LM63615-Q1 TI1 | Alldatasheet

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Technical content

ADVANCE□INFORMATION VIN VIN EN CBOOT SW FB AGND VOUT C BOOT C IN C OUT VCC RESET PGND C VCCRT VSEL SYNC/ MODE 0.001 0.01 0.1 1 10 Efficiency (%) Output Current (A) 13.5V C011 Product Folder Order Now T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to change without notice. LM63615-Q1,LM63625-Q1,LM63635-Q1 SNVSBA6 –JANUARY 2019 LM636x5-Q13.5-Vto36-V,2.5-AStep-downvoltageconverter withspreadspectrum

1 Features

1• AEC-Q100-Qualified for automotive applications – Device temperature grade 1: –40°C to +125°C, TA

  • Configured for rugged automotive applications – Input voltage range: 3.5 V to 36 V – Output voltage options: 3.3 V, 5 V, adjustable

1 V to 24 V

– Output current options: 1.5 A, 2.5 A, 3.5 A – Peak-current-mode control – Short minimum on-time of 50 ns – Frequency options: 400 kHz, 2.1 MHz, adjustable 250 kHz to 2200 kHz – Low shutdown quiescent current of 3 µA – Low operating quiescent current of 25 µA – Junction temperature range –40°C to +150°C

2 Applications

  • Automotive infotainment: telematics control unit
  • Automotive body: gateway
  • Automotive ADAS: mirror replacement/CMS

3 Description

The LM636x5-Q1 regulators are a family of easy-to- use, synchronous, step-down DC/DC converters designed for rugged automotive applications. The LM636x5-Q1 drive up to 2.5-A of load current from an input of up to 36 V. The converter has high light load efficiency and output accuracy in a small solution size. Features such as a power-good flag and precision enable provide both flexible and easy-to- use solutions for a wide range of applications. Automatic frequency foldback at light load improves efficiency while maintaining tight load regulation. Integration eliminates many external components and provides a pinout designed for simple PCB layout. Protection features include thermal shutdown, input undervoltage lockout, cycle-by-cycle current limit, and hiccup short-circuit protection. The LM636x5-Q1 is available in a PowerPAD™ HTSSOP 16-pin power package. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) LM636x5-Q1 HTSSOP (16) 5.00 mm × 4.40 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. space space space space Simplified Schematic Efficiency VOUT = 5 V, VIN = 13.5 V, ƒSW = 400 kHz

ADVANCE□INFORMATION LM63615-Q1,LM63625-Q1,LM63635-Q1 SNVSBA6 –JANUARY 2019 www.ti.com Product Folder Links: LM63615-Q1 LM63625-Q1 LM63635-Q1 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Table of Contents

6 Mechanical, Packaging, and Orderable

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DATE REVISION NOTES January 2019 * Initial release

ADVANCE□INFORMATION LM63615-Q1,LM63625-Q1,LM63635-Q1 www.ti.com SNVSBA6 –JANUARY 2019 Product Folder Links: LM63615-Q1 LM63625-Q1 LM63635-Q1 Submit Documentation FeedbackCopyright © 2019, Texas Instruments Incorporated

5 Device and Documentation Support

5.1 Documentation Support

5.1.1 Related Documentation

For related documentation see the following:

  • Thermal design by insight not hindsight
  • A guide to board layout for best thermal resistance for exposed pad packages
  • Semiconductor and IC package thermal metrics
  • Thermal design made simple with LM43603 and LM43602
  • SBVA025 Using new thermal metrics
  • Layout guidelines for switching power supplies
  • Simple switcher PCB layout guidelines
  • Constructing your power supply-layout considerations
  • Low radiated EMI layout made simple with LM4360x and LM4600x

5.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

5.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

5.4 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners.

5.5 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

5.6 Glossary

SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.

6 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com 22-Feb-2019 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples PLM63615DQA0PWPRQ1 PREVIEW HTSSOP PWP 16 2000 TBD Call TI Call TI -40 to 125 PLM63625DQA0PWPRQ1 ACTIVE HTSSOP PWP 16 2000 TBD Call TI Call TI -40 to 125 PLM63635DQA0PWPRQ1 PREVIEW HTSSOP PWP 16 2000 TBD Call TI Call TI -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

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