LM6225N

LM6125 NSC | Alldatasheet

Document overview

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Technical content

Features

n High slew rate: 800 V/µs n High output current:±300 mA n Stable with large capacitive loads n Current and thermal limiting n Electronic shutdown n 5V to±15V operation guaranteed n Fully specified to drive 50Ω lines

Applications

Simplified Schematic and Block Diagram VIP™ is a trademark of National Semiconductor Corporation. DS009222-1 DS009222-2 Numbers in () are for 14–pin N DIP. December 1994 LM6125/LM6225/LM6325 High Speed Buffer © 1999 National Semiconductor Corporation DS009222 www.national.com

Note 1:Available per 5962-9081501 DS009222-3 *Heat sinking pins. Internally connected to V−. Order Number LM6225N or LM6325N See NS Package Number N14A DS009222-4 Note:Pin 4 connected to case Top View Order Number LM6125H/883 (Note 1) or LM6125H See NS Package Number H08C www.national.com 2

Absolute Maximum Ratings(Note 2) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage 36V ( ±18V) Input to Output Voltage (Note 2) ±7V Input Voltage ±Vsupply Output Short-Circuit to GND (Note 3) Continuous Flag Output Voltage GND ≤ Vflag≤ +Vsupply Storage Temperature Range −65˚C to +150˚C Lead Temperature (Soldering, 10 seconds) 260˚C ESD Tolerance (Note 9) ±1500V θJA (Note 4) H Package 150˚C/W N Package 40˚C/W Maximum Junction Temperature (T J) 150˚C Operating Temperature Range LM6125 −55˚C to +125˚C LM6225 −40˚C to +85˚C LM6325 0˚C to +70˚C Operating Supply Voltage Range 4.75V to ±16V The following specifications apply for Supply Voltage= ±15V, VCM = 0, RL ≥ 100 kΩ and RS = 50Ω unless otherwise noted. Boldfacelimits apply for TA = TJ = TMIN to TMAX ; all other limits TA = TJ = 25˚C. Symbol Parameter Conditions Typ LM6125 LM6225 LM6325 Units Limit Limit Limit (Notes 5, 10) (Note 5) (Note 5) AV1 Voltage Gain 1 R L = 1kΩ ,V IN = ±10V 0.990 0.980 0.980 0.970 0.970 0.950 0.950 AV2 Voltage Gain 2 R L = 50Ω ,V IN = ±10V 0.900 0.860 0.860 0.850 V/V 0.800 0.820 0.820 Min AV3 Voltage Gain 3 R L = 50Ω ,V += 5V 0.840 0.780 0.780 0.750 (Note 6) V IN = 2V PP (1.5 VPP ) 0.750 0.700 0.700 VOS Offset Voltage R L = 1k Ω 15 30 30 50 mV 50 60 100 Max IB Input Bias Current R L = 1k Ω ,R S = 10 kΩ 14 4 5 µ A 77 7 Max R IN Input Resistance R L = 50Ω 5M Ω C IN Input Capacitance 3.5 pF R O Output Resistance I OUT = ±10 mA 3 5 5 5 Ω 10 10 6 Max IS1 Supply Current 1 R L = ∞ 15 18 18 20 20 20 22 IS2 Supply Current 2 R L = ∞ ,V += 5V 14 16 16 18 mA 18 18 20 Max IS/D Supply Current R L = ∞ ,V ± = ±15V 1.1 1.5 1.5 1.5 in Shutdown 2.0 2.0 2.0 VO1 Output Swing 1 R L = 1k Ω 13.5 13.3 13.3 13.2 13 13 13 VO2 Output Swing 2 R L = 100Ω 12.7 11.5 11.5 11 ±V 10 10 10 Min VO3 Output Swing 3 R L = 50Ω 12 11 11 10 99 9 VO4 Output Swing 4 R L = 50Ω 1.8 1.6 1.6 1.6 V PP 1.3 1.4 1.5 Min PSRR Power Supply V+ = 5V (Note 6) 70 60 60 60 dB Rejection Ratio 55 50 50 Min VOL Flag Pin Output V ± = ±5V to±15V 300 300 340 mV Low Voltage V S/D = 0V 400 400 400 Max www.national.com3

