Accurate Remote Diode Dig Temp Sensor w/Integrated Fan Control datasheet (Rev. E)
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SNAS190,E]
- PDF pages: 44
Technical content
www.ti.com SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 LM63±1°C/±3°C AccurateRemoteDiodeDigitalTemperatureSensorwithIntegratedFan Control Check forSamples: LM63 1FEATURES DESCRIPTION The LM63 isa remotediodetemperaturesensorwith 23• AccuratelySenses Diode-Connected 2N3904 integratedfan control.The LM63 accuratelyTransistorsor Thermal Diodes On Board Large measures: (1) itsown temperatureand (2) theProcessors or ASICs temperatureofa diode-connectedtransistor,such as
- AccuratelySenses itsOwn Temperature a 2N3904, or a thermaldiode commonly found on Computer Processors,Graphics Processor Units• FactoryTrimmed forIntel® Pentium® 4 and (GPU) and other ASIC's. The LM63 remoteMobilePentium 4 Processor-M Thermal Diodes temperaturesensor'saccuracyisfactorytrimmedfor• IntegratedPWM Fan Speed ControlOutput the seriesresistanceand 1.0021 non-idealityof the
- AcousticFan Noise Reduction With User- Intel0.13 µm Pentium 4 and Mobile Pentium 4 Programmable 8-StepLookup Table Processor-Mthermaldiode.The LM63 has an offset registertocorrectforerrorscaused by differentnon-• Multi-Function,User-SelectablePin forEither idealityfactorsofotherthermaldiodes.ALERT Output,or Tachometer Input, Functions The LM63 alsofeaturesan integrated,pulse-width- modulated(PWM), open-drainfancontroloutput.Fan• Tachometer InputforMeasuring Fan RPM speed is a combinationof the remote temperature• Smart-Tach Modes forMeasuring RPM ofFans reading,the lookup tableand the registersettings.With Pulse-Width-ModulatedPower as Shown The 8-step Lookup Table enables the user toinTypicalApplication program a non-linearfan speed vs. temperature
- OffsetRegistercan Adjustfora Varietyof transferfunctionoftenused to quietacousticfan Thermal Diodes noise.
- 10 BitPlus Sign Remote Diode Temperature CONNECTION DIAGRAMData Format,With 0.125°C Resolution
- SMBus 2.0Compatible Interface,Supports TIMEOUT
- LM86-Compatible Pinout
- LM86-Compatible RegisterSet
- 8-PinSOIC Package
APPLICATIONS
Figure1. 8-PinSOIC (D Package)• Computer Processor Thermal Management (Laptop,Desktop,Workstations,Servers)
- Graphics Processor Thermal Management
- ElectronicTestEquipment
- Projectors
- OfficeEquipment
- IndustrialControls Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Intel,PentiumareregisteredtrademarksofIntelCorporation. 3Allothertrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2002–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 www.ti.com KEY SPECIFICATIONS
- Remote DiodeTemp Accuracy(withquantizationerror) Ambient Temp Diode Temp IPWML Max Version Max Error 30 to50°C 60 to100°C 5 mA LM63C ±1.0°C 30 to50°C 60 to100°C 5 mA LM63D ±3.0°C 0 to85°C 25 to125°C 8 mA All ±3.0°C
- LocalTemp Accuracy(includesquantizationerror) Ambient Temp Max Error 25°C to125°C ±3.0°C
- SupplyVoltage:3.0V to3.6V
- SupplyCurrent:1.3mA (typ) PIN DESCRIPTIONS PIN NAME INPUT/OUTPUT FUNCTION AND CONNECTION Connecttoa low-noise+3.3± 0.3VDC power supply,and bypasstoGND witha 1 VDD Power SupplyInput 0.1µF ceramiccapacitorinparallelwitha 100 pF ceramiccapacitor.A bulk capacitanceof10 µF needs tobe inthevicinityoftheLM63's VDD pin. Connecttotheanode (positiveside)oftheremotediode.A 2.2nF ceramiccapacitor2 D+ AnalogInput must be connectedbetween pins2 and 3. Connecttothecathode(negativeside)oftheremotediode.A 2.2nF ceramiccapacitor3 D − AnalogInput must be connectedbetween pins2 and 3. Open-Drain Open-DrainDigitalOutput.Connecttofandrivecircuitry.The power-ondefaultforthis4 PWM DigitalOutput pinislow(pin4 pulledtoground). 5 GND Ground Thisistheanalogand digitalgroundreturn. Dependingon how theLM63 isprogrammed,thispiniseitheran open-drainALERT 6 ALERT/TACH DigitalI/O outputor a tachometerinputformeasuringfanspeed.The power-ondefaultforthispin istheALERT function. DigitalInput/7 SMBDAT Thisisthebi-directionalSMBus dataline.Open-DrainOutput 8 SMBCLK DigitalInput DigitalInput.ThisistheSMBus clockinput.
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'6 ADC 2 - Wire Serial Interface SMBDAT SMBCLK Temp Reading, Temp Limit, Hysteresis, and Temp Sensor Filter Registers Status and Status Mask Registers Comparators PWM Fan Control Registers PWM Fan Control PWM ALERT/Tach ALERT Tach Tachometer Detection LM63 www.ti.com SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 SIMPLIFIED BLOCK DIAGRAM Figure2. Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM63
2.2 nF +3.3 VDC from motherboard SMBCLK SMBDAT PWM Output To SMBus interface control circuitry ALERT / Tach GND VDD PWM Remote diode- connected transistor inside of an Intel® Pentium® 4 Processor ALERT to system shutdown circuitry +3.3 VDC 470 MMBT2222A Tach. input from Fan Fan voltage +12 or +5 VDC 10k 13k 0.2W Tach In 0.1 100 pF 10 PF These two capacitors are close to Pin 1 DC brushless fan module with Tachometer Fan V+ Fan V- Processor LM63 SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 www.ti.com TYPICAL APPLICATION Figure3. These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates.
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www.ti.com SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 ABSOLUTE MAXIMUM RATINGS (1)(2) SupplyVoltage,VDD −0.3V to6.0V Voltageon SMBDAT, SMBCLK, ALERT/Tach, PWM Pins −0.5V to6.0V Voltageon OtherPins −0.3V to(VDD + 0.3 V) InputCurrent,D − Pin ±1 mA InputCurrentatAllOtherPins(3) 5 mA Package InputCurrent(3) 30 mA Package Power Dissipation See (4) SMBDAT, ALERT, PWM pins OutputSinkCurrent 10 mA StorageTemperature −65°C to+150°C Human Body Model 2000 V ESD Susceptibility(5) Machine Model 200 V Vapor Phase (60seconds) 215°C SolderingInformation,Lead Temperature SOIC-8 Package(6) Infrared(15seconds) 220°C (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisfunctional,butdo notensureperformancelimits.Forensuredspecificationsand testconditions,see theElectrical Characteristics.The ensuredspecificationsapplyonlyforthetestconditionslisted.Some performancecharacteristicsmay degrade when thedeviceisnotoperatedunderthelistedtestconditions. (2) Allvoltagesaremeasured withrespecttoGND, unlessotherwisenoted. (3) When theinputvoltage(VIN)atany pinexceedsthepower supplies(VIN < GND orVIN > V+),thecurrentatthatpinshouldbe limitedto 5 mA. Parasiticcomponents and/orESD protectioncircuitryfortheLM63 's pinsareshown inFigure4 and Table1.The nominal breakdown voltageofD3 is6.5V.Care shouldbe takennottoforwardbiastheparasiticdiode,D1, presenton pinsD+ and D −.Doing so by more than50 mV may corrupttemperaturemeasurements.An "X"means itexistsinthecircuit. (4) Thermalresistancejunction-to-ambientwhen attachedtoa printedcircuitboardwith2 oz.foilis168°C/W. (5) Human body model,100 pF dischargedthrougha 1.5kΩ resistor.Machine model,200 pF dischargeddirectlyintoeach pin.See Figure4 and Table1 fortheESD ProtectionInputStructure. (6) See theURL http://www.ti.com/packagingforotherrecommendationsand methods ofsolderingsurfacemount devices. Figure4. ESD ProtectionInputStructure Table1.ESD ProtectionInputStructure PIN NAME PIN # D1 D2 D3 D4 D5 D6 R1 SNP ESD CLAMP VDD 1 X X D+ 2 X X X X X X D − 3 X X X X X X PWM 4 X X X X ALERT/Tach 6 X X X X SMBDAT 7 X X X X SMBCLK 8 X X Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM63
SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 www.ti.com OPERATING RATINGS (1)(2) SpecifiedTemperatureRange (TMIN ≤ TA ≤ TMAX ) LM63CIM, LM63DIM 0°C ≤ TA ≤ +85°C Remote DiodeTemperatureRange 0°C ≤ TA ≤ +125°C SupplyVoltageRange (VDD ) +3.0V to+3.6V (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisfunctional,butdo notensureperformancelimits.Forensuredspecificationsand testconditions,see theElectrical Characteristics.The ensuredspecificationsapplyonlyforthetestconditionslisted.Some performancecharacteristicsmay degrade when thedeviceisnotoperatedunderthelistedtestconditions. (2) Allvoltagesaremeasured withrespecttoGND, unlessotherwisenoted. DC ELECTRICAL CHARACTERISTICS TEMPERATURE-TO-DIGITAL CONVERTER CHARACTERISTICS The followingspecificationsapplyforVDD = 3.0VDC to3.6VDC, and allanalogsourceimpedance R S = 50Ω unless otherwisespecifiedintheconditions.BoldfacelimitsapplyforTA = TMIN toTMAX ;allotherlimitsTA = +25°C. UNITSPARAMETER CONDITIONS VERSION TYPICAL (1) LIMITS(2) (LIMITS) TD = +60 to+100°C LM63C ±1 °C (max)TemperatureErrorUsingthe TA = +30 to+50°C TD = Remote DiodeRemote ThermalDiodeofan Intel IPWML ≤ 5 mA LM63D ±3 °C (max)JunctionTemperaturePentium4 orMobilePentium4 Processor-Mwithtypicalnon- TA = +0 to+85°C TD = +25 to+125°C All ±3 °C (max)idealityof1.0021. IPWML ≤ 8 mA TemperatureErrorUsingtheLocal TA = +25 to+125°C (3)(4) All ±1 ±3 °C (max)Diode
11 Bits
Remote DiodeResolution All 0.125 °C
8 Bits
1 °C ConversionTime,AllTemperatures FastestSetting All 31.25 34.4 ms (max) D − SourceVoltage All 0.7 V 315 µA (max) (VD+ − VD −)= +0.65V;HighCurrent All 160 110 µA (min) DiodeSourceCurrent 20 µA (max) Low Current All 13 7 µA (min) (1) “Typicals”areatTA = 25°C and representmost likelyparametricnorm.They aretobe used as generalreferencevaluesnotforcritical designcalculations. (2) LimitsarespecifiedtoAOQL (AverageOutgoingQualityLevel). (3) Localtemperatureaccuracydoes notincludetheeffectsofself-heating.The riseintemperaturedue toself-heatingistheproductofthe internalpower dissipationoftheLM63 and thethermalresistance.Forthethermalresistancetobe used intheself-heatingcalculation, see thetablefootnoteaboutThermalresistancejunction-to-ambient. (4) Thermalresistancejunction-to-ambientwhen attachedtoa printedcircuitboardwith2 oz.foilis168°C/W. OPERATING ELECTRICAL CHARACTERISTICS PARAMETER CONDITIONS TYPICAL (1) LIMITS(2) UNITS ALERT PWM ALERT and PWM OutputSaturationVoltage IOUT 4 mA 5 mA 0.4 V (max) IOUT 6 mA 0.55
2.4 V (max)
Power-On-ResetThresholdVoltage
1.8 V (min)
SMBus Inactive,16 Hz 1.1 2.0 mA (max)ConversionRateSupplyCurrent(3) STANDBY Mode 300 µA (1) “Typicals”areatTA = 25°C and representmost likelyparametricnorm.They aretobe used as generalreferencevaluesnotforcritical designcalculations. (2) LimitsarespecifiedtoAOQL (AverageOutgoingQualityLevel). (3) The supplycurrentwillnotincreasesubstantiallywithan SMBus transaction.
