LM828M5X TI1 | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 15

Technical content

www.ti.com SNOS035D –MARCH 2010–REVISED MAY 2013 LM828SwitchedCapacitorVoltageConverter Check forSamples: LM828 1FEATURES DESCRIPTION The LM828 CMOS charge-pump voltageconverter 2• InvertsInputSupply Voltage invertsa positivevoltagein the range of +1.8V to• SOT-23 Package +5.5V tothecorrespondingnegativevoltageof−1.8V

  • 20Ω TypicalOutput Impedance to−5.5V.The LM828 uses two low costcapacitorsto provideup to25 mA ofoutputcurrent.• 97% TypicalConversion Efficiencyat5 mA The LM828 operatesat 12 kHz switchingfrequency APPLICATIONS to reduce outputresistanceand voltageripple.With an operatingcurrentof only 40 µA (operating• CellularPhones efficiencygreaterthan 96% with most loads),the• Pagers LM828 provides ideal performance for battery
  • PDAs powered systems.The deviceis in a tinySOT-23 package.• OperationalAmplifierPower Supplies
  • InterfacePower Supplies
  • Handheld Instruments Basic ApplicationCircuits VoltageInverter +5V to−10V Converter Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2010–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SNOS035D –MARCH 2010–REVISED MAY 2013 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1)(2) SupplyVoltage(V+ toGND, orGND toOUT) 5.8V V+ and OUT ContinuousOutputCurrent 50 mA OutputShort-CircuitDurationtoGND (3) 1 sec. ContinuousPower Dissipation(TA = 25°C)(4) 240 mW TJMax (4) 150°C θJA (4) 300°C/W OperatingJunctionTemperatureRange −40°C to85°C StorageTemperatureRange −65°C to+150°C Lead Temp. (Soldering,10 seconds) 300°C ESD Rating(5) 2kV (1) Absolutemaximum ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.Electricalspecificationsdo notapplywhen operatingthedevicebeyond itsratedoperatingconditions. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) OUT may be shortedtoGND forone second withoutdamage. However,shortingOUT toV+ may damage thedeviceand shouldbe avoided.Also,fortemperaturesabove 85°C, OUT must notbe shortedtoGND orV+, orthedevicemay be damaged. (4) The maximum allowablepower dissipationiscalculatedby usingPDMax = (TJMax − TA)/θJA,where TJMax isthemaximum junction temperature,TA istheambienttemperature,and θJA isthejunction-to-ambientthermalresistanceofthepackage. (5) The human body model isa 100 pF capacitordischargedthrougha 1.5kΩ resistorintoeach pin. ElectricalCharacteristics LimitsinstandardtypefaceareforTJ = 25°C, and limitsinboldfacetypeapplyoverthefulloperatingtemperaturerange. Unlessotherwisespecified:V+ = 5V,C 1 = C 2 = 10 μF.(1) Symbol Parameter Condition Min Typ Max Units V+ SupplyVoltage R L =10kΩ 1.8 5.5 V IQ SupplyCurrent No Load 40 75 µA 115 R OUT OutputResistance(2) IL = 5 mA 20 65 Ω fOSC OscillatorFrequency(3) Internal 12 24 56 kHz fSW SwitchingFrequency(3) Measured atCAP+ 6 12 28 kHz PEFF Power Efficiency IL = 5 mA 97 % VOEFF VoltageConversionEfficiency No Load 95 99.96 % (1) Inthetestcircuit,capacitorsC 1 and C 2 are10 µF,0.3Ω maximum ESR capacitors.CapacitorswithhigherESR willincreaseoutput resistance,reduceoutputvoltageand efficiency. (2) Specifiedoutputresistanceincludesinternalswitchresistanceand capacitorESR. See thedetailsintheapplicationinformation. (3) The outputswitchesoperateatone halfoftheoscillatorfrequency,fOSC = 2fSW .