The following specifications apply for Supply Voltage= ±15V, VCM = 0, RL ≥ 100 kΩ and RS = 50Ω unless otherwise noted. Boldfacelimits apply for TA = TJ = TMIN to TMAX ; all other limits TA = TJ = 25˚C. Symbol Parameter Conditions Typ LM6125 LM6225 LM6325 Units Limit Limit Limit (Notes 5, 10) (Note 5) (Note 5) IOH Flag Pin Output V OH Flag Pin= 15V 0.01 10 10 10 µA High Current (Note 6) 20 20 20 Max VTH Shutdown Threshold 1.4 V VIH Shutdown Pin 2.0 2.0 2.0 V Trip Point High 2.0 2.0 2.0 Min V IL Shutdown Pin 0.8 0.8 0.8 V Trip Point Low 0.8 0.8 0.8 Max I IL Shutdown Pin V S/D = 0V −0.07 −10 −10 −10 µA Input Low Current −20 −20 −20 Max IIH Shutdown Pin V S/D = 5V −0.05 −10 −10 −10 µA Input High Current −20 −20 −20 Max IO Bi-State Output Current Shutdown Pin= 0V 1 50 50 100 µA VOUT = +5V or −5V 2000 100 200 The following specifications apply for Supply Voltage= ±15V, VCM = 0, RL ≥ 100 kΩ and RS = 50Ω unless otherwise noted. Boldfacelimits apply for TA = TJ = TMIN to TMAX ; all other limits TA = TJ = 25˚C. Symbol Parameter Conditions Typ LM6125 LM6225 LM6325 Units Limit Limit Limit (Note 5) (Note 5) (Note 5) SR 1 Slew Rate 1 V IN = ±11V, RL = 1k Ω 1200 V/µs MinSR 2 Slew Rate 2 V IN = ±11V, RL = 50Ω 800 550 550 550 (Note 8) SR 3 Slew Rate 3 V IN = 2V PP ,R L = 50Ω 50 V+ = 5V (Note 6) BW −3 dB Bandwidth V IN = 100 mV PP 50 30 30 30 MHz R L = 50Ω ,C L ≤ 10 pF Min tr,tf Rise Time R L = 50Ω ,C L ≤ 10 pF 8.0 ns Fall Time V O = 100 mV PP tPD Propagation R L = 50Ω ,C L ≤ 10 pF 4.0 ns Delay Time V O = 100 mV PP O S Overshoot R L = 50Ω ,C L ≤ 10 pF 10 % VO = 100 mV PP VFT VIN,V OUT Feedthrough Shutdown Pin = 0V in Shutdown V IN = 4V PP , 1 MHz −50 dB R L = 50Ω C OUT Output Capacitance Shutdown Pin = 0V 30 pF in Shutdown tSD Shutdown 700 ns Response Time Note 2:Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its rated operating conditions. Note 3:During current limit, thermal limit, or electronic shutdown the input current will increase if the input to output differential voltage exceeds 8V. See Overvoltage Protection in Application Hints. Note 4:The LM6125 series buffers contain current limit and thermal shutdown to protect against fault conditions. www.national.com 4

Note 5:For operation at elevated temperature, these devices must be derated based on a thermal resistance ofθJA and TJ max, TJ = TA + θJA PD .θJC for the LM6125H and LM6225H is 17˚C/W. The thermal impedanceθJA of the device in the N package is 40˚C/W when soldered directly to a printed circuit board, and the heat-sinking pins (pins 3, 4, 5, 10, 11, and 12) are connected to 2 square inches of 2 oz. copper. When installed in a socket, the thermal impedanceθJA of the N pack- age is 60˚C/W. Note 6:Limits are guaranteed by testing or correlation. Note 7:The input is biased to +2.5V, and VIN swings VPP about this value. The input swing is 2 VPP at all temperatures except for the AV3 test at −55˚C where it is reduced to 1.5 VPP . Note 8:The Error Flag is set (low) during current limit or thermal fault detection in addition to being set by the Shutdown pin. It is an open-collector output which re- quires an external pullup resistor. Note 9:Slew rate is measured with a±11V input pulse and 50Ω source impedance at 25˚C. Since voltage gain is typically 0.9 driving a 50Ω load, the output swing will be approximately±10V. Slew rate is calculated for transitions between±5V levels on both rising and falling edges. A high speed measurement is done to minimize device heating. For slew rate versus junction temperature see typical performance curves. The input pulse amplitude should be reduced to±10V for measurements at temperature extremes. For accurate measurements, the input slew rate should be at least 1700 V/µs. Note 10:The test circuit consists of the human body model of 120 pF in series with 1500Ω . Note 11:A military RETS specification is available on request. At the time of printing, the LM6125H/883 RETS spec complied with the Boldface limits in this column. The LM6125H/883 may also be procured as Standard Military Drawing specification#5962-9081501MXX. Typical Performance CharacteristicsTA = 25˚C, VS= ± 15V unless otherwise specified Frequency Response DS009222-9 Frequency Response DS009222-10 Slew Rate vs Temperature DS009222-11 Overshoot vs Capacitive Load DS009222-12 Large Signal Response (RL = 1k Ω ) DS009222-13 Large Signal Response (RL = 50Ω ) DS009222-14 Supply Current DS009222-15 −3 dB Bandwidth DS009222-16 Slew Rate DS009222-17 www.national.com5

Typical Performance CharacteristicsTA = 25˚C, VS= ± 15V unless otherwise specified (Continued) Typical Connection Diagram Slew Rate DS009222-18 Power Bandwidth DS009222-19 Input Return Gain (S11) DS009222-20 Forward Transmission Gain (S21) DS009222-21 Current Limit DS009222-22 DS009222-6 www.national.com 6

Physical Dimensionsinches (millimeters) unless otherwise noted Metal Can Package (H) Order Number LM6125H/883 or LM6125H Molded Dual-In-Line Package (N) Order Number LM6225N or LM6325N www.national.com 8

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Corporation Americas Tel: 1-800-272-9959 Fax: 1-800-737-7018 Email: support@nsc.com National Semiconductor Europe Fax: +49 (0) 1 80-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 1 80-530 85 85 English Tel: +49 (0) 1 80-532 78 32 Français Tel: +49 (0) 1 80-532 93 58 Italiano Tel: +49 (0) 1 80-534 16 80 National Semiconductor Asia Pacific Customer Response Group Tel: 65-2544466 Fax: 65-2504466 Email: sea.support@nsc.com National Semiconductor Japan Ltd. Tel: 81-3-5639-7560 Fax: 81-3-5639-7507 www.national.com LM6125/LM6225/LM6325 High Speed Buffer National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.