIONS 2• Over 90% Efficiencyat6 MHz Operation • MobilePhones

  • 600 mA Maximum Load Capability • MP3 players
  • 6 MHz PWM FixedSwitchingFrequency (typ.) • WirelessLAN
  • 27 µA (typ.)QuiescentCurrentinPFM Mode • PDAs, Pocket PCs
  • Wide InputVoltageRange: 2.3Vto5.5V • PortableHard Disk Drives
  • VOUT = 1.0Vto2.9Vwith50 mV steps DESCRIPTION• ±1.5% DC Output VoltagePrecisionOver The LM8801 step-down DC-DC converter isTemperature optimizedforpoweringultra-lowvoltagecircuitsfrom• Best-in-ClassLoad TransientResponse a singleLi-Ioncelland inputvoltagerailsfrom2.3Vto
  • Low Output RippleinPFM Mode 5.5V.Itprovidesup to600 mA loadcurrentoverthe entireinputvoltagerange.• Automatic PFM/PWM Mode Switching
  • CurrentOverload and Thermal Shutdown The LM8801 has a mode-controlpinthatallowsthe user to selectcontinuousPWM operationover theProtection completeloadrangeoran autoPFM-PWM mode that• InternalSoft-Start changes modes automaticallydependingon theload.• 6-bump DSBGA Package DuringPWM mode, the deviceoperatesat a fixed- hystereticPFM extends the batterylifethrough• TotalSolutionSize< 7mm 2 (works with0402 reductionof the quiescentcurrentduringlightloadscapacitors) and systemstandby.• UVLO The LM8801 is availablein a 6-bump DSBGA package.Only threecompact externalsurface-mount components, an inductorand two capacitors,are required. Efficiencyvs.Output Current TypicalApplicationCircuit (AutoMode, VOUT = 1.82V) Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2009–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SNVS597H –APRIL 2009–REVISED MAY 2013 www.ti.com Connection Diagram 6-Bump DSBGA Package See package numbers YFQ0006LCA and YQA0006LCA Pin Descriptions Pin Number Name Description A1 Mode Automode and forcedPWM mode selection.ForcedPWM = HIGH; Auto= LOW. A2 VIN Power supplyinput.Connecttotheinputfiltercapacitor(TypicalApplicationCircuit,page 1). B1 SW Switchingnode connectiontotheinternalPFET switchand NFET synchronousrectifier. B2 EN Enablepin.The deviceisinshutdownmode when voltagetothispinis< 0.4Vand enabled when > 1.2V.Do notleavethispinfloating. C1 FB Feedback analoginput.Connectdirectlytotheoutputfiltercapacitor(TypicalApplication Circuit,page 1). C2 GND Ground pin. These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. DissipationRatingTable TA ≤ 25°C TA = 60°C TA = 85°CθJA Power Rating Power Rating Power Rating 85°CW (1)1176 mW 765 mW 470 mW (1) Junction-to-ambientthermalresistanceishighlyapplicationand board-layoutdependent.Inapplicationswhere highpower dissipation exists,specialcaremust be giventothermaldissipationissuesinboarddesign.

