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www.ti.com SNIS119D –MAY 2004–REVISED NOVEMBER 2012 LM60/LM60-Q12.7V,SOT-23orTO-92TemperatureSensor Check forSamples: LM60/LM60-Q1 1FEATURES DESCRIPTION The LM60/LM60-Q1 is a precisionintegrated-circuit• Calibratedlinearscalefactorof+6.25mV/ °C temperaturesensor that can sense a −40°C to• Rated forfull−40°C to+125°C range +125°C temperaturerange whileoperatingfrom a
- Suitableforremote applications single+2.7V supply.The LM60/LM60-Q1's output voltageislinearlyproportionaltoCelsius(Centigrade)• AvailableinSOT-23 and TO-92 packages temperature(+6.25mV/°C) and has a DC offsetof• LM60Q isAEC-Q100 Grade 1 qualifiedand is +424 mV. The offsetallows reading negativemanufactured on an Automotive Grade flow. temperatureswithouttheneed fora negativesupply. The nominal outputvoltageof the LM60/LM60-Q1 APPLICATIONS ranges from +174 mV to +1205 mV fora −40°C to +125°C temperaturerange.The LM60/LM60-Q1 is• Automotive calibratedto provideaccuraciesof ±2.0°C at room• CellPhones & Computers temperatureand ±3°C overthefull−25°C to+125°C
- Power Supply Modules temperaturerange.
- BatteryManagement The LM60/LM60-Q1's linearoutput,+424 mV offset,
- FAX Machines & Printers and factorycalibrationsimplifyexternalcircuitry requiredin a single supply environment where• HVAC & Disk Drives readingnegativetemperaturesisrequired.Because• Appliances the LM60/LM60-Q1's quiescentcurrentislessthan 110 μA, self-heatingislimitedtoa verylow 0.1°C inKEY SPECIFICATIONS stillairinthe SOT-23 package.Shutdown capability for the LM60/LM60-Q1 is intrinsicbecause its• Accuracy at25°C: ±2.0°C and ±3.0°C (max) inherentlow power consumption allows itto be• Accuracy for−40°C to+125°C: ±4.0°C (max) powered directlyfromtheoutputofmany logicgates.
- Accuracy for−25°C to+125°C: ±3.0°C (max) TYPICAL APPLICATION• Temperature Slope:+6.25mV/°C
- Power Supply VoltageRange: +2.7V to+10V
- CurrentDrainat25°C: 110μA (max)
- Nonlinearity:±0.8°C (max)
- Output Impedance: 800Ω (max) CONNECTION DIAGRAMS SOT-23 (TOP VIEW) VO = (+6.25mV/°C × T°C) + 424 mV Temperature (T) TypicalVO +125°C +1205 mV +100°C +1049 mV +25°C +580 mV TO-92 (BOTTOM VIEW) 0°C +424 mV –25°C +268 mV –40°C +174 mV Figure1.Full-RangeCentigradeTemperature Sensor (−40°C to125°C) Operatingfrom a SingleLi-Ion BatteryCell Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2004–2012,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SNIS119D –MAY 2004–REVISED NOVEMBER 2012 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates.