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www.ti.com SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 AC ELECTRICAL CHARACTERISTICS The followingspecificationsapplyforVDD = 3.0VDC to3.6VDC, and allanalogsourceimpedance R S = 50Ω unless otherwisespecifiedintheconditions.BoldfacelimitsapplyforTA = TMIN toTMAX ;allotherlimitsTA= +25°C. UNITSSYMBOL PARAMETER CONDITIONS TYPICAL (1) LIMITS(2) (LIMIT) TACHOMETER ACCURACY Fan ControlAccuracy ±10 % (max) Fan Full-ScaleCount 65535 (max) Fan CounterClockFrequency 90 kHz Fan Count Update Frequency 1.0 Hz FAN PWM OUTPUT FrequencyAccuracy ±10 % (max) (1) “Typicals”areatTA = 25°C and representmost likelyparametricnorm.They aretobe used as generalreferencevaluesnotforcritical designcalculations. (2) LimitsarespecifiedtoAOQL (AverageOutgoingQualityLevel). DIGITAL ELECTRICAL CHARACTERISTICS UNITSSYMBOL PARAMETER CONDITIONS TYPICAL (1) LIMITS(2) (LIMIT) VIH LogicalHighInputVoltage 2.1 V (min) VIL LogicalLow InputVoltage 0.8 V (max) IIH LogicalHighInputCurrent VIN = VDD 0.005 +10 µA (max) IIL LogicalLow InputCurrent VIN = GND −0.005 −10 µA (max) C IN DigitalInputCapacitance 20 pF (1) “Typicals”areatTA = 25°C and representmost likelyparametricnorm.They aretobe used as generalreferencevaluesnotforcritical designcalculations. (2) LimitsarespecifiedtoAOQL (AverageOutgoingQualityLevel). SMBus LOGICAL ELECTRICAL CHARACTERISTICS The followingspecificationsapplyforVDD = 3.0VDC to3.6VDC, and allanalogsourceimpedance R S = 50Ω unless otherwisespecifiedintheconditions.BoldfacelimitsapplyforTA = TMIN toTMAX ;allotherlimitsTA = +25°C. UNITSSYMBOL PARAMETER CONDITIONS TYPICAL (1) LIMITS(2) (LIMIT) SMBDAT OPEN-DRAIN OUTPUT VOL LogicLow LevelOutputVoltage IOL = 4 mA 0.4 V (max) IOH HighLevelOutputCurrent VOUT = VDD 0.03 10 µA (max) SMBDAT, SMBCLK INPUTS VIH LogicalHighInputVoltage 2.1 V (min) VIL LogicalLow InputVoltage 0.8 V (max) VHYST LogicInputHysteresisVoltage 320 mV (1) “Typicals”areatTA = 25°C and representmost likelyparametricnorm.They aretobe used as generalreferencevaluesnotforcritical designcalculations. (2) LimitsarespecifiedtoAOQL (AverageOutgoingQualityLevel). Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM63
P S VIH VIL SMBDAT tBUF tHD;STA tLOW tR tHD;DAT tHIGH tF tSU;DAT tSU;STA tSU;STO P LM63 SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 www.ti.com SMBus DIGITAL SWITCHING CHARACTERISTICS Unlessotherwisenoted,thesespecificationsapplyforVDD = +3.0VDC to+3.6VDC, C L (loadcapacitance)on outputlines= 80 pF.BoldfacelimitsapplyforTA = TJ;TMIN ≤ TA ≤ TMAX ;allotherlimitsTA = TJ = +25°C, unlessotherwisenoted.The switchingcharacteristicsoftheLM63 fullymeet orexceed thepublishedspecificationsoftheSMBus version2.0.The followingparametersarethetimingrelationshipsbetween SMBCLK and SMBDAT signalsrelatedtotheLM63. They adhere to,butarenotnecessarilythesame as theSMBus bus specifications. UNITSSYMBOL PARAMETER CONDITIONS LIMITS(1) (LIMIT) 10 kHz (min)fSMB SMBus ClockFrequency 100 kHz (max) tLOW SMBus ClockLow Time From VIN(0)max toVIN(0)max 4.7 µs (min) From VIN(1)min toVIN(1)min 4.0 µs (min)tHIGH SMBus ClockHighTime 50 µs (max) tR SMBus RiseTime See (2) 1 µs (max) tF SMBus FallTime See (3) 0.3 µs (max) tOF OutputFallTime C L = 400 pF,IO = 3 mA 250 ns (max) SMBData and SMBCLK Time Low forResetof 25 ms (min)tTIMEOUT SerialInterface.See (4). 35 ms (max) tSU:DAT Data InSetupTime toSMBCLK High 250 ns (min) 300 ns (min)tHD:DAT Data Out HoldTime afterSMBCLK Low 930 ns (max) HoldTime after(Repeated)StartCondition.AftertHD:STA 4.0 µs (min)thisperiodthefirstclockisgenerated. StopConditionSMBCLK HightoSMBDAT LowtSU:STO 100 ns (min)(StopConditionSetup) SMBus Repeated Start-ConditionSetupTime,tSU:STA 4.7 µs (min)SMBCLK HightoSMBDAT Low SMBus FreeTime between Stopand StarttBUF 4.7 µs (min)Conditions (1) LimitsarespecifiedtoAOQL (AverageOutgoingQualityLevel). (2) The outputrisetimeismeasured from(VILmax -0.15V) to(VIH min + 0.15V). (3) The outputfalltimeismeasured from(VIH min + 0.15V) to(VILmin -0.15V). (4) HoldingtheSMBData and/orSMBCLK linesLow fora timeintervalgreaterthantTIMEOUT willresettheLM63 ’s SMBus statemachine, thereforesettingSMBDAT and SMBCLK pinstoa high-impedancestate. Figure5. SMBus Timing Diagram forSMBCLK and SMBDAT Signals
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0.01 0.1 1.0 10 100 CONVERSION RATE (Hz) 200 500 800 1100 1400 1700 2000 2300 2600 SUPPLY CURRENT ( PA LM63 www.ti.com SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 FUNCTIONAL DESCRIPTION The LM63 Remote Diode Temperature Sensor with IntegratedFan Controlincorporatesa ΔVBE -based temperaturesensorusinga LocalorRemote diodeand a 10-bitplussignΔΣ ADC (Delta-SigmaAnalog-to-Digital Converter).The pulse-widthmodulated(PWM) open-drainoutput,witha pullupresistor,can drivea switching transistorto modulate fan speed. When the ALERT/Tach isprogrammed to the Tach mode the LM63 can measure the fan speed on the pulsesfrom the fan’s tachometeroutput.The LM63 includesa smart-tach measurement mode to accommodate the corruptedtachometerpulseswhen usingswitchingtransistordrive. When theALERT/Tach pinisprogrammed totheALERT mode theALERT open-drainoutputwillbe pulledlow when themeasured temperatureexceeds certainprogrammed limitswhen enabled.Detailsarecontainedinthe sectionstofollow. The LM63's two-wireinterfaceiscompatiblewiththeSMBus Specification2.0.Formore informationthereaderis directedtowww.smbus.org. IntheLM63 digitalcomparatorsare used tocompare themeasured LocalTemperature(LT)totheLocalHigh Setpointuser-programmabletemperaturelimitregister.The measured Remote Temperature(RT) isdigitally compared to the Remote High Setpoint(RHS), the Remote Low Setpoint(RLS),and the Remote T_CRIT Setpoint(RCS) user-programmabletemperaturelimits.An ALERT outputwilloccur when the measured temperatureis:(1)higherthan eitherthe High Setpointor the T_CRIT Setpoint,or (2)lowerthan the Low Setpoint.The ALERT Mask registerallowstheusertopreventthegenerationoftheseALERT outputs. The temperaturehysteresisissetby thevalueplacedintheHysteresisRegister(TH). The LM63 may be placedina low-powerStandby mode by settingtheStandby bitfoundintheConfiguration Register.IntheStandby mode continuousconversionsare stopped.InStandby mode theusermay choose to allowthe PWM outputsignalto continue,or not,by programming the PWM Disablein Standby bitin the ConfigurationRegister. The LocalTemperaturereadingand setpointdata registersare 8-bitswide.The formatof the 11-bitremote temperaturedata isa 16-bitleftjustifiedword.Two 8-bitregisters,highand low bytes,are providedforeach setpointas wellas thetemperaturereading.Two Remote TemperatureOffset(RTO) Registers:High Byte and Low Byte (RTOHB and RTOLB) may be used to correctthe temperaturereadingsby addingor subtractinga fixedvaluebased on a differentnon-idealityfactorof the thermaldiodeifdifferentfrom the 0.13 micronIntel Pentium4 orMobilePentium4 Processor-Mprocessor’s thermaldiode.See theDIODE NON-IDEALITY section. CONVERSION SEQUENCE The LM63 takesapproximately31.25ms toconverttheLocalTemperature(LT),Remote Temperature(RT),and toupdateallofitsregisters.The ConversionRate may be modifiedusingtheConversionRate Register.When theconversionrateismodifieda delayisinsertedbetween conversions,theactualconversiontimeremainsat 31.25ms. DifferentConversionRates willcause theLM63 todraw differentamounts ofsupplycurrentas shown inFigure6. Figure6. Supply Currentvs Conversion Rate Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM63