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www.ti.com SNVS597H –APRIL 2009–REVISED MAY 2013 AbsoluteMaximum Ratings (1)(2) VIN PintoGND −0.2Vto6.0V EN, MODE pintoGND −0.2Vto6.0V FB, SW pin (GND −0.2V)to (VIN + 0.2V)w/ 6.0Vmax JunctionTemperature(TJ-MAX ) +150°C StorageTemperatureRange −65°C to+150°C ContinuousPower Dissipation(3) InternallyLimited Maximum Lead Temperature 260°C (Soldering,10 sec.) ESD Rating(4) Human Body Model 2 kV Machine Model 200V (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothecomponent may occur.OperatingRatingsareconditionsunder whichoperationofthedeviceisspecified.OperatingRatingsdo notimplyperformancelimits.Forperformancelimitsand associatedtest conditions,see theElectricalCharacteristicstables. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsfor availabilityand specifications. (3) Internalthermalshutdowncircuitryprotectsthedevicefrompermanentdamage. Thermalshutdownengages atTJ = 150°C (typ.)and disengagesatTJ = 130°C (typ.). (4) The Human Body Model isa 100 pF capacitordischargedthrougha 1.5kΩ resistorintoeach pin.The machine model isa 200 pF capacitordischargeddirectlyintoeach pin.MIL-STD-883–3015.7. OperatingRatings (1)(2) InputVoltageRange 2.3Vto5.5V Recommended Load Current 0 mA to600 mA JunctionTemperature(TJ)Range −30°C to+125°C AmbientTemperature(TA)Range (3) −30°C to+85°C (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothecomponent may occur.OperatingRatingsareconditionsunder whichoperationofthedeviceisspecified.OperatingRatingsdo notimplyperformancelimits.Forperformancelimitsand associatedtest conditions,see theElectricalCharacteristicstables. (2) AllvoltagesarewithrespecttothepotentialattheGND pin. (3) Inapplicationswhere highpower dissipationand/orpoorpackage resistanceispresent,themaximum ambienttemperaturemay have to be derated.Maximum ambienttemperature(TA-MAX )isdependenton themaximum operatingjunctiontemperature(TJ-MAX-OP = 125°C), themaximum power dissipationofthedeviceintheapplication(PD-MAX )and thejunction-to-ambientthermalresistanceofthe part/package(θJA)intheapplication,as givenby thefollowingequation:TA-MAX = TJ-MAX − (θJAx PD-MAX ).Due tothepulsednatureof testingthepart,thetemp intheElectricalCharacteristictableisspecifiedas TA = TJ. ThermaL Characteristics Junction-to-AmbientThermalResistance(θJA)(DSBGA) (1) 85°C/W (1) Junction-to-ambientthermalresistanceishighlyapplicationand board-layoutdependent.Inapplicationswhere highpower dissipation exists,specialcaremust be giventothermaldissipationissuesinboarddesign. Copyright© 2009–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM8801

SNVS597H –APRIL 2009–REVISED MAY 2013 www.ti.com ElectricalCharacteristics(1)(2)(3) LimitsinstandardtypefaceareforTA = 25°C. Limitsinboldfacetypeapplyovertheoperatingambienttemperaturerange (−30°C ≤ TA = TJ ≤ +85°C).Unlessotherwisenoted,specificationsapplytotheLM8801 open loopTypicalApplicationCircuit withVOUT = 1.82V,VIN = EN = 3.6V. Parameter TestConditions Min Typ Max Units VFB Feedback VoltageTolerance PWM -1.5 +1.5 % 2.3V≤ VIN ≤ 5.5V; 0.2IOUT = 10 mA (PFM) LineReg. (closedloop) %/V 2.3V≤ VIN ≤ 5.5V;VOUT 0.048IOUT = 200 mA (PWM) 0.1mA ≤ IOUT ≤ 600 mA;Load Reg. (closedloop) 0.0019 %/mAVIN = 3.6V(Auto) ISHDN Shutdown SupplyCurrent EN = 0V,SW = GND 0.08 1.0 µA IQ_PFM QuiescentCurrentinPFM Mode No load,deviceisnotswitching 27 35 µA IQ_PWM QuiescentCurrentinPWM Mode No load,deviceisnotswitching 0.57 0.7 mA R DSON (P) Pin-PinResistanceforPFET VIN = VGS = 3.6V 220 m Ω R DSON (N) Pin-PinResistanceforSync NFET VIN = VGS = 3.6V 180 m Ω ILIM PFET Peak CurrentLimit 900 1100 1300 mA VIH LogicHighInput,allcontrolpins 1.2 V VIL LogicLow Input 0.4 V IEN,MODE PinInputCurrent 0.01 1 µA FOSC InternalOscillatorFrequency PWM Mode 5.6 6.0 6.4 MHz UVLO Under-VoltageLock Out 2.0 V (1) AllvoltagesarewithrespecttothepotentialattheGND pin. (2) Min and Max limitsarespecifiedby design,testorstatisticalanalysis.Typicalnumbers representthemost likelynorm. (3) The parametersintheelectricalcharacteristictablearetestedunderopen loopconditionsatVIN = 3.6Vunlessotherwisespecified.For performanceovertheinputvoltagerangeand closedloopcondition,refertothedatasheetcurves.