2 SubmitDocumentationFeedback Copyright© 2010–2013,Texas InstrumentsIncorporated

ProductFolderLinks:LM828

www.ti.com SNOS035D –MARCH 2010–REVISED MAY 2013 TestCircuit *C1 and C 2 are10 µF capacitors. Figure1. LM828 TestCircuit TypicalPerformance Characteristics (CircuitofFigure1,V+ = 5V unlessotherwisespecified) Supply Currentvs Supply Currentvs Supply Voltage Temperature Figure2. Figure3. Output Source Resistance Output Source Resistance vs vs Supply Voltage Temperature Figure4. Figure5. Copyright© 2010–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM828

SNOS035D –MARCH 2010–REVISED MAY 2013 www.ti.com TypicalPerformance Characteristics(continued) (CircuitofFigure1,V+ = 5V unlessotherwisespecified) Output Voltage Efficiencyvs vs Load Current Load Current Figure6. Figure7. SwitchingFrequency vs SwitchingFrequency vs Supply Voltage Temperature Figure8. Figure9. CONNECTION DIAGRAMS 5-Lead SOT-23 Package (DBV) Figure10.SOT-23 Package – Top View Figure11.ActualSize See Package Number DBV0005A

4 SubmitDocumentationFeedback Copyright© 2010–2013,Texas InstrumentsIncorporated

ProductFolderLinks:LM828

www.ti.com SNOS035D –MARCH 2010–REVISED MAY 2013 Pin Functions PIN DESCRIPTIONS Pin Name Function 1 OUT Negativevoltageoutput. 2 V+ Power supplypositiveinput. 3 CAP − Connectthispintothenegativeterminalofthecharge-pumpcapacitor. 4 GND Power supplygroundinput. 5 CAP+ Connectthispintothepositiveterminalofthecharge-pumpcapacitor. CircuitDescription The LM828 containsfourlargeCMOS switcheswhich are switchedina sequence to invertthe inputsupply voltage.Energy transferand storageare providedby externalcapacitors.Figure12 illustratesthe voltage conversionscheme. When S1 and S3 areclosed,C 1 chargestothesupplyvoltageV+. Duringthistimeinterval, switchesS2 and S4 areopen.Inthesecond timeinterval,S1 and S3 areopen;atthesame time,S2 and S4 are closed,C 1 ischargingC 2.Aftera number ofcycles,thevoltageacrossC 2 willbe pumped toV+. Sincetheanode ofC 2 isconnectedtoground,theoutputatthecathodeofC 2 equals−(V+)when thereisno loadcurrent.The outputvoltagedrop when a load isadded isdeterminedby the parasiticresistance(Rds(on) of the MOSFET switchesand theESR ofthecapacitors)and thechargetransferlossbetween capacitors. Figure12. VoltageInvertingPrinciple ApplicationInformation SIMPLE NEGATIVE VOLTAGE CONVERTER The main applicationofLM828 istogeneratea negativesupplyvoltage.The voltageinvertercircuituses only two externalcapacitorsas shown intheBasicApplicationCircuits.The rangeoftheinputsupplyvoltageis1.8V to5.5V. The outputcharacteristicsof thiscircuitcan be approximatedby an idealvoltagesource in serieswitha resistance.The voltagesourceequals−(V+).The outputresistance,R out ,isa functionoftheON resistanceof theinternalMOSFET switches,theoscillatorfrequency,thecapacitanceand theESR ofbothC 1 and C 2.Since theswitchingcurrentchargingand dischargingC 1 isapproximatelytwiceas theoutputcurrent,theeffectofthe ESR ofthepumping capacitorC 1 willbe multipliedby fourintheoutputresistance.The outputcapacitorC 2 is chargingand dischargingata currentapproximatelyequaltotheoutputcurrent,therefore,thisESR term only countsonce intheoutputresistance.A good approximationofR out is: (1) where R SW isthesum oftheON resistanceoftheinternalMOSFET switchesshown inFigure12. Highcapacitance,lowESR capacitorswillreducetheoutputresistance. The peak-to-peakoutputvoltagerippleisdeterminedby theoscillatorfrequency,thecapacitanceand ESR ofthe outputcapacitorC 2: Copyright© 2010–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM828

SNOS035D –MARCH 2010–REVISED MAY 2013 www.ti.com (2) Again,usinga lowESR capacitorwillresultinlowerripple. CAPACITOR SELECTION The outputresistanceand ripplevoltageare dependent on the capacitanceand ESR valuesof the external capacitors.The outputvoltagedropistheloadcurrenttimestheoutputresistance,and thepower efficiencyis (3) Where IQ (V+)isthequiescentpower lossoftheIC device,and IL 2R out istheconversionlossassociatedwiththe switchon-resistance,thetwo externalcapacitorsand theirESRs. The selectionof capacitorsisbased on the specificationsof the dropoutvoltage(whichequalsIout R out),the outputvoltageripple,and the converterefficiency.Low ESR capacitors(followingtable)are recommended to maximizeefficiency,reducetheoutputvoltagedropand voltageripple. Low ESR CapacitorManufacturers Manufacturer Phone CapacitorType NichiconCorp. (708)-843-7500 PL & PF series,through-holealuminum electrolytic AVX Corp. (803)-448-9411 TPS series,surface-mounttantalum Sprague (207)-324-4140 593D, 594D, 595D series,surface-mounttantalum Sanyo (619)-661-6835 OS-CON series,through-holealuminum electrolytic Murata (800)-831-9172 Ceramicchipcapacitors TaiyoYuden (800)-348-2496 Ceramicchipcapacitors Tokin (408)-432-8020 Ceramicchipcapacitors Other Applications PARALLELING DEVICES Any number of LM828s can be paralleledto reduce the outputresistance.Each devicemust have itsown pumping capacitorC 1, whileonlyone outputcapacitorC out isneeded as shown inFigure13. The composite outputresistanceis: (4) Figure13. Lowering Output Resistanceby ParallelingDevices