Status Register: RTDS High Time Temperature LM63 SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 www.ti.com THE ALERT/TACH PIN AS ALERT OUTPUT The ALERT/Tach pinisa multi-usepin.Inthissection,we willaddresstheALERT active-lowopen-drainoutput function.When theALERT/Tach Selectbitiswrittenas a zerointheConfigurationRegistertheALERT outputis selected.Also,when theALERT Mask bitintheConfigurationregisteriswrittenas zerotheALERT interrupts areenabled. The LM63's ALERT pinisversatileand can produce threedifferentmethods of use to bestservethe system designer:(1)as a temperaturecomparator(2)as a temperature-basedinterruptflag,and (3)as partof an SMBus ALERT System. The threemethods of use are furtherdescribedin the followingsections:ALERT OUTPUT AS A TEMPERATURE COMPARATOR ,ALERT OUTPUT AS AN INTERRUPT ,and ALERT OUTPUT AS AN SMBus ALERT .The ALERT and interruptmethods are differentonlyinhow theuserinteractswiththe LM63. The remotetemperature(RT)readingisassociatedwitha T_CRIT SetpointRegister,and bothlocaland remote temperature(LT and RT) readingsareassociatedwitha HIGH setpointregister(LHS and RHS). The RT isalso associatedwitha LOW setpointregister(RLS).At the end of everytemperaturereadinga digitalcomparison determineswhetherthatreadingisabove itsHIGH or T_CRIT setpointor below itsLOW setpoint.Ifso,the correspondingbitintheALERT StatusRegisterisset.IftheALERT mask bitislow,any bitsetintheALERT StatusRegister,withthe exceptionof Busy or Open, willcause the ALERT outputto be pulledlow.Any temperatureconversionthatisout of the limitsdefinedin the temperaturesetpointregisterswilltriggeran ALERT. Additionally,theALERT Mask Bitmust be clearedtotriggeran ALERT inallmodes. The three differentALERT modes willbe discussedin the followingsections:ALERT OUTPUT AS A TEMPERATURE COMPARATOR ,ALERT OUTPUT AS AN INTERRUPT ,and ALERT OUTPUT AS AN SMBus ALERT . ALERT OUTPUT AS A TEMPERATURE COMPARATOR When theLM63 isused ina system inwhichdoes notrequiretemperature-basedinterrupts,theALERT output couldbe used as a temperaturecomparator.Inthismode, once theconditionthattriggeredtheALERT togo low isno longerpresent,theALERT isnegated(Figure7).For example,iftheALERT outputwas activatedby the comparisonofLT > LHS, when thisconditionisno longertrue,theALERT willreturnHIGH. Thismode allows operationwithoutsoftwareintervention,once allregistersareconfiguredduringset-up.InorderfortheALERT to be used as a temperaturecomparator,theComparatorMode bitintheRemote Diode TemperatureFilterand ComparatorMode Registermust be asserted.Thisisnotthepower-ondefaultstate. Figure7. ALERT Output as Temperature Comparator Response Diagram
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Remote High Limit RDTS Measurement Time Temperature ALERT mask set in response to reading of status register by master LM63 ALERT pin Status Register: RTDS High End of Temperature conversion LM63 www.ti.com SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 ALERT OUTPUT AS AN INTERRUPT The LM63's ALERT outputcan be implementedas a simpleinterruptsignalwhen itisused totriggeran interrupt serviceroutine.In such systems itisdesirableforthe interruptflagto repeatedlytriggerduringor beforethe interruptserviceroutinehas been completed.Under thismethod of operation,duringthe read of the ALERT StatusRegisterthe LM63 willsetthe ALERT Mask bitinthe ConfigurationRegisterifany bitinthe ALERT StatusRegisterisset,withthe exceptionof Busy and Open. ThispreventsfurtherALERT triggeringuntilthe masterhas resettheALERT Mask bit,attheend oftheinterruptserviceroutine.The ALERT StatusRegisterbits areclearedonlyupon a readcommand fromthemaster(seeFigure8 )and willbe re-assertedattheend ofthe next conversionifthe triggeringcondition(s)persist(s).In orderforthe ALERT to be used as a dedicated interruptsignal,the Comparator Mode bitin the Remote Diode Temperature Filterand Comparator Mode Registermust be setlow.Thisisthepower-ondefaultstate.The followingsequence describestheresponseofa systemthatuses theALERT outputpinas an interruptflag: 1. MastersensesALERT low. 2. MasterreadstheLM63 ALERT StatusRegistertodeterminewhat caused theALERT. 3. LM63 clearsALERT StatusRegister,resetsthe ALERT HIGH and sets the ALERT Mask bitin the ConfigurationRegister. 4. Masterattendstoconditionsthatcaused theALERT tobe triggered.The fanisstarted,setpointlimitsare adjusted,etc. 5. MasterresetstheALERT Mask bitintheConfigurationRegister. Figure8. ALERT Output as an InterruptTemperature Response Diagram ALERT OUTPUT AS AN SMBus ALERT An SMBus alertlineiscreatedwhen theALERT outputisconnectedto:(1)one ormore ALERT outputsofother SMBus compatibledevices,and (2)to a master.Under thisimplementation,the LM63's ALERT shouldbe operatedusingtheARA (AlertResponse Address)protocol.The SMBus 2.0ARA protocol,definedintheSMBus specification2.0,isa proceduredesignedtoassistthemasterindeterminingwhich partgeneratedan interrupt and toservicethatinterrupt. The SMBus alertlineisconnectedto the open-drainportsof alldeviceson the bus,therebyAND'ing them together.The ARA method allowsthe SMBus master,withone command, to identifywhich partispullingthe SMBus alertlineLOW. ItalsopreventsthepartfrompullingthelineLOW againforthesame triggeringcondition. When an ARA command isreceivedby alldeviceson thebus,thedevicespullingtheSMBus alertlineLOW: (1)send theiraddress to the master and (2)releasethe SMBus alertlineafteracknowledgement of their address. The SMBus Specifications1.1 and 2.0 statethatin response to and ARA (AlertResponse Address)“after acknowledgingtheslaveaddressthedevicemust disengageitsALERT pulldown”.Furthermore,“ifthehoststill sees ALERT low when the message transferis complete,itknows to read the ARA again.” This SMBus “disengagingALERT requirementpreventslockingup theSMBus alertline.Competitivepartsmay addressthe “disengagingofALERT ”differentlythantheLM63 ornotatall.SMBus systemsthatimplementtheARA protocol as suggestedfortheLM63 willbe fullycompatiblewithallcompetitiveparts. Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM63
Status Register: Remote High LM63 SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 www.ti.com The LM63 fulfills“disengagingof ALERT ” by settingthe ALERT Mask Bitinthe ConfigurationRegisterafter sendingoutitsaddressinresponsetoan ARA and releasingtheALERT outputpin.Once theALERT Mask bitis activated,the ALERT outputpinwillbe disableduntilenabledby software.In orderto enablethe ALERT the master must read the ALERT StatusRegister,duringthe interruptserviceroutineand then resetthe ALERT Mask bitintheConfigurationRegisterto0 attheend oftheinterruptserviceroutine. The followingsequence describestheARA responseprotocol. 1. MastersensesSMBus alertlinelow 2. Mastersends a START followedby theAlertResponse Address(ARA) witha Read Command. 3. AlertingDevice(s)send ACK. 4. AlertingDevice(s)send theiraddress.Whiletransmittingtheiraddress,alertingdevicessense whethertheir addresshas been transmittedcorrectly.(The LM63 willresetitsALERT outputand settheALERT Mask bit once itscompleteaddresshas been transmittedsuccessfully.) 5. Master/slaveNoACK 6. Mastersends STOP 7. Masterattendstoconditionsthatcaused theALERT tobe triggered.The ALERT StatusRegisterisreadand fanstarted,setpointsadjusted,etc. 8. MasterresetstheALERT Mask bitintheConfigurationRegister. The ARA, 000 1100,isa generalcalladdress.No deviceshouldeverbe assignedtothisaddress. The ALERT ConfigurationbitintheRemote Diode TemperatureFilterand ComparatorMode Registermust be setlowinorderfortheLM63 torespondtotheARA command. The ALERT outputcan be disabledby settingtheALERT Mask bitintheConfigurationRegister.The power-on defaultistohave theALERT Mask bitand theALERT Configurationbitlow. Figure9. ALERT Output as an SMBus ALERT Temperature Response Diagram SMBus INTERFACE SincetheLM63 operatesas a slaveon theSMBus theSMBCLK lineisan inputand theSMBDAT lineisbi- directional.The LM63 never drivesthe SMBCLK lineand itdoes not supportclockstretching.Accordingto SMBus specifications,theLM63 has a 7-bitslaveaddress.Allbits,A6 throughA0, are internallyprogrammed and cannotbe changed by softwareorhardware. The completeslaveaddressis: A6 A5 A4 A3 A2 A1 A0 1 0 0 1 1 0 0