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www.ti.com SNVS597H –APRIL 2009–REVISED MAY 2013 BLOCK DIAGRAM SimplifiedFunctionalDiagram ORDERING INFORMATION (1)(2) DSBGA package Orderable VoltageOption (V) LM8801TME-1.2/NOPB 1.2 LM8801TMX-1.2/NOPB LM8801TME-1.82/NOPB LM8801TMX-1.82/NOPB 1.82 LM8801XUE-1.82/NOPB LM8801XUX-1.82/NOPB LM8801TME-2.9/NOPB 2.9 LM8801TMX-2.9/NOPB (1) Forthemost currentpackage and orderinginformation,see thePackage OptionAddendum attheend ofthisdocument,orsee theTI web siteatwww.ti.com. (2) Package drawings,thermaldata,and symbolizationareavailableatwww.ti.com/packaging. Copyright© 2009–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM8801

SUPPL Y VOL T AGE ( V ) OUTPUT V OLTAG E (V) 1. 825 1. 823 1. 821 1. 819 1. 817 1. 815 IOUT = 160 mA I OUT = 600 mA I OUT = 300 mA OUTPUT CURRENT (mA) OUTPUT V OLTAG E (V) 1. 845 1. 840 1. 835 1. 830 1. 825 1. 820 1. 815 0 100 200 300 400 500 600 700 2 .7V 3 .6V 4. 2V PFM PWM OUTPUT CURRENT (mA) EFFICIENCY (%) 100 0 100 200 300 400 500 600 2.7V 3.6V 4.2V 2.3V OUTPUT CURRENT (mA) EFFICIENCY (%) 100 0.1 1 10 100 1000 VIN = 2.3V VIN = 3.6V VIN = 4.2V OUTPUT CURRENT (mA) EFFICIENCY (%) 100 0.1 1 10 100 1000 2.7V 3.6V 2.3V 4.2V OUTPUT CURRENT (mA) EFFICIE N CY ( %) 100 0.1 1 10 100 1000 3.6 V 2 .7V 4. 2V 2.3 V LM8801 SNVS597H –APRIL 2009–REVISED MAY 2013 www.ti.com TypicalPerformance Characteristics LM8801TM-1.82,TypicalApplicationCircuit(page1),VOUT = 1.82V,VIN = 3.6V,TA = 25°C, C IN = 2.2µF,0402 (JMK105BJ225MV-F), C OUT = 4.7µF,0402,6.3V(CL05A475MQ5NRNC), L = 0.5µH, 2012 (MIPSZ2012D0R5), unless otherwisenoted. Efficiency Efficiency vs. vs. Output Current(AutoMode) Output Current(PWM Mode) Figure1. Figure2. Efficiency Efficiency vs. vs. Output Current, Output Current(PWM Mode) Auto Mode, VOUT = 1.2V Figure3. Figure4. Output Voltage Output Voltage vs. vs. Output Current(AutoMode) Supply Voltage(PWM) Figure5. Figure6.

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VIN (V) LOAD (mA) 160 140 120 100 PFM to PWM PWM to PFM LM8801 www.ti.com SNVS597H –APRIL 2009–REVISED MAY 2013 TypicalPerformance Characteristics(continued) LM8801TM-1.82,TypicalApplicationCircuit(page1),VOUT = 1.82V,VIN = 3.6V,TA = 25°C, C IN = 2.2µF,0402 (JMK105BJ225MV-F), C OUT = 4.7µF,0402,6.3V(CL05A475MQ5NRNC), L = 0.5µH, 2012 (MIPSZ2012D0R5), unless otherwisenoted. TypicalSwitchingWaveform PFM ↔ PWM Mode Change Point (PWM Mode, IOUT = 300 mA) Figure7. Figure8. TypicalSwitchingWaveform Load TransientResponse (PFM Mode IOUT = 50 mA) (0↔ 150 mA) Figure9. Figure10. Load TransientResponse Load TransientResponse (50↔ 350 mA) (150↔ 400 mA) Figure11. Figure12. Copyright© 2009–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM8801

SNVS597H –APRIL 2009–REVISED MAY 2013 www.ti.com TypicalPerformance Characteristics(continued) LM8801TM-1.82,TypicalApplicationCircuit(page1),VOUT = 1.82V,VIN = 3.6V,TA = 25°C, C IN = 2.2µF,0402 (JMK105BJ225MV-F), C OUT = 4.7µF,0402,6.3V(CL05A475MQ5NRNC), L = 0.5µH, 2012 (MIPSZ2012D0R5), unless otherwisenoted. Load TransientResponse Load TransientResponse (250↔ 600 mA) (VOUT = 1.2V,0 ↔ 150 mA) Figure13. Figure14. Load TransientResponse Load TransientResponse (VOUT = 1.2V,50 ↔ 350 mA) (VOUT = 1.2V,150 ↔ 400 mA) Figure15. Figure16. Load TransientResponse LineTransientResponse (VOUT = 1.2V,250↔ 600 mA) (3.0VIN ↔ 3.6VIN,250 mA) Figure17. Figure18.