ORDERING INFORMATION
ACCURACY OVER SPECIFIED SPECIFIEDORDER NUMBER DEVICE TOP MARK TEMPERATURE RANGE TEMPERATURE RANGE LM60BIM3 T6B LM60BIM3X T6B LM60CIM3 T6C LM60CIM3X T6C LM60QIM3 L60Q LM60QIM3X L60Q LM60BIZ LM60BIZ ±3 –25°C ≤ TA ≤ +125°C LM60CIZ LM60CIZ ±4 –40°C ≤ TA ≤ +125°C ABSOLUTE MAXIMUM RATINGS (1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) VALUE UNIT Supplyvoltage +12 to−0.2 V Outputvoltage (+VS + 0.6)to−0.6 V Outputcurrent 10 mA InputCurrentatany pin(2) 5 mA Human Body Model 2500 V ESD Susceptibility(3) SOT-23 250 V Machine Model TO-92 200 V Storagetemperature −65 to+150 °C Maximum junctiontemperature(TJMAX ) 125 °C (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisfunctional,butdo not guaranteespecificperformancelimits.Forspecifiedspecificationsand testconditions,see the ElectricalCharacteristics.The specifiedspecificationsapplyonlyforthetestconditionslisted.Some performancecharacteristicsmay degradewhen thedeviceisnotoperatedunderthelistedtestconditions. (2) When theinputvoltage(VI)atany pinexceedspower supplies(VI< GND orVI> +VS),thecurrentatthatpinshouldbe limitedto5 mA. (3) The human body model isa 100 pF capacitordischargedthrougha 1.5kΩ resistorintoeach pin.The machine model isa 200 pF capacitordischargeddirectlyintoeach pin. RECOMMENDED OPERATING CONDITIONS (1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN NOM MAX UNIT TMIN ≤ TA ≤ TMAX SpecifiedTemperatureRange: LM60B –25 ≤ TA ≤ +125 °C LM60C/LM60-Q1 –40 ≤ TA ≤ +125 °C SupplyVoltageRange (+VS) 2.7 10 V ThermalResistance,θJA (2) SOT-23 450 °C/W TO-92 180 °C/W (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisfunctional,butdo not guaranteespecificperformancelimits.Forspecifiedspecificationsand testconditions,see the ElectricalCharacteristics.The specifiedspecificationsapplyonlyforthetestconditionslisted.Some performancecharacteristicsmay degradewhen thedeviceisnotoperatedunderthelistedtestconditions. (2) The junctiontoambientthermalresistance(θJA)isspecifiedwithouta heatsinkinstillair.
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www.ti.com SNIS119D –MAY 2004–REVISED NOVEMBER 2012
ELECTRICAL CHARACTERISTICS
Unlessotherwisenoted,thesespecificationsapplyfor+VS = +3.0VDC and ILOAD = 1 μA.BoldfacelimitsapplyforTA = TJ = TMIN toTMAX ;allotherlimitsTA = TJ = 25°C. LM60B LM60C/LM60-Q1 PARAMETER CONDITIONS TYPICAL (1) UNITS (Limit) Limits(2) Limits(2) ±2.0 ±3.0 °C (max) Accuracy(3) ±3.0 ±4.0 °C (max) OutputVoltageat0°C +424 mV Nonlinearity(4) ±0.6 ±0.8 °C (max) +6.25 6.06 6 mV/°C (min) SensorGain (AverageSlope) 6.44 6.5 mV/°C (max) OutputImpedance 800 800 Ω (max) +3.0V ≤ +VS ≤ +10 V ±0.3 ±0.3 mV/V (max) LineRegulation(5) +2.7V ≤ +VS ≤ +10 V 82 110 110 μA (max) QuiescentCurrent 125 125 μA (max) Change ofQuiescentCurrent +2.7V ≤ +VS ≤ +10 V ±5.0 μA (max) TemperatureCoefficientofQuiescentCurrent 0.2 μA/°C TJ = TMAX = +125°CLong Term Stability(6) ±0.2 °Cfor1000 hours (1) TypicalsareatTJ = TA = 25°C and representmost likelyparametricnorm. (2) LimitsarespecifiedtoNational's AOQL (AverageOutgoingQualityLevel). (3) Accuracyisdefinedas theerrorbetween theoutputvoltageand +6.25mV/°C timesthedevice's case temperatureplus424 mV, at specifiedconditionsofvoltage,current,and temperature(expressedin°C). (4) Nonlinearityisdefinedas thedeviationoftheoutput-voltage-versus-temperaturecurvefromthebest-fitstraightline,overthedevice's ratedtemperaturerange. (5) Regulationismeasured atconstantjunctiontemperature,usingpulsetestingwitha lowdutycycle.Changes inoutputdue toheating effectscan be computed by multiplyingtheinternaldissipationby thethermalresistance. (6) Forbestlong-termstability,any precisioncircuitwillgivebestresultsiftheunitisaged ata warm temperature,and/ortemperature cycledforatleast46 hoursbeforelong-termlifetestbegins.Thisisespeciallytruewhen a small(Surface-Mount)partiswave-soldered; allowtimeforstressrelaxationtooccur.The majorityofthedriftwilloccurinthefirst1000 hoursatelevatedtemperatures.The driftafter 1000 hourswillnotcontinueatthefirst1000 hourrate. Copyright© 2004–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM60/LM60-Q1
SNIS119D –MAY 2004–REVISED NOVEMBER 2012 www.ti.com TYPICAL CHARACTERISTICS To generatethesecurvestheLM60/LM60-Q1 was mounted toa printedcircuitboardas shown inFigure13. Thermal ResistanceJunctiontoAir Thermal Time Constant Figure2. Figure3. Thermal Response inStillAir Thermal Response inStirred withHeat Sink OilBath withHeat Sink Figure4. Figure5. Thermal Response inStillAir Start-UpVoltagevs Temperature withouta Heat Sink Figure6. Figure7. QuiescentCurrentvs Temperature Accuracy vs Temperature Figure8. Figure9.