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www.ti.com SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 POWER-ON RESET (POR) DEFAULT STATES Forinformationon thePOR defaultstates,see REGISTER MAP IN FUNCTIONAL ORDER . TEMPERATURE DATA FORMAT Temperaturedata can onlybe read from the Localand Remote Temperatureregisters.The High,Low and T_CRIT setpointregistersareRead/Write. Remote temperaturedataisrepresentedby an 11-bit,two'scomplement word witha LeastSignificantBit(LSB) equalto0.125°C. The dataformatisa leftjustified16-bitword availableintwo 8-bitregisters: DIGITAL OUTPUT TEMPERATURE BINARY HEX +125°C 0111 1101 0000 0000 7D00 +25°C 0001 1001 0000 0000 1900 +1°C 0000 0001 0000 0000 0100 +0.125°C 0000 0000 0010 0000 0020 0°C 0000 0000 0000 0000 0000 −0.125°C 1111 1111 1110 0000 FFE0 −1°C 1111 1111 0000 0000 FF00 −25°C 1110 0111 0000 0000 E700 −55°C 1100 1001 0000 0000 C900 LocalTemperaturedataisrepresentedby an 8-bit,two'scomplement bytewithan LSB equalto1°C: DIGITAL OUTPUT TEMPERATURE BINARY HEX +125°C 0111 1101 7D +25°C 0001 1001 19 +1°C 0000 0001 01 0°C 0000 0000 00 −1°C 1111 1111 FF −25°C 1110 0111 E7 −55°C 1100 1001 C9 OPEN-DRAIN OUTPUTS The SMBDAT, ALERT, and PWM outputsareopen-drainoutputsand do nothave internalpullups.A “High”level willnotbe observedon thesepinsuntilpullupcurrentisprovidedby an internalsource,typicallythrougha pullup resistor.Choice of resistorvaluedepends on severalfactorsbut,ingeneral,the valueshouldbe as highas possibleconsistentwith reliableoperation.This willlower the power dissipationof the LM63 and avoid temperatureerrorscaused by self-heatingofthedevice.The maximum valueofthepullupresistortoprovidethe 2.1V highlevelis88.7kΩ. Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:LM63
SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 www.ti.com DIODE FAULT DETECTION The LM63 can detectfaultconditionscaused by theremotediode.IftheD+ pinisdetectedtobe shortedtoVDD , or open: (1) the Remote Temperature High Byte (RTHB) registeris loaded with 127°C, (2) the Remote TemperatureLow Byte(RTLB) registerisloadedwith0,and (3)theOPEN bit(D2)inthestatusregisterisset. Therefore,ifthe Remote T_CRIT setpointregister(RCS): (1)issetto a valuelessthan +127°C and (2)the ALERT Mask isdisabled,thentheALERT outputpinwillbe pulledlow.IftheRemote High SetpointHigh Byte (RHSHB) issettoa valuelessthan+127°C and (2)theALERT Mask isdisabled,thentheALERT willbe pulled low.The OPEN bitby itselfwillnottriggeran ALERT. Ifthe D+ pinisshortedto eitherground or D −, then the Remote TemperatureHigh Byte (RTHB) registeris loadedwith−128°C (10000000)and theOPEN bitintheALERT StatusRegisterwillnotbe set.A temperature readingof−128°C indicatesthatD+ isshortedtoeitherground or D-.IfthevalueintheRemote Low Setpoint HighByte(RLSHB) Registerismore than−128°C and theALERT Mask isDisabled,ALERT willbe pulledlow. COMMUNICATING WITH THE LM63 Each dataregisterintheLM63 fallsintoone offourtypesofuseraccessibility: 1. Read Only 2. WriteOnly 3. Read/Writesame address 4. Read/Writedifferentaddress A WritetotheLM63 iscomprisedofan addressbyteand a command byte.A writetoany registerrequiresone databyte. Reading the LM63 Registerscan take place afterthe requisiteregistersetup sequence takes place.See REQUIRED INITIALFAN CONTROL REGISTER SEQUENCE . The data byte has the Most SignificantBit(MSB) first.At the end of a read,the LM63 can accepteither Acknowledge or No-Acknowledge from theMaster.Note thattheNo-Acknowledge istypicallyused as a signal fortheslaveindicatingthattheMasterhas readitslastbyte. DIGITAL FILTER The LM63 incorporatesa user-configureddigitalfiltertosuppresserroneousRemote Temperaturereadingsdue to noise.The filterisaccessed inthe Remote Diode TemperatureFilterand Comparator Mode Register.The filtercan be setaccordingtoTable2. Level2 ismaximum filtering. Table2.DigitalFilterSelectionTable D2 D1 FILTER 0 0 No Filter 0 1 Level1 1 0 Level1 1 1 Level2
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TEMPERATURE ( oC) LM63 with Filter On LM63 with Filter Off 0 5 10 15 20 25 TEMPERATURE (° C) NUMBER OF SAMPLES No Filter Filter Level 1 Filter Level 2 0 5 10 15 20 25 TEMPERATURE (° C) NUMBER OF SAMPLES No Filter Filter Level 1 Filter Level 2 LM63 www.ti.com SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 Figure10.Step Response oftheDigitalFilter Figure11.Impulse Response oftheDigitalFilter Figure12.DigitalFilterResponse inan IntelPentium 4 processorSystem. The Filteron and offcurves were purposelyoffsettobettershow noiseperformance. Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:LM63
Status Register: RTDS High LM63 SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 www.ti.com FAULT QUEUE The LM63 incorporatesa FaultQueue tosuppresserroneousALERT triggering.The FaultQueue preventsfalse triggeringby requiringthree consecutiveout-of-limitHIGH, LOW, or T_CRIT temperaturereadings.See Figure13.The FaultQueue defaultstoOFF upon power-upand may be activatedby settingtheRDTS Fault Queue bitintheConfigurationRegistertoa 1. Figure13.FaultQueue Temperature Response Diagram ONE-SHOT REGISTER The One-Shot Registerisused to initiatea singleconversionand comparisoncyclewhen the deviceisin standbymode, afterwhichthedatareturnstostandby.Thisisnota dataregister.A writeoperationcauses the one-shotconversion.The datawrittentothisaddressisirrelevantand isnotstored.A zerowillalwaysbe read fromthisregister. SERIAL INTERFACE RESET IntheeventthattheSMBus MasterisresetwhiletheLM63 istransmittingon theSMBDAT line,theLM63 must be returnedtoa known stateinthecommunicationprotocol.Thismay be done inone oftwo ways: 1. When SMBDAT isLow, theLM63 SMBus statemachine resetstotheSMBus idlestateifeitherSMBData or SMBCLK areheldLow formore than35 ms (tTIMEOUT ).Alldevicesaretotimeoutwhen eithertheSMBCLK or SMBDAT linesare heldLow for25 ms – 35 ms. Therefore,toinsurea timeoutofalldeviceson thebus, eithertheSMBCLK ortheSMBData linemust be heldLow foratleast35 ms. 2. WithbothSMBDAT and SMBCLK High,themastercan initiatean SMBus startconditionwitha High toLow transitionon the SMBDAT line.The LM63 willrespond properlyto an SMBus startconditionat any point duringthecommunication.AfterthestarttheLM63 willexpectan SMBus Addressaddressbyte.
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www.ti.com SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 LM63 REGISTERS Thissectionincludesthe followingsubsections:REGISTER MAP IN HEXADECIMAL ORDER , which shows a summary ofallregistersand theirbitassignments;REGISTER MAP IN FUNCTIONAL ORDER ;and REGISTER DESCRIPTIONS IN FUNCTIONAL ORDER , which providesa detailedexplanationof each register.Do not addresstheunused ormanufacturer’s testregisters. REGISTER MAP IN HEXADECIMAL ORDER Table3 isa RegisterMap groupedinhexadecimaladdressorder.Some addresslocationshave been leftblank tomaintaincompatibilitywithLM86. Addressesinparenthesisare mirrorsof“Same As” addressforbackwards compatibilitywithsome oldersoftware.Readingorwritingeitheraddresswillaccessthesame 8-bitregister. Table3. RegisterMap Grouped inHexadecimal Address Order DATA BITSREGISTER REGISTER 0x[HEX] NAME D7 D6 D5 D4 D3 D2 D1 D0
00 Local LT7 LT6 LT5 LT4 LT3 LT2 LT1 LT0
01 Rmt Temp MSB RTHB ± RTHB14 RTHB13 RTHB12 RTHB11 RTHB10 RTHB9 RTHB8
02 ALERT Status BUSY LHIGH 0 RHIGH RLOW RDFA RCRIT TACH
03 Configuration ALTMSK STBY PWMDIS 0 0 ALT/TCH TCRITOV FLTQUE
04 Conversion 0 0 0 0 CONV3 CONV2 CONV1 CONV0
05 LocalHigh LHS7 LHS6 LHS5 LHS4 LHS3 LHS2 LHS1 LHS0
06 [Reserved] Not Used
07 Rmt High RHSHB15 RHSHB14 RHHBS13 RHSHB12 RHSHB11 RHSHB10 RHSHB9 RHSHB8
08 Rmt Low RLSHB15 RLSHB14 RLSHB13 RLSHB12 RLHBS11 RLSHB10 RLSHB9 RLSHB8
(09) Same as 03 (0A) Same as 04 (0B) Same as 05 0C [Reserved] Not Used (0D) Same as 07 (0E) Same as 08 0F One Shot WriteOnly.Writecommand triggersone temperatureconversioncycle.
10 Rmt Temp LSB RTLB7 RTLB6 RTLB5 0 0 0 0 0
11 Rmt Temp RTOHB15 RTOHB14 RTOHB13 RTOHB12 RTOHB11 RTOHB10 RTOHB9 RTOHB8
12 Rmt Temp RTOLB7 RTOLB6 RTOLB5 0 0 0 0 0
13 Rmt High RHSLB7 RHSLB6 RHSLB5 0 0 0 0 0
14 Rmt Low RLSLB7 RLSLB6 RLSLB5 0 0 0 0 0
15 [Reserved] Not Used