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www.ti.com SNVS597H –APRIL 2009–REVISED MAY 2013 TypicalPerformance Characteristics(continued) LM8801TM-1.82,TypicalApplicationCircuit(page1),VOUT = 1.82V,VIN = 3.6V,TA = 25°C, C IN = 2.2µF,0402 (JMK105BJ225MV-F), C OUT = 4.7µF,0402,6.3V(CL05A475MQ5NRNC), L = 0.5µH, 2012 (MIPSZ2012D0R5), unless otherwisenoted. StartupinPFM Mode (IOUT = 20 mA) StartupinPWM Mode (IOUT = 300 mA) Figure19. Figure20. StartupinPWM Mode StartupinPFM Mode (VOUT = 1.2V,IOUT = 300 mA) (VOUT = 1.2V,IOUT = 20 mA) Figure21. Figure22. Copyright© 2009–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM8801

SNVS597H –APRIL 2009–REVISED MAY 2013 www.ti.com OPERATION DESCRIPTION DEVICE INFORMATION The LM8801, a high-efficiency,step-downDC-DC switchingbuck converter,deliversa constantvoltagefrom eithera singleLi-IonorthreecellNiMH/NiCd batterytoportabledevicessuch as cellphones and PDAs. Usinga voltagemode architecturewithsynchronousrectification,the LM8801 has the abilityto deliverup to 600 mA dependingon theinputvoltageand outputvoltage,ambienttemperature,and theinductorchosen. There are threemodes ofoperationdependingon thecurrentrequired- PWM (PulseWidth Modulation),PFM (Pulse Frequency Modulation),and shutdown. The device operatesin PWM mode at load currentsof approximately80 mA or higher,havingvoltageprecisionof±1.5% with90% efficiencyor better.Lighteroutput currentloadscause thedevicetoautomaticallyswitchintoPFM forreducedcurrentconsumption(IQ = 27 µA typ.)and a longerbatterylife.Shutdown mode turnsoffthe device,offeringthe lowestcurrentconsumption (ISHUTDOWN = 0.08µA typ.). Additionalfeaturesincludesoft-start,undervoltageprotection,currentoverloadprotection,and thermalshutdown protection.As shown intheTypicalApplicationCircuit,onlythreeexternalpower components are requiredfor implementation. CIRCUIT OPERATION The LM8801 operatesas follows.Duringthefirstportionofeach switchingcycle,thecontrolblockintheLM8801 turnson theinternalPFET switch.Thisallowscurrenttoflowfrom theinputthroughtheinductortotheoutput filtercapacitorand load.The inductorlimitsthecurrenttoa ramp witha slopeof(VIN − VOUT )/L,by storingenergy ina magneticfield.Duringthesecond portionofeach cycle,thecontrollerturnsthePFET switchoff,blocking currentflowfrom theinput,and thenturnstheNFET synchronousrectifieron.The inductordraws currentfrom ground throughtheNFET totheoutputfiltercapacitorand load,which ramps theinductorcurrentdown witha slopeof–VOUT /L. The outputfiltercapacitorstoreschargewhen theinductorcurrentishigh,and releasesitwhen low,smoothing thevoltageacrosstheload. The outputvoltageisregulatedby modulatingthePFET switchon timetocontroltheaveragecurrentsenttothe load.The effectisidenticalto sendinga duty-cyclemodulated rectangularwave formed by the switchand synchronousrectifierattheSW pintoa low-passfilterformed by theinductorand outputfiltercapacitor.The outputvoltageisequaltotheaveragevoltageattheSW pin. PWM OPERATION DuringPWM operation,theconverteroperatesas a voltage-modecontrollerwithinputvoltagefeedforward.This allowstheconvertertoachieveexcellentloadand lineregulation.The DC gainofthepower stageisproportional to the inputvoltage.To eliminatethisdependence,feed forwardinverselyproportionalto the inputvoltageis introduced. WhileinPWM mode, theoutputvoltageisregulatedby switchingata constantfrequencyand thenmodulating theenergypercycletocontrolpower totheload.At thebeginningofeach clockcyclethePFET switchisturned on and theinductorcurrentramps up untilthecomparatortripsand thecontrollogicturnsofftheswitch.The currentlimitcomparatorcan alsoturnofftheswitchincase thecurrentlimitofthePFET isexceeded.Then the NFET switchisturnedon and theinductorcurrentramps down. The nextcycleisinitiatedby theclockturningoff theNFET and turningon thePFET. AUTO MODE OPERATION SettingMode pinlow placestheLM8801 inAuto mode. By doingso thedevicewillautomaticallyswitchbetween PFM stateand PWM (PulseWidthModulation)statebased on loaddemand. Atlightloads(lessthan50 mA), the deviceentersPFM mode and operateswithreduced switchingcycleand supplycurrentto maintainhigh efficiency.DuringPFM operation,theconverterpositionstheoutputvoltageslightlyhigher(+15mV typ.)thanthe nominaloutputvoltageduringPWM operation,allowingadditionalheadroom forvoltagedrop duringa load transientfromlighttoheavy load.

