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LM809,LM810 www.ti.com SNVS052D –SEPTEMBER 1999–REVISED MAY 2013 LM809/LM8103-PinMicroprocessorResetCircuits Check forSamples: LM809 ,LM810 1FEATURES DESCRIPTION The LM809/810 microprocessorsupervisorycircuits 2• PreciseMonitoringof3V,3.3V,and 5V Supply can be used to monitor the power suppliesinVoltages microprocessorand digitalsystems.They providea• SuperiorUpgrade toMAX809/810 resettothemicroprocessorduringpower-up,power-
- FullySpecifiedOver Temperature down and brown-outconditions.
- 140ms Min.Power-On Reset Pulse Width, The functionoftheLM809/810 istomonitortheVCC 240ms Typical supplyvoltage,and asserta resetsignalwhenever thisvoltagedeclinesbelow the factory-programmed– Active-LowRESET Output (LM809) resetthreshold.The resetsignalremainsassertedfor– Active-HighRESET Output (LM810) 240ms afterVCC risesabove the threshold.The
- Ensured RESET Output ValidforVCC ≥1V LM809 has an active-lowRESET output,whilethe LM810 has an active-highRESET output.• Low Supply Current,15µA Typ
- Power Supply TransientImmunity Seven standardresetvoltageoptionsare available, suitablefor monitoring5V, 3.3V, and 3V supply APPLICATIONS voltages.
- MicroprocessorSystems With a low supply currentof only 15µA, the LM809/810 are idealforuse inportableequipment.• Computers The LM809/LM810 are availableinthe3-pinSOT-23• Controllers package and inthe6-LeadSON package.
- IntelligentInstruments
- Portable/Battery-PoweredEquipment
- Automotive Connection Diagrams TypicalApplicationCircuit Top View Top View Figure1.3-Lead Figure2.6-Lead See Package Number See Package Number DBZ NGB0006A ()areforLM810 ()areforLM810 Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1999–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
LM809,LM810 SNVS052D –SEPTEMBER 1999–REVISED MAY 2013 www.ti.com Pin Descriptions PIN NAME FUNCTION SON SOT-23 1 1 GND Ground reference Active-lowoutput.RESET remainslowwhileVCC isbelowtheresetthreshold,and forRESET (LM809) 240ms afterVCC risesabove theresetthreshold. 3 2 Active-highoutput.RESET remainshighwhileVCC isbelowtheresetthreshold,and forRESET (LM810) 240ms afterVCC risesabove theresetthreshold. 5 3 VCC SupplyVoltage(+5V,+3.3V,or+3.0V) These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1)(2) VCC −0.3Vto6.0V RESET, RESET −0.3Vto(VCC + 0.3V) InputCurrent,VCC Pin 20mA OutputCurrent,RESET, RESET Pin 20mA Rate ofRise,VCC 100V/µs ESD Rating(3) 2kV ContinuousPower Dissipation(4) 320mW ThermalResistance,θJA SON-6 152°C/W SOT-23-3 326°C/W AmbientTemperatureRange −40°C to+105°C Maximum JunctionTemperature 125°C StorageTemperatureRange −65°C to+160°C Lead Temperature(soldering,10sec) +300°C (1) AbsoluteMaximum Ratingsarelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsareconditionsunderwhichthe deviceoperatescorrectly.Operatingratingsdo notimplyensuredperformancelimits.Forspecifiedperformancelimitsand associated testconditions,see theElectricalCharacteristics. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) The human body model isa 100pF capacitordischargedthrougha 1.5kΩ resistorintoeach pin. (4) Atelevatedtemperatures,devicesmust be deratedbased on package thermalresistance.The deviceintheSOT-23-3 package must be deratedat4mW/ °C atambienttemperaturesabove 70°C. The devicehas internalthermalprotection.
