LM6121 NSC | Alldatasheet

Document overview

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Technical content

Features

n High slew rate: 800 V/µs n Wide bandwidth: 50 MHz n Slew rate and bandwidth 100% tested n Peak output current:±300 mA n High input impedance: 5 MΩ n LH0002H pin compatible n No oscillations with capacitive loads n 5V to±15V operation guaranteed n Current and thermal limiting n Fully specified to drive 50Ω lines

Applications

VIP™ is a trademark of National Semiconductor Corporation. DS009223-1 Numbers in ( ) are for 8-pin N DIP. May 1998 LM6121/LM6221/LM6321 High Speed Buffer © 1999 National Semiconductor Corporation DS009223 www.national.com

*Heat-sinking pins. See Application section on heat sinking requirements. Order Number LM6221N, LM6321N or LM6121J/883 See NS Package Number J08A or N08E Metal Can DS009223-3 Note:Pin 6 connected to case. Top View Order Number LM6221H or LM6121H/883 See NS Package Number H08C Plastic SO DS009223-7 *Pin 3 must be connected to the negative supply. **Heat-sinking pins. See Application section on heat-sinking requirements. These pins are at V − potential. Order Number LM6321M See NS Package Number M14A www.national.com 2

Absolute Maximum Ratings(Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage 36V ( ±18) Input to Output Voltage (Note 2) ±7V Input Voltage ±Vsupply Output Short-Circuit to GND Continuous (Note 3) Storage Temperature Range −65˚C to +150˚C Lead Temperature (Soldering, 10 seconds) 260˚C Power Dissipation (Note 10) ESD Tolerance (Note 8) ±2000V Junction Temperature (TJ(max)) 150˚C Operating Ratings Operating Temperature Range LM6121H/883 −55˚C to +125˚C LM6221 −40˚C to +85˚C LM6321 0˚C to +70˚C Operating Supply Range 4.75 to ±16V Thermal Resistance (θJA), (Note 4) H Package 150˚C/W N Package 47˚C/W M Package 69˚C/W Thermal Resistance (θ JC), H Package 17˚C/W The following specifications apply for Supply Voltage= ±15V, VCM = 0, RL ≥ 100 kΩ and RS = 50Ω unless otherwise noted. Boldfacelimits apply for TA = TJ = TMIN to TMAX ; all other limits TA = TJ = 25˚C. Symbol Parameter Conditions Typ LM6121 LM6221 LM6321 Units Limit Limit Limit (Notes 5, 9) (Note 5) (Note 5) AV1 Voltage Gain 1 R L = 1k Ω ,V IN = ±10V 0.990 0.980 0.980 0.970 0.970 0.950 0.950 AV2 Voltage Gain 2 R L = 50Ω ,V IN = ±10V 0.900 0.860 0.860 0.850 V/V 0.800 0.820 0.820 Min AV3 Voltage Gain 3 R L = 50Ω ,V + = 5V 0.840 0.780 0.780 0.750 (Note 6) V IN = 2V pp (1.5 Vpp) 0.750 0.700 0.700 VOS Offset Voltage R L = 1k Ω 15 30 30 50 mV 50 60 100 Max IB Input Bias Current R L = 1k Ω ,R S = 10 kΩ 14 4 5 µ A 77 7 Max R IN Input Resistance R L = 50Ω 5M Ω C IN Input Capacitance 3.5 pF R O Output Resistance I OUT = ±10 mA 3 5 5 5 Ω 10 10 6 Max IS1 Supply Current 1 R L = ∞ 15 18 18 20 mA Max20 20 22 IS2 Supply Current 2 R L = ∞ ,V + = 5V 14 16 16 18 18 18 20 VO1 Output Swing 1 R L = 1k 13.5 13.3 13.3 13.2 13 13 13 VO2 Output Swing 2 R L = 100Ω 12.7 11.5 11.5 11 ±V 10 10 10 Min VO3 Output Swing 3 R L = 50Ω 12 11 11 10 99 9 VO4 Output Swing 4 R L = 50Ω ,V + = 5V 1.8 1.6 1.6 1.6 V PP (Note 6) 1.3 1.4 1.5 Min PSSR Power Supply V ± = ±5V to±15V 70 60 60 60 dB Rejection Ratio 55 50 50 Min www.national.com3