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A xi s Axis Target Output Voltage LM8801 www.ti.com SNVS597H –APRIL 2009–REVISED MAY 2013 Figure23. OperationinPFM Mode and TransfertoPWM Mode INTERNAL SYNCHRONOUS RECTIFICATION WhileinPWM mode, theLM8801 uses an internalNFET as a synchronousrectifiertoreducerectifierforward voltagedrop and associatedpower loss.Synchronous rectificationprovidesa significantimprovement in efficiencywhenever theoutputvoltageisrelativelylow compared tothevoltagedropacrossan ordinaryrectifier diode. CURRENT LIMITING A currentlimitfeatureallowstheLM8801 toprotectitselfand externalcomponents duringoverloadconditions. PWM mode implementscurrentlimitusingan internalcomparatorthattripsat1.1A (typ).Iftheoutputisshorted toground thedeviceentersa timedcurrentlimitmode where theNFET isturnedon fora longerdurationuntil the inductorcurrentfallsbelow a low threshold,ensuringinductorcurrenthas more time to decay,thereby preventingrunaway. SHUTDOWN MODE SettingtheEN inputpinlow (<0.4V)placestheLM8801 inshutdown mode. Duringshutdown thePFET switch, NFET switch,reference,controland biascircuitryoftheLM8801 areturnedoff.SettingEN high(>1.2V)enables normaloperation.Whileturningon thedevicewithEN soft-startisactivated.EN pinshouldbe setlow toturnoff the LM8801 duringsystem power up and under-voltageconditionswhen the supplyislessthan 2.3V.Do not leavetheEN pinfloating. SOFT-START The LM8801 has a soft-startcircuitthatlimitsin-rushcurrentduringstart-up.Duringstart-uptheswitchcurrent limitisincreasedinsteps.SoftstartisactivatedonlyifEN goes from logiclow tologichighafterVIN reaches 2.3V. THERMAL SHUTDOWN PROTECTION The LM8801 has a thermaloverloadprotectionfunctionthatoperatestoprotectitselffromshort-termmisuseand overloadconditions.When thejunctiontemperatureexceeds around 150°C, thedeviceinhibitsoperation.Both thePFET and theNFET are turnedoff.When thetemperaturedropsbelow 130°C, normaloperationresumes. Prolongedoperationinthermaloverloadconditionsmay damage thedeviceand isconsideredbad practice. Copyright© 2009–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM8801

!ISAT IOUTMAX + IRIPPLE where IRIPPLE = VOUT VIN VIN - VOUT ¹·©§¹ LM8801 SNVS597H –APRIL 2009–REVISED MAY 2013 www.ti.com UVLO (UNDER-VOLTAGE LOCK OUT) The LM8801 has an UVP comparatortoturnthepower deviceoffinthecase theinputvoltageorbatteryvoltage istoolow.The typicalUVP thresholdisaround2V with100 mV hysteresis.