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LM809,LM810 www.ti.com SNVS052D –SEPTEMBER 1999–REVISED MAY 2013 ElectricalCharacteristics VCC = fullrange,TA = −40°C to+105°C, unlessotherwisenoted.TypicalvaluesareatTA = +25°C, VCC = 5V for Parameter TestConditions Min Typ Max Units TA = 0°C to+70°C 1.0 5.5 VCC Range V TA = −40°C to VCC <5.5V,LM8_ _ - 18 60 VCC <3.6V,LM8_ _ - 15 50 ICC SupplyCurrent µA TA = +85°C to VCC <5.5V,LM8_ _ - 100 VCC <3.6V,LM8_ _ - 100 TA = +25°C 4.56 4.63 4.70 TA = +85°C to+105°C 4.40 4.86 TA = +25°C 4.31 4.38 4.45 TA = +85°C to+105°C 4.16 4.56 TA = +25°C 3.93 4.00 4.06 TA = +85°C to+105°C 3.80 4.20 TA = +25°C 3.04 3.08 3.11 VTH ResetThreshold(2) LM8_ _ -3.08 TA = −40°C to+85°C 3.00 3.15 V TA = +85°C to+105°C 2.92 3.23 TA = +25°C 2.89 2.93 2.96 TA = +85°C to+105°C 2.78 3.08 TA = +25°C 2.59 2.63 2.66 TA = +85°C to+105°C 2.50 2.76 TA = +25°C 2.41 2.45 2.49 TA = +85°C to+105°C 2.33 2.57 ResetThresholdTemperature 30 ppm/°CCoefficient VCC toResetDelay(2) VCC = VTH to(VTH − 100mV) 20 µs TA = −40°C to+85°C 140 240 560 ResetActiveTimeoutPeriod ms TA = +85°C to+105°C 100 840 VCC = VTH min,ISINK = 1.2mA,LM809- 0.3 VCC > 1.0V,ISINK = 50µA 0.3 VCC > VTH max, ISOURCE = 500µA,LM809- 0.8VCC 4.63/4.38/4.00 (1) Productiontestingdone atTA = +25°C, overtemperaturelimitsspecifiedby designonly. (2) RESET OutputforLM809, RESET outputforLM810. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM809 LM810
LM809,LM810 SNVS052D –SEPTEMBER 1999–REVISED MAY 2013 www.ti.com ElectricalCharacteristics(continued) VCC = fullrange,TA = −40°C to+105°C, unlessotherwisenoted.TypicalvaluesareatTA = +25°C, VCC = 5V for Parameter TestConditions Min Typ Max Units VCC = VTH max, ISINK = 1.2mA,LM810- 0.3 4.63/4.38/4.00 VOH RESET OutputVoltageHigh 0.8VCC V1.8V< VCC < VTH min,ISOURCE = 150μA(LM810)
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LM809,LM810 www.ti.com SNVS052D –SEPTEMBER 1999–REVISED MAY 2013 TypicalPerformance Characteristics Supply Currentvs Temperature Supply Currentvs Temperature Figure3. Figure4. Power-Down Reset Delay vs Temp Power-Down Reset Delay vs Temperature Figure5. Figure6. Power-Up Reset Timeout vs Temperature NormalizedReset Thresholdvs Temperature Figure7. Figure8. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM809 LM810
LM809,LM810 SNVS052D –SEPTEMBER 1999–REVISED MAY 2013 www.ti.com APPLICATIONS INFORMATION BenefitsofPrecisionReset Thresholds A microprocessorsupplysupervisormust providea resetoutputwithina predictablerangeofthesupplyvoltage. A common thresholdrange isbetween 5% and 10% below thenominalsupplyvoltage.The 4.63V and 3.08V optionsoftheLM809/810 use highlyaccuratecircuitrytoensurethattheresetthresholdoccursonlywithinthis range (for5V and 3.3V supplies).The othervoltageoptionshave the same tighttoleranceto ensure a reset signalforothernarrowmonitorranges.See Table1 forexamples ofhow thestandardresetthresholdsapplyto 3V,3.3V,and 5V nominalsupplyvoltages. Table1.Reset ThresholdsRelatedtoCommon Supply Voltages Reset Threshold 3.0V 3.3V 5.0V 4.63± 3% 90 -95% 4.38± 3% 85 -90% 4.00± 3% 78 -82% 3.08± 3% 90 -95% 2.93± 3% 86 -90% Ensuring a ValidReset Output Down toVCC = 0V When VCC fallsbelow 1V, the LM809 RESET outputno longersinkscurrent.A high-impedanceCMOS logic inputconnectedto RESET can thereforedriftto undeterminedvoltages.To preventthissituation,a 100kΩ resistorshouldbe connectedfromtheRESET outputtoground,as shown inFigure9. A 100kΩ pull-upresistortoVCC isalsorecommended fortheLM810, ifRESET isrequiredtoremainvalidforVCC < 1V. Figure9. RESET ValidtoVCC = Ground Circuit Negative-GoingVCC Transients The LM809/810 arerelativelyimmune toshortnegative-goingtransientsorglitcheson VCC .Figure10 shows the maximum pulsewidtha negative-goingVCC transientcan have withoutcausinga resetpulse.Ingeneral,as the magnitude of the transientincreases,going furtherbelow the threshold,the maximum allowablepulsewidth decreases.Typically,forthe4.63V and 4.38V versionoftheLM809/810,a VCC transientthatgoes 100mV below theresetthresholdand lasts20µs or lesswillnotcause a resetpulse.A 0.1µF bypass capacitormounted as closeas possibletotheVCC pinwillprovideadditionaltransientrejection.