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www.ti.com SNIS119D –MAY 2004–REVISED NOVEMBER 2012 TYPICAL CHARACTERISTICS (continued) To generatethesecurvestheLM60/LM60-Q1 was mounted toa printedcircuitboardas shown inFigure13. Noise Voltage Supply Voltagevs Supply Current Figure10. Figure11. Start-UpResponse Figure12. Copyright© 2004–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM60/LM60-Q1
SNIS119D –MAY 2004–REVISED NOVEMBER 2012 www.ti.com
APPLICATION INFORMATION
NOTE: 1/2"Square PrintedCircuitBoard with2 oz.Copper FoilorSimilar. Figure13. PrintedCircuitBoard Used forHeat Sink toGenerate AllCurves Mounting The LM60/LM60-Q1 can be appliedeasilyinthe same way as otherintegrated-circuittemperaturesensors.It can be gluedorcemented toa surface.The temperaturethattheLM60/LM60-Q1 issensingwillbe withinabout +0.1°C ofthesurfacetemperaturethatLM60/LM60-Q1's leadsareattachedto. This presumes thatthe ambient airtemperatureis almost the same as the surfacetemperature;ifthe air temperaturewere much higherorlowerthanthesurfacetemperature,theactualtemperatureoftheLM60/LM60- Q1 diewouldbe atan intermediatetemperaturebetween thesurfacetemperatureand theairtemperature. To ensuregood thermalconductivitythebacksideoftheLM60/LM60-Q1 dieisdirectlyattachedtotheGND pin. The landsand tracestotheLM60/LM60-Q1 will,ofcourse,be partoftheprintedcircuitboard,whichistheobject whose temperatureis being measured. These printedcircuitboard lands and traceswillnot cause the LM60/LM60-Q1's temperaturetodeviatefromthedesiredtemperature. Alternatively,theLM60/LM60-Q1 can be mounted insidea sealed-endmetaltube,and can thenbe dippedintoa bathorscrewedintoa threadedholeina tank.As withany IC,theLM60/LM60-Q1 and accompanyingwiringand circuitsmust be keptinsulatedand dry,toavoidleakageand corrosion.Thisisespeciallytrueifthecircuitmay operateat coldtemperatureswhere condensationcan occur.Printed-circuitcoatingsand varnishessuch as Humisealand epoxy paintsordipsareoftenused toensurethatmoisturecannotcorrodetheLM60/LM60-Q1 or itsconnections. The thermalresistancejunctiontoambient(θJA )istheparameterused tocalculatetheriseofa devicejunction temperaturedue tothedevicepower dissipation.For theLM60/LM60-Q1 theequationused tocalculatetherise inthedietemperatureisas follows: TJ = TA + θJA [(+VS IQ )+ (+VS − VO )IL] where IQ isthequiescentcurrentand IL istheloadcurrenton theoutput. Table 1 summarizes the riseindietemperatureof the LM60/LM60-Q1 withoutany loading,and the thermal resistancefordifferentconditions.
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www.ti.com SNIS119D –MAY 2004–REVISED NOVEMBER 2012 Table1.Temperature Rise ofLM60/LM60-Q1 Due toSelf-Heatingand Thermal Resistance(θJA ) SOT-23 (1) SOT-23 (2) TO-92(1) TO-92 (3) no heatsink smallheatfin no heatfin smallheatfin θJA TJ − TA θJA TJ − TA θJA TJ − TA θJA TJ − TA(°C/W) (°C) (°C/W) (°C) Stillair 450 0.17 260 0.1 180 0.07 140 0.05 Moving air 180 0.07 90 0.034 70 0.026 (1) Partsolderedto30 gauge wire. (2) Heat sinkused is1/2"squareprintedcircuitboardwith2 oz.foilwithpartattachedas shown inFigure13. (3) Partgluedorleadssolderedto1”squareof1/16”printedcircuitboardwith2 oz.foilorsimilar. CapacitiveLoads The LM60/LM60-Q1 handlescapacitiveloadingwell.Withoutany specialprecautions,the LM60/LM60-Q1 can driveany capacitiveloadas shown inFigure14.Over thespecifiedtemperaturerangetheLM60/LM60-Q1 has a maximum outputimpedance of 800Ω. In an extremelynoisyenvironmentitmay be necessaryto add some filteringto minimizenoisepickup.Itisrecommended that0.1 μF be added from +V S to GND to bypass the power supplyvoltage,as shown inFigure15.Ina noisyenvironmentitmay be necessarytoadd a capacitor fromtheoutputtoground.A 1 μF outputcapacitorwiththe800Ω outputimpedance willforma 199 Hz lowpass filter.Since the thermaltime constantof the LM60/LM60-Q1 ismuch slowerthan the 6.3 ms time constant formed by theRC, theoverallresponsetimeoftheLM60/LM60-Q1 willnotbe significantlyaffected.For much largercapacitorsthisadditionaltimelagwillincreasetheoverallresponsetimeoftheLM60/LM60-Q1. Figure14.LM60/LM60-Q1 No Decoupling Required Figure15.LM60/LM60-Q1 withFilterforNoisy forCapacitiveLoad Environment Figure16. SimplifiedSchematic Copyright© 2004–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM60/LM60-Q1
R14.1V R20.1 FU3LM4040 VOUT VT VTemp LM60V+ (Low = overtemp alarm) VT1 VT2 VTEMP VOUT VT1 = R1 + R2||R3 (4.1)R2 VT2 = R2 + R1||R3 (4.1)R2||R3 LM7211 SVA-1268118 LM60/LM60-Q1 LM60/LM60-Q1 SNIS119D –MAY 2004–REVISED NOVEMBER 2012 www.ti.com ApplicationsCircuits Figure17. CentigradeThermostat Figure18. Conserving Power DissipationwithShutdown
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www.ti.com 9-Mar-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Top-Side Markings (4) Samples LM60BIM3 ACTIVE SOT-23 DBZ 3 1000 TBD Call TI Call TI -25 to 125 T6B LM60BIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -25 to 125 T6B LM60BIM3X ACTIVE SOT-23 DBZ 3 3000 TBD Call TI Call TI -25 to 125 T6B LM60BIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -25 to 125 T6B LM60BIZ/LFT3 ACTIVE TO-92 LP 3 2000 TBD Call TI Call TI LM60 BIZ LM60BIZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM -25 to 125 LM60 BIZ LM60CIM3 ACTIVE SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 125 T6C LM60CIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 T6C LM60CIM3X ACTIVE SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 125 T6C LM60CIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 T6C LM60CIZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM -40 to 125 LM60 CIZ LM60QIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM60QIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined.
www.ti.com 9-Mar-2013 Addendum-Page 2 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Only one of markings shown within the brackets will appear on the physical device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM60, LM60-Q1 :
- Catalog: LM60
- Automotive: LM60-Q1 NOTE: Qualified Version Definitions:
- Catalog - TI's standard catalog product
- Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM60BIM3 SOT-23 DBZ 3 1000 203.0 190.0 41.0 LM60BIM3/NOPB SOT-23 DBZ 3 1000 203.0 190.0 41.0 LM60BIM3X SOT-23 DBZ 3 3000 206.0 191.0 90.0 LM60BIM3X/NOPB SOT-23 DBZ 3 3000 206.0 191.0 90.0 LM60CIM3 SOT-23 DBZ 3 1000 203.0 190.0 41.0 LM60CIM3/NOPB SOT-23 DBZ 3 1000 203.0 190.0 41.0 LM60CIM3X SOT-23 DBZ 3 3000 206.0 191.0 90.0 LM60CIM3X/NOPB SOT-23 DBZ 3 3000 206.0 191.0 90.0 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 Pack Materials-Page 2
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