APPLICATION INFORMATION

There aretwo main considerationswhen choosingan inductor;theinductorshouldnotsaturate,and theinductor currentrippleis smallenough to achievethe desiredoutputvoltageripple.Differentmanufacturersfollow differentsaturationcurrentratingspecifications,so attentionmust be giventodetails.Saturationcurrentratings are typicallyspecifiedat25°C so ratingsatmaximum ambienttemperatureofapplicationshouldbe requested frommanufacturer. Minimum value of inductanceto ensure good performance is0.3µH at (ILIM typ.)bias currentover the ambient temperaturerange. Shieldedinductorsradiatelessnoiseand shouldbe preferred.There are two methods tochoose theinductor saturationcurrentrating. Method 1: The saturationcurrentshouldbe greaterthanthesum ofthemaximum loadcurrentand theworstcase average topeak inductorcurrent.Thiscan be writtenas: (1)

  • IRIPPLE :averagetopeak inductorcurrent
  • IOUTMAX :maximum loadcurrent(600mA)
  • VIN:maximum inputvoltageinapplication
  • L:minimum inductorvalueincludingworstcase tolerances(30% dropcan be consideredformethod 1)
  • f:minimum switchingfrequency(5.4MHz)
  • VOUT :outputvoltage Method 2: A more conservativeand recommended approachistochoose an inductorthatcan handlethemaximum current limitof1300 mA. The inductor'sresistanceshouldbe lessthanaround0.1Ω forgood efficiency.Table1 listssuggestedinductors and suppliers. INPUT CAPACITOR SELECTION A ceramicinputcapacitorof2.2µF,6.3V issufficientformost applications.Placetheinputcapacitoras closeas possibletotheVIN pinofthedevice.A largervalueorhighervoltageratingmay be used toimproveinputvoltage filtering.Use X7R or X5R types;do not use Y5V. DC bias characteristicsof ceramic capacitorsmust be consideredwhen selectingcase sizeslike0402 and 0603. The inputfiltercapacitorsuppliescurrentto the top switchof the LM8801 inthe firsthalfof each cycleand reducesvoltagerippleimposed on the inputpower source.A ceramiccapacitor'slow ESR providesthe best noisefilteringoftheinputvoltagespikesdue tothisrapidlychangingcurrent.Selectan inputfiltercapacitorwith sufficientripplecurrentrating. The inputcurrentripplecan be calculatedas:

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VPP-RMS = VPP-C 2 + VPP-ESR VPP-C = 4*f*C IRIPPLE IRMS = IOUTMAX x r = VOUT VIN 1 - + VOUT VIN

  • ¨¨ (VIN - VOUT ) VOUTx L f IOUTMAX VINx x x LM8801 www.ti.com SNVS597H –APRIL 2009–REVISED MAY 2013 (2) The worstcase iswhen VIN = 2 x VOUT . Table1. Suggested Inductorsand Suppliers Model Vendor Dimensions LxWxH (mm) MIPSZ2012D0R5 FDK 2.0x 1.2x 1.0 LQM21PNR54MG0D Murata 2.0x 1.2x 0.9 HSLI-201208AG-R47 HitachiMetals 2.0x 1.2x 0.8 OUTPUT CAPACITOR SELECTION Use a 4.7μF, 6.3V ceramiccapacitor,X7R or X5R types;do notuse Y5V. DC biascharacteristicsofceramic capacitorsmust be consideredwhen selectingcase sizes0402 and 0603. DC biascharacteristicsvaryfrom manufacturerto manufacturer,and DC biascurvesshouldbe requestedfrom them as partof the capacitor selectionprocess.Minimum output capacitance to ensure good performance is 2.2 µF (for4.7 µF capacitor)at1.8VDC biasincludingtolerancesand over ambient temp range. The outputfiltercapacitorsmooths outcurrentflowfromtheinductortotheload,helpsmaintaina steadyoutput voltageduringtransientloadchanges and reducesoutputvoltageripple.These capacitorsmust be selectedwith sufficientcapacitanceand sufficientlylowESR toperformthesefunctions. The outputvoltagerippleiscaused by thechargingand dischargingoftheoutputcapacitorand alsodue toits R ESR and can be calculatedas: Voltagepeak-to-peakrippledue tocapacitance= (3) Voltagepeak-to-peakrippledue toESR = VPP-ESR = (2*IRIPPLE )*R ESR Because thesetwo components are out of phase,the rms valuecan be used to get an approximatevalueof peak-to-peakripple. Voltagepeak-to-peakripple,rootmean squared= (4) Note thattheoutputvoltagerippleisdependenton thecurrentrippleand theequivalentseriesresistanceofthe outputcapacitor(RESR ).The R ESR isfrequencydependent(aswellas temperaturedependent);make surethe valueused forcalculationsisattheswitchingfrequencyofthepart. Table2 listssuggestedcapacitorsand suppliers. Table2. Suggested Capacitorsand Suppliers Case SizeModel Vendor Inch(mm) GRM155R60J225ME15 (CIN) Murata 0402 (1005) JMK105BJ225MV-F (CIN) TaiyoYuden 0402 (1005) CL05A475MQ5NRNC (CIN orC OUT ) Samsung 0402 (1005) Copyright© 2009–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:LM8801

