DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 12

Technical content

Features

Y High slew rate 300 V/ ms Y High gain-bandwidth product 100 MHz Y Low supply current 5 mA Y Fast settling time 120 ns to 0.1% Y Low differential gain k0.1% Y Low differential phase k0.1§ Y Wide supply range 4.75V to 32V Y Stable with unlimited capacitive load Y Well behaved; easy to apply

Applications

Y Wide-bandwidth signal conditioning for image process- ing (FAX, scanners, laser printers) Y Hard disk drive preamplifier Y Error amplifier for high-speed switching regulator Connection Diagrams 20-Lead LCC TL/H/11061 14 Top View See NS Package Number E20A 10-Pin Ceramic Flatpak TL/H/11061 15 Top View See NS Package Number W10A TL/H/11061 2 See NS Package Number N08E, M08A or J08A Temperature Range Package Drawing NSC Military Industrial Commercial b55§C s TA s a125§C b25§C s TA s a85§C0 §C s TA s a70§C LM6162N LM6262N LM6362N 8-Pin Molded DIP N08E LM6162J/883 8-Pin Ceramic DIP J08A5962-9216501PA LM6262M LM6362M 8-Pin Molded Surface Mt. M08A LM6162E/883 20-Lead LCC E20A5962-92165012A LM6162W/883 10-Pin Ceramic Flatpak W10A5962-9216501HA VIPTM is a trademark of National Semiconductor Corporation C1995 National Semiconductor Corporation RRD B30M115/Printed in U S A

Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Supply Voltage (V a –V ) 36V Differential Input Voltage (Note 2) g8V Common-Mode Input Voltage (V ab0.7V) to (Note 3) (V a 0.7V) Output Short Circuit to GND (Note 4) Continuous Soldering Information Dual-In-Line Package (N) Soldering (10 seconds) 260 Small Outline Package (M) Vapor Phase (60 seconds) 215 §C Infrared (15 seconds) 220 §C See AN-450 ‘‘Surface Mounting Methods and Their Effect on Product Reliability’’ for other methods of soldering sur- face mount devices. Storage Temperature Range b65§C s TJ s a150§C Max Junction Temperature 150 §C ESD Tolerance (Note 5) g1100V Operating Ratings Temperature Range (Note 6) LM6162 b55§C s TJ s a125§C LM6262 b25§C s TJ s a85§C LM6362 0 §C s TJ s a70§C Supply Voltage Range 4.75V to 32V These limits apply for supply voltage g15V, V CM 0V, and R L t 100 k X, unless otherwise specified. Limits in standard typeface are for T A TJ 25§C; limits in boldface type apply over the Operating Temperature Range . (Note 7) Typical LM6162 LM6262 LM6362 Symbol Parameter Conditions Limit Limit Limit Units (Note 8) (Note 8) (Note 8) VOS Input Offset Voltage g3 g5 g5 g13 mV g8 g8 g15 max DVOS DTemp Input Offset Voltage 7 mV/§CAverage Drift Ibias Input Bias Current 2.2 3 3 4 mA 656 max IOS Input Offset Current g150 g350 g350 g1500 nA g800 g600 g1900 max DIOS DTemp Input Offset Current 0.3 nA/ §CAverage Drift RIN Input Resistance Differential 180 kX CIN Input Capacitance 2.0 pF AVOL Large Signal VOUT g10V, R L 2k X 1400 1000 1000 800 V/V Voltage Gain (Note 9) 500 700 650 min RL 10 k X 6500 V/V VCM Input Common-Mode Supply g15V a14.0 a13.9 a13.9 a13.8 V Voltage Range a13.8 a13.8 a13.7 min b13.2 b12.9 b12.9 b12.9 V b12.7 b12.7 b12.8 max Supply a5V 4.0 3.9 3.9 3.8 V (Note 10) 3.8 3.8 3.7 min 1.6 1.8 1.8 1.9 V 2.0 2.0 2.0 max CMRR Common-Mode b10V s VCM s a10V 100 83 83 76 dB Rejection Ratio 79 79 74 min PSRR Power Supply g10V s VS s g16V 93 83 83 76 dB Rejection Ratio 79 79 74 min VO Output Voltage Supply g15V, R L 2k X a14.2 a13.5 a13.5 a13.4 V Swing a13.3 a13.3 13.3 min b13.4 b13.0 b13.0 b12.9 V b12.7 b12.8 b12.8 max