6 SubmitDocumentationFeedback Copyright© 2010–2013,Texas InstrumentsIncorporated

ProductFolderLinks:LM828

www.ti.com SNOS035D –MARCH 2010–REVISED MAY 2013 CASCADING DEVICES CascadingtheLM828s isan easy way toproducea greaternegativevoltage(e.g.A two-stagecascade circuitis shown inFigure14). Ifn istheintegerrepresentingthenumber ofdevicescascaded,theunloadedoutputvoltageVout is(-nVin).The effectiveoutputresistanceisequaltotheweightedsum ofeach individualdevice: R out = nR out_1 + n/2R out_2 + ...+ R out_n (5) Thiscan be seen by firstassuming thateach deviceis100 percentefficient.Sincetheoutputvoltageisdifferent on each devicethe outputcurrentisas well.Each cascaded devicesees lesscurrentat the outputthan the previousso theR OUT voltagedropislowerineach deviceadded.Note that,thenumber ofn ispracticallylimited sincethe increasingof n significantlyreducesthe efficiency,and increasesthe outputresistanceand output voltageripple. Figure14. IncreasingOutput Voltageby Cascading Devices COMBINED DOUBLER AND INVERTER InFigure15,theLM828 isused toprovidea positivevoltagedoublerand a negativevoltageconverter.Note that thetotalcurrentdrawn fromthetwo outputsshouldnotexceed 40 mA. Figure15. Combined VoltageDoubler and Inverter Copyright© 2010–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM828

SNOS035D –MARCH 2010–REVISED MAY 2013 www.ti.com REGULATING VOUT Itispossibleto regulatethe negativeoutputof the LM828 by use of a low dropoutregulator(such as the LP2980).The whole converterisdepictedinFigure16.Thisconvertercan givea regulatedoutputfrom−1.8V to −5.5Vby choosingtheproperresistorratio: Vout= Vref(1+ R 1/R2) (6) where,Vref= 1.23V (7) Note thatthefollowingconditionsmust be satisfiedsimultaneouslyforworstcase design: Vin_min>Vout_min+Vdrop_max (LP2980) (8) + Iout_max × R out_max (LM828) (9) Vin_max < Vout_max +Vdrop_min (LP2980) (10) + Iout_min× R out_min(LM828) (11) Figure16. Combining LM828 withLP2980 toMake a NegativeAdjustableRegulator

8 SubmitDocumentationFeedback Copyright© 2010–2013,Texas InstrumentsIncorporated

ProductFolderLinks:LM828

www.ti.com SNOS035D –MARCH 2010–REVISED MAY 2013

REVISION HISTORY

Changes from RevisionC (May 2013)toRevisionD Page Copyright© 2010–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM828

www.ti.com 1-Nov-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM828M5 NRND SOT-23 DBV 5 1000 TBD Call TI Call TI S08A LM828M5/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM S08A LM828M5X NRND SOT-23 DBV 5 3000 TBD Call TI Call TI S08A LM828M5X/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM S08A (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

www.ti.com 1-Nov-2013 Addendum-Page 2 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 8-May-2013 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM828M5 SOT-23 DBV 5 1000 210.0 185.0 35.0 LM828M5/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM828M5X SOT-23 DBV 5 3000 210.0 185.0 35.0 LM828M5X/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 8-May-2013 Pack Materials-Page 2

