LM63635DQPWPRQ1

LM63635-Q1_V01 TI1 | Alldatasheet

Document overview

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Technical content

ADVANCE□INFORMATION VIN VIN EN CBOOT SW FB AGND VOUT CBOOT CIN COUT VCC RESET PGND CVCCRT VSEL SYNC/ MODE Product Folder Order Now T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to change without notice. LM63635-Q1 SNVSBN9 –NOVEMBER 2019 LM63635-Q13.5-Vto32-V,3.25-A,AutomotiveStep-downVoltageConverter

1 Features

1• AEC-Q100-Qualified for automotive applications – Device temperature grade 1: –40°C to +125°C ambient operating temperature

• Supports automotive system requirements – Input voltage range: 3.5 V to 32 V – Short minimum on-time of 50 ns – Low operating quiescent current of 23 µA – Junction temperature range –40°C to +150°C
• High design flexibility – Pin selectable VOUT: 3.3 V, 5 V, adjustable

1 V to 20 V

– Output current: 3.25 A – Pin selectable frequency: 400 kHz, 2.1 MHz, adjustable 250 kHz to 2200 kHz – Pin selectable FPWM, AUTO, sync modes – Pin compatible with LM63615-Q1, LM63625-Q1 – TSSOP: Thermally-enhanced package

• Small solution size – Typical: 20 mm x 13 mm for 2.5 A, 2200 kHz – Highly integrated solution – Low component count

2 Applications

• Automotive infotainment and cluster
• Automotive body electronics and lighting
• Automotive ADAS

3 Description

The LM63635D-Q1 regulators are a family of easy-to- use, synchronous, step-down DC/DC converters designed for rugged automotive applications. The LM63635D-Q1 can drive up to 3.25-A of load current from an input of up to 32 V. The converter has high light load efficiency and output accuracy in a small solution size. Features such as a RESET flag and precision enable provide both flexible and easy-to- use solutions for a wide range of applications. Automatic frequency foldback at light load improves efficiency while maintaining tight load regulation. Integration eliminates many external components and provides a pinout designed for simple PCB layout. Protection features include thermal shutdown, input undervoltage lockout, cycle-by-cycle current limit, and hiccup short-circuit protection. The LM63635D-Q1 is available in the HTSSOP 16-pin power package, with PowerPAD™ . Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) LM63635-Q1 HTSSOP (16) 5.00 mm × 4.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. space space space space space space Simplified Schematic Typical Solution Example IOUT = 2.5 A, ƒSW = 2200 kHz

ADVANCE□INFORMATION LM63635-Q1 SNVSBN9 –NOVEMBER 2019 www.ti.com Product Folder Links: LM63635-Q1 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated

4 Device and Documentation Support

4.1 Documentation Support

4.1.1 Related Documentation

For related documentation see the following:

• Texas Instruments, AN-2020 Thermal Design By Insight, Not Hindsight Application Report
• Texas Instruments, A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages Application Report
• Texas Instruments, Semiconductor and IC Package Thermal Metrics Application Report
• Texas Instruments, Thermal Design Made Simple with LM43603 and LM43602 Application Report
• Texas Instruments, Using New Thermal Metrics Application Report
• Texas Instruments, Layout Guidelines for Switching Power Supplies Application Report
• Texas Instruments, Simple Switcher PCB Layout Guidelines Application Report
• Texas Instruments, Constructing Your Power Supply-layout Considerations Seminar
• Texas Instruments, Low Radiated EMI Layout Made Simple with LM4360x and LM4600x Application Report

4.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

4.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

4.4 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners.

4.5 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

4.6 Glossary

SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.

5 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com 27-Dec-2019 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM63635DQPWPRQ1 PREVIEW HTSSOP PWP 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 125 63635DQ PLM63635DQB1PWPQ1 PREVIEW HTSSOP PWP 16 2000 TBD Call TI Call TI -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

www.ti.com PACKAGE OUTLINE C 14X 0.65 4.55 16X 0.30 0.19 6.6

6.2 TYP

0.15 0.05 0.25 GAGE PLANE 0 -8

1.2 MAX

2X 0.95 MAX NOTE 5 2X 0.23 MAX NOTE 5 2.30 1.54 2.46 1.86 B 4.5 4.3 A 5.1 4.9 NOTE 3 0.75 0.50 (0.15) TYP 4X (0.3) PowerPAD TSSOP - 1.2 mm max heightPWP0016K SMALL OUTLINE PACKAGE 4224484/A 08/2018

0.1 C A B

0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. Reference JEDEC registration MO-153. 5. Features may differ or may not be present. TM PowerPAD is a trademark of Texas Instruments. A 20 DETAIL A TYPICAL SCALE 2.500 THERMAL PAD 8 9

www.ti.com EXAMPLE BOARD LAYOUT

0.05 MAX

0.05 MIN

16X (1.5) 16X (0.45) 14X (0.65) (5.8) (R0.05) TYP (3.4) NOTE 9 (5) NOTE 9 (1.1) TYP (0.6) (1.2) TYP ( 0.2) TYP VIA (2.46) (2.3) PowerPAD TSSOP - 1.2 mm max heightPWP0016K SMALL OUTLINE PACKAGE 4224484/A 08/2018 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature 9. Size of metal pad may vary due to creepage requirement. 10. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented. TM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SYMM SYMM 8 9 METAL COVERED BY SOLDER MASK SOLDER MASK DEFINED PAD SEE DETAILS 15.000 METALSOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METALEXPOSED METAL SOLDER MASK DETAILS NON-SOLDER MASK DEFINED SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN 16X (1.5) 16X (0.45) 14X (0.65) (5.8) (R0.05) TYP (2.3) BASED ON

0.125 THICK

(2.46) BASED ON PowerPAD TSSOP - 1.2 mm max heightPWP0016K SMALL OUTLINE PACKAGE 4224484/A 08/2018 2.08 X 1.940.175 2.25 X 2.100.15 2.46 X 2.30 (SHOWN)0.125 2.75 X 2.570.1 SOLDER STENCIL OPENING STENCIL THICKNESS NOTES: (continued) 11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 12. Board assembly site may have different recommendations for stencil design. TM SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X SYMM SYMM 8 9 METAL COVERED BY SOLDER MASK SEE TABLE FOR DIFFERENT OPENINGS FOR OTHER STENCIL THICKNESSES

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