LM4030AMF-2.5/NOPB

LM4030 SOT-23 Ultra-High Precision Shunt Voltage Reference (Rev. B)

Document overview

• Manufacturer or author: Texas Instruments, Incorporated [SNVS552,B]
• PDF pages: 20

Technical content

www.ti.com SNVS552B –MARCH 2008–REVISED APRIL 2013 LM4030SOT-23Ultra-HighPrecisionShuntVoltageReference Check forSamples: LM4030 1FEATURES DESCRIPTION The LM4030 isan ultra-highprecisionshuntvoltage 2• High Output VoltageAccuracy 0.05% reference,havingexceptionallyhigh initialaccuracy• Low Temperature Coefficient10 ppm/ °C (0.05%) and temperaturestability(10ppm/°C). The

• Extended Temperature Operation-40-125°C LM4030 isavailablewithfixedvoltageoptionsof2.5V and 4.096V.Despitethe tinySOT-23 package,the• ExcellentThermal Hysteresis,75ppm LM4030 exhibits excellent thermal hysteresis• ExcellentLong-Term Stability,40ppm (75ppm) and long-termstability(40ppm) as wellas
• High Immunity toBoard StressEffects immunitytoboardstresseffects.
• Capable ofHandling50 mA Transients The LM4030 is designed to operate withoutan
• VoltageOptions 2.5V,4.096V externalcapacitor,butany capacitorup to10µF may be used.The LM4030 can be powered offas littleas• SOT-23 Package 120µA (max) butiscapableofshuntingup to30mA continuously.As with any shunt reference,theAPPLICATIONS LM4030 can be powered offof virtuallyany supply
• Data Acquisition/Signalpath and isa simpleway to generatea highlyaccurate systemreference.• Testand Measurement
• Automotive & Industrial The LM4030 isavailableinthreegrades (A,B, and C). The best grade devices (A) have an initial• Communications accuracy of 0.05% with ensured temperature• Instrumentation coefficientof 10 ppm/°C or less,whilethe lowest
• Power Management gradeparts(C)have an initialaccuracyof0.15% and a temperaturecoefficientof30 ppm/°C. TypicalApplicationCircuit Connection Diagram (Top View) Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2008–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SNVS552B –MARCH 2008–REVISED APRIL 2013 www.ti.com PIN DESCRIPTIONS Pin # Name Function

1 N/C No connectpin,leavefloating

2 GND, N/C Ground orno connect

3 N/C No connectpin,leavefloating

4 VREF Referencevoltsge

5 GND Ground

These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings (1)(2) Maximum Voltageon any input -0.3to6V Power Dissipation(TA = 25°C) (3) 350mW StorageTemperatureRange −65°C to150°C Lead Temperature (soldering,10sec) 260°C Vapor Phase (60sec) 215°C Infrared(15sec) 220°C ESD Susceptibility(4) Human Body Model 2kV (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage may occurtothedevice.OperatingRatingsindicateconditionsfor whichthedeviceisintendedtobe functional,butdo notensurespecificperformancelimits.Forensuredspecifications,see Electrical Characteristics. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) WithoutPCB copperenhancements.The maximum power dissipationmust be de-ratedatelevatedtemperaturesand islimitedby TJMAX (maximum junctiontemperature),θJ-A (junctiontoambientthermalresistance)and TA (ambienttemperature).The maximum power dissipationatany temperatureis:PDissMAX = (TJMAX -TA)/θJ-A up tothevaluelistedintheAbsoluteMaximum Ratings.θJ-A forSOT-23 package is220°C/W, TJMAX = 125°C. (4) The human body model isa 100 pF capacitordischargedthrougha 1.5kΩ resistorintoeach pin. OperatingRatings Maximum ContinuousShuntCurrent 30mA Maximum ShuntCurrent(<1s) 50mA JunctionTemperatureRange (TJ) −40°C to+125°C

