LM809 TI1 | Alldatasheet
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µP Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM809,LM810 SNVS052E –SEPTEMBER 1999–REVISED APRIL 2016 LM809/LM8103-PinMicroprocessorResetCircuits
1 Features
1• Precision Monitoring of Supply Voltages – Available Threshold Options:
- Superior Upgrade to MAX809 and MAX810
- Fully Specified Over Temperature
- 140-ms Minimum Power-On Reset Pulse Width, 240-ms Typical – Active-Low RESET Output (LM809) – Active-High RESET Output (LM810)
- Ensured RESET Output Valid for VCC ≥ 1 V
- Low Supply Current, 15-µA Typical
- Power Supply Transient Immunity
2 Applications
- Factory Automation
- Building Automation
- Programmable Logic Control
- Renewable Energy
- Microprocessor Systems
- Computers
- Controllers
- Intelligent Instruments
- Portable/Battery-Powered Equipment
- Automotive
3 Description
The LM809 and LM810 microprocessors supervisory circuits can be used to monitor the power supplies in microprocessor and digital systems. They provide a reset to the microprocessor during power-up, power- down and brown-out conditions. The function of the LM809 and LM810 are to monitor the VCC supply voltage, and assert a reset signal whenever this voltage declines below the factory- programmed reset threshold. The reset signal remains asserted for 240 ms after VCC rises above the threshold. The LM809 has an active-low RESET output, while the LM810 has an active-high RESET output. Seven standard reset voltage options are available, suitable for monitoring 5-V, 3.3-V, and 3-V supply voltages. With a low supply current of only 15 µA, the LM809 and LM810 are ideal for use in portable equipment. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) LM809, LM810 SOT-23 (3) 2.92 mm × 1.30 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application for Microprocessor Reset Circuit
LM809,LM810 SNVS052E –SEPTEMBER 1999–REVISED APRIL 2016 www.ti.com Product Folder Links: LM809 LM810 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Table of Contents
12 Mechanical, Packaging, and Orderable
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (May 2013) to Revision E Page
- Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
3 V CC
3 V CC/UNI2009
LM809,LM810 www.ti.com SNVS052E –SEPTEMBER 1999–REVISED APRIL 2016 Product Folder Links: LM809 LM810 Submit Documentation FeedbackCopyright © 1999–2016, Texas Instruments Incorporated
5 Pin Configuration and Functions
NO. LM809 LM810 RESET 2 — O Active-low output. RESET remains low while VCC is below the reset threshold, and for 240 ms after VCC rises above the reset threshold. RESET — 2 O Active-high output. RESET remains high while VCC is below the reset threshold, and for 240 ms after VCC rises above the reset threshold. VCC 3 3 I Supply voltage GND 1 1 — Ground reference
LM809,LM810 SNVS052E –SEPTEMBER 1999–REVISED APRIL 2016 www.ti.com Product Folder Links: LM809 LM810 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.
6 Specifications
6.1 Absolute Maximum Ratings
see (1)(2) MIN MAX UNIT Input supply voltage VCC –0.3 6 V Output voltage RESET, RESET –0.3 VCC + 0.3 V Input current VCC 20 mA Output current RESET, RESET 20 mA Rate of rise VCC 100 V/µs Continuous power dissipation 320 mW Lead temperature (soldering, 10 s) 300 °C Ambient temperature range, TA –40 105 °C Maximum junction temperature, TJ(MAX) 125 °C Storage temperature, Tstg –65 160 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. Pins listed as ±200 V may actually have higher performance.
6.2 ESD Ratings
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±200
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VCC Input voltage range TA = 0°C to 70°C 1.0 5.5 V TA = –40°C to 105°C 1.2 5.5 ICC Supply Current VCC < 5.5 V, TA = –40°C to 85°C 18 60 µA TA = 85°C to 105°C 100 VCC < 3.6 V, TA = –40°C to 85°C 15 50 TA = 85°C to 105°C 100 (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
6.4 Thermal Information
THERMAL METRIC(1) LM809, LM810 UNITDBZ (SOT-23)
3 PINS
RθJA Junction-to-ambient thermal resistance 252.0 °C/W RθJC(top) Junction-to-case (top) thermal resistance 113.3 °C/W RθJB Junction-to-board thermal resistance 53.5 °C/W ψJT Junction-to-top characterization parameter 9.9 °C/W ψJB Junction-to-board characterization parameter 52.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W
LM809,LM810 www.ti.com SNVS052E –SEPTEMBER 1999–REVISED APRIL 2016 Product Folder Links: LM809 LM810 Submit Documentation FeedbackCopyright © 1999–2016, Texas Instruments Incorporated (1) Production testing done at TA = 25°C, over temperature limits specified by design only. (2) RESET Output for LM809, RESET output for LM810.
