LM8207 NSC | Alldatasheet

Document overview

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Technical content

Features

n Gamma buffers 1-2 swing to V DD n Gamma buffers 17-18 swing to V SS n Large output current V COM driver (ISC = 300 mA) n Stable (1%) internal 1.295V reference, to improve picture quality and reduce variations n 48-pin TSSOP package

Applications

n TFT gamma curve connection and V COM voltage buffering TFT Panel Block Diagram 20137926 September 2005 LM8207 TFT 18 Gamma Buffer + VCOMDriver + Voltage Reference © 2005 National Semiconductor Corporation DS201379 www.national.com

Absolute Maximum Ratings(Notes 1, 2) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. ESD Tolerance (Note 3) Human Body 2.5 kV Machine Model 250V Supply Voltage (V DD -V SS) 18V Storage Temperature Range −65˚C to +150˚C Junction Temperature (Note 4) +150˚C Soldering Information Infrared or Convection (20 sec.) 230˚C Wave Soldering (10 sec.) 260˚C Operating Ratings(Note 1) Operating Temperature Range −40˚C to +105˚C Operating Voltage Range 6V to 16V Package Thermal Resistance, θ JA (Note 4) 48-Pin TSSOP 84˚C/W Unless otherwise specified, all limits guaranteed for T J = 25˚C, VDD = 16V, VSS =0 V ,&C LOAD = 100 pF (Gamma & V COM Buffers). Boldface limits apply at the temperature extremes. (Note 5) Symbol Parameter Conditions Min (Note 6) Typ (Note 7) Max (Note 6) Units Gamma Buffers BW_Gamma −3 dB Bandwidth 2 MHz SR_Gamma Slew Rate (Note 8) 1 V/µs T REC_Gamma Output Recovery Time (Note 9) 400 ns VIN_Gamma Input Voltage Range Buffer 1-2 Positive V DD V Negative V SS +0.6 Buffer 3-8 & 11-16 Positive V DD-0.6 Negative V SS +0.6 Buffer 9 Positive V DD −0.6 Negative V SS Buffer 10 Positive V DD-0.6 Negative V SS +0.6 Buffer 17-18 Positive V DD −0.6 Negative V SS VOUT_Gamma Output Voltage Range Buffer 1-2, No Load Positive V DD -0.25 V DD -0.1 V Negative V SS +1.5 V SS +1.6 Buffer 3-8 & 11-16 No Load Positive V DD −1.2 V DD -1.1 Negative V SS +0.6 V SS +0.7 Buffer 9, No Load Positive V DD −1.0 V DD -0.8 Negative V SS +0.8 V SS +0.9 Buffer 10, No Load Positive V DD –1.2 V DD –1.1 Negative V SS +0.6 V SS +0.7 Buffer 17-18, No Load Positive V DD –1.6 V DD –1.5 Negative V SS +0.1 V SS +0.25 IBIAS_Gamma Absolute, Input Bias Current Within Gamma Buffer Output Voltage Range 30 nA VOS_Gamma Input Offset Voltage Buffer 1-2, V IN =8 V 5 1 0 mV Buffer 3-8, 11-16, V IN =8 V 1 5 Buffer 9, VIN =8 V 1 5 Buffer 10, VIN =8 V 1 5 Buffer 17-18, VIN =8 V 5 1 0 LM8207 www.national.com 2