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www.ti.com SNVS552B –MARCH 2008–REVISED APRIL 2013 ElectricalCharacteristics LM4030-2.5(VOUT = 2.5V) LimitsinstandardtypeareforTJ = 25°C only,and limitsinboldfacetypeapplyoverthejunctiontemperature(TJ)rangeof- 40°C to+125°C. Minimum and Maximum limitsareensuredthroughtest,design,orstatisticalcorrelation.Typicalvalues representthemost likelyparametricnorm atTJ = 25°C, and areprovidedforreferencepurposesonly. Symbol Parameter Conditions Min (1) Typ (2) Max (1) Unit VREF ReverseBreakdown Voltage ISHUNT = 120µA 2.5 V ReverseBreakdown VoltageTolerance(ISHUNT = 120µA) IRMIN Minimum OperatingCurrent 120 µA TC TemperatureCoefficient(3) LM4030A-2.5 0°C ≤ TJ ≤ + 85°C 10 ppm /°C -40°C ≤ TJ ≤ +125°C 20 ppm /°C LM4030B-2.5 -40°C ≤ TJ ≤ +125°C 20 ppm /°C LM4030C-2.5 -40°C ≤ TJ ≤ +125°C 30 ppm /°C ΔVREF /ΔISHUNT ReverseBreakdown VoltageChange 160µA ≤ ISHUNT ≤ 30mA 25 110 ppm /mA withCurrent ΔVREF Long Term Stability(4) 1000 Hrs,TA = 30°C 40 ppm VHYST ThermalHysteresis(5) -40°C ≤ TJ ≤ +125°C 75 ppm VN OutputNoiseVoltage(6) 0.1Hz to10 Hz 105 µVPP (1) Limitsare100% productiontestedat25°C. LimitsovertheoperatingtemperaturerangeareensuredthroughcorrelationusingStatistical QualityControl. (2) Typicalnumbers areat25°C and representthemost likelyparametricnorm. (3) Temperaturecoefficientismeasured by the"Box"method;i.e.,themaximum ΔVREF isdividedby themaximum ΔT. (4) Long termstabilityisVREF @25 °C measured during1000 hrs.Thismeasurement istakenforIR = 500 µA. (5) Thermalhysteresisisdefinedas thechange in+25°C outputvoltagebeforeand aftercyclingthedevicefrom(-40°C to125°C) eight times. (6) Low frequencypeak-to-peaknoisemeasured usingfirst-order0.1Hz HPF and second-order10 Hz LPF. ElectricalCharacteristics LM4030-4.096(VOUT = 4.096V) LimitsinstandardtypeareforTJ = 25°C only,and limitsinboldfacetypeapplyoverthejunctiontemperature(TJ)rangeof- 40°C to+125°C. Minimum and Maximum limitsareensuredthroughtest,design,orstatisticalcorrelation.Typicalvalues representthemost likelyparametricnorm atTJ = 25°C, and areprovidedforreferencepurposesonly. Symbol Parameter Conditions Min (1) Typ (2) Max (1) Unit VREF ReverseBreakdown Voltage ISHUNT = 130µA 4.096 V ReverseBreakdown VoltageTolerance(ISHUNT = 130µA) IRMIN Minimum OperatingCurrent 130 µA TC TemperatureCoefficient(3) LM4030A-4.096 0°C ≤ TJ ≤ + 85°C 10 ppm /°C -40°C ≤ TJ ≤ +125°C 20 ppm /°C LM4030B-4.096 -40°C ≤ TJ ≤ +125°C 20 ppm /°C LM4030C-4.096 -40°C ≤ TJ ≤ +125°C 30 ppm /°C ΔVREF /ΔILOAD ReverseBreakdown VoltageChange 160µA ≤ ISHUNT ≤ 30mA 15 95 ppm /mA withCurrent (1) Limitsare100% productiontestedat25°C. LimitsovertheoperatingtemperaturerangeareensuredthroughcorrelationusingStatistical QualityControl. (2) Typicalnumbers areat25°C and representthemost likelyparametricnorm. (3) Temperaturecoefficientismeasured by the"Box"method;i.e.,themaximum ΔVREF isdividedby themaximum ΔT. Copyright© 2008–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM4030