16 ALERT Mask 1 ALTMSK6 1 ALTMSK4 ALTMSK3 1 ALTMSK1 ALTMSK0
17 [Reserved] Not Used 18 [Reserved] Not Used
19 Rmt TCRIT RCS7 RCS6 RCS5 RCS4 RCS3 RCS2 RCS1 RCS0
1A–1F [Reserved] Not Used 20 [Reserved] Not Used
21 Rmt TCRIT RTH7 RTH6 RTH5 RTH4 RTH3 RTH2 RTH1 RTH0
22–2F [Reserved] Not Used 30–3F [Reserved] Not Used 40–45 [Reserved] Not Used
46 Tach Count LSB TCLB5 TCLB4 TCLB3 TCLB2 TCLB1 TCLB0 TEDGE1 TEDGE0
47 Tach Count TCHB13 TCHB12 TCHB11 TCHB10 TCHB9 TCHB8 TCHB7 TCHB6
48 Tach LimitLSB TLLB7 TLLB6 TLLB5 TLLB4 TLLB3 TLLB2 Not Used Not Used
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SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 www.ti.com Table3. RegisterMap Grouped inHexadecimal Address Order (continued) DATA BITSREGISTER REGISTER 0x[HEX] NAME D7 D6 D5 D4 D3 D2 D1 D0
49 Tach LimitMSB TLHB15 TLHB14 TLHB13 TLHB12 TLHB11 TLHB10 TLHB9 TLHB8
4A PWM and RPM 0 0 PWPGM PWOUT ± PWCKSL 0 TACH1 TACH0 4B Fan Spin-Up 0 0 SPINUP SPNDTY1 SPNDTY0 SPNUPT2 SPNUPT1 SPNUPT0 Config 4C PWM Value 0 0 PWVAL5 PWVAL4 PWVAL3 PWVAL2 PWVAL1 PWVAL0 4D PWM 0 0 0 PWMF4 PWMF3 PWMF2 PWMF1 PWMF0 Frequency 4E [Reserved] Not Used 4F Lookup Table 0 0 0 LOOKH4 LOOKH3 LOOKH2 LOOKH1 LOOKH0 Hystersis 50–5F Lookup Table Lookup Tableofup to8 PWM and Temp Pairsin8-bitRegisters 60–BE [Reserved] Not Used BF Rmt Diode 0 0 0 0 0 RDTF1 RDTF0 ALTCOMP Temp Filter C0 –FD [Reserved] Not Used FE Manufacturer’s 0 0 0 0 0 0 0 1 ID FF Stepping/Die 0 1 0 0 0 0 0 1 Rev.ID
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www.ti.com SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 REGISTER MAP IN FUNCTIONAL ORDER Table4 isa RegisterMap groupedinFunctionalOrder.Some addresslocationshave been leftblanktomaintain compatibilitywithLM86. Addresses in parenthesisare mirrorsof named address.Reading or writingeither addresswillaccessthesame 8-bitregister.The Fan Controland ConfigurationRegistersarelistedfirst,as there is a requiredorderto setup these registersfirstand then setup the others(see REQUIRED INITIALFAN CONTROL REGISTER SEQUENCE ).The detailedexplanationsofeach registerwillfollowtheordershown in Table4. Note:POR = Power-On-Reset. Table4.RegisterMap Grouped inFunctionalOrder REGISTER POR DEFAULTREGISTER NAME READ/WRITE[HEX] [HEX] FAN CONTROL REGISTERS 4A PWM and RPM R/W 20 4B Fan Spin-UpConfiguration R/W 3F 4D PWM Frequency R/W 17 Read Only4C PWM Value 00(R/W ifOverrideBitisSet) 50–5F Lookup Table R/W See Table 4F Lookup TableHysteresis R/W 04 CONFIGURATION REGISTER 03 (09) Configuration R/W 00 TACHOMETER COUNT AND LIMITREGISTERS
46 Tach Count LSB Read Only N/A
47 Tach Count MSB Read Only N/A
48 Tach LimitLSB R/W FF
49 Tach LimitMSB R/W FF
LOCAL TEMPERATURE AND LOCAL SETPOINT REGISTERS
00 LocalTemperature Read Only N/A
05 (0B) LocalHighSetpoint R/W 46 (70°) REMOTE DIODE TEMPERATURE AND SETPOINT REGISTERS
01 Remote TemperatureMSB Read Only N/A
10 Remote TemperatureLSB Read Only N/A
11 Remote TemperatureOffsetMSB R/W 00
12 Remote TemperatureOffsetLSB R/W 00
07 (0D) Remote HighSetpointMSB R/W 46 (70°C)
13 Remote HighSetpointLSB R/W 00
08 (0E) Remote Low SetpointMSB R/W 00 (0°C)
14 Remote Low SetpointLSB R/W 00
19 Remote TCRIT Setpoint R/W 55 (85°C)
21 Remote TCRIT Hys R/W 0A (10°C)
BF Remote DiodeTemperatureFilter R/W 00 CONVERSION AND ONE-SHOT REGISTERS 04 (0A) ConversionRate R/W 08 0F One-Shot WriteOnly N/A ALERT STATUS AND MASK REGISTERS
02 ALERT Status Read Only N/A
16 ALERT Mask R/W A4
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SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 www.ti.com Table4.RegisterMap Grouped inFunctionalOrder (continued) REGISTER POR DEFAULTREGISTER NAME READ/WRITE[HEX] [HEX] [RESERVED] REGISTERS — NOT USED
06 Not Used N/A N/A
15 Not Used N/A N/A
17 Not Used N/A N/A
18 Not Used N/A N/A
1A–1F Not Used N/A N/A
20 Not Used N/A N/A
22–2F Not Used N/A N/A 30–3F Not Used N/A N/A 40–45 Not Used N/A N/A 4E Not Used N/A N/A 60–BE Not Used N/A N/A C0 –FD Not Used N/A N/A
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www.ti.com SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 REGISTER DESCRIPTIONS IN FUNCTIONAL ORDER The REGISTER DESCRIPTIONS IN FUNCTIONAL ORDER sectionshows a RegisterMap groupedinfunctional order.Some address locationshave been leftblank to maintaincompatibilitywith LM86. Addresses in parenthesisare mirrorsof named addressforbackwards compatibilitywithsome oldersoftware.Reading or writingeitheraddresswillaccessthesame 8-bitregister. Table5.Fan ControlRegisters ADDRESS READ/ PORBITS NAME DESCRIPTIONHEX WRITE VALUE 4A HEX FAN PWM AND TACHOMETER CONFIGURATION REGISTER 7:6 00 These bitsareunused and alwayssetto0. 0:thePWM Value(register4C) and theLookup Table(50–5F)areread- only.The PWM value(0to100%) isdeterminedby thecurrentremote diodetemperatureand theLookup Table,and can be readfromthePWM PWM valueregister.Program5 1 1:thePWM value(register4C) and theLookup Table(Register50–5F) areread/writeenabled.WritingthePWM ValueregisterwillsetthePWM output.ThisisalsothestateduringwhichtheLookup Tablecan be written. PWM 0:thePWM outputpinwillbe 0 V forfanOFF and open forfanON. 4 0 Output 1:thePWM outputpinwillbe open forfanOFF and 0 V forfanON. Polarity PWM Clock if0,themasterPWM clockis360 kHz3 04A R/W Select if1,themasterPWM clockis1.4kHz. 2 0 [Reserved] Alwayswrite0 tothisbit. 00:Traditionaltachinputmonitor,falsereadingswhen underminimum detectableRPM. 01:Traditionaltachinputmonitor,FFFF readingwhen underminimum detectableRPM. 10:Most accuratereadings,FFFF readingwhen underminimum Tachometer detectableRPM. Smart-tachmode enabled.Use withdirectPWM drive1:0 00 Mode offanpower. 11:Leastefforton programmed PWM offan,FFFF readingwhen under minimum detectableRPM. Smart-tachmode enabled.Use withdirect PWM driveoffanpower. Note:IfthePWM Clockis360 kHz,mode 00 isused regardlessofthe settingofthesetwo bits. 4B HEX FAN PWM AND TACHOMETER CONFIGURATION REGISTER 7:6 0 These bitsareunused and alwayssetto0 If0,thefanspin-upuses thedutycycleand spin-uptime,bits0–4. If1,theLM63 setsthePWM outputto100% untilthespin-uptimesout (perbits0–2)ortheminimum desiredRPM has been reached(pertheFast TachometerSetpointsetting)usingthetachometerinput,whicheverTachometer 5 1 happens first.ThisbitoverridesthePWM Spin-UpDutyCycleregisterSpin-Up (bits4:3)— PWM outputisalways100%. Registerx03,bit2 = 1 for Tachometermode. IfPWM Spin-UpTime (bits2:0)= 000,theSpin-Upcycleisbypassed, regardlessofthestateofthisbit. 00:Spin-Upcyclebypassed(noSpin-Up),unlessFastTachometer TerminatedSpin-Up(bit5)isset.4B R/W PWM 01:50%4:3 11 Spin-Up 10:75% –81% Depends on PWM Frequency.See theAPPLICATIONDutyCycle NOTES sectionattheend ofthisdatasheet. 11:100% 000:Spin-Upcyclebypassed(No Spin-Up) 001:0.05seconds 010:0.1sPWM 011:0.2s2:0 111 Spin-Up 100:0.4sTime 101:0.8s 110:1.6s 111:3.2s Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 21 ProductFolderLinks:LM63
SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 www.ti.com Table5.Fan ControlRegisters(continued) ADDRESS READ/ PORBITS NAME DESCRIPTIONHEX WRITE VALUE 4D HEX FAN PWM FREQUENCY REGISTER 7:5 000 These bitsareunused and alwayssetto0 The PWM Frequency= PWM_Clock /2n,where PWM_Clock = 360 kHz PWM or1.4kHz (perthePWM ClockSelectbitinRegister4A),and n = value4D R/W Frequency oftheregister.4:0 10111 Note:n = 0 ismapped ton = 1.See theAPPLICATION NOTES section attheend ofthisdatasheet. 4C HEX PWM VALUE REGISTER 7:6 00 These bitsareunused and alwayssetto0 IfPWM Program (register4A,bit5)= 0 thisregisterisreadonlyand reflectstheLM63 ’s currentPWM valuefromtheLookup Table.Read IfPWM Program (register4A,bit5)= 1,thisregisterisread/writeand the(Writeonly PWM4C desiredPWM valueiswrittendirectlytothisregister,insteadoffromtheifreg4A Value5:0 000000 Lookup Table,fordirectfanspeed control.bit5 = 1.) Thisregisterwillread0 duringtheSpin-Upcycle. See theAPPLICATION NOTES sectionattheend ofthisdatasheetfor more informationregardingthePWM Valueand DutyCyclein%.
