LM358

LM358 - Single Supply Dual Operational Amplifiers

Document overview

• Manufacturer or author: onsemi
• PDF pages: 16

Technical content

Features

• Short Circuit Protected Outputs
• True Differential Input Stage
• Single Supply Operation: 3.0 V to 32 V
• Low Input Bias Currents
• Internally Compensated
• Common Mode Range Extends to Negative Supply
• Single and Split Supply Operation
• ESD Clamps on the Inputs Increase Ruggedness of the Device without Affecting Operation
• NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant PDIP−8 N, AN, VN SUFFIX CASE 626 SOIC−8 D, VD SUFFIX CASE 7511 PIN CONNECTIONS VEE/Gnd Inputs A Inputs B Output B Output A VCC (Top View) See general marking information in the device marking section on page 11 of this data sheet. DEVICE MARKING INFORMATION See detailed ordering and shipping information on page 10 of this data sheet.

ORDERING INFORMATION

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3.0 V to VCC(max)

1.5 V to VCC(max)

1.5 V to VEE(max)

Figure 2. Representative Schematic Diagram

LM258, LM358, LM358A, LM358E, LM2904, LM2904A, LM2904E, LM2904V, NCV2904 www.onsemi.com MAXIMUM RATINGS (TA = +25°C, unless otherwise noted.) Rating Symbol Value Unit Power Supply Voltages Single Supply Split Supplies VCC VCC, VEE ±16 Vdc Input Differential Voltage Range (Note 1) VIDR ±32 Vdc Input Common Mode Voltage Range VICR −0.3 to 32 Vdc Output Short Circuit Duration tSC Continuous Junction Temperature TJ 150 °C Thermal Resistance, Junction−to−Air (Note 2) Case 846A Case 751 Case 626 R/C0113JA 238 212 161 °C/W Thermal Resistance, Junction−to−Case Case 751 R/C0113JC 72 °C/W Thermal Resistance, Junction−to−Board Case 751 R/C0113JB 74 °C/W Storage Temperature Range Tstg −65 to +150 °C Operating Ambient Temperature Range LM258 LM358, LM358A, LM358E LM2904, LM2904A, LM2904E LM2904V, NCV2904 (Note 3) TA −25 to +85 0 to +70 −40 to +105 −40 to +125 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Split Power Supplies. 2. All R /C0113JA measurements made on evaluation board with 1 oz. copper traces of minimum pad size. All device outputs were active. 3. NCV2904 is qualified for automotive use. ESD RATINGS Rating HBM MM Unit ESD Protection at any Pin (Human Body Model − HBM, Machine Model − MM) NCV2904 (Note 3) LM358E, LM2904E LM358DG/DR2G, LM2904DG/DR2G All Other Devices 2000 2000 250 2000 200 200 100 200 V V V V Share FeedbackYour Opinion Matters

