LM2830 TI | Alldatasheet
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VIN = 5V C2 C3 VO = 3.3V @ 1.0A LM2830 Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community LM2830,LM2830-Q1 SNVS454E –AUGUST 2006–REVISED DECEMBER 2014 LM2830/-Q1High-Frequency1.0-ALoadStep-DownDC-DCRegulator
1 Features 3 Description
The LM2830 regulator is a monolithic, high- 1• LM2830Z-Q1 and LM2830X-Q1 in the SOT-23 frequency, PWM step-down DC-DC converter in a 5-Package are Automotive-Grade Products that are pin SOT-23 and a 6-Pin WSON package. The deviceAEC-Q100 Grade 1 Qualified (–40°C to +125°C provides all the active functions to provide local DC-Operating Junction Temperature) DC conversion with fast transient response and
- Space-Saving SOT-23 Package accurate regulation in the smallest possible PCB area. With a minimum of external components, the• Input Voltage Range of 3.0 V to 5.5 V
- High Switching Frequencies results in the best power density available. The world- class control circuitry allows on-times as low as 30– 1.6 MHz (LM2830X) ns, thus supporting exceptionally high frequency– 3.0 MHz (LM2830Z) conversion over the entire 3-V to 5.5-V input
- 130-mΩ PMOS Switch operating range down to the minimum output voltage of 0.6 V. Switching frequency is internally set to 1.6• 0.6-V, 2% Internal Voltage Reference MHz, or 3.0 MHz, allowing the use of extremely small• Internal Soft-Start surface-mount inductors and chip capacitors. Even
- Current Mode, PWM Operation though the operating frequency is high, efficiencies up to 93% are easy to achieve. External shutdown is• Thermal Shutdown included, featuring an ultra-low standby current of 30• Overvoltage Protection nA. The LM2830 regulator uses current-mode control and internal compensation to provide high-2 Applications performance regulation over a wide range of operating conditions. Additional features include• Local 5-V to Vcore Step-Down Converters internal soft-start circuitry to reduce inrush current,• Core Power in HDDs pulse-by-pulse current limit, thermal shutdown, and• Set-Top Boxes output overvoltage protection.
- USB Powered Devices Device Information(1)
- DSL Modems PART NUMBER PACKAGE BODY SIZE (NOM)• Automotive SOT (5) 2.90 mm × 1.60 mm LM2830 WSON (6) 3.00 mm × 3.00 mm LM2830-Q1 SOT (5) 2.90 mm × 1.60 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. Typical Application Circuit Efficiency vs Load Current An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM2830,LM2830-Q1 SNVS454E –AUGUST 2006–REVISED DECEMBER 2014 www.ti.com Table of Contents
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (April 2013) to Revision E Page
- Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device Changes from Revision C (April 2013) to Revision D Page
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5 Pin Configuration and Functions
Pin Functions (5-Pin SOT) PIN I/O(1) DESCRIPTION NAME NO. SW 1 O Output switch. Connect to the inductor and catch diode. Signal and power ground pin. Place the bottom resistor of the feedback network as close asGND 2 G possible to this pin. FB 3 I Feedback pin. Connect to external resistor divider to set output voltage. Enable control input. Logic high enables operation. Do not allow this pin to float or be greaterEN 4 I than VIN + 0.3 V. VIN 5 I/P Input supply voltage. (1) I: Input Pin, O: Output Pin, P: Power Pin, G: Ground Pin Pin Functions (6-Pin WSON) PIN I/O(1) DESCRIPTION NAME NO. FB 1 I Feedback pin. Connect to external resistor divider to set output voltage. Signal and power ground pin. Place the bottom resistor of the feedback network as close asGND 2 G possible to this pin. SW 3 O Output switch. Connect to the inductor and catch diode. VIND 4 I/P Power Input supply. VINA 5 I/P Control circuitry supply voltage. Connect VINA to VIND on PC board. Enable control input. Logic high enables operation. Do not allow this pin to float or be greaterEN 6 I than VINA + 0.3V. Die Attach Connect to system ground for low thermal impedance, but it cannot be used as a primary– –Pad GND connection. (1) I: Input Pin, O: Output Pin, P: Power Pin, G: Ground Pin Copyright © 2006–2014, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM2830 LM2830-Q1
LM2830,LM2830-Q1 SNVS454E –AUGUST 2006–REVISED DECEMBER 2014 www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings(1)(2)
VIN –0.5 7 V FB Voltage –0.5 3 V EN Voltage –0.5 7 V SW Voltage –0.5 7 V Junction Temperature(3) 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) Thermal shutdown will occur if the junction temperature exceeds the maximum junction temperature of the device.
