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Sample & Buy T echnical Documents Tools & Software Support & Community LM231,LM331 SNOSBI2C –JUNE 1999–REVISED SEPTEMBER 2015 LMx31xPrecisionVoltage-to-FrequencyConverters
1 Features 3 Description
The LMx31 family of voltage-to-frequency converters 1• Ensured Linearity 0.01% Maximum are ideally suited for use in simple low-cost circuits• Improved Performance in Existing Voltage-to- for analog-to-digital conversion, precision frequency-Frequency Conversion Applications to-voltage conversion, long-term integration, linear
- Split or Single-Supply Operation frequency modulation or demodulation, and many other functions. The output when used as a voltage-• Operates on Single 5-V Supply to-frequency converter is a pulse train at a frequency• Pulse Output Compatible With All Logic Forms precisely proportional to the applied input voltage.
- Excellent Temperature Stability: ±50 ppm/°C Thus, it provides all the inherent advantages of the Maximum voltage-to-frequency conversion techniques, and is easy to apply in all standard voltage-to-frequency• Low Power Consumption: 15 mW Typical at 5 V converter applications.• Wide Dynamic Range, 100 dB Minimum at 10-kHz Full Scale Frequency Device Information(1)
- Wide Range of Full Scale Frequency: PART NUMBER PACKAGE BODY SIZE (NOM)
1 Hz to 100 kHz LM231
PDIP (8) 9.81 mm × 6.35 mm• Low-Cost LM331 (1) For all available packages, see the orderable addendum at2 Applications the end of the data sheet.
- Voltage to Frequency Conversions
- Frequency to Voltage Conversions
- Remote-Sensor Monitoring
- Tachometers Schematic Diagram An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM231,LM331 SNOSBI2C –JUNE 1999–REVISED SEPTEMBER 2015 www.ti.com Table of Contents
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (March 2013) to Revision C Page
- Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device Changes from Revision A (March 2013) to Revision B Page
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5 Description continued
Further, the LMx31A attain a new high level of accuracy versus temperature which could only be attained with expensive voltage-to-frequency modules. Additionally the LMx31 are ideally suited for use in digital systems at low power supply voltages and can provide low-cost analog-to-digital conversion in microprocessor-controlled systems. And, the frequency from a battery-powered voltage-to-frequency converter can be easily channeled through a simple photo isolator to provide isolation against high common-mode levels. The LMx31 uses a new temperature-compensated band-gap reference circuit, to provide excellent accuracy over the full operating temperature range, at power supplies as low as 4 V. The precision timer circuit has low bias currents without degrading the quick response necessary for 100-kHz voltage-to-frequency conversion. And the output are capable of driving 3 TTL loads, or a high-voltage output up to 40 V, yet is short-circuit-proof against VCC. Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM231 LM331
LM231,LM331 SNOSBI2C –JUNE 1999–REVISED SEPTEMBER 2015 www.ti.com
6 Pin Configuration and Functions
NAME NO. IOUT 1 O Current Output IREF 2 I Reference Current FOUT 3 O Frequency Output. This output is an open-collector output and requires a pullup resistor. GND 4 G Ground RC 5 I R-C filter input THRESH 6 I Threshold input COMPIN 7 I Comparator Input VS 8 P Supply Voltage
7 Specifications
7.1 Absolute Maximum Ratings(1)(2)(3)
Supply Voltage, VS 40 V Output Short Circuit to Ground Continuous Output Short Circuit to VCC Continuous Input Voltage −0.2 +VS V Lead Temperature (Soldering, 10 sec.) PDIP 260 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are measured with respect to GND = 0 V, unless otherwise noted. (3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
7.2 ESD Ratings
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±500 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) Human body model, 100 pF discharged through a 1.5-kΩ resistor.
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7.3 Recommended Operating Conditions
LM231, LM231A −25 85 °COperating Ambient Temperature LM331, LM331A 0 70 °C Supply Voltage, VS(1) 4 40 V (1) All voltages are measured with respect to GND = 0 V, unless otherwise noted.