Unless otherwise specified, all limits guaranteed for T J = 25˚C, VDD = 16V, VSS =0 V ,&C LOAD = 100 pF (Gamma & V COM Buffers). Boldface limits apply at the temperature extremes. (Note 5) Symbol Parameter Conditions Min (Note 6) Typ (Note 7) Max (Note 6) Units IOUT_Gamma Linear Output Current (Note 10) Buffer 1-2 Sourcing 20 46 mA Sinking 0.2 0.33 Buffer 3-8 & 11-16 Sourcing 10 24.5 Sinking 3.5 5.5 Buffer 9 Sourcing 4.5 9.4 Sinking 15 27 Buffer 10 Sourcing 23 34.8 Sinking 3.5 5.5 Buffer 17-18 Sourcing 0.2 0.33 Sinking 20 50 PSRR Power Supply Rejection Ratio V DD -V SS = 6V to 16V 75 88 dB VCOM Driver BW_VCOM Bandwidth 10 MHz SR_ VCOM Slew Rate (Note 8) 4.5 V/µs T_REC_VCOM Output Recovery Time (Note 9) 200 ns VIN_VCOM Input Voltage Range Positive V DD VNegative V SS +0.6 VOUT_VCOM Output Voltage Range No Load Positive V DD –1.0 V DD –0.7 VNegative V SS +0.9 V SS +1.2 IBIAS_VCOM Input Bias Current Within V COM Buffer Output Voltage Range 50 nA VOS_VCOM Input Offset Voltage V IN =8V 1 1 0 m V IOUT_LIN_VCOM Linear Output Current (Notes 10, 11) Sourcing 160 mASinking 150 IOUT_SC_VCOM Short Circuit Output Current (Notes 11, 12) Sourcing 220 300 mASinking 220 300 PSRR Power Supply Rejection Ratio V DD -V SS = 6V to 16V 75 88 dB Voltage Reference Section V REF Voltage No Load 1.28 1.295 1.31 V RegLOAD Load Regulation I OUT = 0 to 10 mA 0.14 mV/mA VREF_ACC Voltage Accuracy No Load, V REF = 1.295V 1 % VREF_MAX Max Programming Range I OUT =4m A V DD −0.3 V IIN_VREF Input Bias Current Within V REF Output Voltage Range 10 50 nA TC_VREF Temperature Stability 70 ppm/˚C IOUT_VREF Max Output Current Sourcing, V OUT = 1.295 V 71 mA PSRR Power Supply Rejection Ratio (Line Regulation) 70 80 dB Miscellaneous IS Supply Current 4.5 6.5 8.5 9.5 mA Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications, see the Electrical Characteristics tables. Note 2: When the output of the V COM buffer exceeds the supply rails, while sinking or sourcing 100 mA, the V COM output is susceptible to latch. Note 3: Human body model, 1.5 k Ω in series with 100 pF. Machine model, 0 Ω in series with 200 pF Note 4: The maximum power dissipation is a function of T J(MAX), θJA and T A. The maximum allowable power dissipation at any ambient temperature is PD =( TJ(MAX) –T A)/θJA. All numbers apply for packages soldered directly onto a PC board. Note 5: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing condition result in very limited se lf-heating of the device such that T J =T A. No guarantee of parametric performance is indicated in the electrical table under conditions of internal self-heating where T J > TA. LM8207 www.national.com3

Note 6: All limits are guaranteed by design or statistical analysis. Note 7: Typical values represent the parametric norm at the time of characterization. Note 8: Slew Rate is measured for V IN =4V PP. 10% -90% values are used. Slew rate is the average of the rising and falling slew rates Note 9: 4V PP pulse (50 ns rise time) applied to one side of 100 pF series output capacitance, other side connected to output of buffer. Output to within 0.1% of input voltage. Note 10: Linear output current measured at |V OUT -V IN| = 0.1V. Note 11: This is a momentary test. Continuous large output currents may result in exceeding the maximum power dissipation and damage the device. Note 12: Short circuit current measured at |V OUT -V IN|=1 V . Connection Diagram 48-Pin TSSOP 20137902 Top View Pin Descriptions Pin # Description Remark

1 OUT_V REF Reference voltage amplifier output

2 NC No connection

3 IN_1 Input gamma buffer 1

4 IN_2 Input gamma buffer 2

5 IN_3 Input gamma buffer 3

6 IN_4 Input gamma buffer 4

7 IN_5 Input gamma buffer 5

8 IN_6 Input gamma buffer 6

9 IN_7 Input gamma buffer 7

10 IN_8 Input gamma buffer 8

11 IN_9 Input gamma buffer 9

DD Positive supply voltage (V DD)

13 IN_10 Input gamma buffer 10

14 IN_11 Input gamma buffer 11

15 IN_12 Input gamma buffer 12

16 IN_13 Input gamma buffer 13

17 IN_14 Input gamma buffer 14

18 IN_15 Input gamma buffer 15

19 IN_16 Input gamma buffer 16

20 IN_17 Input gamma buffer 17

21 IN_18 Input gamma buffer 18

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Pin Descriptions (Continued) 22,23 NC No connection