6.2 ESD Ratings: LM2830
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V(ESD) Electrostatic discharge VCharged device model (CDM), per JEDEC specification JESD22-C101, all ±1000 pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 ESD Ratings: LM2830-Q1
Human body model (HBM), per AEC Q100-002(1) ±2000 WSON corner pins (1, 3, 4, and 6) ±1000 V(ESD) Electrostatic discharge VCharged device model (CDM), per SOT-23 corner pins (1, 3, 4, and 5) ±1000AEC Q100-011 Other pins ±1000 (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.4 Recommended Operating Conditions
VIN 3 5.5 V Junction Temperature –40 125 °C
6.5 Thermal Information
LM2830, LM2830 LM2830-Q1 THERMAL METRIC(1) UNITDBV NGG
5 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 165.2 53.9 RθJC(top) Junction-to-case (top) thermal resistance 69.9 51.2 RθJB Junction-to-board thermal resistance 27.3 28.2 °C/W ψJT Junction-to-top characterization parameter 1.8 0.6 ψJB Junction-to-board characterization parameter 26.8 28.3 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 8.1 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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6.6 Electrical Characteristics
VIN = 5 V unless otherwise indicated. Typical values correspond to TJ = 25°C. Minimum and maximum limits apply over –40°C to 125°C junction temperature range unless otherwise stated. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VFB Feedback Voltage WSON and SOT-23 Package 0.588 0.600 0.612 V ΔVFB/VIN Feedback Voltage Line Regulation VIN = 3 V to 5 V 0.02 %/V IB Feedback Input Bias Current 0.1 100 nA VIN Rising 2.73 2.90 V Undervoltage Lockout UVLO VIN Falling 1.85 2.3 UVLO Hysteresis 0.43 LM2830-X 1.2 1.6 1.95 FSW Switching Frequency MHz LM2830-Z 2.25 3.0 3.75 LM2830-X 86% 94% DMAX Maximum Duty Cycle LM2830-Z 82% 90% LM2830-X 5% DMIN Minimum Duty Cycle LM2830-Z 7% RDS(ON) Switch On Resistance mΩ ICL Switch Current Limit VIN = 3.3 V 1.2 1.75 A Shutdown Threshold Voltage 0.4 VEN_TH V Enable Threshold Voltage 1.8 ISW Switch Leakage 100 nA IEN Enable Pin Current Sink/Source 100 nA LM2830X VFB = 0.55 3.3 5 mA Quiescent Current (switching) IQ LM2830Z VFB = 0.55 4.3 6.5 mA Quiescent Current (shutdown) All Options VEN = 0 V 30 nA TSD Thermal Shutdown Temperature 165 °C Copyright © 2006–2014, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM2830 LM2830-Q1
6.7 Typical Characteristics
data sheet. TJ = 25°C, unless otherwise specified. Figure 5. Load Regulation Vin = 5 V, Vo = 1.8 V (All Options) Figure 6. Load Regulation Vin = 5 V, Vo = 3.3 V (All Options)
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data sheet. TJ = 25°C, unless otherwise specified. Figure 14. Line Regulation Vo = 1.8 V, Io = 500 mAFigure 13. LM2830Z IQ (Quiescent Current) Figure 16. Gain vs Frequency (Vin = 5 V, Vo = 1.2 V at 1 A)Figure 15. VFB vs Temperature Figure 17. Phase Plot vs Frequency (Vin = 5 V, Vo = 1.2 V at 1 A)
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7 Detailed Description
7.1 Overview
Figure 18. Typical Waveforms
S R R Q GND FB SW VINEN /c0e/c0e DRIVER ArtificialRamp SHDNThermal SHDNOVP
1.6 MHz
15 . 1 xREFV Control Logic VREF = 0.6V LM2830,LM2830-Q1 SNVS454E –AUGUST 2006–REVISED DECEMBER 2014 www.ti.com
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Soft-Start
This function forces VOUT to increase at a controlled rate during start up. During soft-start, the error reference voltage of the amplifier ramps from 0 V to its nominal value of 0.6 V in approximately 600 µs. This forces the regulator output to ramp up in a controlled fashion, which helps reduce inrush current.