The following specifications apply for Supply Voltage= ±15V, VCM = 0, RL ≥ 100 kΩ and RS = 50Ω unless otherwise noted. Boldfacelimits apply for TA = TJ = TMIN to TMAX ; all other limits TA = TJ = 25˚C. Symbol Parameter Conditions Typ LM6121 LM6221 LM6321 Units Limit Limit Limit (Note 5) (Note 5) (Note 5) SR 1 Slew Rate 1 V IN = ±11V, RL = 1k Ω 1200 550 550 550 V/µs MinSR 2 Slew Rate 2 V IN = ±11V, RL = 50Ω 800 550 550 550 (Note 7) SR 3 Slew Rate 3 V IN = 2V PP ,R L = 50Ω 50 550 550 550 V+ = 5V (Note 6) BW −3 dB Bandwidth V IN = ±100 mV PP ,R L = 50Ω 50 30 30 30 MHz C L ≤ 10 pF Min tr,tf Rise Time R L = 50Ω ,C L ≤ 10 pF 7.0 ns Fall Time V O = 100 mV PP tpd Propagation R L = 50Ω ,C L ≤ 10 pF 4.0 ns Delay Time V O = 100 mV PP O S Overshoot R L = 50Ω ,C L ≤ 10 pF 10 % VO = 100 mV PP Note 1:Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its rated operating conditions. Note 2:During current limit or thermal limit, the input current will increase if the input to output differential voltage exceeds 8V. For input to output differential voltages in excess of 8V the input current should be limited to±20 mA. Note 3:The LM6121 series buffers contain current limit and thermal shutdown to protect against fault conditions. Note 4:The thermal resistanceθJA of the device in the N package is measured when soldered directly to a printed circuit board, and the heat-sinking pins (pins 1, 4, 5 and 8) are connected to 2 square inches of 2 oz. copper. When installed in a socket, the thermal resistanceθJA of the N package is 84˚C/W. The thermal re- sistanceθJA of the device in the M package is measured when soldered directly to a printed circuit board, and the heat-sinking pins (pins 1, 2, 6, 7, 8, 9, 13, 14) are connected to 1 square inch of 2 oz. copper. Note 5:Limits are guaranteed by testing or correlation. Note 6:The input is biased to 2.5V and VIN swings Vpp about this value. The input swing is 2 Vpp at all temperatures except for the AV 3 test at −55˚C where it is reduced to 1.5 Vpp. Note 7:Slew rate is measured with a±11V input pulse and 50Ω source impedance at 25˚C. Since voltage gain is typically 0.9 driving a 50Ω load, the output swing will be approximately±10V. Slew rate is calculated for transitions between±5V levels on both rising and falling edges. A high speed measurement is done to minimize device heating. For slew rate versus junction temperature see typical performance curves. The input pulse amplitude should be reduced to±10V for measurements at temperature extremes. For accurate measurements, the input slew rate should be at least 1700 V/µs. Note 8:The test circuit consists of the human body model of 120 pF in series with 1500Ω . Note 9:For specification limits over the full Military Temperature Range, see RETS6121X. Note 10:The maximum power dissipation is a function of TJ(max),θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)–TA)/θJA. Typical Performance CharacteristicsTJ = 25˚C, unless otherwise specified Frequency Response DS009223-11 Frequency Response DS009223-12 Slew Rate vs Temperature DS009223-13 www.national.com 4

Typical Performance CharacteristicsTJ = 25˚C, unless otherwise specified (Continued) Overshoot vs Capacitive Load DS009223-14 Large Signal Response R L = 1k Ω DS009223-15 Large Signal Response R L = 50Ω DS009223-16 Supply Current DS009223-17 −3 dB Bandwidth DS009223-18 Slew Rate DS009223-19 Slew Rate DS009223-20 Power Bandwidth DS009223-21 Input Return Gain (S11) DS009223-22 Forward Transmission Gain (S12) DS009223-23 Current Limit DS009223-24 www.national.com5

Physical Dimensionsinches (millimeters) unless otherwise noted Metal Can Package (H) Order Number LM6221H or LM6121H/883 8-Pin Ceramic Dual-In-Line Package (J) Order Number LM6121J/883 www.national.com 8

Physical Dimensionsinches (millimeters) unless otherwise noted (Continued) 14-Pin Small Outline Package (M) Order Number LM6321M Molded Dual-In-Line Package (N) Order Number LM6221N or LM6321N www.national.com9

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Corporation Americas Tel: 1-800-272-9959 Fax: 1-800-737-7018 Email: support@nsc.com National Semiconductor Europe Fax: +49 (0) 1 80-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 1 80-530 85 85 English Tel: +49 (0) 1 80-532 78 32 Français Tel: +49 (0) 1 80-532 93 58 Italiano Tel: +49 (0) 1 80-534 16 80 National Semiconductor Asia Pacific Customer Response Group Tel: 65-2544466 Fax: 65-2504466 Email: sea.support@nsc.com National Semiconductor Japan Ltd. Tel: 81-3-5639-7560 Fax: 81-3-5639-7507 www.national.com LM6121/LM6221/LM6321 High Speed Buffer National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.