24 IN_V COM Input VCOM

25 OUT_V COM Output VCOM

26,27 NC No connection

28 OUT_18 Output gamma buffer 18

29 OUT_17 Output gamma buffer 17

30 OUT_16 Output gamma buffer 16

31 OUT_15 Output gamma buffer 15

32 OUT_14 Output gamma buffer 14

33 OUT_13 Output gamma buffer 13

34 OUT_12 Output gamma buffer 12

35 OUT_11 Output gamma buffer 11

36 OUT_10 Output gamma buffer 10

SS Negative supply voltage (V SS)

38 OUT_9 Output gamma buffer 9

39 OUT_8 Output gamma buffer 8

40 OUT_7 Output gamma buffer 7

41 OUT_6 Output gamma buffer 6

42 OUT_5 Output gamma buffer 5

43 OUT_4 Output gamma buffer 4

44 OUT_3 Output gamma buffer 3

45 OUT_2 Output gamma buffer 2

46 OUT_1 Output gamma buffer 1

47 NC No connection

48 IN_V

REF Reference voltage amplifier feedback input

Ordering Information

Package Part Number Package Marking Transport Media NSC Drawing 48-Pin TSSOP LM8207MT LM8207MT 38 Units/Rail MTD48LM8207MTX 1k Units Tape and Reel Block Diagram 20137901 LM8207 www.national.com5

Typical Performance CharacteristicsAt TJ = 25˚C, VDD = 16V, V SS = 0V. Unless otherwise specified. Output Voltage Swing (Negative rail) Output Voltage Swing (Positive rail) 20137907 20137908 Voltage Drop vs. Output Current (VCOM Buffer) Voltage Drop vs. Output Current (V COM Buffer) 20137942 20137944 Voltage Drop vs. Output Current (Gamma Buffer) Voltage Drop vs. Output Current (Gamma Buffer) 20137941 20137943 LM8207 www.national.com 6

Typical Performance CharacteristicsAt TJ = 25˚C, VDD = 16V, V SS = 0V. Unless otherwise specified. (Continued) Offset Voltage vs. Supply Voltage (Gamma Buffer) Offset Voltage vs. Supply Voltage (V COM Buffer) 20137937 20137938 Recovery Time (VCOM Buffer) Negative Slope (CL = 100 pF) Recovery Time (VCOM Buffer) Positive Slope (CL = 100 pF) 20137911 20137913 Large Signal Transient Response (VCOM Buffer) Negative Slope (CL = 100 pF) Large Signal Transient Response (VCOM Buffer) Positive Slope (CL = 100 pF) 20137915 20137916 LM8207 www.national.com7

Typical Performance CharacteristicsAt TJ = 25˚C, VDD = 16V, V SS = 0V. Unless otherwise specified. (Continued) Frequency Response for Various Temperature (VCOM Buffer) Frequency Response for Various Load (VCOM Buffer) 20137932 20137934 Gain/Phase (Gamma Buffer) (CL = 100 pF) PSRR (V COM Buffer) 20137903 20137919 Recovery Time (Gamma Buffer 3-16) Negative Slope (CL = 100 pF) Recovery Time (Gamma Buffer 3-16) Positive Slope (CL = 100 pF) 20137912 20137914 LM8207 www.national.com 8

Typical Performance CharacteristicsAt TJ = 25˚C, VDD = 16V, V SS = 0V. Unless otherwise specified. (Continued) Large Signal Transient Response (Gamma Buffer 3-16) Negative slope (CL = 100 pF) Large Signal Transient Response (Gamma Buffer 3-16) Positive slope (CL = 100 pF) 20137917 20137918 Frequency Response for Various Load (Gamma Buffer) Frequency Response for Various Temperature (Gamma Buffer) 20137933 20137935 Gain/Phase (Gamma Buffer) (CL = 100 pF) PSRR (Gamma Buffer) 20137904 20137920 LM8207 www.national.com9