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www.ti.com SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 Table5.Fan ControlRegisters(continued) ADDRESS READ/ PORBITS NAME DESCRIPTIONHEX WRITE VALUE 50HEX to5FHEX LOOKUP TABLE (7BitsforTemperature and 6 BitsforPWM foreach Temperature/PWM Pair) 7 0 Thisbitisunused and alwayssetto0.Lookup Table 50 Temperature Iftheremotediodetemperatureexceedsthisvalue,thePWM outputwill6:0 0x7F Entry1 be thevalueinRegister51. 7:6 00 These bitsareunused and alwayssetto0.Lookup Table51 PWM Entry15:0 0x3F The PWM valuecorrespondingtothetemperaturelimitinregister50. 7 0 Thisbitisunused and alwayssetto0.Lookup Table 52 Temperature Iftheremotediodetemperatureexceedsthisvalue,thePWM outputwill6:0 0x7F Entry2 be thevalueinRegister53. 7:6 00 These bitsareunused and alwayssetto0.Lookup Table53 PWM Entry25:0 0x3F The PWM valuecorrespondingtothetemperaturelimitinregister52. 7 0 Thisbitisunused and alwayssetto0.Lookup Table 54 Temperature Iftheremotediodetemperatureexceedsthisvalue,thePWM outputwill6:0 0x7F Entry3 be thevalueinRegister55. 7:6 00 These bitsareunused and alwayssetto0.Lookup Table55 PWM Entry35:0 0x3F The PWM valuecorrespondingtothetemperaturelimitinregister54. 7 0 Thisbitisunused and alwayssetto0.Lookup Table 56 Temperature Iftheremotediodetemperatureexceedsthisvalue,thePWM outputwill6:0 0x7F Entry4 be thevalueinRegister57. 7:6 00 These bitsareunused and alwayssetto0.Lookup TableRead.57 PWM Entry45:0 0x3F The PWM valuecorrespondingtothetemperaturelimitinregister56.(Writeonly ifreg4A 7 0 Thisbitisunused and alwayssetto0.Lookup Tablebit5 = 1.)58 Temperature Iftheremotediodetemperatureexceedsthisvalue,thePWM outputwill6:0 0x7F Entry5 be thevalueinRegister59. 7:6 00 These bitsareunused and alwayssetto0.Lookup Table59 PWM Entry55:0 0x3F The PWM valuecorrespondingtothetemperaturelimitinregister58. 7 0 Thisbitisunused and alwayssetto0.Lookup Table 5A Temperature Iftheremotediodetemperatureexceedsthisvalue,thePWM outputwill6:0 0x7F Entry6 be thevalueinRegister5B. 7:6 00 These bitsareunused and alwayssetto0.Lookup Table5B PWM Entry65:0 0x3F The PWM valuecorrespondingtothetemperaturelimitinregister5A. 7 0 Thisbitisunused and alwayssetto0.Lookup Table 5C Temperature Iftheremotediodetemperatureexceedsthisvalue,thePWM outputwill6:0 0x7F Entry7 be thevalueinRegister5D. 7:6 00 These bitsareunused and alwayssetto0.Lookup Table5D PWM Entry75:0 0x3F The PWM valuecorrespondingtothetemperaturelimitinregister5C. 7 0 Thisbitisunused and alwayssetto0.Lookup Table 5E Temperature Iftheremotediodetemperatureexceedsthisvalue,thePWM outputwill6:0 0x7F Entry8 be thevalueinRegister5F. 7:6 00 These bitsareunused and alwayssetto0.Lookup Table5F PWM Entry85:0 0x3F The PWM valuecorrespondingtothetemperaturelimitinregister5E. 4FHEX LOOKUP TABLE HYSTERESIS 7:5 000 Lookup These bitsareunused and alwayssetto0 4F R/W Table 4:0 00100 The amount ofhysteresisappliedtotheLookup Table.(1LSB = 1°C).Hysteresis Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 23 ProductFolderLinks:LM63
SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 www.ti.com Table6.ConfigurationRegister ADDRESS READ/ PORBITS NAME DESCRIPTIONHEX WRITE VALUE 03 (09)HEX CONFIGURATION REGISTER When thisbitisa 0,ALERT interruptsareenabled.ALERT7 0 When thisbitissettoa 1,ALERT interruptsaremasked, and theMask ALERT pinisalwaysina high-impedance(open)state. When thisbitisa 0,theLM63 isinoperationalmode, converting, comparing,and updatingthePWM outputcontinuously. When thisbitisa 1,theLM63 entersa low-powerstandbymode. 6 0 STANDBY InSTANDBY, continuousconversionsarestopped,buta conversion/comparisoncyclemay be initiatedby writingany valueto register0x0F.OperationofthePWM outputinSTANDBY depends on thesettingofbit5 inthisregister. When thisbitisa 0,theLM63 ’s PWM outputcontinuestooutputthe PWM Disable currentfancontrolsignalwhileinSTANDBY.5 0 inSTANDBY When thisbitisa 1,thePWM outputisdisabled(asdefinedby the PWM polaritybit)whileinSTANDBY. 4:3 00 These bitsareunused and alwayssetto0. When thisbitisa 0,theALERT/Tach pinisan open drainALERT03 (09) R/W output. ALERT/Tach When thisbitisa 1,theALERT/Tach pinisa high-impedance2 0 Select Tachometerinput. Note thatifthisbitisset,thefunctionoftheALERT/Tach pinmust be Tach input,so an externalALERT conditionwillnotoccur. The T_CRIT limitfortheremotediodeisnominally85°C. Thisvalue can be changed once afterpower-upby firstsettingthisbittoa 1,T_CRIT Limit1 0 thenprogramminga new T_CRIT valueintotheRemote DiodeOverride T_CRIT Limit(register0x19).The T_CRIT valuecan notbe changed againexceptby cyclingpower totheLM63. 0:an ALERT willbe generatedifany Remote Diodeconversionresult isabove theRemote High Set Pointor below theRemote Low RDTS Fault Setpoint.0 0 Queue 1:an ALERT willbe generatedonlyifthreeconsecutiveRemote Diodeconversionsareabove theRemote High Set Pointor below theRemote Low Setpoint.
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www.ti.com SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 Table7.Tachometer Count And LimitRegisters ADDRESS READ/ PORBITS NAME DESCRIPTIONHEX WRITE VALUE 47HEX TACHOMETER COUNT (MSB) and 46HEX TACHOMETER COUNT (LSB) REGISTERS (16bits:Read LSB firsttolockMSB and ensure MSB and LSB arefrom thesame reading) Tachometer These registerscontainthecurrent16-bitTachometer47 Read Only 7:0 N/A Count (MSB) Count,representingtheperiodoftimebetween tachpulses. Note thatthe16-bittachometerMSB and LSB arereversedTachometerRead Only 7:2 N/A fromthe16-bittemperaturereadings.Count (LSB) Bits Edges Used Tach_Count_Multiple 00: Reserved-do notuse 01: 2 4 Tachometer 10: 3 246 Read Only 1:0 00 Edge Count 11: 5 1 Note:IfPWM_Clock_Select = 360 kHz,then Tach_Count_Multiple= 1 regardlessofthesettingofthese bits. 49HEX TACHOMETER LIMIT(MSB) and 48HEX TACHOMETER LIMIT(LSB) REGISTERS Tachometer These registerscontainthecurrent16-bitTachometer49 R/W 7:0 0xFF LimitMSB) Count,representingtheperiodoftimebetween tachpulses. Fan RPM = (f*5,400,000)/(TachometerCount),where f= 1 for2 pulses/revfan;f= 2 for1 pulse/revfan;and f= 2/3 for3 pulses/revfan.See theAPPLICATION NOTES sectionTachometerR/W 7:2 0xFF attheend ofthisdatasheetformore tachometerLimit(LSB)48 information.Note thatthe16-bittachometerMSB and LSB arereversedfromthe16 bittemperaturereadings. R/W 1:0 [Reserved] Not Used. Table8.LocalTemperature And LocalHigh SetpointRegisters ADDRESS READ/ PORBITS NAME DESCRIPTIONHEX WRITE VALUE 00HEX LOCAL TEMPERATURE REGISTER (8-bits) LocalTemperature00 Read Only 7:0 N/A 8-bitintegerrepresentingthetemperatureoftheLM63 die.Reading(8-bit) 05 (0B)HEX LOCAL HIGH SETPOINT REGISTER (8-bits) 05 R/W 7:0 0x46 (70°) LocalHIGH SetpointHighSetpointfortheinternaldiode. Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 25 ProductFolderLinks:LM63
SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 www.ti.com Table9.Remote Diode Temperature,OffsetAnd SetpointRegisters ADDRESS READ/ PORBITS NAME DESCRIPTIONHEX WRITE VALUE ThisistheMSB ofthe2’s complement value,representingthe Remote Diode temperatureoftheremotediodeconnectedtotheLM63. Bit7 isthe 01 Read Only 7:0 N/A Temperature signbit,bit6 has a weightof0x40 (64°),and bit0 has a weightof1°C. Reading(MSB) Thisbytetobe readfirst.The LM63C and LM63D willreporttheactual thermaldiodetemperature. ThisistheLSB ofthe2’s complement value,representingthe temperatureoftheremotediodeconnectedtotheLM63. Bit7 has aRemote Diode7:5 N/A weight0.5°C, bit6 has a weightof0.25°C, and bit5 has a weightof10 Read Only Temperature 0.125°C.Reading(MSB) 4:0 00 Always00. Remote These registerscontainthevalueadded toorsubtractedfromthe
11 R/W 7:5 00 Temperature remotediode’s readingtocompensate forthedifferentnon-ideality
OFFSET (MSB) factorsofdifferentprocessors,diodes,etc.The 2’s complement value, intheseregistersisadded totheoutputoftheLM63 ’s ADC toformtheRemote7:5 00 temperaturereadingcontainedinregisters01 and 10.12 R/W Temperature 4:0 00 OFFSET (LSB) Always00. 0x46 Remote HIGH07 (0D) R/W 7:0 Highsetpointtemperatureforremotediode.Same formatas Remote(70°C) Setpoint(MSB) Temperature Reading (registers01 and 10). 7:5 00 Remote HIGH13 R/W Setpoint(LSB)4:0 00 Always00. 00 Remote LOW08 (0E) R/W 7:0 Low setpointtemperatureforremotediode.Same formatas Remote(0°C) Setpoint(MSB) Temperature Reading (registers01 and 10). 7:5 00 Remote LOW14 R/W Setpoint(LSB)4:0 00 Always00. This8-bitintegerstoringtheT_CRIT limitisnominally85°C. Thisvalue can be changed once afterpower-upby settingT_CRIT LimitOverride0x55 Remote Diode19 R/W 7:0 (bit1)intheConfigurationregistertoa 1,thenprogramminga new(85°C) T_CRIT Limit T_CRIT valueintothisregister.The T_CRIT Limitcan notbe changed againexceptby cyclingpower totheLM63. Remote Diode 8-bitintegerstoringT_CRIT hysteresis.T_CRIT staysactivateduntil0x0A21 R/W 7:0 T_CRIT theremotediodetemperaturegoes below[(T_CRITLimit)— (T_CRIT(10°C) Hysteresis Hysteresis)]. 7:3 00000 These bitsareunused and shouldalwayssetto0. 00:FilterDisabledRemote Diode 01:FilterLevel1 (minimalfiltering,same as 10)2:1 00 Temperature 10:FilterLevel1 (minimalfiltering,same as 01)FilterBF R/W 11:FilterLevel2 (maximum filtering) 0:theALERT/Tach pinfunctionsnormally. Comparator 1:theALERTTach pinbehaves as a comparator,assertingitselfwhen0 0 Mode an ALERT conditionexists,de-assertingitselfwhen theALERT conditiongoes away.