Texas InstrumentsIncorporatedand itssubsidiaries(TI)reservetherighttomake corrections,enhancements,improvementsand other changes toitssemiconductorproductsand servicesperJESD46, latestissue,and todiscontinueany productorserviceperJESD48, latest issue.Buyersshouldobtainthelatestrelevantinformationbeforeplacingordersand shouldverifythatsuch informationiscurrentand complete.Allsemiconductorproducts(alsoreferredtohereinas “components”)aresoldsubjecttoTI’s termsand conditionsofsale suppliedatthetimeoforderacknowledgment. TIwarrantsperformanceofitscomponents tothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI’s terms and conditionsofsaleofsemiconductorproducts.Testingand otherqualitycontroltechniquesareused totheextentTIdeems necessary tosupportthiswarranty.Exceptwhere mandated by applicablelaw,testingofallparametersofeach component isnotnecessarily performed. TIassumes no liabilityforapplicationsassistanceorthedesignofBuyers’products.Buyersareresponsiblefortheirproductsand applicationsusingTIcomponents.To minimizetherisksassociatedwithBuyers’productsand applications,Buyersshouldprovide adequatedesignand operatingsafeguards. TIdoes notwarrantorrepresentthatany license,eitherexpressorimplied,isgrantedunderany patentright,copyright,mask work right,or otherintellectualpropertyrightrelatingtoany combination,machine,orprocessinwhichTIcomponents orservicesareused.Information publishedby TIregardingthird-partyproductsorservicesdoes notconstitutea licensetouse such productsorservicesora warrantyor endorsementthereof.Use ofsuch informationmay requirea licensefroma thirdpartyunderthepatentsorotherintellectualpropertyofthe thirdparty,ora licensefromTIunderthepatentsorotherintellectualpropertyofTI. ReproductionofsignificantportionsofTIinformationinTIdatabooks ordatasheetsispermissibleonlyifreproductioniswithoutalteration and isaccompaniedby allassociatedwarranties,conditions,limitations,and notices.TIisnotresponsibleorliableforsuch altered documentation.Informationofthirdpartiesmay be subjecttoadditionalrestrictions. ResaleofTIcomponents orserviceswithstatementsdifferentfromorbeyond theparametersstatedby TIforthatcomponent orservice voidsallexpressand any impliedwarrantiesfortheassociatedTIcomponent orserviceand isan unfairand deceptivebusinesspractice. TIisnotresponsibleorliableforany such statements. Buyeracknowledgesand agreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryand safety-relatedrequirements concerningitsproducts,and any use ofTIcomponents initsapplications,notwithstandingany applications-relatedinformationorsupport thatmay be providedby TI.Buyerrepresentsand agreesthatithas allthenecessaryexpertisetocreateand implementsafeguardswhich anticipatedangerousconsequencesoffailures,monitorfailuresand theirconsequences,lessenthelikelihoodoffailuresthatmightcause harm and takeappropriateremedialactions.BuyerwillfullyindemnifyTIand itsrepresentativesagainstany damages arisingoutoftheuse ofany TIcomponents insafety-criticalapplications. Insome cases,TIcomponents may be promotedspecificallytofacilitatesafety-relatedapplications.Withsuch components,TI’s goalisto helpenablecustomerstodesignand createtheirown end-productsolutionsthatmeet applicablefunctionalsafetystandardsand requirements.Nonetheless,such components aresubjecttotheseterms. No TIcomponents areauthorizedforuse inFDA ClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersoftheparties have executeda specialagreementspecificallygoverningsuch use. OnlythoseTIcomponents whichTIhas specificallydesignatedas militarygradeor“enhanced plastic”aredesignedand intendedforuse in military/aerospaceapplicationsorenvironments.Buyeracknowledgesand agreesthatany militaryoraerospaceuse ofTIcomponents whichhave not been so designatedissolelyattheBuyer's risk,and thatBuyerissolelyresponsibleforcompliancewithalllegaland regulatoryrequirementsinconnectionwithsuch use. TIhas specificallydesignatedcertaincomponents as meetingISO/TS16949 requirements,mainlyforautomotiveuse.Inany case ofuse of non-designatedproducts,TIwillnotbe responsibleforany failuretomeet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotiveand Transportationwww.ti.com/automotive Amplifiers amplifier.ti.com Communicationsand Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP ® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energyand Lighting www.ti.com/energy Clocksand Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space,Avionicsand Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Videoand Imaging www.ti.com/video RFID www.ti-rfid.com OMAP ApplicationsProcessors www.ti.com/omap TIE2E Community e2e.ti.com WirelessConnectivity www.ti.com/wirelessconnectivity MailingAddress:Texas Instruments,PostOfficeBox 655303,Dallas,Texas 75265 Copyright© 2013,Texas InstrumentsIncorporated