LM258, LM358, LM358A, LM358E, LM2904, LM2904A, LM2904E, LM2904V, NCV2904 www.onsemi.com ELECTRICAL CHARACTERISTICS (VCC = 5.0 V, VEE = GND, TA = 25°C, unless otherwise noted.) Characteristic Symbol LM258 LM358, LM358E LM358A UnitMin Typ Max Min Typ Max Min Typ Max Input Offset Voltage VCC = 5.0 V to 30 V, VIC = 0 V to VCC −1.7 V, VO /C0093 1.4 V, RS = 0 /C0087 VIO mV TA = Thigh (Note 4) − − 7.0 − − 9.0 − − 5.0 Average Temperature Coefficient of Input Offset Voltage TA = Thigh to Tlow (Note 4) Input Offset Current IIO − 3.0 30 − 5.0 50 − 5.0 30 nA TA = Thigh to Tlow (Note 4) − − 100 − − 150 − − 75 Input Bias Current IIB − −45 −150 − −45 −250 − −45 −100 TA = Thigh to Tlow (Note 4) − −50 −300 − −50 −500 − −50 −200 Average Temperature Coefficient of Input Offset Current /C0068IIO//C0068T − 10 − − 10 − − 10 − pA/°C TA = Thigh to Tlow (Note 4) Input Common Mode Voltage Range (Note 5), VCC = 30 V VICR 0 − 28.3 0 − 28.3 0 − 28.5 V VCC = 30 V, TA = Thigh to Tlow 0 − 28 0 − 28 0 − 28 Differential Input Voltage Range VIDR − − VCC − − VCC − − VCC V Large Signal Open Loop Voltage Gain AVOL V/mV RL = 2.0 k/C0087, VCC = 15 V, For Large VO Swing, 50 100 − 25 100 − 25 100 − TA = Thigh to Tlow (Note 4) 25 − − 15 − − 15 − − Channel Separation CS − −120 − − −120 − − −120 − dB 1.0 kHz ≤ f ≤ 20 kHz, Input Referenced Common Mode Rejection CMR 70 85 − 65 70 − 65 70 − dB RS ≤ 10 k/C0087 Power Supply Rejection PSR 65 100 − 65 100 − 65 100 − dB Output Voltage−High Limit TA = Thigh to Tlow (Note 4) VOH V VCC = 30 V, RL = 2.0 k/C0087 26 − − 26 − − 26 − − VCC = 30 V, RL = 10 k/C0087 27 28 − 27 28 − 27 28 − Output Voltage−Low Limit VOL − 5.0 20 − 5.0 20 − 5.0 20 mV VCC = 5.0 V, RL = 10 k/C0087, TA = Thigh to Tlow (Note 4) Output Source Current IO/C8201+ mA VID = +1.0 V, VCC = 15 V 20 40 − 20 40 − 20 40 − TA = Thigh to Tlow (LM358A Only) 10 − − Output Sink Current IO/C8201− VID = −1.0 V, VCC = 15 V 10 20 − 10 20 − 10 20 − mA TA = Thigh to Tlow (LM358A Only) 5.0 − − mA VID = −1.0 V, VO = 200 mV 12 50 − 12 50 − 12 50 − /C0109A Output Short Circuit to Ground (Note 6) ISC − 40 60 − 40 60 − 40 60 mA Power Supply Current (Total Device) TA = Thigh to Tlow (Note 4) ICC mA 4. LM258: T low = −25°C, Thigh = +85°C LM358, LM358A, LM358E: T low = 0°C, Thigh = +70°C LM2904/A/E: Tlow = −40°C, Thigh = +105°C LM2904V & NCV2904: T low = −40°C, Thigh = +125°C NCV2904 is qualified for automotive use. 5. The input common mode voltage or either input signal voltage should not be allowed to go negative by more than 0.3 V. The upper end of the common mode voltage range is VCC − 1.7 V, but either or both inputs can go to +32 V without damage, independent of the magnitude of VCC. 6. Short circuits from the output to V CC can cause excessive heating and eventual destruction. Destructive dissipation can result from simultaneous shorts on all amplifiers. Share FeedbackYour Opinion Matters

