LM79L TI | Alldatasheet
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- Easily Compensated with a Small 0.1μF Output using the latest computer techniques for optimizing the packaged IC thermal/electrical performance. TheCapacitor LM79LXXAC series, when combined with a minimum• Internal Short-Circuit, Thermal and Safe output capacitor of 0.1μF, exhibits an excellentOperating Area Protection transient response, a maximum line regulation of
- Easily Adjustable to Higher Output Voltages 0.07% VO/V, and a maximum load regulation of 0.01% VO/mA.• Maximum Line Regulation Less than 0.07% VOUT/V The LM79LXXAC series also includes, as self-
- Maximum Load Regulation Less than 0.01% protection circuitry: safe operating area circuitry for output transistor power dissipation limiting, aVOUT/mA temperature independent short circuit current limit for• See AN-1112 (SNVA009) for DSBGA peak output current limiting, and a thermal shutdownConsiderations circuit to prevent excessive junction temperature. Although designed primarily as fixed voltage regulators, these devices may be combined with simple external circuitry for boosted and/or adjustable voltages and currents. The LM79LXXAC series is available in the 3-lead TO package, the 8-lead SOIC package, and the 6-Bump DSBGA package. For output voltages other than the pre-set -5V, -12V and -15V, the LM137L series provides an adjustable output voltage range from -1.2V to -47V. Typical Applications *Required if the regulator is located far from the power supply filter. A 1μF aluminum electrolytic may be substituted. −V0 = −5V − (5V/R1 + IQ) •R2, **Required for stability. A 1μF aluminum electrolytic may be 5V/R1 > 3 IQ substituted.
Figure 1. Fixed Output Regulator Figure 2. Adjustable Output Regulator Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2All trademarks are the property of their respective owners. necessarily include testing of all parameters.
during storage or handling to prevent electrostatic damage to the MOS gates. Pins labeled 'NC' on LM79LXXACM 8-Lead SOIC (pin 4 and pin 8) are Open, no internal connection. Figure 3. 8-Lead SOIC Narrow (D) Figure 4. 3–Lead TO-226 (LP) Figure 5. 6-Bump DSBGA
2 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated
LM79L05, LM79L12, LM79L12AC LM79L15, LM79L15AC www.ti.com SNOSBR8K –JULY 1999–REVISED APRIL 2013 Absolute Maximum Ratings(1)(2) Input Voltage Internal Power Dissipation (3) Internally Limited Operating Temperature Range 0°C to +70°C Maximum Junction Temperature +125°C Storage Temperature Range −55°C to +150°C Lead Temperature (Soldering, 10 sec.) 260°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) Thermal resistance of TO-226 (LP) package is 60°C/W θJC, 232°C/W θJA at still air, and 88°C/W at 400 ft/min of air. The θJA of the LM78LXX in the 6-Bump DSBGA package is 114°C/W when mounted on a 4-Layer JEDEC test board (JESD 51-7). The θJA of the LM78LXX in the SOIC-8 (D) package is 180°C/W in still air. The maximum junction temperature shall not exceed 125°C on electrical parameters. Electrical Characteristics (1) TA = 0°C to +70°C unless otherwise noted. Output Voltage −5V −12V −15V Input Voltage (unless otherwise noted) −10V −17V −20V Symbol Parameter Conditions Min Typ Max Min Typ Max Min Typ Max Units OutputVO VMIN ≤ VIN ≤ VMAX (−20 ≤ VIN ≤ −7.5) (−27 ≤ VIN ≤ −14.8) (−30 ≤ VIN ≤ −18) VVoltage VMIN ≤ VIN ≤ VMAX (−20 ≤ VIN ≤ −7) (−27 ≤ VIN ≤ −14.5) (−30 ≤ VIN ≤ −17.5) TJ = 25°C, IO = 100mA 60 45 45 mV VMIN ≤ VIN ≤ VMAX (−20 ≤ VIN ≤ −7.3) (−27 ≤ VIN ≤ −14.6) (−30 ≤ VIN ≤ −17.7) VLineΔVO Regulation TJ = 25°C, IO = 40mA 60 45 45 mV VMIN ≤ VIN ≤ VMAX (−20 ≤ VIN ≤ −7) (−27 ≤ VIN ≤ −14.5) (−30 ≤ VIN ≤ −17.5) V TJ = 25°C 50 100 125 mVLoadΔVO Regulation 1mA ≤ IO ≤ 100mA Long Term mV/khΔVO IO = 100mA 20 48 60Stability rs QuiescentIQ IO = 100mA 2 6 2 6 2 6 mACurrent 1mA ≤ IO ≤ 100mA 0.3 0.3 0.3 Quiescent 1mA ≤ IO ≤ 40mA 0.1 0.1 0.1 mA ΔIQ Current IO = 100mA 0.25 0.25 0.25 mAChange VMIN ≤ VIN ≤ VMAX (−20 ≤ VIN ≤ −7.5) (−27 ≤ VIN ≤ −14.8) (−30 ≤ VIN ≤ −18) V Output Noise TJ = 25°C, IO = 100mAVn 40 96 120 μVVoltage f = 10Hz − 10kHz Ripple TJ = 25°C, IO = 100mAΔVIN/ΔVO 50 52 50 dBRejection f = 120Hz Input Voltage TJ = 25°C, IO = 100mA −7.3 −14.6 −17.7 VRequired to Maintain Line IO = 40mA −7.0 −14.5 −17.5 VRegulation (1) To ensure constant junction temperature, low duty cycle pulse testing is used. Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM79L05 LM79L12 LM79L12AC LM79L15 LM79L15AC
Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11.