7.3.2 Output Overvoltage Protection
The overvoltage comparator compares the FB pin voltage to a voltage that is 15% higher than the internal reference VREF. Once the FB pin voltage goes 15% above the internal reference, the internal PMOS control switch is turned off, which allows the output voltage to decrease toward regulation.
7.3.3 Undervoltage Lockout
Undervoltage lockout (UVLO) prevents the LM2830 device from operating until the input voltage exceeds 2.73 V (typical). The UVLO threshold has approximately 430 mV of hysteresis, so the part will operate until VIN drops below 2.3V (typical). Hysteresis prevents the part from turning off during power up if VIN is nonmonotonic.
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LM2830,LM2830-Q1 www.ti.com SNVS454E –AUGUST 2006–REVISED DECEMBER 2014 Feature Description (continued)
7.3.4 Current Limit
The LM2830 device uses cycle-by-cycle current limiting to protect the output switch. During each switching cycle, a current limit comparator detects if the output switch current exceeds 1.75 A (typical), and turns off the switch until the next switching cycle begins.
7.3.5 Thermal Shutdown
Thermal shutdown limits total power dissipation by turning off the output switch when the IC junction temperature exceeds 165°C. After thermal shutdown occurs, the output switch does not turn on until the junction temperature drops to approximately 150°C.
7.4 Device Functional Modes
In normal operational mode, the device will regulate output voltage to the value set with resistive divider. In addition, this device has an enable (EN) pin that lets the user turn the device on and off by driving this pin high and low. Default setup is that this pin is connected to VIN through pull up resistor (typically 100 kΩ). When enable pin is low the device is in shutdown mode consuming typically only 30 nA, making it ideal for applications where low power consumption is desirable. Copyright © 2006–2014, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: LM2830 LM2830-Q1
8 Application and Implementation
validate and test their design implementation to confirm system functionality.
8.1 Application Information
very small solution size. For component selection, see Detailed Design Procedure.
8.2 Typical Applications
Figure 19. LM2830X (1.6 MHz): Vin = 5 V, Vo = 1.2 V at 1.0-A Schematic
8.2.1.1 Design Requirements
This device must be able to operate at any voltage within input voltage range. to handle full expected load current as well as the peak current generated during load transients and start up. not be left floating in application.
8.2.1.2 Detailed Design Procedure
Table 1. Bill of Materials
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Table 1. Bill of Materials (continued)
8.2.1.2.1 Inductor Selection
VD, the higher the operating efficiency of the converter. The inductor value determines the output ripple current. inductor value will decrease the output ripple current. Figure 20. Inductor Current be safe enough. The typical current limit is 1.75 A.
/c27VOUT = /c27IL R ESR +8 x FSW x COUT IRMS_IN = IOUT x D(1 - D) IRMS_IN D IOUT 2 (1-D) +/c27i2 x (VIN - VOUT )L = 2/c27iL DT S LM2830,LM2830-Q1 SNVS454E –AUGUST 2006–REVISED DECEMBER 2014 www.ti.com The LM2830 device operates at frequencies allowing the use of ceramic output capacitors without compromising transient response. Ceramic capacitors allow higher inductor ripple without significantly increasing output ripple. See the Output Capacitor for more details on calculating output voltage ripple. Now that the ripple current is determined, the inductance is calculated by: where
- Ts = 1/fs (7) When selecting an inductor, make sure that it is capable of supporting the peak output current without saturating. Inductor saturation will result in a sudden reduction in inductance and prevent the regulator from operating correctly. Because of the speed of the internal current limit, it is necessary to specify the peak current of the inductor only required maximum output current. For example, if the designed maximum output current is 1.0 A and the peak current is 1.25 A, then the inductor should be specified with a saturation current limit of > 1.25 A. There is no need to specify the saturation or peak current of the inductor at the 1.75-A typical switch current limit. The difference in inductor size is a factor of 5. Because of the operating frequency of the LM2830 device, ferrite based inductors are preferred to minimize core losses. This presents little restriction because the variety of ferrite-based inductors is huge. Lastly, inductors with lower series resistance (RDCR) will provide better operating efficiency.