LM258, LM358, LM358A, LM358E, LM2904, LM2904A, LM2904E, LM2904V, NCV2904 www.onsemi.com ELECTRICAL CHARACTERISTICS (VCC = 5.0 V, VEE = Gnd, TA = 25°C, unless otherwise noted.) Characteristic Symbol LM2904/LM2904E LM2904A LM2904V, NCV2904 UnitMin Typ Max Min Typ Max Min Typ Max Input Offset Voltage VCC = 5.0 V to 30 V, VIC = 0 V to VCC −1.7 V, VO /C0093 1.4 V, RS = 0 /C0087 VIO mV TA = Thigh (Note 7) − − 10 − − 10 − − 13 TA = Tlow (Note 7) − − 10 − − 10 − − 10 Average Temperature Coefficient of Input Offset Voltage TA = Thigh to Tlow (Note 7) Input Offset Current IIO − 5.0 50 − 5.0 50 − 5.0 50 nA TA = Thigh to Tlow (Note 7) − 45 200 − 45 200 − 45 200 Input Bias Current IIB − −45 −250 − −45 −100 − −45 −250 TA = Thigh to Tlow (Note 7) − −50 −500 − −50 −250 − −50 −500 Average Temperature Coefficient of Input Offset Current /C0068IIO//C0068T − 10 − − 10 − − 10 − pA/°C TA = Thigh to Tlow (Note 7) Input Common Mode Voltage Range (Note 8), VCC = 30 V VICR 0 − 28.3 0 − 28.3 0 − 28.3 V VCC = 30 V, TA = Thigh to Tlow 0 − 28 0 − 28 0 − 28 Differential Input Voltage Range VIDR − − VCC − − VCC − − VCC V Large Signal Open Loop Voltage Gain AVOL V/mV RL = 2.0 k/C0087, VCC = 15 V, For Large VO Swing, 25 100 − 25 100 − 25 100 − TA = Thigh to Tlow (Note 7) 15 − − 15 − − 15 − − Channel Separation CS − −120 − − −120 − − −120 − dB 1.0 kHz ≤ f ≤ 20 kHz, Input Referenced Common Mode Rejection CMR 50 70 − 50 70 − 50 70 − dB RS ≤ 10 k/C0087 Power Supply Rejection PSR 50 100 − 50 100 − 50 100 − dB Output Voltage−High Limit TA = Thigh to Tlow (Note 7) VOH V VCC = 30 V, RL = 2.0 k/C0087 26 − − 26 − − 26 − − VCC = 30 V, RL = 10 k/C0087 27 28 − 27 28 − 27 28 − Output Voltage−Low Limit VOL − 5.0 20 − 5.0 20 − 5.0 20 mV VCC = 5.0 V, RL = 10 k/C0087, TA = Thigh to Tlow (Note 7) Output Source Current IO/C8201+ 20 40 − 20 40 − 20 40 − mA VID = +1.0 V, VCC = 15 V Output Sink Current IO/C8201− VID = −1.0 V, VCC = 15 V 10 20 − 10 20 − 10 20 − mA Output Short Circuit to Ground (Note 9) ISC − 40 60 − 40 60 − 40 60 mA Power Supply Current (Total Device) TA = Thigh to Tlow (Note 7) ICC mA 7. LM258: T low = −25°C, Thigh = +85°C LM358, LM358A, LM358E: T low = 0°C, Thigh = +70°C LM2904/A/E: Tlow = −40°C, Thigh = +105°C LM2904V & NCV2904: T low = −40°C, Thigh = +125°C NCV2904 is qualified for automotive use. 8. The input common mode voltage or either input signal voltage should not be allowed to go negative by more than 0.3 V. The upper end of the common mode voltage range is VCC − 1.7 V, but either or both inputs can go to +32 V without damage, independent of the magnitude of VCC. 9. Short circuits from the output to V CC can cause excessive heating and eventual destruction. Destructive dissipation can result from simultaneous shorts on all amplifiers. Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. Share FeedbackYour Opinion Matters

accomplished by splitting the collectors of Q20 and Q18. well as excellent power supply rejection. Figure 3. Large Signal Voltage

1.0 V/DIV

Figure 4. Input Voltage Range Figure 5. Large−Signal Open Loop Voltage Gain

Figure 15. Function Generator Figure 16. Multiple Feedback Bandpass Filter For less than 10% error from operational amplifier. follower buffer to stabilize filter parameters. Where fo and BW are expressed in Hz.

4 CRf R1 R3 = R2 R1

LM258, LM358, LM358A, LM358E, LM2904, LM2904A, LM2904E, LM2904V, NCV2904 www.onsemi.com Device Operating Temperature Range Package Shipping† LM358ADR2G 0°C to +70°C SOIC−8 (Pb−Free) 2500 / Tape & Reel LM358DG 98 Units / Rail LM358DR2G 2500 / Tape & Reel LM358EDR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel LM358DMR2G Micro8 (Pb−Free) 4000 / Tape & Reel LM358NG PDIP−8 (Pb−Free)

50 Units / Rail

−25°C to +85°C SOIC−8 (Pb−Free)

98 Units / Rail

LM258DR2G 2500 / Tape & Reel LM258DMR2G Micro8 (Pb−Free) 4000 / Tape & Reel LM258NG PDIP−8 (Pb−Free) −40°C to +105°C SOIC−8 (Pb−Free) LM2904DR2G 2500 / Tape & Reel LM2904EDR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel LM2904DMR2G Micro8 (Pb−Free) 2500 / Tape & Reel LM2904NG PDIP−8 (Pb−Free) (Pb−Free) 4000 / Tape & Reel LM2904ADMR2G 4000 / Tape & Reel LM2904ANG PDIP−8 (Pb−Free) −40°C to +125°C SOIC−8 (Pb−Free) LM2904VDR2G 2500 / Tape & Reel LM2904VDMR2G Micro8 (Pb−Free) 4000 / Tape & Reel LM2904VNG PDIP−8 (Pb−Free) NCV2904DR2G* SOIC−8 (Pb−Free) 2500 / Tape & Reel NCV2904DMR2G* Micro8 (Pb−Free) 4000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. Share FeedbackYour Opinion Matters