Enable Pin=0, part off Enable Pin=1, part on Mode Pin=0, Auto mode Mode Pin=1, PWM mode LM8801 SNVS597H –APRIL 2009–REVISED MAY 2013 www.ti.com DSBGA PACKAGE ASSEMBLY AND USE Use of the DSBGA package requiresspecializedboard layout,precisionmounting and carefulre-flow techniques,as detailedin ApplicationNote 1112. Refer to the sectionSurface Mount Technology (SMD) Assembly Considerations.For bestresultsinassembly,alignmentordinalson thePC board shouldbe used to facilitateplacementofthedevice. The pad styleused withDSBGA package must be theNSMD (Non-SolderMask Defined)type.Thismeans that thesolder-maskopeningislargerthanthepad size.Thispreventsa lipthatotherwiseformsifthesolder-mask and pad overlap,from holdingthe deviceoffthe surfaceof the board and interferingwithmounting.See ApplicationNote 1112 forspecificinstructionshow todo this. BOARD LAYOUT CONSIDERATIONS PC boardlayoutisan importantpartofDC-DC converterdesign.Poor boardlayoutcan disrupttheperformance ofa DC-DC converterand surroundingcircuitryby contributingtoEMI, groundbounce,and resistivevoltageloss in the traces.These can send erroneoussignalsto the DC-DC converterIC,resultingin poor regulationor instability.Poor layoutcan alsoresultinre-flowproblemsleadingto poor solderjointsbetween the DSBGA package and boardpads.Poor solderjointscan resultinerraticordegradedperformance. Good layoutforthe LM8801 can be implemented by followinga few simpledesign rules,as illustratedin Figure24. Figure24. LM8801 Board Layout (Top View) 1. PlacetheLM8801 on 8.26milpads.As a thermalrelief,connecteach pad witha 7 milwide,approximately7 millongtrace,and then incrementallyincreaseeach traceto itsoptimalwidth.The importantcriterionis symmetry to ensure the solderbumps re-flowevenly.See AN-1112 DSBGA Wafer Level Chip Scale 2. Place the LM8801, inductorand filtercapacitorsclosetogetherand make the tracesshort.The traces between thesecomponents carryrelativelyhighswitchingcurrentsand actas antennas.Followingthisrule reducesradiatednoise.Specialcaremust be giventoplacetheinputfiltercapacitorveryclosetotheVIN and GND pin. 3. Arrangethecomponents so thattheswitchingcurrentloopscurlinthesame direction.Duringthefirsthalfof each cycle,currentflowsfromtheinputfiltercapacitor,throughtheLM8801 and inductortotheoutputfilter capacitorand back throughground,forminga currentloop.Inthesecond halfofeach cycle,currentispulled up from ground,throughthe LM8801 by the inductor,to the outputfiltercapacitorand then back through ground,forminga second currentloop.Routingthese loopsso the currentcurlsin the same direction preventsmagneticfieldreversalbetween thetwo half-cyclesand reducesradiatednoise. 4. Connect the ground pins of the LM8801, and filtercapacitorstogetherusing generous component-side copper fillas a pseudo-groundplane.Then connectthisto the ground-plane(ifone isused) withseveral vias.This reduces ground-planenoiseby preventingthe switchingcurrentsfrom circulatingthroughthe groundplane.Italsoreducesgroundbounce attheLM8801 by givingita low-impedancegroundconnection. 5. Use wide tracesbetween thepower components and forpower connectionstotheDC-DC convertercircuit. Thisreducesvoltageerrorscaused by resistivelossesacrossthetraces.