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www.ti.com SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 Table10.ALERT Statusand Mask Registers ADDRESS READ/ PORBITS NAME DESCRIPTIONHEX WRITE VALUE 02HEX ALERT STATUS REGISTER (8-bits)(AllAlarms arelatcheduntilread,then clearedifalarm conditionwas removed atthe timeoftheread.) When thisbitisa 0,theADC isnotconverting. 7 0 Busy When thisbitissettoa 1,theADC isperforminga conversion.Thisbit does notaffectALERT status. When thisbitisa 0,theinternaltemperatureoftheLM63 isatorbelow Local theLocalHighSetpoint.6 0 HighAlarm When thisbitisa 1,theinternaltemperatureoftheLM63 isabove the LocalHighSetpoint,and an ALERT istriggered. 5 0 Thisbitisunused and alwaysreadas 0. When thisbitisa 0,thetemperatureoftheRemote Diodeisator Remote belowtheRemote HighSetpoint.4 0 HighAlarm When thisbitisa 1,thetemperatureoftheRemote Diodeisabove the Remote HighSetpoint,and an ALERT istriggered. When thisbitisa 0,thetemperatureoftheRemote Diodeisator Remote above theRemote Low Setpoint.3 0 Low Alarm When thisbitisa 1,thetemperatureoftheRemote Diodeisbelowthe Remote Low Setpoint,and an ALERT istriggered. 0x02 Read Only When thisbitisa 0,theRemote Diodeappearstobe correctly Remote Diode connected.2 0 FaultAlarm When thisbitisa 1,theRemote Diodemay be disconnectedor shorted.ThisAlarmdoes nottriggeran ALERT. When thisbitisa 0,thetemperatureoftheRemote Diodeisator Remote belowtheT_CRIT Limit.1 0 T_CRIT Alarm When thisbitisa 1,thetemperatureoftheRemote Diodeisabove the T_CRIT Limit,and an ALERT istriggered.. When thisbitisa 0,theTachometercountislowerthanorequaltothe TachometerLimit(theRPM ofthefanisgreaterthanorequaltothe minimum desiredRPM). When thisbitisa 1,theTachometercountishigherthanthe 0 0 Tach Alarm TachometerLimit(theRPM ofthefanislessthantheminimum desiredRPM), and an ALERT istriggered.Note thatifthisbitisset, thefunctionoftheALERT/Tach pinmust be Tach input,so an external ALERT conditionwillnotbe generated.The usermay readthestatus registerperiodicallytofindoutifand ALERT conditionhas occurred. 16HEX ALERT MASK REGISTER (8-bits) 7 1 Thisbitisunused and alwaysreadas 1. LocalHigh When thisbitisa 0,a LocalHighAlarmeventwillgeneratean ALERT.6 0 AlarmMask When thisbitisa 1,a LocalHighAlarmwillnotgeneratean ALERT 5 1 Thisbitisunused and alwaysreadas 1. When thisbitisa 0,Remote HighAlarmeventwillgeneratean Remote ALERT.4 0 HighAlarmMask When thisbitisa 1,a Remote HighAlarmeventwillnotgeneratean ALERT. When thisbitisa 0,a Remote Low Alarmeventwillgeneratean16 R/W Remote ALERT.3 0 Low Alarm When thisbitisa 1,a Remote Low AlarmeventwillnotgenerateanMask ALERT. 2 1 Thisbitisunused and alwaysreadas 1. Remote When thisbitisa 0,a Remote T_CRIT eventwillgeneratean ALERT. 1 0 T_CRIT When thisbitisa 1,a Remote T_CRIT eventwillnotgeneratean AlarmMask ALERT. Tach When thisbitisa 0,a Tach Alarmeventwillgeneratean ALERT.0 0 AlarmMask When thisbitisa 1,a Tach Alarmeventwillnotgeneratean ALERT. Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 27 ProductFolderLinks:LM63
SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 www.ti.com Table11.Conversion Rate And One-Shot Registers ADDRESS READ/ PORBITS NAME DESCRIPTIONHEX WRITE VALUE 04 (0A)HEX CONVERSION RATE REGISTER (8-bits) SetstheconversionrateoftheLM63. 00000000 = 0.0625Hz 00000001 = 0.125Hz 00000010 = 0.25Hz 00000011 = 0.5Hz Conversion 00000100 = 1 Hz04 (0A) R/W 7:0 0x08 Rate 00000101 = 2 Hz 00000110 = 4 Hz 00000111 = 8 Hz 00001000 = 16 Hz 00001001 = 32 Hz Allothervalues= 32 Hz 04 (0A)HEX ONE-SHOT REGISTER (8-bits) Write One Shot WiththeLM63 intheSTANDBY mode a singlewritetothisregisterwill0F 7:0 N/AOnly Trigger initiateone completetemperatureconversioncycle. Table12.ID Registers ADDRESS READ/ PORBITS NAME DESCRIPTIONHEX WRITE VALUE FFHEX STEPPING /DIE REVISION ID REGISTER (8-bits) Read Stepping/DieFF 7:0 0x41 VersionofLM63Only RevisionID FE HEX MANUFACTURER ’S ID REGISTER (8-bits) ReadFE 7:0 0x01 Manufacturer’s ID 0x01 = Texas InstrumentsOnly
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%100 %100___ __(%) u= forValuePWM ValuePWMDutyCycle LM63 www.ti.com SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 APPLICATION NOTES FAN CONTROL DUTY CYCLE VS. REGISTER SETTINGS AND FREQUENCY ACTUALPWM PWMPWM PWM PWM DUTYPWM STEP FREQ AT FREQ ATVALUE VALUE VALUE CYCLE, %FREQ RESOLUTION, 360 kHz 1.4kHz4D [5:0] 4C [5:0]FOR 4C [5:0] WHEN4D [4:0] % INTERNAL INTERNALFOR 100% ABOUT 75% FOR 50% 75% ISCLOCK, kHz CLOCK, Hz SELECTED
0 Address0 ismapped toAddress1
1 50 2 1 1 180.0 703.1 50.0 2 25 4 3 2 90.00 351.6 75.0 3 16.7 6 5 3 60.00 234.4 83.3 4 12.5 8 6 4 45.00 175.8 75.0 5 10.0 10 8 5 36.00 140.6 80.0 6 8.33 12 9 6 30.00 117.2 75.0 7 7.14 14 11 7 25.71 100.4 78.6 8 6.25 16 12 8 22.50 87.9 75.0 9 5.56 18 14 9 20.00 78.1 77.8 10 5.00 20 15 10 18.00 70.3 75.0 11 4.54 22 17 11 16.36 63.9 77.27 12 4.16 24 18 12 15.00 58.6 75.00 13 3.85 26 20 13 13.85 54.1 76.92 14 3.57 28 21 14 12.86 50.2 75.00 15 3.33 30 23 15 12.00 46.9 76.67 16 3.13 32 24 16 11.25 43.9 75.00 17 2.94 34 26 17 10.59 41.4 76.47 18 2.78 36 27 18 10.00 39.1 75.00 19 2.63 38 29 19 9.47 37.0 76.32 20 2.50 40 30 20 9.00 35.2 75.00 21 2.38 42 32 21 8.57 33.5 76.19 22 2.27 44 33 22 8.18 32.0 75.00 23 2.17 46 35 23 7.82 30.6 76.09 24 2.08 48 36 24 7.50 29.3 75.00 25 2.00 50 38 25 7.20 28.1 76.00 26 1.92 52 39 26 6.92 27.0 75.00 27 1.85 54 41 27 6.67 26.0 75.93 28 1.79 56 42 28 6.42 25.1 75.00 29 1.72 58 44 29 6.21 24.2 75.86 30 1.67 60 45 30 6.00 23.4 75.00 31 1.61 62 47 31 5.81 22.7 75.81 COMPUTING DUTY CYCLES FOR A GIVEN FREQUENCY Selecta PWM Frequencyfromthefirstcolumn correspondingtothedesiredactualfrequencyincolumns 6 or7. Note thePWM Valuefor100% DutyCycle. FindtheDutyCycleby takingthePWM ValueofRegister4C and computing: (1) Example: For a PWM Frequencyof24,a PWM Valueat100% = 48 and PWM Valueactual= 28,thentheDuty Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 29 ProductFolderLinks:LM63
RPMRPMFan _2723 1983 )_(__ 000,400, 5_ DecimalCountTachTotal fRPMFan u= LM63 SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 www.ti.com REQUIRED INITIALFAN CONTROL REGISTER SEQUENCE Important!The BIOS must followthesequence listedinTable13 toconfigurethefollowingFan Registersforthe LM63 beforeusingany oftheFan orTachometerorPWM registers. Table13.[Register]HEX and Setup Instructions STEP [Register]HEX AND SETUP INSTRUCTIONS (1) [4A]Writebits0 and 1;3 and 4.Thisincludestachsettingsifused,PWM internalclockselect(1.4kHz or360 kHz)and PWM1 OutputPolarity. 2 [4B]Writebits0 through5 toprogramthespin-upsettings. 3 [4D]Writebits0 through4 tosetthefrequencysettings.ThisworkswiththePWM internalclockselect. Choose,thenwrite,onlyone ofthefollowing: 4 A.[4F–5F]theLookup Table,or B.[4C]thePWM valuebits0 through5. 5 IfStep4A,Lookup Table,was chosen and writtenthenwrite[4A]bit5 = 0. (1) Allotherregisterscan be writtenatany timeaftertheabove sequence. COMPUTING RPM OF THE FAN FROM THE TACH COUNT The Tach Count Registers46HEX and 47HEX countthenumber ofperiodsofthe90 kHz tachometerclockinthe LM63 forthetachometerinputfromthefanassuming a 2 pulseperrevolutionfantachometer,such as thefans suppliedwiththe Pentium 4 boxed processors.The RPM of the fan can be computed from the Tach Count Registers46HEX and 47HEX .Thiscan bestbe shown throughan example. EXAMPLE: Given:thefanused has a tachometeroutputwith2 perrevolution. Let:
- Register46 (LSB)isBF HEX = Decimal(11x 16)+ 15 = 191 and
- Register47 (MSB) is7HEX = Decimal(7x 256)= 1792. The totalTach Count,indecimal,is191 + 1792 = 1983. The RPM iscomputed usingtheformula where
- f= 1 for2 pulses/revfantachometeroutput;
- f= 2 for1 pulse/revfantachometeroutput,and
- f= 2 /3 for3 pulses/revfantachometeroutput (2) Forourexample (3)
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2.2 nF PROCESSOR IC IR IE = IF LM63 www.ti.com SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 USE OF THE LOOKUP TABLE FOR NON-LINEAR PWM VALUES VS TEMPERATURE The Lookup Table,Registers50 through5F,can be used tocreatea non-linearPWM vs Temperaturecurvethat couldbe used to reduce the acousticnoisefrom processorfan due to linearor step transferfunctions.An example isgivenbelow. EXAMPLE: Ina particularsystem itwas foundthatthebestacousticfannoiseperformancewas foundtooccurwhen the PWM vs Temperaturetransferfunctioncurvewas parabolicinshape. From 25°C to105°C thefanistogo from 20% to100%. Sincethereare 8 stepstotheLookup Tablewe will breakup theTemperaturerangeinto8 separatetemperatures.For the80°C over8-steps= 10°C perstep.This takescareofthex-axis. For the PWM Value,we firstselectthe PWM Frequency.In thisexample,we willmake the PWM Frequency (Register4C) 20. For100% DutyCyclethen,thePWM valueis40.For20%, theminimum is40 x (0.2)= 8. We can thenarrangethePWM, Temperaturepairsina parabolicfashionintheformofy = 0.005•(x−25)2 + 8 PWM VALUE CLOSEST PWMTEMPERATURE CALCULATED VALUE 25 8.0 8 35 8.5 9 45 10.0 10 55 12.5 13 65 16.0 16 75 20.5 21 85 26.0 26 95 32.5 33 105 40.0 40 We can thenprogram theLookup Tablewiththetemperatureand ClosestPWM Valuesrequiredforthecurve requiredinourexample. NON-IDEALITY FACTOR AND TEMPERATURE ACCURACY The LM63 can be appliedto remote diode sensingin the same way as otherintegrated-circuittemperature sensors.Itcan be solderedto a printed-circuitboard,and because the path of best thermalconductivityis between thedieand thepins,itstemperaturewilleffectivelybe thatoftheprinted-circuitboardlandsand traces solderedto itspins.This presumes thatthe ambient airtemperatureis nearlythe same as the surface temperatureof the printed-circuitboard.Ifthe airtemperatureis much higheror lower than the surface temperature,theactualtemperatureoftheLM63 diewillbe an intermediatetemperaturebetween thesurface and airtemperatures.Again,the primarythermalconductionpath isthroughthe leads,so the circuitboard surfacetemperaturewillcontributetothedietemperaturemuch more thantheairtemperature. To measure thetemperatureexternaltothedieuse a remotediode.Thisdiodecan be locatedon thedieofthe targetIC,such as a CPU processorchipas shown inFigure14,allowingmeasurement oftheIC’s temperature, independentoftheLM63 ’s temperature.The LM63 has been optimizedforuse withthethermaldiodeon thedie ofan IntelPentium4 ora MobilePentium4 Processor-Mprocessor. Figure14. Processor Connection toLM63 Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 31 ProductFolderLinks:LM63
