LM68680-Q1 TI | Alldatasheet
Document overview
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Technical content
LM686x0-Q1 70V, 8A/6A/4A, Automotive Buck Converters Optimized for Safety-Relevant Applications
1 Features
- AEC-Q100 qualified for automotive applications: – Temperature grade 1: –40°C to +125°C, TA
- Functional Safety-Compliant – Developed for functional safety applications – Documentation available to aid ISO 26262 system design planned – Systematic capability up to ASIL D – Hardware capability up to ASIL C – Analog built-in-self-test at start-up – Redundant and fast (0.35μs) VOUT monitor – Excellent pin FMEA and pin spacing
- Wide input voltage range: 3V to 70V
- 1% accurate, VOUT from 0.8V to 60V
- Optimized for low EMI requirements – Facilitates CISPR 25 Class 5 compliance – Pin-configurable dual-random spread spectrum and slew-rate control reduce peak emissions – Enhanced HotRod™ QFN package with symmetrical pinout – Switching frequency from 300kHz to 2.2MHz – Pin-configurable AUTO or FPWM operation
- Low minimum on time: 36ns (typical) – Enables 36V to 3.3V conversion at 2.1MHz
- High-efficiency power conversion – > 95% peak efficiency, 12VIN to 5VOUT, 400kHz – No-load input current: 3.5µA
- High power density – Internal compensation, OCP, and TSD – 4.5mm × 4.5mm eQFN-26 with wettable flanks – ΘJA = 18°C/W (EVM)
- VIN to PGND pin clearance: 1.1mm
2 Applications
- Advanced Driver Assistance Systems (ADAS)
- Automotive infotainment and cluster
- Hybrid, electric, and powertrain systems
3 Description
The LM686x0-Q1 are a family of stackable, automotive buck converters designed for high efficiency, high power density, and ultra-low electromagnetic interference (EMI). The converters operate over a wide input voltage range of 3V to 70V simplifying input surge protection design. The low EMI operation is enabled with minimized loop inductance, internal bypass capacitors, pin-selectable SW node slew-rate control and dual-random spread spectrum (DRSS). The current-mode control architecture with 36ns minimum on-time allows high conversion ratios at high frequencies, easy loop compensation, fast transient response, and excellent load and line regulation. Up to two converters can be set up in an interleaved mode (paralleled outputs) with accurate current sharing for supporting output current up to 16A. The LM686x0-Q1 buck converters are specifically intended for functional safety relevant applications. An array of safety features including ABIST at start-up, redundant and fast V OUT monitor, feedback path failure detection, redundant temperature sensor, thermal shutdown, and current limit significantly reduces residual failure-in-time (FIT). Device Information PART NUMBER(2) PACKAGE(1) OUTPUT CURRENT LM68680-Q1 RZY (WQFN-FCRLF, 26) LM68660-Q1 (3) 6A LM68640-Q1 (3) 4A (1) For more information, see Section 7. (2) See the Device Comparison Table. (3) Preview information (not Advance Information). VOUT SW BIAS VIN PGNDRT FB COUT LFVIN CIN RRT PG VSNS RPU1 BST COMP VCC CONFIG / CLKOUT EN / UVLO nFAULT CBST CVCC SGND RFB1 SS RFB1 RFB2 RFB2 RTEMP MODE / SYNC / TEMP RPU2 VCC DRSS / MODECOMM Typical Application Circuit L o a d ( A ) Efficiency (%) 0 1 2 3 4 5 6 7 8 6 0 6 5 7 0 7 5 8 0 8 5 9 0 9 5 1 0 0 V I N = 1 2 V V I N = 2 4 V V I N = 3 6 V V I N = 4 8 V Typical Efficiency VOUT = 5V, fSW = 400kHz ADVANCE INFORMATION LM68680-Q1 SNVSCW0 – OCTOBER 2024 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change without notice.