6.5 Electrical Characteristics
VCC = full range, TA = –40°C to 105°C, unless otherwise noted. Typical values are at TA = 25°C, VCC = 5 V for 4.63, 4.38, and PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VTH Reset Threshold(2) LM8xx: 4.63 V TA = 25°C 4.56 4.63 4.70 V TA = –40°C to 85°C 4.50 4.75 TA = 85°C to 105°C 4.40 4.86 LM8xx: 4.38 V TA = 25°C 4.31 4.38 4.45 TA = –40°C to 85°C 4.25 4.50 TA = 85°C to 105°C 4.16 4.56 LM8xx: 4.00 V TA = 25°C 3.93 4.00 4.06 TA = –40°C to 85°C 3.89 4.10 TA = 85°C to 105°C 3.80 4.20 LM8xx: 3.08 V TA = 25°C 3.04 3.08 3.11 TA = –40°C to 85°C 3.00 3.15 TA = 85°C to 105°C 2.92 3.23 LM8xx: 2.93 V TA = 25°C 2.89 2.93 2.96 TA = –40°C to 85°C 2.85 3.00 TA = 85°C to 105°C 2.78 3.08 LM8xx: 2.63 V TA = 25°C 2.59 2.63 2.66 TA = –40°C to 85°C 2.55 2.70 TA = 85°C to 105°C 2.50 2.76 LM8xx: 2.45 V TA = 25°C 2.41 2.45 2.49 TA = –40°C to 85°C 2.38 2.52 TA = 85°C to 105°C 2.33 2.57 Reset Threshold Temperature Coefficient 30 ppm/°C VCC to Reset Delay(2) VCC = VTH to (VTH – 100 mV) 20 µs Reset Active Timeout Period TA = –40°C to 85°C 140 240 560 ms TA = 85°C to 105°C 100 840 VOL RESET Output Voltage Low (LM809) V VCC > 1 V, ISINK = 50 µA 0.3 RESET Output Voltage Low (LM810) VOH RESET Output Voltage High (LM809) VVCC > VTH(max), ISOURCE = 800 µA, LM809: 4.63, 4.38, 4.00 VCC – 1.5 RESET Output Voltage High (LM810) 1.8 V < VCC < VTH(min), ISOURCE = 150 μA 0.8 × VCC
6.6 Typical Characteristics
Figure 1. Supply Current vs Temperature Figure 2. Supply Current vs Temperature Figure 3. Power-Down Reset Delay vs Temp Figure 4. Power-Down Reset Delay vs Temperature Figure 5. Power-Up Reset Timeout vs Temperature Figure 6. Normalized Reset Threshold vs Temperature
7 Detailed Description
7.1 Overview
provide precision monitoring of supply voltages.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Benefits of Precision Reset Thresholds
A microprocessor supply supervisor must provide a reset output within a predictable range of the supply voltage. apply to 3-V, 3.3-V, and 5-V nominal supply voltages. Table 1. Reset Thresholds Related to Common Supply Voltages
7.3.1.1 Ensuring a Valid Reset Output Down to VCC = 0 V
resistor should be connected from the RESET output to ground, as shown in Figure 7. Figure 7. RESET Valid to VCC = Ground Circuit
7.3.1.2 Negative-Going VCC Transients
capacitor mounted as close as possible to the VCC pin will provide additional transient rejection. Figure 8. Maximum Transient Duration without Causing a Reset Pulse vs Reset Comparator Overdrive
7.3.1.3 Interfacing to µPs with Bidirectional Reset Pins
in Figure 9. Buffer the LM809 RESET output to other system components. Figure 9. Interfacing to Microprocessors with Bidirectional Reset I/O
7.4 Device Functional Modes
7.4.1 VCC Supply Voltage Low
active-low RESET output is low. For LM810, the active-high RESET output is high.
7.4.2 VCC Supply Voltage High
the active-low RESET output rises high. For LM810, the active-high RESET output drops low.
8 Application and Implementation
validate and test their design implementation to confirm system functionality.
8.1 Application Information
of only 15 µA, the LM809 and LM810 are ideal for use in portable equipment.
8.2 Typical Application
Figure 10. Microprocessor RESET Circuit
8.2.1 Design Requirements
For this design example, use the parameters listed in Table 2 as the input parameters. Table 2. Design Parameters
8.2.2 Detailed Design Procedure
highest expected input voltage.
8.2.3 Application Curve
Figure 11. Reset Active Timeout
9 Power Supply Recommendations
taken. An input capacitor is recommended to avoid false reset output triggers due to noise.
10 Layout
10.1 Layout Guidelines
Place the input capacitor as close as possible to the IC.
10.2 Layout Example
Figure 12. Layout Example
11 Device and Documentation Support
11.1 Related Links
resources, tools and software, and quick access to sample or buy. Table 3. Related Links
11.2 Community Resources
solve problems with fellow engineers. contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
www.ti.com 3-Nov-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM809M3-2.63 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 105 S3B LM809M3-2.63/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S3B LM809M3-2.93 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 105 S4B LM809M3-2.93/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S4B LM809M3-3.08 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 105 S5B LM809M3-3.08/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S5B LM809M3-4.38/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S7B LM809M3-4.63/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S8B LM809M3X-2.63/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S3B LM809M3X-2.93/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S4B LM809M3X-3.08/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S5B LM809M3X-4.38/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM S7B LM809M3X-4.63/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S8B LM810M3-4.63 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 105 SEB LM810M3-4.63/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 SEB LM810M3X-4.63/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 SEB (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
www.ti.com 3-Nov-2015 Addendum-Page 2 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 3-Nov-2015 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM809M3-2.63 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-2.63/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-2.93 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-2.93/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-3.08 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-3.08/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-4.38/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-4.63/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3X-2.63/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM809M3X-2.93/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM809M3X-3.08/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM809M3X-4.38/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM809M3X-4.63/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM810M3-4.63 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM810M3-4.63/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM810M3X-4.63/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 3-Nov-2015 Pack Materials-Page 2
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