8.2.1.2.2 Input Capacitor
An input capacitor is necessary to ensure that VIN does not drop excessively during switching transients. The primary specifications of the input capacitor are capacitance, voltage, RMS current rating, and ESL (Equivalent Series Inductance). The recommended input capacitance is 22 µF. The input voltage rating is specifically stated by the capacitor manufacturer. Make sure to check any recommended deratings and also verify if there is any significant change in capacitance at the operating input voltage and the operating temperature. The input capacitor maximum RMS input current rating (IRMS-IN) must be greater than: (8) Neglecting inductor ripple simplifies the above equation to: (9) From Equation 9, it can be shown that maximum RMS capacitor current occurs when D = 0.5. Always calculate the RMS at the point where the duty cycle D is closest to 0.5. The ESL of an input capacitor is usually determined by the effective cross sectional area of the current path. A large leaded capacitor will have high ESL and a 0805 ceramic chip capacitor will have very low ESL. At the operating frequencies of the LM2830 device, leaded capacitors may have an ESL so large that the resulting impedance (2πfL) will be higher than that required to provide stable operation. As a result, surface-mount capacitors are strongly recommended. Sanyo POSCAP, Tantalum or Niobium, Panasonic SP, and multilayer ceramic capacitors (MLCC) are all good choices for both input and output capacitors and have very low ESL. For MLCCs it is recommended to use X7R or X5R type capacitors due to their tolerance and temperature characteristics. Consult the capacitor manufacturer data sheets to see how rated capacitance varies over operating conditions.
8.2.1.2.3 Output Capacitor
The output capacitor is selected based upon the desired output ripple and transient response. The initial current of a load transient is provided mainly by the output capacitor. The output ripple of the converter is: (10) When using MLCCs, the ESR is typically so low that the capacitive ripple may dominate. When this occurs, the output ripple will be approximately sinusoidal and 90° phase shifted from the switching action. Given the availability and quality of MLCCs and the expected output voltage of designs using the LM2830 device, there is really no need to review any other capacitor technologies. Another benefit of ceramic capacitors is their ability to bypass high frequency noise. A certain amount of switching edge noise will couple through parasitic
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Product Folder Links: LM2830 LM2830-Q1
D = VOUT + VD + VDCR VIN + VD + VDCR - VSW D = VOUT + VD VIN + VD - VSW /c4b = POUT POUT + PLOSS /c4b = POUT PIN x R2R1 = VREF VOUT - 1 LM2830,LM2830-Q1 www.ti.com SNVS454E –AUGUST 2006–REVISED DECEMBER 2014 capacitances in the inductor to the output. A ceramic capacitor will bypass this noise while a tantalum will not. Because the output capacitor is one of the two external components that control the stability of the regulator control loop, most applications will require a minimum of 22 µF of output capacitance. Capacitance often, but not always, can be increased significantly with little detriment to the regulator stability. Like the input capacitor, recommended multilayer ceramic capacitors are X7R or X5R types.
8.2.1.2.4 Catch Diode
The catch diode (D1) conducts during the switch off-time. A Schottky diode is recommended for its fast switching times and low forward voltage drop. The catch diode should be chosen so that its current rating is greater than: ID1 = IOUT × (1-D) (11) The reverse breakdown rating of the diode must be at least the maximum input voltage plus appropriate margin. To improve efficiency, choose a Schottky diode with a low forward voltage drop.
8.2.1.2.5 Output Voltage
The output voltage is set using Equation 12, where R2 is connected between the FB pin and GND, and R1 is connected between VO and the FB pin. A good value for R2 is 10 kΩ. When designing a unity gain converter (Vo = 0.6 V), R1 should be between 0 Ω and 100 Ω, and R2 should be equal or greater than 10 kΩ. (12) VREF = 0.60 V (13)
8.2.1.2.6 Calculating Efficiency, and Junction Temperature
The complete LM2830 DC-DC converter efficiency can be calculated in the following manner. (14) Or (15) Calculations for determining the most significant power losses are shown below. Other losses totaling less than 2% are not discussed. Power loss (PLOSS) is the sum of two basic types of losses in the converter: switching and conduction. Conduction losses usually dominate at higher output loads, whereas switching losses remain relatively fixed and dominate at lower output loads. The first step in determining the losses is to calculate the duty cycle (D): (16) VSW is the voltage drop across the internal PFET when it is on, and is equal to: VSW = IOUT × RDSON (17) VD is the forward voltage drop across the Schottky catch diode. It can be obtained from the diode manufacturer's Electrical Characteristics section. If the voltage drop across the inductor (VDCR) is accounted for, the equation becomes: (18) The conduction losses in the free-wheeling Schottky diode are calculated as follows: PDIODE = VD × IOUT × (1-D) (19) Often this is the single most significant power loss in the circuit. Care should be taken to choose a Schottky diode that has a low forward voltage drop. Copyright © 2006–2014, Texas Instruments Incorporated Submit Documentation Feedback 15 Product Folder Links: LM2830 LM2830-Q1
is to empirically measuring the rise and fall times (10% to 90%) of the switch at the switch node. IQ is the quiescent operating current, and is typically around 3.3 mA for the 1.6-MHz frequency option. Table 2 lists typical application power losses. Table 2. Power Loss Tabulation
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8.2.1.3 Application Curves
Figure 21 and Figure 22 show start-up waveforms.
