LM2901

LM339_07 ONSEMI | Alldatasheet

Document overview

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Technical content

Features

• Single or Split Supply Operation
• Low Input Bias Current: 25 nA (Typ)
• Low Input Offset Current: ±5.0 nA (Typ)
• Low Input Offset V oltage
• Input Common Mode V oltage Range to GND
• Low Output Saturation V oltage: 130 mV (Typ) @ 4.0 mA
• TTL and CMOS Compatible
• ESD Clamps on the Inputs Increase Reliability without Affecting Device Operation
• NCV Prefix for Automotive and Other Applications Requiring Site and Control Changes
• Pb−Free Packages are Available PDIP−14 N, P SUFFIX CASE 646 SOIC−14 D SUFFIX CASE 751A PIN CONNECTIONS 1/C0042 /C0041 /C0042 /C0041 Output 2 − Input 1 Output 1 Output 3 Output 4 + Input 1 − Input 2 + Input 2 + Input 4 − Input 4 + Input 3 − Input 3 V CC GND /C0041 /C0042 /C0041 /C0042 (Top View) See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet.

ORDERING INFORMATION

See general marking information in the device marking section on page 8 of this data sheet. DEVICE MARKING INFORMATION http://onsemi.com TSSOP−14 DTB SUFFIX CASE 948G

1. The maximum output current may be as high as 20 mA, independent of the magnitude of VCC. Output short circuits to VCC can cause excessive

heating and eventual destruction.

1. V ESD rating for NCV/SC devices is: Human Body Model − 2000 V; Machine Model − 200 V.

Figure 1. Circuit Schematic NOTE: Diagram shown is for 1 comparator.

LM339, LM239, LM2901, LM2901V, NCV2901, MC3302 http://onsemi.com ELECTRICAL CHARACTERISTICS (VCC = +5.0 Vdc, TA = +25°C, unless otherwise noted) Characteristic Symbol LM239/339 LM2901/2901V/ NCV2901 MC3302 UnitMin Typ Max Min Typ Max Min Typ Max Input Bias Current (Notes 4, 5) IIB − 25 250 − 25 250 − 25 500 nA (Output in Analog Range) Input Offset Current (Note 4) IIO − ±5.0 ±50 − ±5.0 ±50 − ±3.0 ±100 nA Input Common Mode Voltage Range VICMR 0 − VCC −1.5 0 − VCC −1.5 0 − VCC −1.5 V Supply Current ICC mA Voltage Gain AVOL 50 200 − 25 100 − 25 100 − V/mV RL ≥ 15 k/C0087, VCC = 15 Vdc Large Signal Response Time − − 300 − − 300 − − 300 − ns VI = TTL Logic Swing, Vref = 1.4 Vdc, VRL = 5.0 Vdc, RL = 5.1 k/C0087 Response Time (Note 6) − − 1.3 − − 1.3 − − 1.3 − /C0109s VRL = 5.0 Vdc, RL = 5.1 k/C0087 Output Sink Current ISink 6.0 16 − 6.0 16 − 6.0 16 − mA VO ≤ 1.5 Vdc Saturation Voltage Vsat − 130 400 − 130 400 − 130 500 mV VI(−) ≥ +1.0 Vdc, VI(+) = 0, Isink ≤ 4.0 mA Output Leakage Current IOL − 0.1 − − 0.1 − − 0.1 − nA VI(+) ≥ +1.0 Vdc, VI(−) = 0, VO = +5.0 Vdc 3. (LM239) T low = −25°C, Thigh = +85° (LM339) Tlow = 0°C, Thigh = +70°C (MC3302) Tlow = −40°C, Thigh = +85°C (LM2901) Tlow = −40°C, Thigh = +105° (LM2901V & NCV2901) Tlow = −40°C, Thigh = +125°C NCV2901 is qualified for automotive use. 4. At the output switch point, V O /C0093 1.4 Vdc, RS ≤ 100 /C0087 5.0 Vdc ≤ VCC ≤ 30 Vdc, with the inputs over the full common mode range (0 Vdc to VCC −1.5 Vdc). 5. The bias current flows out of the inputs due to the PNP input stage. This current is virtually constant, independent of the o utput state. 6. The response time specified is for a 100 mV input step with 5.0 mV overdrive. For larger signals, 300 ns is typical.

LM339, LM239, LM2901, LM2901V, NCV2901, MC3302 http://onsemi.com APPLICATIONS INFORMATION These quad comparators feature high gain, wide bandwidth characteristics. This gives the device oscillation tendencies if the outputs are capacitively coupled to the inputs via stray capacitance. This oscillation manifests itself during output transitions (V OL to V OH). To alleviate this situation input resistors < 10 k /C0087 should be used. The addition of positive feedback (< 10 mV) is also recommended. It is good design practice to ground all unused input pins. Differential input voltages may be larger than supply voltages without damaging the comparator’s inputs. V oltages more negative than −300 mV should not be used. Figure 9. Zero Crossing Detector Figure 10. Zero Crossing Detector Vin(min) ≈ 0.4 V peak for 1% phase distortion (/C0068/C0113). D1 prevents input from going negative by more than 0.6 V. Device Package Shipping† LM239D SOIC−14

55 Units/TubeLM239DG SOIC−14

(Pb−Free) LM239DR2 SOIC−14 2500 / Tape & Reel LM239DR2G SOIC−14 (Pb−Free) LM239DTBR2 TSSOP−14* LM239DTBR2G TSSOP−14* LM239N PDIP−14

25 Units/RailLM239NG PDIP−14

(Pb−Free) LM339D SOIC−14

55 Units/TubeLM339DG SOIC−14

(Pb−Free) LM339DR2 SOIC−14 2500 / Tape & Reel LM339DR2G SOIC−14 (Pb−Free) LM339DTBR2 TSSOP−14* LM339DTBR2G TSSOP−14* †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free.