SNVS552B –MARCH 2008–REVISED APRIL 2013 www.ti.com ElectricalCharacteristics LM4030-4.096(VOUT = 4.096V)(continued) LimitsinstandardtypeareforTJ = 25°C only,and limitsinboldfacetypeapplyoverthejunctiontemperature(TJ)rangeof- 40°C to+125°C. Minimum and Maximum limitsareensuredthroughtest,design,orstatisticalcorrelation.Typicalvalues representthemost likelyparametricnorm atTJ = 25°C, and areprovidedforreferencepurposesonly. Symbol Parameter Conditions Min (1) Typ (2) Max (1) Unit ΔVREF Long Term Stability(4) 1000 Hrs,TA = 30°C 40 ppm VHYST ThermalHysteresis(5) -40°C ≤ TJ ≤ +125°C 75 ppm VN OutputNoiseVoltage(6) 0.1Hz to10 Hz 165 µVPP (4) Long termstabilityisVREF @25 °C measured during1000 hrs.Thismeasurement istakenforIR = 500 µA. (5) Thermalhysteresisisdefinedas thechange in+25°C outputvoltagebeforeand aftercyclingthedevicefrom(-40°C to125°C) eight times. (6) Low frequencypeak-to-peaknoisemeasured usingfirst-order0.1Hz HPF and second-order10 Hz LPF.

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TEMPERATURE ( oC) OUTPUT VOLTAGE (V) -40 -20 0 20 40 60 80 100 1202.497 2.498 2.499 2.5 2.501 2.502 2.503

5 TYPICAL UNITS

www.ti.com SNVS552B –MARCH 2008–REVISED APRIL 2013 TypicalPerformance Characteristicsfor2.5V Output Voltage vs Temperature 0.1-10 Hz Peak-to-PeakNoise Figure1. Figure2. StartUp -120 µA StartUp -50 mA Figure3. Figure4. Reverse Dynamic Impedance vs Reverse Breakdown VoltageChange withCurrent Frequency Figure5. Figure6. Copyright© 2008–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM4030

SNVS552B –MARCH 2008–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristicsfor4.096V Output Voltage vs Temperature 0.1-10 Hz Peak-to-PeakNoise Figure7. Figure8. StartUp -130 µA StartUp -50 mA Figure9. Figure10. Reverse Dynamic Impedance vs Reverse Breakdown VoltageChange withCurrent Frequency Figure11. Figure12.

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HYSTERESIS (PPM) LM4030 www.ti.com SNVS552B –MARCH 2008–REVISED APRIL 2013 TypicalPerformance Characteristics Forward Characteristic Load TransientResponse Figure13. Figure14. Minimum OperatingCurrent Noise Spectrum Figure15. Figure16. Output Voltage vs Thermal HysteresisDistribution Thermal Cycle (-40°C to125°C) Figure17. Figure18. Copyright© 2008–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM4030

SNVS552B –MARCH 2008–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics(continued) Long Term Stability(TA = 25°C) Long Term Stability(TA =125°C) Figure19. Figure20.