4 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated
Figure 12. Figure 13.
Figure 14. ±15V, 100mA Dual Power Supply Figure 15. −5V Schematic Diagram
6 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated
Figure 16. −12V and −15V Schematic Diagram
LM79L05, LM79L12, LM79L12AC LM79L15, LM79L15AC SNOSBR8K –JULY 1999–REVISED APRIL 2013 www.ti.com
REVISION HISTORY
Changes from Revision J (April 2013) to Revision K Page
8 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM79L05 LM79L12 LM79L12AC LM79L15 LM79L15AC
www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM79L05ACM/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM79L 05ACM LM79L05ACM/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM79L 05ACM LM79L05ACMX/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM79L 05ACM LM79L05ACMX/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM79L 05ACM LM79L05ACTL/NOPB Active Production DSBGA (YZR) | 6 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM 0 to 70 P B LM79L05ACTL/NOPB.B Active Production DSBGA (YZR) | 6 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM 0 to 70 P B LM79L05ACTLX/NOPB Active Production DSBGA (YZR) | 6 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM 0 to 70 P B LM79L05ACTLX/NOPB.B Active Production DSBGA (YZR) | 6 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM 0 to 70 P B LM79L05ACZ/LFT1 Active Production TO-92 (LP) | 3 2000 | LARGE T&R Yes SN N/A for Pkg Type - 320L 79L05 LM79L05ACZ/LFT1.B Active Production TO-92 (LP) | 3 2000 | LARGE T&R Yes SN N/A for Pkg Type 0 to 70 320L 79L05 LM79L05ACZ/NOPB Active Production TO-92 (LP) | 3 1800 | BULK Yes SN N/A for Pkg Type 0 to 70 320L 79L05 LM79L05ACZ/NOPB.B Active Production TO-92 (LP) | 3 1800 | BULK Yes SN N/A for Pkg Type 0 to 70 320L 79L05 LM79L12ACM/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM79L 12ACM LM79L12ACM/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM79L 12ACM LM79L12ACMX/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM79L 12ACM LM79L12ACMX/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM79L 12ACM Addendum-Page 1
www.ti.com 23-May-2025 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM79L12ACZ/LFT4 Active Production TO-92 (LP) | 3 2000 | LARGE T&R Yes SN N/A for Pkg Type - 320L 79L12 LM79L12ACZ/LFT4.B Active Production TO-92 (LP) | 3 2000 | LARGE T&R Yes SN N/A for Pkg Type 0 to 70 320L 79L12 LM79L12ACZ/NOPB Active Production TO-92 (LP) | 3 1800 | BULK Yes SN N/A for Pkg Type 0 to 70 320L 79L12 LM79L12ACZ/NOPB.B Active Production TO-92 (LP) | 3 1800 | BULK Yes SN N/A for Pkg Type 0 to 70 320L 79L12 LM79L15ACM/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM79L 15ACM LM79L15ACM/NOPB.B Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 LM79L 15ACM LM79L15ACMX/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM79L 15ACM LM79L15ACMX/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 LM79L 15ACM (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Addendum-Page 2