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LM809,LM810 www.ti.com SNVS052D –SEPTEMBER 1999–REVISED MAY 2013 Figure10. Maximum TransientDurationwithoutCausing a Reset Pulse vs.Reset Comparator Overdrive InterfacingtoµPs withBidirectionalReset Pins Microprocessorswithbidirectionalresetpins,such as the Motorola68HC11 series,can be connectedto the LM809 RESET output.To ensurea correctoutputon theLM809 even when themicroprocessorresetpinisin theoppositestate,connecta 4.7kΩ resistorbetween theLM809 RESET outputand theµP resetpin,as shown inFigure11.BuffertheLM809 RESET outputtoothersystemcomponents. Figure11. InterfacingtoMicroprocessorswithBidirectionalReset I/O SON Mounting The SON package requiresspecialmountingtechniqueswhich are detailedinTexas InstrumentsApplication Note AN-1187. Referringto the sectionPCB Design Recommendations, itshouldbe noted thatthe pad style whichshouldbe used withtheSON package istheNSMD (non-soldermask defined)type. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM809 LM810
LM809,LM810 SNVS052D –SEPTEMBER 1999–REVISED MAY 2013 www.ti.com
REVISION HISTORY
Changes from RevisionC (May 2013)toRevisionD Page
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www.ti.com 1-Nov-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM809M3-2.63 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 105 S3B LM809M3-2.63/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S3B LM809M3-2.93 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 105 S4B LM809M3-2.93/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S4B LM809M3-3.08 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 105 S5B LM809M3-3.08/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S5B LM809M3-4.38/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S7B LM809M3-4.63 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 105 S8B LM809M3-4.63/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S8B LM809M3X-2.63/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S3B LM809M3X-2.93/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S4B LM809M3X-3.08/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S5B LM809M3X-4.38/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM S7B LM809M3X-4.63/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S8B LM810M3-4.63 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 105 SEB LM810M3-4.63/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 SEB LM810M3X-4.63/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 SEB (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
www.ti.com 1-Nov-2013 Addendum-Page 2 PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM809M3-2.63 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-2.63/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-2.93 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-2.93/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-3.08 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-3.08/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-4.38/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-4.63 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-4.63/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3X-2.63/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM809M3X-2.93/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM809M3X-3.08/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM809M3X-4.38/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM809M3X-4.63/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM810M3-4.63 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM810M3-4.63/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM810M3X-4.63/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 2
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