N q kTVbe ln¸¨ ' K ¸ SF II e T be V V K ª º VT = q kT SF II e T be V V K 1 ª º MMBT3904 IR IF LM63 2.2 nF LM63 SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 www.ti.com A discretediodecan alsobe used tosense thetemperatureofexternalobjectsorambientair.Remember thata discretediode’s temperaturewillbe affected,and oftendominatedby,thetemperatureofitsleads. Most silicondiodesdo notlendthemselveswelltothisapplication.Itisrecommended thata diode-connected 2N3904 transistorbe used,as shown inFigure15.The base ofthetransistorisconnectedtothecollectorand becomes theanode.The emitteristhecathode. Figure15. Processor Connection toLM63 A LM63 witha diode-connected2N3904 transistorapproximatesthetemperaturereadingoftheLM63 withthe Pentium4 processorby 1°C. T2N3904 = TPENTIUM 4 − 1°C (4) DIODE NON-IDEALITY When a transistorisconnectedtoa diodethefollowingrelationshipholdsforVbe,T,and IF: where (5)
- q = 1.6x10−19 Coulombs (theelectroncharge)
- T = AbsoluteTemperatureinKelvin
- k = 1.38x10−23 joules/K(Boltzmann’s constant)
- η isthenon-idealityfactorofthemanufacturingprocessused tomake thethermaldiode
- Is = SaturationCurrentand isprocessdependent
- If = ForwardCurrentthroughthebase emitterjunction
- Vbe = Base EmitterVoltageDrop (6) Intheactiveregion,the−1 termisnegligibleand may be eliminated,yieldingthefollowingequation (7) InEquation7,η and Is aredependentupon theprocessthatwas used inthefabricationoftheparticulardiode. By forcingtwo currentswitha very controlledratio(N) and measuring the resultingvoltagedifference,itis possibletoeliminatetheIs term.Solvingfortheforwardvoltagedifferenceyieldstherelationship: (8)
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www.ti.com SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 The voltageseen by theLM63 alsoincludestheIF×R S voltagedrop acrosstheinternalseriesresistanceofthe Pentium 4 processor’s thermaldiode.The non-idealityfactor,η,istheonlyotherparameternotaccountedfor and depends on the diode thatisused formeasurement. Since ΔVbe isproportionalto both η and T, the variationsinη cannotbe distinguishedfrom variationsintemperature.Sincethetemperaturesensordoes not controlthenon-idealityfactor,itwilldirectlyadd totheinaccuracyofthesensor. For theIntelPentium4 and MobilePentium4 Processor-MprocessorsIntelspecifiesa ±0.1% variationinη from parttopart.As an example,assume thata temperaturesensorhas an accuracyspecificationof±1% °C atroom temperatureof 25°C and processused to manufacturethe diodehas a non-idealityvariationof ±0.1%. The resultingaccuracywillbe: The additionalinaccuracyinthetemperaturemeasurement caused by η,can be eliminatedifeach temperature sensoriscalibratedwiththeremotediodethatitwillbe pairedwith.Refertotheprocessordatasheetforthenon- idealityfactor. COMPENSATING FOR DIODE NON-IDEALITY In orderto compensate forthe errorsintroducedby non-ideality,the temperaturesensor iscalibratedfora particularprocessor.Texas Instrumentstemperaturesensorsarealwayscalibratedtothetypicalnon-idealityofa particularprocessortype. The LM63 iscalibratedforthenon-idealityofthe0.13micronIntelPentium4 and MobilePentium4 Processor-M processors. When a temperaturesensor,calibratedfora specifictypeofprocessorisused witha differentprocessortypeor a givenprocessortypehas a non-idealitythatstraysformthetypicalvalue,errorsareintroduced. Temperatureerrorsassociatedwithnon-idealitymay be introducedina specifictemperaturerange ofconcern throughtheuse oftheTemperatureOffsetRegisters11HEX and 12HEX . The userisencouragedtosend an e-mailtohardware.monitor.team@ti.comtofurtherrequestinformationon ourrecommended settingoftheoffsetregisterfordifferentprocessortypes. Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 33 ProductFolderLinks:LM63
SNAS190E –SEPTEMBER 2002–REVISED MAY 2013 www.ti.com PCB LAYOUT FOR MINIMIZING NOISE Figure16. IdealDiode Trace Layout Ina noisyenvironment,such as a processormotherboard,layoutconsiderationsareverycritical.Noiseinduced on tracesrunningbetween the remote temperaturediode sensor and the LM63 can cause temperature conversionerrors.Keep inmind thatthesignalleveltheLM63 istryingtomeasure isinmicrovolts.The following guidelinesshouldbe followed: 1. Use a low-noise+3.3VDC power supply,and bypass toGND witha 0.1µF ceramiccapacitorinparallelwith a 100 pF ceramiccapacitor.A bulkcapacitanceof10 µF needs tobe inthevicinityoftheLM63's VDD pin. 2. Placethe100pF power supplybypass capacitoras closeas possibletotheVDD pinand therecommended 2.2 nF diodecapacitoras closeas possibleto the LM63's D+ and D − pins.Make sure the tracesto the 2.2nF capacitorarematched. 3. Ideally,the LM63 shouldbe placedwithin10 cm of the Processordiode pinswiththe tracesbeing as straight,shortand identicalas possible.Trace resistanceof1 Ω can cause as much as 1°C oferror.This errorcan be compensated by usingthe Remote TemperatureOffsetRegisters,sincethe valueplacedin theseregisterswillautomaticallybe subtractedfromoradded totheremotetemperaturereading. 4. Diode tracesshouldbe surroundedby a GND guard ringtoeitherside,above and below ifpossible.This GND guard shouldnotbe between theD+ and D − lines.Intheeventthatnoisedoes coupletothediode linesitwouldbe idealifitiscoupledcommon mode. ThatisequallytotheD+ and D − lines. 5. Avoidroutingdiodetracesincloseproximitytopower supplyswitchingorfilteringinductors. 6. Avoidrunningdiodetracesclosetoor paralleltohigh-speeddigitaland bus lines.Diode tracesshouldbe keptatleast2 cm apartfromthehigh-speeddigitaltraces. 7. Ifitisnecessarytocrosshigh-speeddigitaltraces,thediodetracesand thehigh-speeddigitaltracesshould crossata 90 degreeangle. 8. The idealplacetoconnecttheLM63's GND pinisas closeas possibletotheProcessor'sGND associated withthesense diode. 9. Leakage currentbetween D+ and GND shouldbe keptto a minimum. One nano-ampere of leakagecan cause as much as 1°C oferrorinthediodetemperaturereading.Keepingtheprintedcircuitboardas clean as possiblewillminimizeleakagecurrent. Noisecouplingintothedigitallinesgreaterthan400 mVp-p (typicalhysteresis)and undershootlessthan500 mV below GND, may preventsuccessfulSMBus communicationwiththeLM63. SMBus no acknowledgeisthemost common symptom, causing unnecessary trafficon the bus. Althoughthe SMBus maximum frequencyof communicationisratherlow (100 kHz max),carestillneeds tobe takentoensureproperterminationwithina system withmultiplepartson the bus and longprintedcircuitboard traces.An RC lowpass filterwitha 3 dB cornerfrequencyofabout40 MHz isincludedon theLM63's SMBCLK input.Additionalresistancecan be added inserieswiththeSMBData and SMBCLK linestofurtherhelpfilternoiseand ringing.Minimizenoisecouplingby keepingdigitaltracesoutofswitchingpower supplyareasas wellas ensuringthatdigitallinescontaininghigh- speed datacommunicationscrossatrightanglestotheSMBData and SMBCLK lines.
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REVISION HISTORY
Changes from RevisionD (May 2013)toRevisionE Page Copyright© 2002–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 35 ProductFolderLinks:LM63
www.ti.com 15-Jul-2026 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM63CIMA NRND Production SOIC (D) | 8 95 | TUBE No Call TI Call TI 0 to 125 LM63 CIMA LM63CIMA.A NRND Production SOIC (D) | 8 95 | TUBE No Call TI Call TI 0 to 125 LM63 CIMA LM63CIMA/NOPB Obsolete Production SOIC (D) | 8 - - Call TI Call TI 0 to 125 LM63 CIMA LM63CIMAX/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 125 LM63 CIMA LM63CIMAX/NOPB.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 125 LM63 CIMA LM63DIMA/NOPB Obsolete Production SOIC (D) | 8 - - Call TI Call TI 0 to 125 LM63 DIMA LM63DIMAX/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 125 LM63 DIMA LM63DIMAX/NOPB.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 125 LM63 DIMA (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Addendum-Page 1
www.ti.com 15-Jul-2026 Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM63CIMAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM63DIMAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) LM63CIMA D SOIC 8 95 495 8 4064 3.05 LM63CIMA D SOIC 8 95 495 8 4064 3.05 LM63CIMA.A D SOIC 8 95 495 8 4064 3.05 LM63CIMA.A D SOIC 8 95 495 8 4064 3.05 Pack Materials-Page 3
www.ti.com PACKAGE OUTLINE C .228-.244 TYP [5.80-6.19] .069 MAX [1.75] 6X .050 [1.27] 8X .012-.020 [0.31-0.51] .150 [3.81] .005-.010 TYP [0.13-0.25] 0 - 8 .004-.010 [0.11-0.25] .010 [0.25].016-.050 [0.41-1.27] 4X (0 -15 ) A .189-.197 [4.81-5.00] NOTE 3 B .150-.157 [3.81-3.98] NOTE 4 4X (0 -15 ) (.041) [1.04] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. 1 8 .010 [0.25] C A B PIN 1 ID AREA SEATING PLANE .004 [0.1] C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800
www.ti.com EXAMPLE BOARD LAYOUT .0028 MAX [0.07] ALL AROUND .0028 MIN [0.07] ALL AROUND (.213) [5.4] 6X (.050 ) [1.27] 8X (.061 ) [1.55] 8X (.024) [0.6] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM 4 5 SEE DETAILS SYMM
www.ti.com EXAMPLE STENCIL DESIGN 8X (.061 ) [1.55] 8X (.024) [0.6] 6X (.050 ) [1.27] (.213) [5.4] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X SYMM SYMM 4 5
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