LM339, LM239, LM2901, LM2901V, NCV2901, MC3302 http://onsemi.com Device Shipping†Package LM339N PDIP−14

25 Units/RailLM339NG PDIP−14

(Pb−Free) LM2901D SOIC−14

55 Units/RailLM2901DG SOIC−14

(Pb−Free) LM2901DR2 SOIC−14 2500 / Tape & Reel LM2901DR2G SOIC−14 (Pb−Free) LM2901DTBR2 TSSOP−14* LM2901DTBR2G TSSOP−14* LM2901N PDIP−14

25 Units/RailLM2901NG PDIP−14

(Pb−Free) LM2901VD SOIC−14

55 Units/TubeLM2901VDG SOIC−14

(Pb−Free) LM2901VDR2 SOIC−14 2500 / Tape & Reel LM2901VDR2G SOIC−14 (Pb−Free) LM2901VDTBR2 TSSOP−14* LM2901VDTBR2G TSSOP−14* LM2901VN PDIP−14

25 Units/RailLM2901VNG PDIP−14

(Pb−Free) NCV2901DR2 SOIC−14 2500 / Tape & ReelNCV2901DR2G SOIC−14 (Pb−Free) NCV2901DTBR2G TSSOP−14* NCV2901CTR Bare Die 6000 / Tape & Reel MC3302D SOIC−14

55 Units/TubeMC3302DG SOIC−14

(Pb−Free) MC3302DR2 SOIC−14 2500 / Tape & Reel MC3302DR2G SOIC−14 (Pb−Free) MC3302DTBR2 TSSOP−14* MC3302DTBR2G TSSOP−14* MC3302P PDIP−14

25 Units/RailMC3302PG PDIP−14

(Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free.

LM339, LM239, LM2901, LM2901V, NCV2901, MC3302 http://onsemi.com SOIC−14 D SUFFIX CASE 751A PDIP−14 N, P SUFFIX CASE 646 MARKING DIAGRAMS *This marking diagram also applies to NCV2901. 239 ALYW /C0071 /C0071 TSSOP−14 DTB SUFFIX CASE 948G 339 ALYW /C0071 /C0071 2901 ALYW /C0071 /C0071 2901 V ALYW /C0071 /C0071 3302 ALYW /C0071 /C0071 LM339DG AWLYWW LM239DG AWLYWW LM2901DG AWLYWW LM2901VDG AWLYWW MC3302DG AWLYWW A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or /C0071= Pb−Free Package LM339N AWLYYWWG LM239N AWLYYWWG LM2901N AWLYYWWG LM2901VN AWLYYWWG MC3302P AWLYYWWG 1414141414 111 (Note: Microdot may be in either location)

LM339, LM239, LM2901, LM2901V, NCV2901, MC3302 http://onsemi.com PACKAGE DIMENSIONS PDIP−14 CASE 646−06 ISSUE P 14 8 B A DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.715 0.770 18.16 19.56 B 0.240 0.260 6.10 6.60 C 0.145 0.185 3.69 4.69 D 0.015 0.021 0.38 0.53 F 0.040 0.070 1.02 1.78 G 0.100 BSC 2.54 BSC H 0.052 0.095 1.32 2.41 J 0.008 0.015 0.20 0.38 K 0.115 0.135 2.92 3.43 L N 0.015 0.039 0.38 1.01 /C0095/C0095 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. F HG D K C SEATING PLANE N −T− 14 PL M0.13 (0.005) L M J 0.290 0.310 7.37 7.87

LM339, LM239, LM2901, LM2901V, NCV2901, MC3302 http://onsemi.com PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. −A− −B− G P 7 PL 14 8 M0.25 (0.010) B M SBM0.25 (0.010) A ST −T− FR X 45 SEATING PLANE D 14 PL K C JM /C0095 DIM MIN MAX MIN MAX INCHESMILLIMETERS A 8.55 8.75 0.337 0.344 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 5.80 6.20 0.228 0.244 R 0.25 0.50 0.010 0.019 /C0095/C0095/C0095/C0095 7.04 14X 0.58 14X 1.52 1.27 DIMENSIONS: MILLIMETERS PITCH SOLDERING FOOTPRINT* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

LM339, LM239, LM2901, LM2901V, NCV2901, MC3302 http://onsemi.com PACKAGE DIMENSIONS TSSOP−14 CASE 948G−01 ISSUE B DIM MIN MAX MIN MAX INCHESMILLIMETERS A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.50 0.60 0.020 0.024 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0 8 0 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. /C0095/C0095/C0095/C0095 SU0.15 (0.006) T 2X L/2 SUM0.10 (0.004) V ST L −U− SEATING PLANE 0.10 (0.004) −T− ÇÇÇ ÇÇÇ SECTION N−N DETAIL E J J1 K ÉÉÉ ÉÉÉ DETAIL E F M −W− 0.25 (0.010) 814 PIN 1 IDENT. HG A D C B SU0.15 (0.006) T −V− 14X REFK N N 7.06 14X 0.36 14X 1.26 0.65 DIMENSIONS: MILLIMETERS PITCH SOLDERING FOOTPRINT* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

LM339, LM239, LM2901, LM2901V, NCV2901, MC3302 http://onsemi.com ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 LM339/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative