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www.ti.com SNOS695C –JUNE 1999–REVISED MARCH 2013 LM6511180ns3VComparator Check forSamples: LM6511 1FEATURES DESCRIPTION The LM6511 voltagecomparatorisidealforanalog- 2• (TypicalUnless OtherwiseNoted) digitalinterfacecircuitrywhen onlya +3V or +3.3V• Operates at+2.7V,+3V, +3.3V,+5V supplyisavailable.The open-collectoroutputpermits

  • Low Power Consumption <9.45mW @ V+ = signalcompatibilitywith a wide varietyof digital 2.7V(max) families:+5V CMOS, +3V CMOS, TTL and so on. Supplyvoltagemay rangefrom2.7V to36V between• FastResponse Time of180 ns supplyvoltageleads.The LM6511 operateswithlittle power consumption(Pdiss < 9.45 mW at V+ = +2.7VAPPLICATIONS and V− = 0V).
  • PortableEquipment Thisvoltagecomparatoroffersmany featuresthatare• CellularPhones availableintraditionalsub-microsecondcomparators:
  • DigitalLevelShifting outputsync strobe,inputsand outputmay be isolated from system ground, and wire-ORing.Also, the LM6511 uses the industry-standard,single comparatorpinoutconfiguration. Connection Diagram Figure1. 8-PinSOIC See Package Number D These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1999–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SNOS695C –JUNE 1999–REVISED MARCH 2013 www.ti.com AbsoluteMaximum Ratings(1)(2) SupplyVoltage −0.3to+36V OutputtoNegativeSupplyVoltage 50V Ground toNegativeSupplyVoltage 30V DifferentialInputVoltage ±30V InputVoltage See (1) StorageTemperatureRange −65°C to+150°C SolderingInformation: SOIC Package (VaporPhase in60 sec) 215°C Power Dissipation 500 mW OutputShortCircuitDuration 10s JunctionTemperature 150°C ESD Rating(C = +100 pF,R = 1.5kΩ) 300V (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.Operatingratingsindicateconditionsthe deviceisintendedtobe functional,butdo notguaranteespecificperformancelimits.Forguaranteedspecificationsand testconditions, see theElectricalCharacteristics.The guaranteedspecificationsapplyonlyforthetestconditionslisted. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. OperatingRatings(1) SupplyVoltage 2.5Vto30V TemperatureRange −40°C ≤ TJ ≤ +85°C ThermalResistance(θJA) SOIC Package 170°C/W (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.Operatingratingsindicateconditionsthe deviceisintendedtobe functional,butdo notguaranteespecificperformancelimits.Forguaranteedspecificationsand testconditions, see theElectricalCharacteristics.The guaranteedspecificationsapplyonlyforthetestconditionslisted. DC ElectricalCharacteristics Unlessotherwisespecified,alllimitsguaranteedforTJ = 25°C. Boldfacelimitsapplyatthetemperatureextremes.V+ = 2.7V, V− = 0V,50Ω ≤ R L ≤ 50kΩ,and IL = 1.0mA unlessotherwisespecified Symbol Parameter Conditions Typical LM6511I Units (Limits)Limit VOS OffsetVoltage R S ≤ 50 kΩ(1) 1.5 5 mV 8 max IB InputBiasCurrent 38 130 nA max200 IOS InputOffsetCurrent R S ≤ 50 kΩ(1) 1.5 20 nA max50 IS PositiveSupplyCurrent 2.7 3.5 5 mA maxNegativeSupplyCurrent 1.5 2.0 2.5 VSAT SaturationVoltage VIN ≤ 10 mV 0.23 0.4 V ISINK = 8 mA 0.4 max AV LargeSignalVoltageGain ΔVOUT = 2V 40 V/mV CMRR Common Mode RejectionRatio 72 dB ISTROBE StrobeON Current See (2) 2.0 5.0 mA max (1) The offsetvoltageand offsetcurrentlimitsarethemaximum valuesrequiredtodrivetheoutputwithina voltofeithersupplywitha 1 mA load.Therefore,theseparametersdefinean errorband and takeintoaccounttheworst-caseeffectsofvoltagegainand input impedance. (2) Thisspecificationgivestherangeofcurrentwhichmust be drawn fromthestrobepintoensuretheoutputisproperlydisabled.Do not shortthestrobepintoground;itshouldbe currentdrivenat3 mA to5 mA.

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www.ti.com SNOS695C –JUNE 1999–REVISED MARCH 2013 DC ElectricalCharacteristics(continued) Unlessotherwisespecified,alllimitsguaranteedforTJ = 25°C. Boldfacelimitsapplyatthetemperatureextremes.V+ = 2.7V, V− = 0V,50Ω ≤ R L ≤ 50kΩ,and IL = 1.0mA unlessotherwisespecified Symbol Parameter Conditions Typical LM6511I Units (Limits)Limit VIN InputVoltageRange 0.50 V min V+ − 1.25 V max OutputLeakage Current VIN ≥ 10 mV, VOUT = 35V, nA0.2ISTROBE = 3 mA max AC ElectricalCharacteristics Unlessotherwisespecified,alllimitsguaranteedforTJ = 25°C. Boldfacelimitsapplyatthetemperatureextremes.V+ = 2.7V, V− = 0V,50Ω ≤ R L ≤ 50kΩ,and IL = 1.0mA unlessotherwisespecified Symbol Parameter Conditions Typical LM6511I Units (Limits)Limit TR Response Time See (1) 180 ns (1) Thisspecificationisfora 100 mV inputstepwitha 25 mV overdrive. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM6511

SNOS695C –JUNE 1999–REVISED MARCH 2013 www.ti.com LM6511 TypicalPerformance Characteristics VS = 3V unlessotherwisenoted InputBias Current InputOffsetCurrent Figure2. Figure3. InputCurrent vs.InputVoltage Common Mode Limits Figure4. Figure5. TransferFunction Output SaturationVoltage Figure6. Figure7.

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www.ti.com SNOS695C –JUNE 1999–REVISED MARCH 2013 LM6511 TypicalPerformance Characteristics(continued) VS = 3V unlessotherwisenoted Supply Current Output CurrentLimiting vs.Temperature Figure8. Figure9. PropagationDelay Output Leakage Current vs.Overdrive Figure10. Figure11. TypicalApplication Notes:Because oftheverywideoperatingand outputvoltagerange,theLM6511 may be used toshiftlogiclevels from3V toTTL orCMOS totheotherway around.By biasingtheinputto½ oftheinputlogicsupply(VA),this assuresthatthisinputremainswithintheinputvoltagerange.The pull-upresistorshouldgo totheoutputlogicsupply (VB). Figure12. UniversalLogic LevelShifter Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM6511

SNOS695C –JUNE 1999–REVISED MARCH 2013 www.ti.com Schematic Diagram

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www.ti.com SNOS695C –JUNE 1999–REVISED MARCH 2013

REVISION HISTORY

Changes from RevisionB (March 2013)toRevisionC Page Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM6511

www.ti.com 1-Nov-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM6511IM NRND SOIC D 8 95 TBD Call TI Call TI -40 to 85 LM65 11IM LM6511IM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 85 LM65 11IM LM6511IMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 85 LM65 11IM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

www.ti.com 1-Nov-2013 Addendum-Page 2 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM6511IMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 Pack Materials-Page 2

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