Typical Performance CharacteristicsAt TJ = 25˚C, VDD = 16V, V SS = 0V. Unless otherwise specified. (Continued) Supply Current vs. Supply Voltage Voltage Reference vs. Output Current 20137939 20137940 Voltage Reference vs. Supply Voltage Voltage Reference PSRR (Line Regulation) 20137936 20137945 LM8207 www.national.com 10

value is to combine two resistors in series. FIGURE 9. Typical TFT Display Application Diagram Using the LM8207

middle of the gamma voltage range. supplying a common voltage to the back plate of the display. tied to the input voltage range value. FIGURE 11. VCOM Buffer

FIGURE 12. LM8207 Configuration

Application Section (Continued) MAXIMUM POWER DISSIPATION The maximum power dissipation in the LM8207 TSSOP package depends on the ambient temperature and the in- crease of the junction temperature of the die. Exceeding the maximum temperature will damage the part. (See the Abso- lute Maximum Ratings table on page 2 of the datasheet.) The V COM buffer of the LM8207 is designed for use in pulsed conditions. Driving a continuous current of several hundred mA to a load will damage the part due to the high power consumption of the output stage of the V COM buffer. The maximum operating temperature can be calculated us- ing this formula: TJ =T A + θJA xP DISSIPATION (3) Where TA = Ambient temperature θJA = Thermal resistance of package (See Operating Ratings table on page 2) (84˚C/W) P DISSIPATION = Total power dissipation of the LM8207 Example: The estimated power consumption of the LM8207 in a steady state situation with no load is: VDD = 16V IDD = 6 mA (all buffers within normal operating range) OUT_VREF = 14.4V ILOAD =3m A VDD xI DD =1 6Vx6m A (VDD - OUT_VREF)xI LOAD = (16 V – 14.4 V )x3m A =4 . 8m W Total steady state power dissipation = 100.8 mW For an ambient temperature T A of 40˚C and a dissipated power of 100.8 mW, the junction temperature TJ will be 49˚C. This will not exceed the maximum operating temperature. Two issues are not considered in the calculation:  Continuous power dissipation of the gamma buffers. This is load dependent, and can be calculated using the volt- age drop over the output stage times the output current: P=( V DD-VGMAx)xI OUT for current sourcing P=( V GMAx)xI OUT for current sinking  Pulsed power dissipation of the buffers. The RMS value of this pulsed current depends on the magnitude of the current fluctuations and the duty cycle. This can majorly contribute to the total power dissipation. Example: When the LM8207 is in steady state biasing, the V buffer is considered at three various load conditions: IOUTRMS (mA) VCOM Level (V) Dissipation (mW) Temp Rise TJ 10 8 80 7 56 50 8 400 35 83 100 8 800 67 107 When I OUTRMS = 100 mA, the package (T J) will exceed the Operating Temperature! EVALUATION BOARD For testing purposes an evaluation board is available. It is intended to evaluate the following functions:  The Voltage Reference is fully adjustable within the op- erating range. For optimal output voltage ranges, user defined resistors can be trimmed by using two resistors in series.  The Gamma correction curve is user defined using exter- nal resistors. Each optimal value can be achieved by using two series resistors for fine-tuning.  The V COM node input voltage can be achieved using National Semiconductor’s LM8342 programmable VCOM calibrator, or using an external supply.  For testing, an additional dummy load can be connected to all outputs of the gamma buffers. LM8207 www.national.com19

FIGURE 13. Schematic LM8207 Evaluation Board

Physical Dimensions inches (millimeters) unless otherwise noted 48-Pin TSSOP National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. For the most current product information visit us at www.national.com. LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. BANNED SUBSTANCE COMPLIANCE National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2. Leadfree products are RoHS compliant. National Semiconductor Americas Customer Support Center Email: new.feedback@nsc.com Tel: 1-800-272-9959 National Semiconductor Europe Customer Support Center Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 National Semiconductor Asia Pacific Customer Support Center Email: ap.support@nsc.com National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507 Email: jpn.feedback@nsc.com Tel: 81-3-5639-7560 www.national.com LM8207 TFT 18 Gamma Buffer + VCOM Driver + Voltage Reference