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www.ti.com SNVS597H –APRIL 2009–REVISED MAY 2013 6. Route noisesensitivetracessuch as thevoltagefeedbackpathaway fromnoisytracesbetween thepower components.The voltagefeedbacktracemust remain closeto the LM8801 circuitand shouldbe routed directlyfrom FB toVOUT attheoutputcapacitorand shouldbe routedoppositetonoisecomponents.This reducesEMI radiatedontotheDC-DC converter’s own voltagefeedbacktrace. 7. Placenoisesensitivecircuitry,such as radioIFblocks,away fromtheDC-DC converter,CMOS digitalblocks and othernoisycircuitry.Interferencewithnoise-sensitivecircuitryinthe system can be reduced through distance. Inmobilephones,forexample,a common practiceistoplacetheDC-DC converteron one corneroftheboard, arrange the CMOS digitalcircuitryaround it(sincethisalso generatesnoise),and then place sensitive preamplifiersand IF stageson the diagonallyopposingcorner.Often,the sensitivecircuitryisshieldedwitha metalpan and power toitispost-regulatedtoreduceconductednoise,usinglow-dropoutlinearregulators. Copyright© 2009–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:LM8801

SNVS597H –APRIL 2009–REVISED MAY 2013 www.ti.com

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www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM8801TME-1.2/NOPB Active Production DSBGA (YFQ) | 6 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM - J LM8801TME-1.2/NOPB.A Active Production DSBGA (YFQ) | 6 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM -30 to 85 J LM8801TME-1.82/NO.A Active Production DSBGA (YFQ) | 6 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM -30 to 85 E LM8801TME-1.82/NOPB Active Production DSBGA (YFQ) | 6 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM -30 to 85 E LM8801TME-2.9/NOPB Active Production DSBGA (YFQ) | 6 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM - S LM8801TME-2.9/NOPB.A Active Production DSBGA (YFQ) | 6 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM -30 to 85 S LM8801TMX-1.82/NO.A Active Production DSBGA (YFQ) | 6 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -30 to 85 E LM8801TMX-1.82/NOPB Active Production DSBGA (YFQ) | 6 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -30 to 85 E LM8801TMX-2.9/NOPB Active Production DSBGA (YFQ) | 6 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM - S LM8801TMX-2.9/NOPB.A Active Production DSBGA (YFQ) | 6 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -30 to 85 S LM8801XUE-1.82/NO.A Active Production DSBGA (YQA) | 6 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM -30 to 85 L LM8801XUE-1.82/NOPB Active Production DSBGA (YQA) | 6 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM - L LM8801XUX-1.82/NO.A Active Production DSBGA (YQA) | 6 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -30 to 85 L LM8801XUX-1.82/NOPB Active Production DSBGA (YQA) | 6 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM - L (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Addendum-Page 1

www.ti.com 23-May-2025 Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 10-Jan-2024 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 10-Jan-2024 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM8801TME-1.2/NOPB DSBGA YFQ 6 250 208.0 191.0 35.0 LM8801TME-1.82/NOPB DSBGA YFQ 6 250 208.0 191.0 35.0 LM8801TME-2.9/NOPB DSBGA YFQ 6 250 208.0 191.0 35.0 LM8801TMX-1.82/NOPB DSBGA YFQ 6 3000 208.0 191.0 35.0 LM8801TMX-2.9/NOPB DSBGA YFQ 6 3000 208.0 191.0 35.0 LM8801XUE-1.82/NOPB DSBGA YQA 6 250 208.0 191.0 35.0 LM8801XUX-1.82/NOPB DSBGA YQA 6 3000 208.0 191.0 35.0 Pack Materials-Page 2

www.ti.com TMD06XXX (Rev B) E 0.600±0.075 D A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994. B. This drawing is subject to change without notice. NOTES: 4215075/A 12/12 D: Max = E: Max = 1.29 mm, Min = 1.09 mm, Min = 1.23 mm 1.03 mm

www.ti.com XUD06XXX (Rev A) 0.250±0.045 D E 4215207/A 12/12 A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994. B. This drawing is subject to change without notice. NOTES: D: Max = E: Max = 1.29 mm, Min = 1.09 mm, Min = 1.23 mm 1.03 mm

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