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APPLICATION INFORMATION

The LM4030 isan ultra-highprecisionshuntvoltagereference,havingexceptionallyhighinitialaccuracy(0.05%) and temperaturestability(10ppm/°C).The LM4030 isavailablewithfixedvoltageoptionsof2.5V and 4.096V. Despitethe tinySOT-23 package,the LM4030 exhibitsexcellentthermalhysteresis(75ppm) and long-term stability(25ppm).The LM4030 isdesignedtooperatewithoutan externalcapacitor,butany capacitorup to10 µF may be used.The LM4030 can be powered offas littleas 120 µA (max)butiscapableofshuntingup to30 mA continuously.The typicalapplicationcircuitfortheLM4030 isshown inFigure21. Figure21. TypicalApplicationCircuit COMPONENT SELECTION A resistormust be chosen tosetthemaximum operatingcurrentfortheLM4030 (RZ inFigure21).The valueof theresistorcan be calculatedusingthefollowingequation: R Z = (VIN -VREF )/(IMIN_OPERATING + ILOAD_MAX ) (1) R Z ischosen such thatthetotalcurrentflowingthroughR Z isgreaterthanthemaximum loadcurrentplusthe minimum operatingcurrentofthereferenceitself.Thisensuresthatthereferenceisneverstarvedforcurrent. Running theLM4030 athighercurrentsisadvantageousforreducingnoise.The reversedynamic impedance of the VREF node scalesinverselywiththe shuntedcurrent(see Figure22) leadingto higherrejectionof noise emanatingfromtheinputsupplyand fromEMI (electro-magneticinterferrence). Figure22. Reverse Dynamic Impedance vs IOUT The LM4030 isdesignedto operatewithor withouta bypass capacitor(COUT inFigure21) and isstablewith capacitorsofup to10 μF.The use ofa bypass capacitorcan improvetransientresponseand reducebroadband noise.Additionally,a bypass capacitorwillcountertherisingreversedynamic impedance athigherfrequencies improvingnoiseimmunity(seeFigure23). Copyright© 2008–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM4030

VHYS = lVREF1 - VREF2 l VREF x 106 ppm -40oC VREF1 Time VREF2 25oC 125oC LM4030 SNVS552B –MARCH 2008–REVISED APRIL 2013 www.ti.com Figure23. Reverse Dynamic Impedance vs C OUT As withotherregulators,an externalcapacitorreduces the amplitudeof the VREF transientwhen a sudden change inloadingtakesplace.The capacitorshouldbe placedas closetothepartas possibletoreducethe effectsofunwanted boardparasitics. THERMAL HYSTERESIS Thermalhysteresisisthedefinedas thechange inoutputvoltageat25°C aftersome deviationfrom25°C. This istosay thatthermalhysteresisisthedifferenceinoutputvoltagebetween two pointsina giventemperature profile.An illustrativetemperatureprofileisshown inFigure24. Figure24. IllustrativeTemperature Profile Thismay be expressedanalyticallyas thefollowing: where

• VHYS = Thermalhysteresisexpressedinppm
• VREF = Nominalpresetoutputvoltage
• VREF1 = VREF beforetemperaturefluctuation
• VREF2 = VREF aftertemperaturefluctuation (2) The LM4030 featuresa low thermalhysteresisof 75 ppm (typical)from -40°C to 125°C after8 temperature cycles.

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= VERROR103 VREF x ppmERROR TD = VREF x 'T x 106 ppm (VREF_MAX - VREF_MIN ) Temperature Range Voltage Temperature VREF_MAX Change in Output Voltage VREF_MIN LM4030 www.ti.com SNVS552B –MARCH 2008–REVISED APRIL 2013 TEMPERATURE COEFFICIENT Temperaturedriftis definedas the maximum deviationin outputvoltageover the temperaturerange.This deviationovertemperaturemay be illustratedas shown inFigure25. Figure25. IllustrativeVREF vs Temperature Profile Temperaturecoefficientmay be expressedanalyticallyas thefollowing: where

• TD = Temperaturedrift
• VREF = Nominalpresetoutputvoltage
• VREF_MIN = Minimum outputvoltageoveroperatingtemperaturerange
• VREF_MAX = Maximum outputvoltageoveroperatingtemperaturerange
• ΔT = Operatingtemperaturerange (3) The LM4030 featuresa lowtemperaturedriftof10ppm (max)to30ppm (max),dependingon thegrade. DYNAMIC OFFSET CANCELLATION AND LONG TERM STABILITY Asidefrom initialaccuracyand driftperformance,otherspecificationssuch as thermalhysteresisand long-term stabilitycan affectthe accuracyof a voltagereference,especiallyover the lifetimeof the application.The referencevoltagecan also shiftdue to board stressonce the partis mounted onto the PCB and during subsequentthermalcycles.Generally,theseshiftsinVREF arisedue tooffsetsbetween matched deviceswithin the regulationloop.Both passiveand activedevicesnaturallyexperiencedriftover time and stressand temperaturegradientsacrossthe silicondiealsogenerateoffset.The LM4030 incorporatesa dynamic offset cancellationscheme whichcompensates foroffsetsdevelopingwithintheregulationloop.ThisgivestheLM4030 excellentlong-termstability(40 ppm typical)and thermalhysteresisperformance(75ppm typical),as wellas substantialimmunitytoPCB stresseffects,despitebeingpackaged ina tinySOT-23. EXPRESSION OF ELECTRICAL CHARACTERISTICS Electricalcharacteristicsare typicallyexpressedinmV, ppm, or a percentageofthenominalvalue.Depending on theapplication,one expressionmay be more usefulthantheother.To convertone quantitytotheotherone may applythefollowing: ppm tomV errorinoutputvoltage: where
• VREF isinvolts(V)and VERROR isinmilli-volts(mV) (4) Copyright© 2008–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM4030

x 0.1VREF = Percent_Error VERROR x 103 VREF = ppmERROR VERROR x 103VREF 2n = VERROR LM4030 SNVS552B –MARCH 2008–REVISED APRIL 2013 www.ti.com Biterror(1bit)tovoltageerror(mV): (5) VREF isinvolts(V),VERROR isinmilli-volts(mV),and n isthenumber ofbits. mV toppm errorinoutputvoltage: where

• VREF isinvolts(V)and VERROR isinmilli-volts(mV) (6) Voltageerror(mV) topercentageerror(percent): where
• VREF isinvolts(V)and VERROR isinmilli-volts(mV) (7) PRINTED CIRCUIT BOARD and LAYOUT CONSIDERATIONS The LM4030 has a verysmallchange inreversevoltagewithcurrent(25ppm/mA typical)so largevariationsin loadcurrent(upto50mA) shouldnotappreciablyshiftVREF. Parasiticresistancebetween theLM4030 and the loadintroducesa voltagedrop proportionalto loadcurrentand shouldbe minimized.The LM4030 shouldbe placedas closeto the loaditisdrivingas the layoutwillallow.The locationof R Z isnot important,but C OUT shouldbe as closetotheLM4030 as possibleso added ESR does notdegradethetransientperformance.

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REVISION HISTORY

Changes from RevisionA (April2013)toRevisionB Page Copyright© 2008–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:LM4030

www.ti.com 13-Sep-2014 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM4030AMF-2.5/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 R5JA LM4030AMF-4.096/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 R5KA LM4030AMFX-2.5/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 R5JA LM4030AMFX4.096/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 R5KA LM4030BMF-2.5/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 R5JB LM4030BMF-4.096/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 R5KB LM4030BMFX-2.5/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 R5JB LM4030BMFX4.096/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 R5KB LM4030CMF-2.5/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 R5JC LM4030CMF-4.096/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 R5KC LM4030CMFX-2.5/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 R5JC LM4030CMFX4.096/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 R5KC (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined.

www.ti.com 13-Sep-2014 Addendum-Page 2 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant LM4030AMFX4.096/NOP B LM4030BMFX4.096/NOP B LM4030CMFX4.096/NOP B PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM4030AMF-2.5/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM4030AMF-4.096/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM4030AMFX-2.5/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM4030AMFX4.096/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM4030BMF-2.5/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM4030BMF-4.096/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM4030BMFX-2.5/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM4030BMFX4.096/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM4030CMF-2.5/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM4030CMF-4.096/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM4030CMFX-2.5/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM4030CMFX4.096/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 Pack Materials-Page 2

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