LM258, LM358, LM358A, LM358E, LM2904, LM2904A, LM2904E, LM2904V, NCV2904 www.onsemi.com PDIP−8 N SUFFIX CASE 626 SOIC−8 D SUFFIX CASE 751 MARKING DIAGRAMS x = 2 or 3 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G = Pb− Free Package /C0071 = Pb−Free Package − (Note: Microdot may be in either location) PDIP−8 AN SUFFIX CASE 626 SOIC−8 VD SUFFIX CASE 751 PDIP−8 VN SUFFIX CASE 626 LMx58N AWL YYWWG LM2904AN AWL YYWWG LM2904N AWL YYWWG LM2904VN AWL YYWWG Micro8 DMR2 SUFFIX CASE 846A x58 AYW/C0071 /C0071 2904 AYW/C0071 /C0071 904A AYW/C0071 /C0071 904V AYW/C0071 /C0071 *This diagram also applies to NCV2904 LM358 ALYWA /C0071 2904 ALYW /C0071 2904V ALYW /C0071 LMx58 ALYW /C0071 358E ALYWA /C0071 2904E ALYW /C0071 Share FeedbackYour Opinion Matters

PDIP−8 CASE 626−05 ISSUE P DATE 22 APR 2015 SCALE 1:1 NOTE 8 D b L A eB XXXXXXXXX AWL YYWWG E GENERIC MARKING DIAGRAM* XXXX = Specific Device Code A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb −Free Package A TOP VIEW C SEATING PLANE

0.010 CASIDE VIEW

A −−−− 0.210 A1 0.015 −−−− b 0.014 0.022 C 0.008 0.014 D 0.355 0.400 D1 0.005 −−−− e 0.100 BSC E 0.300 0.325 M −−−− 10 −−− 5.33 0.38 −−− 0.35 0.56 0.20 0.36 9.02 10.16 0.13 −−−

2.54 BSC

7.62 8.26 −−− 10 MIN MAX MILLIMETERS NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK- AGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3. 4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE NOT TO EXCEED 0.10 INCH. 5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR TO DATUM C. 6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE LEADS UNCONSTRAINED. 7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE LEADS, WHERE THE LEADS EXIT THE BODY . 8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE CORNERS). E1 0.240 0.280 6.10 7.11 0.060 TYP 1.52 TYP M c B A2 0.115 0.195 2.92 4.95 L 0.115 0.150 2.92 3.81 H NOTE 5 e e/2 A2 NOTE 3 M B M NOTE 6 M STYLE 1: PIN 1. AC IN 2. DC + IN 3. DC − IN 4. AC IN 5. GROUND 6. OUTPUT 7. AUXILIARY 8. V CC *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “/C0071”, may or may not be present. Some products may not follow the Generic Marking. MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 98ASB42420BDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1PDIP−8 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com

SOIC−8 NB CASE 751−07 ISSUE AK DATE 16 FEB 2011 SEATING PLANE N J X 45/C0095 K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751 −01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A B S DH C 0.10 (0.004) SCALE 1:1 STYLES ON PAGE 2 DIM A MIN MAX MIN MAX INCHES 4.80 5.00 0.189 0.197 MILLIMETERS B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.053 0.069 D 0.33 0.51 0.013 0.020 G 1.27 BSC 0.050 BSC H 0.10 0.25 0.004 0.010 J 0.19 0.25 0.007 0.010 K 0.40 1.27 0.016 0.050 M 0 8 0 8 N 0.25 0.50 0.010 0.020 S 5.80 6.20 0.228 0.244 −X− −Y− G MYM0.25 (0.010) −Z− YM0.25 (0.010) Z S X S M /C0095/C0095/C0095/C0095 XXXXX = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year W = Work Week /C0071 = Pb−Free Package GENERIC MARKING DIAGRAM* XXXXX ALYWX IC Discrete XXXXXX AYWW /C0071 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155 /C0466mm inches/C0467SCALE 6:1 *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* Discrete XXXXXX AYWW (Pb−Free) XXXXX ALYWX /C0071 IC (Pb−Free) XXXXXX = Specific Device Code A = Assembly Location Y = Year WW = Work Week /C0071 = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “/C0071”, may or may not be present. Some products may not follow the Generic Marking. MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 98ASB42564BDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 2SOIC−8 NB onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com