Figure 23 shows typical application circuit for step-down solution from VIN=5 to VOUT=0.6 V, 1.0-A load current. Figure 23. LM2830X (1.6 MHz): Vin = 5 V, Vo = 0.6 V at 1.0-A Schematic Table 3. Bill of Materials
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when using device version with higher switching frequency. Figure 25. LM2830Z (3 MHz): Vin = 5 V, Vo = 3.3 V at 1.0-A Schematic Table 5. Bill of Materials
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8.2.6 LM2830X Dual Converters With Delayed Enabled Design
and requires typically 20-kΩ pullup resistor to the monitored voltage. Table 7. Bill of Materials
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8.2.7 LM2830X Buck Converter and Voltage Double Circuit With LDO Follower
well as input voltage for an LDO, effectively providing solution with two output voltages. Table 8. Bill of Materials
9 Power Supply Recommendations
required in addition to the ceramic bypass capacitors.
10 Layout
10.1 Layout Guidelines
the GND connection of the output capacitor, which should be near the GND connections of CIN and D1. inductor and any other traces that are switching. High AC currents flow through the VIN, SW and VOUT traces, so they should be as short and wide as possible. noise can be decreased by choosing a shielded inductor. SNVA054 for further considerations and the LM2830 demo board as an example of a four-layer layout.
10.2 Layout Example
Figure 29. Example Schematic
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Figure 30. PCB Layout Example
10.3 Thermal Considerations
etc), and the surrounding circuitry. method requires the user to know the thermal impedance of the silicon junction to top case temperature. Some clarification needs to be made before we go any further. RθJC is the thermal impedance from all six sides of an IC package to silicon junction. RΦJC is the thermal impedance from top case to the silicon junction. thermocouple attached to the top case.
R /c54JA/c03= 165oC - 144oC 189 mW = 111o C/W R /c54JA/c03= 165° - Ta PINTERNAL R /c29JC/c03= TJ - TC Power LM2830,LM2830-Q1 SNVS454E –AUGUST 2006–REVISED DECEMBER 2014 www.ti.com Thermal Considerations (continued) RΦJC is approximately 30°C/Watt for the 6-pin WSON package with the exposed pad. Knowing the internal dissipation from the efficiency calculation given previously, and the case temperature, which can be empirically measured on the bench we have: (30) Therefore: Tj = (RΦJC x PLOSS) + TC (31) From the previous example: Tj = (RΦJC x PINTERNAL) + TC (32) Tj = 30°C/W x 0.189W + TC (33) The second method can give a very accurate silicon junction temperature. The first step is to determine RθJA of the application. The LM2830 device has over-temperature protection circuitry. When the silicon temperature reaches 165°C, the device stops switching. The protection circuitry has a hysteresis of about 15°C. Once the silicon temperature has decreased to approximately 150°C, the device will start to switch again. Knowing this, the RθJA for any application can be characterized during the early stages of the design one may calculate the RθJA by placing the PCB circuit into a thermal chamber. Raise the ambient temperature in the given working application until the circuit enters thermal shutdown. If the SW-pin is monitored, it will be obvious when the internal PFET stops switching, indicating a junction temperature of 165°C. Knowing the internal power dissipation from the above methods, the junction temperature, and the ambient temperature RθJA can be determined. (34) Once this is determined, the maximum ambient temperature allowed for a desired junction temperature can be found. An example of calculating RθJA for an application using the Texas Instruments LM2830 WSON demonstration board is shown below. The four layer PCB is constructed using FR4 with ½ oz copper traces. The copper ground plane is on the bottom layer. The ground plane is accessed by two vias. The board measures 3-cm × 3-cm. It was placed in an oven with no forced airflow. The ambient temperature was raised to 144°C, and at that temperature, the device went into thermal shutdown. From the previous example: PINTERNAL = 189mW (35) (36) If the junction temperature was to be kept below 125°C, then the ambient temperature could not go above 109°C Tj - (RθJA x PLOSS) = TA (37)
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10.4 WSON Package
Figure 31. Internal WSON Connection increasing the size of ground plane, and adding thermal vias, the RθJA for the application can be reduced. Figure 32. 6-Lead WSON PCB "Dog Bone" Layout
11 Device and Documentation Support
11.1 Device Support
11.1.1 Third-Party Products Disclaimer
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.1.2 Thermal Definitions
Heat in the LM2830 device due to internal power dissipation is removed through conduction and/or convection. convection occurs when air currents rise from the hot device to cooler air.
11.2 Related Links
resources, tools and software, and quick access to sample or buy. Table 9. Related Links
11.3 Trademarks
All trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
during storage or handling to prevent electrostatic damage to the MOS gates.
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11.5 Glossary
SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2006–2014, Texas Instruments Incorporated Submit Documentation Feedback 29 Product Folder Links: LM2830 LM2830-Q1
www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) LM2830XMF/NOPB Active Production SOT-23 (DBV) | 5 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 SKTB LM2830XMF/NOPB.A Active Production SOT-23 (DBV) | 5 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 SKTB LM2830XMFX/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 SKTB LM2830XMFX/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 SKTB LM2830XQMF/NOPB Active Production SOT-23 (DBV) | 5 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 SUFB LM2830XQMF/NOPB.A Active Production SOT-23 (DBV) | 5 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 SUFB LM2830XQMFE/NOPB Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 SUFB LM2830XQMFE/NOPB.A Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 SUFB LM2830XQMFX/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 SUFB LM2830XQMFX/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 SUFB LM2830ZMF/NOPB Active Production SOT-23 (DBV) | 5 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 SKXB LM2830ZMF/NOPB.A Active Production SOT-23 (DBV) | 5 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 SKXB LM2830ZQMF/NOPB Active Production SOT-23 (DBV) | 5 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 SURB LM2830ZQMF/NOPB.A Active Production SOT-23 (DBV) | 5 1000 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 SURB LM2830ZQMFE/NOPB Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 SURB LM2830ZQMFE/NOPB.A Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes SN Level-1-260C-UNLIM -40 to 125 SURB LM2830ZQMFX/NOPB Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 SURB LM2830ZQMFX/NOPB.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 SURB LM2830ZSD/NOPB Active Production WSON (NGG) | 6 1000 | SMALL T&R Yes SN Level-3-260C-168 HR -40 to 125 L192B LM2830ZSD/NOPB.A Active Production WSON (NGG) | 6 1000 | SMALL T&R Yes SN Level-3-260C-168 HR -40 to 125 L192B (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. Addendum-Page 1
www.ti.com 23-May-2025 (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM2830, LM2830-Q1 :
- Catalog : LM2830
- Automotive : LM2830-Q1 NOTE: Qualified Version Definitions:
- Catalog - TI's standard catalog product
- Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 25-Sep-2024 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 25-Sep-2024 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2830XMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM2830XMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM2830XQMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM2830XQMFE/NOPB SOT-23 DBV 5 250 210.0 185.0 35.0 LM2830XQMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM2830ZMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM2830ZQMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM2830ZQMFE/NOPB SOT-23 DBV 5 250 210.0 185.0 35.0 LM2830ZQMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM2830ZSD/NOPB WSON NGG 6 1000 208.0 191.0 35.0 Pack Materials-Page 2
www.ti.com SDE06A (Rev A)
www.ti.com PACKAGE OUTLINE C 0.22
0.08 TYP
0.25 3.0 2.6 2X 0.95 1.9 1.45 0.90 0.15
0.00 TYP
5X 0.5 0.3 0.6
0.3 TYP
0 TYP
1.9 (0.1) (0.15) 4X 0 -15 4X 4 -15 A 3.05 2.75 B1.75 1.45 (1.1) SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR 4214839/K 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25 mm per side. 5. Support pin may differ or may not be present.
0.2 C A B
0.1 C SCALE 4.000
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
0.07 MIN
5X (1.1) 5X (0.6) (2.6) (1.9) 2X (0.95) (R0.05) TYP 4214839/K 08/2024 SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X PKG 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN (2.6) (1.9) 2X(0.95) 5X (1.1) 5X (0.6) (R0.05) TYP SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR 4214839/K 08/2024 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X SYMM PKG 3 4
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