These limits apply for supply voltage g15V, V CM 0V, and R L t 100 k X, unless otherwise specified. Limits in standard typeface are for T A TJ 25§C; limits in boldface type apply over the Operating Temperature Range . (Note 7) Typical LM6162 LM6262 LM6362 Symbol Parameter Conditions Limit Limit Limit Units (Note 8) (Note 8) (Note 8) VO Output Voltage Swing Supply a5V and 4.2 3.5 3.5 3.4 V RL 2k X (Note 10) 3.3 3.3 3.3 min 1.3 1.7 1.7 1.8 V 2.0 1.9 1.9 max IOSC Output Short Sourcing 65 30 30 30 mA Circuit Current 20 25 25 min Sinking 65 30 30 30 mA 20 25 25 min IS Supply Current 5.0 6.5 6.5 6.8 mA 6.8 6.7 6.9 max These limits apply for supply voltage g15V, V CM 0V, R L t 100 k X, and C L s 5 pF, unless otherwise specified. Limits in standard typeface are for T A TJ 25§C; limits in boldface type apply over the Operating Temperature Range . (Note 7) Typical LM6162 LM6262 LM6362 Symbol Parameter Conditions Limit Limit Limit Units (Note 8) (Note 8) (Note 8) GBW Gain-Bandwidth Product f 20 MHz 100 80 80 75 MHz 65 65 min Supply g5V 70 MHz SR Slew Rate AV a2 (Note 11) 300 200 200 200 V/ ms 180 180 180 min Supply g5V 200 V/ms PBW Power Bandwidth VOUT 20 V PP 4.5 MHz ts Settling Time 10V step, to 0.1% 100 nsAV b1, R L 2k X wm Phase Margin AV a2 45 deg Differential Gain NTSC, A V a2 k0.1 % Differential Phase NTSC, A V a2 k0.1 deg en Input Noise Voltage f 10 kHz 10 nV/SHz in Input Noise Current f 10 kHz 1.2 pA/SHz Note 1: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the device beyond its rated operating conditions. Note 2: The ESD protection circuitry between the inputs will begin to conduct when the differential input voltage reaches 8V. Note 3: a) In addition, the voltage between the V a pin and either input pin must not exceed 36V. b) When the voltage applied to an input pin is driven more than 0.3V below the negative supply pin voltage, a substrate diode begins to conduct. Current through this pin must then be kept less than 20 mA to limit damage from self-heating. Note 4: Although the output current is internally limited, continuous short-circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150 §C. Note 5: This value is the average voltage that the weakest pin combinations can withstand and still conform to the datasheet limits. The test circuit used consists of the human body model, 100 pF in series with 1500 X. Note 6: The typical thermal resistance, junction-to-ambient, of the molded plastic DIP (N package) is 105 §C/W. For the molded plastic SO (M package), use 155§C/W. All numbers apply for packages soldered directly into a printed circuit board. Note 7: Typical values are for T J 25§C, and represent the most likely parametric norm. Note 8: Limits are guaranteed, by testing or correlation. Note 9: Voltage Gain is the total output swing (20V) divided by the magnitude of the input signal required to produce that swing. Note 10: For single-supply operation, the following conditions apply: V a 5V, V 0V, V CM 2.5V, V OUT 2.5V. Pin 1 and Pin 8 (V OS Adjust pins) are each connected to pin 4 (V ) to realize maximum output swing. This connection will increase the offset voltage. Note 11: VIN 10V step. For g5V supplies, V IN 1V step. Note 12: A military RETS electrical test specification is available on request.

Typical Performance Characteristics RL 10 k X,T A 25§C unless otherwise noted Supply Voltage Supply Current vs Rejection Ratio Common-Mode Rejection Ratio Power Supply vs Supply Voltage Gain-Bandwidth Product vs Load Capacitance Gain-Bandwidth Product Rise and Fall Times Propagation Delay, Supply Voltage Slew Rate vs Load Capacitance Slew Rate vs Load Capacitance Overshoot vs (Open-Loop) Output Impedance Load Resistance Voltage Gain vs Supply Voltage Voltage Gain vs TL/H/11061 3

Typical Performance Characteristics (Continued) RL 10 k X,T A 25§C unless otherwise noted Differential Gain (Note) TL/H/11061 4 Differential Phase (Note) TL/H/11061 5 Note: Differential gain and differential phase measured for four series LM6362 op amps con- figured with gain of a2 each, in series with a 1:16 attenuator and an LM6321 buffer. Error added by LM6321 is negligible. Test performed using Tektronix Type 520 NTSC test system. Step Response; Av a2 TL/H/11061 6 TIME (50 ns/div) Input Noise Voltage Input Noise Current Power Bandwidth TL/H/11061 7 Input (1V/div) Output (2V/div)