www.onsemi.com SOIC−8 NB CASE 751−07 ISSUE AK DATE 16 FEB 2011 STYLE 4: PIN 1. ANODE 2. ANODE 3. ANODE 4. ANODE 5. ANODE 6. ANODE 7. ANODE 8. COMMON CATHODE STYLE 1: PIN 1. EMITTER 2. COLLECTOR 3. COLLECTOR 4. EMITTER 5. EMITTER 6. BASE 7. BASE 8. EMITTER STYLE 2: PIN 1. COLLECTOR, DIE, #1 2. COLLECTOR, #1 3. COLLECTOR, #2 4. COLLECTOR, #2 5. BASE, #2 6. EMITTER, #2 7. BASE, #1 8. EMITTER, #1 STYLE 3: PIN 1. DRAIN, DIE #1 2. DRAIN, #1 3. DRAIN, #2 4. DRAIN, #2 5. GATE, #2 6. SOURCE, #2 7. GATE, #1 8. SOURCE, #1 STYLE 6: PIN 1. SOURCE 2. DRAIN 3. DRAIN 4. SOURCE 5. SOURCE 6. GATE 7. GATE 8. SOURCE STYLE 5: PIN 1. DRAIN 2. DRAIN 3. DRAIN 4. DRAIN 5. GATE 6. GATE 7. SOURCE 8. SOURCE STYLE 7: PIN 1. INPUT 2. EXTERNAL BYPASS 3. THIRD STAGE SOURCE 4. GROUND 5. DRAIN 6. GATE 3 7. SECOND STAGE Vd 8. FIRST STAGE Vd STYLE 8: PIN 1. COLLECTOR, DIE #1 2. BASE, #1 3. BASE, #2 4. COLLECTOR, #2 5. COLLECTOR, #2 6. EMITTER, #2 7. EMITTER, #1 8. COLLECTOR, #1 STYLE 9: PIN 1. EMITTER, COMMON 2. COLLECTOR, DIE #1 3. COLLECTOR, DIE #2 4. EMITTER, COMMON 5. EMITTER, COMMON 6. BASE, DIE #2 7. BASE, DIE #1 8. EMITTER, COMMON STYLE 10: PIN 1. GROUND 2. BIAS 1 3. OUTPUT 4. GROUND 5. GROUND 6. BIAS 2 7. INPUT 8. GROUND STYLE 11: PIN 1. SOURCE 1 2. GATE 1 3. SOURCE 2 4. GATE 2 5. DRAIN 2 6. DRAIN 2 7. DRAIN 1 8. DRAIN 1 STYLE 12: PIN 1. SOURCE 2. SOURCE 3. SOURCE 4. GATE 5. DRAIN 6. DRAIN 7. DRAIN 8. DRAIN STYLE 14: PIN 1. N −SOURCE 2. N −GATE 3. P −SOURCE 4. P −GATE 5. P −DRAIN 6. P −DRAIN 7. N −DRAIN 8. N −DRAIN STYLE 13: PIN 1. N.C. 2. SOURCE 3. SOURCE 4. GATE 5. DRAIN 6. DRAIN 7. DRAIN 8. DRAIN STYLE 15: PIN 1. ANODE 1 2. ANODE 1 3. ANODE 1 4. ANODE 1 5. CATHODE, COMMON 6. CATHODE, COMMON 7. CATHODE, COMMON 8. CATHODE, COMMON STYLE 16: PIN 1. EMITTER, DIE #1 2. BASE, DIE #1 3. EMITTER, DIE #2 4. BASE, DIE #2 5. COLLECTOR, DIE #2 6. COLLECTOR, DIE #2 7. COLLECTOR, DIE #1 8. COLLECTOR, DIE #1 STYLE 17: PIN 1. VCC 2. V2OUT 3. V1OUT 4. TXE 5. RXE 6. VEE 7. GND 8. ACC STYLE 18: PIN 1. ANODE 2. ANODE 3. SOURCE 4. GATE 5. DRAIN 6. DRAIN 7. CATHODE 8. CATHODE STYLE 19: PIN 1. SOURCE 1 2. GATE 1 3. SOURCE 2 4. GATE 2 5. DRAIN 2 6. MIRROR 2 7. DRAIN 1 8. MIRROR 1 STYLE 20: PIN 1. SOURCE (N) 2. GATE (N) 3. SOURCE (P) 4. GATE (P) 5. DRAIN 