7 Mechanical, Packaging, and Orderable Information....6 LM68680-Q1 SNVSCW0 – OCTOBER 2024 www.ti.com
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4 Device Comparison Table
Orderable Part Number Input Voltage Rating Current Functional Safety Level-Shifters for Inverting Buck-Boost Topology LM65680RZYRQ1 70V 8A Capable No LM65660RZYRQ1(1) 70V 6A Capable No LM65640RZYRQ1(1) 70V 4A Capable No LM68680FRZYRQ1 70V 8A Compliant No LM68660FRZYRQ1(1) 70V 6A Compliant No LM68640FRZYRQ1(1) 70V 4A Compliant No LM68580FRZYRQ1(1) 42V 8A Compliant No LM68560FRZYRQ1(1) 42V 6A Compliant No LM67680RZYRQ1(1) 70V 8A Capable Yes LM67660RZYRQ1(1) 70V 6A Capable Yes LM67640RZYRQ1(1) 70V 4A Capable Yes (1) Preview information (not Advance Information). For more information, please contact Texas Instruments. www.ti.com LM68680-Q1 SNVSCW0 – OCTOBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: LM68680-Q1 ADVANCE INFORMATION
5 Device and Documentation Support
5.1 Development Support
For development support, see the following:
- For TI's reference design library, visit TI Designs
- TI Designs: – ADAS 8-Channel Sensor Fusion Hub Reference Design with Two 4-Gbps Quad Deserializers – Automotive EMI and Thermally Optimized Synchronous Buck Converter Reference Design – Automotive High Current, Wide VIN Synchronous Buck Controller Reference Design Featuring LM5141- – 25W Automotive Start-Stop Reference Design Operating at 2.2 MHz – Synchronous Buck Converter for Automotive Cluster Reference Design – Automotive Synchronous Buck With 3.3V @ 12.0A Reference Design – Automotive Synchronous Buck Reference Design – Automotive Wide VIN Front-end Reference Design for Digital Cockpit Processing Units
- Technical articles: – High-Density PCB Layout of DC/DC Converters – Synchronous Buck Controller Solutions Support Wide VIN Performance and Flexibility – How to Use Slew Rate for EMI Control
5.2 Documentation Support
5.2.1 Related Documentation
For related documentation, see the following:
- Application notes: – Texas Instruments, Improve High-current DC/DC Regulator Performance for Free with Optimized Power Stage Layout – Texas Instruments, AN-2162 Simple Success with Conducted EMI from DC-DC Converters – Texas Instruments, Multiphase Buck Design From Start to Finish.
- Analog design journal: – Texas Instruments, Reduce Buck Converter EMI and Voltage Stress by Minimizing Inductive Parasitics – Texas Instruments, Benefits of a Multiphase Buck Converter
- White papers: – Texas Instruments, An Overview of Conducted EMI Specifications for Power Supplies – Texas Instruments, An Overview of Radiated EMI Specifications for Power Supplies – Texas Instruments, Valuing Wide VIN, Low EMI Synchronous Buck Circuits for Cost-driven, Demanding
Applications
5.2.1.1 PCB Layout Resources
- Application notes: – Texas Instruments, Improve High-current DC/DC Regulator Performance for Free with Optimized Power Stage Layout – Texas Instruments, AN-1149 Layout Guidelines for Switching Power Supplies – Texas Instruments, AN-1229 Simple Switcher PCB Layout Guidelines – Texas Instruments, Low Radiated EMI Layout Made SIMPLE with LM4360x and LM4600x
- Seminars: – Texas Instruments, Constructing Your Power Supply – Layout Considerations
5.2.1.2 Thermal Design Resources
- Application notes: – Texas Instruments, AN-2020 Thermal Design by Insight, Not Hindsight – AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages – Texas Instruments, Semiconductor and IC Package Thermal Metrics LM68680-Q1 SNVSCW0 – OCTOBER 2024 www.ti.com
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– Texas Instruments, Thermal Design Made Simple with LM43603 and LM43602 – Texas Instruments, PowerPAD™Thermally Enhanced Package – Texas Instruments, PowerPAD Made Easy – Texas Instruments, Using New Thermal Metrics
5.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
5.4 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
5.5 Trademarks
HotRod™, PowerPAD™, and TI E2E™ are trademarks of Texas Instruments. All trademarks are the property of their respective owners.
5.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
5.7 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
6 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DATE REVISION NOTES October 2024 * Initial Release www.ti.com LM68680-Q1 SNVSCW0 – OCTOBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: LM68680-Q1 ADVANCE INFORMATION
7 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
7.1 Tape and Reel Information
Reel Width (W1) REEL DIMENSIONS W Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers Dimension designed to accommodate the component width TAPE DIMENSIONS B0 W A0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket Quadrants Sprocket Holes Q1 Q1Q2 Q2 Q3 Q3Q4 Q4 Reel Diameter User Direction of Feed Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PLM68680FRZYRQ1 VQFN- LM68680-Q1 SNVSCW0 – OCTOBER 2024 www.ti.com
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TAPE AND REEL BOX DIMENSIONS Width (mm) W L H Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) PLM68680FRZYRQ1 VQFN-FCRLF RZY 26 3000 367 367 35 www.ti.com LM68680-Q1 SNVSCW0 – OCTOBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: LM68680-Q1 ADVANCE INFORMATION
www.ti.com PACKAGE OUTLINE 4.64.4 4.64.4 1.050.95 2X 1.875 2.50.1 2.30.1 0.010.00 4X (0.2) (0.655)3X (1.5) 2X 0.550.452X 0.350.25 2X (0.365) 2X(0.75)4X 0.6760.576 2X 1.85
0.010.000.1 MIN
28X (0.18) 4X (0.13) 2X (0.44) (0.2) TYP(0.125) TYP (1.1) (1.1)(0.7)(0.5) (0.1) VQFN-FCRLF - 1.05 mm max heightRZY0026APLASTIC QUAD FLATPACK - NO LEAD 4228661/D 11/2023 0.08C PIN 1 INDEX AREA SEATING PLANE 0.1CABPIN 1 ID(R0.15)1 8 14 2126 27AA NO METAL3 PLACES TYPICAL SCALE 3.000 SECTION A-A AB C LM68680-Q1 SNVSCW0 – OCTOBER 2024 www.ti.com
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www.ti.com EXAMPLE BOARD LAYOUT .000 PKG 0 .000 PKG 0 20X 0.7 0.2) TYPVIA 2X (0.3) 2X(0.365) 0.05 MAXALL AROUND0.05 MINALL AROUND ()2.1 ()2.1 2X ()1.85 ()2.1 ()2.1 (2.5) (2.3) 2X (0.442) 2X (0.5) 4X (0.7) 4X (0.2)4X (0.375) 8X (0.125) 2X(0.37) 4X (0.25) 4X ()14X ()0.5 ()2.45()2.45 ()2.45 4X (0.5) (R0.05)TYP VQFN-FCRLF - 1.05 mm max heightRZY0026APLASTIC QUAD FLATPACK - NO LEAD SOLDER MASK DETAILS LAND PATTERN EXAMPLEEXPOSED METAL SHOWNSCALE: 20X 8 14 2126 METAL UNDERSOLDER MASKSOLDER MASKOPENING METAL EDGESOLDER MASKOPENINGEXPOSEDMETALNON SOLDER MASKDEFINED METAL UNDERSOLDER MASKSOLDER MASKOPENINGEXPOSEDMETALSOLDER MASKDEFINED www.ti.com LM68680-Q1 SNVSCW0 – OCTOBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: LM68680-Q1 ADVANCE INFORMATION
www.ti.com EXAMPLE STENCIL DESIGN )1.875 .000 PKG 0 ()2.1 .000 PKG 0 20X(0.25) 2X (0.5) 2X (1.1) 4X (1.1) 2X (0.3)2X(0.365) 2X ()0.65 2X ()0.65 2X ()1.85()2.1 2X ()0.563 2X ()0.65 20X (0.7) 4X (0.2) 8X (0.125) 4X (0.375) 4X (0.825) 4X (0.7) 2X (0.44)2X(0.368) ()2.45 ()2.45()2.45 ()2.45 (R0.05) TYP VQFN-FCRLF - 1.05 mm max heightRZY0026APLASTIC QUAD FLATPACK - NO LEAD 4228661/D 11/2023NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8 14 2126 BASED ON 0.125 mm THICK STENCILSOLDER PASTE EXAMPLESCALE: 20X PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGEPAD 27: 84% LM68680-Q1 SNVSCW0 – OCTOBER 2024 www.ti.com
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www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) PLM68680FRZYRQ1 Active Preproduction WQFN-FCRLF (RZY) | 26 3000 | LARGE T&R - Call TI Call TI -40 to 150 PLM68680FRZYRQ1.A Active Preproduction WQFN-FCRLF (RZY) | 26 3000 | LARGE T&R - Call TI Call TI -40 to 150 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
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