Typical Performance Characteristics (Continued) RL 10 k X,T A 25§C unless otherwise noted Frequency Response Open-Loop TL/H/11061 8 High-Frequency Response Open-Loop TL/H/11061 9 Voltage Limits Common-Mode Input Output Saturation Voltage Common-Mode Voltage Bias Current vs TL/H/11061 10 Simplified Schematic TL/H/11061 1

The LM6362 has been decompensated for a wider gain- bandwidth product than the LM6361. However, the LM6362 still offers stability at gains of 2 (and b1) or greater over the specified ranges of temperature, power supply voltage, and load. Since this decompensation involved reducing the emit- ter-degeneration resistors in the op amp’s input stage, the DC precision has been increased in the form of lower offset voltage and higher open-loop gain. Other op amps in this family include the LM6361, LM6364, and LM6365. If unity-gain stability is required, the LM6361 should be used. The LM6364 has been decompensated for operation at gains of 5 or more, with corresponding greater gain-bandwidth product (125 MHz, typical) and DC preci- sion. The fully-uncompensated LM6365 offers gain-band- width product of 725 MHz, typical, and is stable for gains of 25 or more. All parts in this family, regardless of compensa- tion, have the same high slew rate of 300 V/ ms (typ). The LM6362 is unusually tolerant of capacitive loads. Most op amps tend to oscillate when their load capacitance is greater than about 200 pF (in low-gain circuits). However, load capacitance on the LM6362 effectively increases its compensation capacitance, thus slowing the op amp’s re- sponse and reducing its bandwidth. The compensation is not ideal, though, and ringing may occur in low-gain circuits with large capacitive loads. Power supply bypassing is not as critical for LM6362 as it is for other op amps in its speed class. However, bypassing will improve the stability and transient response of the LM6362, and is recommended for every design. 0.01 mFt o 0.1 mF ceramic capacitors should be used (from each sup- ply ‘‘rail’’ to ground); if the device is far away from its power supply source, an additional 2.2 mFt o1 0 mF of tantalum may be required for extra noise reduction. Keep all leads short to reduce stray capacitance and lead inductance, and make sure ground paths are low-imped- ance, especially where heavier currents will be flowing. Stray capacitance in the circuit layout can cause signal cou- pling from one pin, input or lead to another, and can cause circuit gain to unintentionally vary with frequency. Breadboarded circuits will work best if they are built using generic PC boards with a good ground plane. If the op amps are used with sockets, as opposed to being soldered into the circuit, the additional input capacitance may degrade circuit frequency response. At low gains ( a2o r b1), a feedback capacitor C f from output to inverting input will compensate for the phase lag caused by capacitance at the inverting input. Typically, values from 2 pF to 5 pF work well; however, best results can be obtained by observing the am- plifier pulse response and optimizing C f for the particular layout. Typical Applications Offset Voltage Adjustment TL/H/11061 11 Inverting Amplifier, 30 MHz Bandwidth Operation on g15V supplies results in wider bandwidth, 50 MHz (typ). TL/H/11061 12

Typical Applications (Continued) Video Cable Driver *Network required when operating on supply voltage over g5V, for overvoltage protection of LM6321. If g5V supplies are used, omit network and connect output of LM6362 directly to input of LM6321. TL/H/11061 13

Physical Dimensions inches (millimeters) 20-Lead Small Outline Package (E) Order Number LM6162E/883 Ceramic Dual-In-Line Package (J) Order Number LM6162J/883

Physical Dimensions inches (millimeters) (Continued) Molded Package SO (M) Order Number LM6262M or LM6362M Molded Dual-In-Line Package (N) Order Number LM6162N, LM6262N or LM6362N

LM6162/LM6262/LM6362 High Speed Operational Amplifier Physical Dimensions inches (millimeters) (Continued) 10-Pin Ceramic Flatpak Order Number LM6162W/883 LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user. National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd. Japan Ltd.

1111 West Bardin Road Fax: ( a49) 0-180-530 85 86 13th Floor, Straight Block, Tel: 81-043-299-2309

Arlington, TX 76017 Email: cnjwge @ tevm2.nsc.com Ocean Centre, 5 Canton Rd. Fax: 81-043-299-2408 Tel: 1(800) 272-9959 Deutsch Tel: ( a49) 0-180-530 85 85 Tsimshatsui, Kowloon Fax: 1(800) 737-7018 English Tel: ( a49) 0-180-532 78 32 Hong Kong Fran3ais Tel: ( a49) 0-180-532 93 58 Tel: (852) 2737-1600 Italiano Tel: ( a49) 0-180-534 16 80 Fax: (852) 2736-9960 National does not assume any respons bility for use of any circuitry described, no circuit patent l censes are implied and National reserves the right at any t me without notice to change said circuitry and specificat ons