www.ti.com 23-May-2025 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM79L05ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM79L05ACTL/NOPB DSBGA YZR 6 250 208.0 191.0 35.0 LM79L05ACTLX/NOPB DSBGA YZR 6 3000 208.0 191.0 35.0 LM79L12ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM79L15ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) LM79L05ACM/NOPB D SOIC 8 95 495 8 4064 3.05 LM79L05ACM/NOPB.B D SOIC 8 95 495 8 4064 3.05 LM79L12ACM/NOPB D SOIC 8 95 495 8 4064 3.05 LM79L12ACM/NOPB.B D SOIC 8 95 495 8 4064 3.05 LM79L15ACM/NOPB D SOIC 8 95 495 8 4064 3.05 LM79L15ACM/NOPB.B D SOIC 8 95 495 8 4064 3.05 Pack Materials-Page 3
www.ti.com TLA06XXX (Rev C) 0.600±0.075 D E NOTES: A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994. B. This drawing is subject to change without notice. 4215044/A 12/12 D: Max = E: Max = 1.845 mm, Min = 1.057 mm, Min = 1.784 mm 0.996 mm
www.ti.com PACKAGE OUTLINE C .228-.244 TYP [5.80-6.19] .069 MAX [1.75] 6X .050 [1.27] 8X .012-.020 [0.31-0.51] .150 [3.81] .005-.010 TYP [0.13-0.25] 0 - 8 .004-.010 [0.11-0.25] .010 [0.25].016-.050 [0.41-1.27] 4X (0 -15 ) A .189-.197 [4.81-5.00] NOTE 3 B .150-.157 [3.81-3.98] NOTE 4 4X (0 -15 ) (.041) [1.04] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. 1 8 .010 [0.25] C A B PIN 1 ID AREA SEATING PLANE .004 [0.1] C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800
www.ti.com EXAMPLE BOARD LAYOUT .0028 MAX [0.07] ALL AROUND .0028 MIN [0.07] ALL AROUND (.213) [5.4] 6X (.050 ) [1.27] 8X (.061 ) [1.55] 8X (.024) [0.6] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM 4 5 SEE DETAILS SYMM
www.ti.com EXAMPLE STENCIL DESIGN 8X (.061 ) [1.55] 8X (.024) [0.6] 6X (.050 ) [1.27] (.213) [5.4] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X SYMM SYMM 4 5
www.ti.com PACKAGE OUTLINE 3X 2.67 2.03 5.21 4.44 5.34 4.32
12.7 MIN
2X 1.27 0.13 3X 0.55 0.38 4.19 3.17
3.43 MIN
3X 0.43 0.35 (2.54) NOTE 3 2X 2.9 2.4
4 MAX
0.076 MAX
(0.51) TYP (1.5) TYP TO-92 - 5.34 mm max heightLP0003A TO-92 4215214/C 04/2025 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Lead dimensions are not controlled within this area. 4. Reference JEDEC TO-226, variation AA. 5. Shipping method: a. Straight lead option available in bulk pack only. b. Formed lead option available in tape and reel or ammo pack. c. Specific products can be offered in limited combinations of shipping medium and lead options. d. Consult product folder for more information on available options. EJECTOR PIN OPTIONAL PLANE SEATING STRAIGHT LEAD OPTION 3 2 1 SCALE 1.200 FORMED LEAD OPTION OTHER DIMENSIONS IDENTICAL TO STRAIGHT LEAD OPTION SCALE 1.200
www.ti.com EXAMPLE BOARD LAYOUT
0.05 MAX
(1.07) (1.5) 2X (1.5) 2X (1.07) (1.27) (2.54) FULL R TYP ( 1.4)0.05 MAX ALL AROUND TYP (2.6) (5.2) (R0.05) TYP 3X ( 0.9) HOLE 2X ( 1.4) METAL 3X ( 0.85) HOLE (R0.05) TYP 4215214/C 04/2025 TO-92 - 5.34 mm max heightLP0003A TO-92 LAND PATTERN EXAMPLE FORMED LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING 1 2 3 LAND PATTERN EXAMPLE STRAIGHT LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X METAL TYP SOLDER MASK OPENING SOLDER MASK OPENING METAL 1 2 3
www.ti.com TAPE SPECIFICATIONS 19.0 17.5 13.7 11.7 11.0 8.5
0.5 MIN
3.7-4.3 TYP 9.75 8.50 2.9
2.4 TYP
6.75 5.95 13.0 12.4 (2.5) TYP 16.5 15.5 4215214/C 04/2025 TO-92 - 5.34 mm max heightLP0003A TO-92 FOR FORMED LEAD OPTION PACKAGE
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