6. DRAIN 7. DRAIN 8. DRAIN STYLE 21: PIN 1. CATHODE 1 2. CATHODE 2 3. CATHODE 3 4. CATHODE 4 5. CATHODE 5 6. COMMON ANODE 7. COMMON ANODE 8. CATHODE 6 STYLE 22: PIN 1. I/O LINE 1 2. COMMON CATHODE/VCC 3. COMMON CATHODE/VCC 4. I/O LINE 3 5. COMMON ANODE/GND 6. I/O LINE 4 7. I/O LINE 5 8. COMMON ANODE/GND STYLE 23: PIN 1. LINE 1 IN 2. COMMON ANODE/GND 3. COMMON ANODE/GND 4. LINE 2 IN 5. LINE 2 OUT 6. COMMON ANODE/GND 7. COMMON ANODE/GND 8. LINE 1 OUT STYLE 24: PIN 1. BASE 2. EMITTER 3. COLLECTOR/ANODE 4. COLLECTOR/ANODE 5. CATHODE 6. CATHODE 7. COLLECTOR/ANODE 8. COLLECTOR/ANODE STYLE 25: PIN 1. VIN 2. N/C 3. REXT 4. GND 5. IOUT 6. IOUT 7. IOUT 8. IOUT STYLE 26: PIN 1. GND 2. dv/dt 3. ENABLE 4. ILIMIT 5. SOURCE 6. SOURCE 7. SOURCE 8. VCC STYLE 27: PIN 1. ILIMIT 2. OVLO 3. UVLO 4. INPUT+ 5. SOURCE 6. SOURCE 7. SOURCE 8. DRAIN STYLE 28: PIN 1. SW_TO_GND 2. DASIC_OFF 3. DASIC_SW_DET 4. GND 5. V_MON 6. VBULK 7. VBULK 8. VIN STYLE 29: PIN 1. BASE, DIE #1 2. EMITTER, #1 3. BASE, #2 4. EMITTER, #2 5. COLLECTOR, #2 6. COLLECTOR, #2 7. COLLECTOR, #1 8. COLLECTOR, #1 STYLE 30: PIN 1. DRAIN 1 2. DRAIN 1 3. GATE 2 4. SOURCE 2 5. SOURCE 1/DRAIN 2 6. SOURCE 1/DRAIN 2 7. SOURCE 1/DRAIN 2 8. GATE 1 98ASB42564BDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 2 OF 2SOIC−8 NB onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com

CASE 846A−02 ISSUE K DATE 16 JUL 2020SCALE 2:1 STYLE 1: PIN 1. SOURCE 2. SOURCE 3. SOURCE 4. GATE 5. DRAIN 6. DRAIN 7. DRAIN 8. DRAIN STYLE 2: PIN 1. SOURCE 1 2. GATE 1 3. SOURCE 2 4. GATE 2 5. DRAIN 2 6. DRAIN 2 7. DRAIN 1 8. DRAIN 1 STYLE 3: PIN 1. N-SOURCE 2. N-GATE 3. P-SOURCE 4. P-GATE 5. P-DRAIN 6. P-DRAIN 7. N-DRAIN 8. N-DRAIN GENERIC MARKING DIAGRAM* XXXX = Specific Device Code A = Assembly Location Y = Year W = Work Week /C0071 = Pb−Free Package XXXX AYW/C0071 /C0071 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “/C0071”, may or may not be present. Some products may not follow the Generic Marking. (Note: Microdot may be in either location) MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 98ASB14087CDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1MICRO8 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com

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