7.4 Thermal Information
LM312, LM331 THERMAL METRIC(1) P (PDIP) UNIT
8 PINS
RθJA Junction-to-ambient thermal resistance 100 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
7.5 Electrical Characteristics
All specifications apply in the circuit of Figure 16, with 4.0 V ≤ VS ≤ 40 V, TA = 25°C, unless otherwise specified. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT % Full-4.5 V ≤ VS ≤ 20 V ±0.003 ±0.01 Scale VFC Non-Linearity (1) % Full-TMIN ≤ TA ≤ TMAX ±0.006 ±0.02 Scale %Full-VFC Non-Linearity in Circuit of Figure 14 VS = 15 V, f = 10 Hz to 11 kHz ±0.024 ±0.14 Scale LM231, LM231A VIN = −10 V, RS = 14 kΩ 0.95 1 1.05 kHz/VConversion Accuracy Scale Factor (Gain) LM331, LM331A 0.9 1 1.1 kHz/V TMIN ≤ TA ≤ TMAXLMx31 ±30 ±150 ppm/°CTemperature Stability 4.5 V ≤ VS ≤ 20 V of Gain LMx31A ±20 ±50 ppm/°C 4.5 V ≤ VS ≤ 10 V 0.01 0.1 %/V Change of Gain with VS 10 V ≤ VS ≤ 40 V 0.006 0.06 %/V Rated Full-Scale Frequency VIN = −10 V 10.0 kHz % Full-Gain Stability vs. Time (1000 Hours) TMIN ≤ TA ≤ TMAX ±0.02 Scale Over Range (Beyond Full-Scale) Frequency VIN = −11 V 10% INPUT COMPARATOR Offset Voltage ±3 ±10 mV LM231/LM331 TMIN ≤ TA ≤ TMAX ±4 ±14 mV LM231A/LM331A TMIN ≤ TA ≤ TMAX ±3 ±10 mV Bias Current −80 −300 nA Offset Current ±8 ±100 nA Common-Mode Range TMIN ≤ TA ≤ TMAX −0.2 VCC − 2 V TIMER Timer Threshold Voltage, Pin 5 0.63 × VS 0.667 × VS 0.7 × VS Input Bias Current, Pin 5 VS = 15 V All Devices 0V ≤ VPIN 5 ≤ 9.9 V ±10 ±100 nA LM231/LM331 VPIN 5 = 10 V 200 1000 nA LM231A/LM331A VPIN 5 = 10 V 200 500 nA VSAT PIN 5 (Reset) I = 5 mA 0.22 0.5 V (1) Non-linearity is defined as the deviation of fOUT from VIN × (10 kHz/−10 VDC) when the circuit has been trimmed for zero error at 10 Hz and at 10 kHz, over the frequency range 1 Hz to 11 kHz. For the timing capacitor, CT, use NPO ceramic, Teflon®, or polystyrene. Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM231 LM331
LM231,LM331 SNOSBI2C –JUNE 1999–REVISED SEPTEMBER 2015 www.ti.com Electrical Characteristics (continued) All specifications apply in the circuit of Figure 16, with 4.0 V ≤ VS ≤ 40 V, TA = 25°C, unless otherwise specified. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT CURRENT SOURCE (PIN 1) LM231, LM231A RS = 14 kΩ, VPIN 1 = 0 126 135 144 μA Output Current LM331, LM331A 116 136 156 μA Change with Voltage 0V ≤ VPIN 1 ≤ 10 V 0.2 1 μA LM231, LM231A, 0.02 10 nACurrent Source OFF LM331, LM331A Leakage All Devices TA = TMAX 2 50 nA Operating Range of Current (Typical) (10 to 500) μA REFERENCE VOLTAGE (PIN 2) LM231, LM231A 1.76 1.89 2.02 VDC LM331, LM331A 1.7 1.89 2.08 VDC Stability vs. Temperature ±60 ppm/°C Stability vs. Time, 1000 Hours ±0.1% LOGIC OUTPUT (PIN 3) I = 5 mA 0.15 0.5 V VSAT I = 3.2 mA (2 TTL Loads), 0.1 0.4 VTMIN ≤ TA ≤ TMAX OFF Leakage ±0.05 1 μA SUPPLY CURRENT VS = 5 V 2 3 4 mA LM231, LM231A VS = 40 V 2.5 4 6 mA VS = 5 V 1.5 3 6 mA LM331, LM331A VS = 40 V 2 4 8 mA
7.6 Dissipation Ratings
Package Dissipation at 25°C(1) 1.25 W (1) The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature TA, and can be calculated using the formula PDmax = (TJmax - TA) / θJA. The values for maximum power dissipation will be reached only when the device is operated in a severe fault condition (e.g., when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided.
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7.7 Typical Characteristics
Figure 1. Non-Linearity Error as Precision V-to-F Converter Figure 2. Non-Linearity Error Figure 4. Frequency vs. TemperatureFigure 3. Non-Linearity Error vs. Power Supply Voltage Figure 6. Output Frequency vs. VSUPPLYFigure 5. VREF vs. Temperature
Figure 8. Non-Linearity Error (Figure 14)Figure 7. 100 kHz Non-Linearity Error (Figure 17) Figure 9. Input Current (Pins 6,7) vs. Temperature Figure 10. Power Drain vs. VSUPPLY Figure 12. Non-Linearity Error, Precision F-to-V ConverterFigure 11. Output Saturation Voltage vs. IOUT (Pin 3)
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8 Detailed Description
8.1 Overview
8.1.1 Detail of Operation, Functional Block Diagram
The Functional Block Diagram shows a band gap reference which provides a stable 1.9-VDC output. This 1.9 VDC is well regulated over a VS range of 3.9 V to 40 V. It also has a flat, low temperature coefficient, and typically changes less than ½% over a 100°C temperature change. The current pump circuit forces the voltage at pin 2 to be at 1.9 V, and causes a current i = 1.90 V/RS to flow. For RS=14 k, i=135 μA. The precision current reflector provides a current equal to i to the current switch. The current switch switches the current to pin 1 or to ground, depending upon the state of the R-S flip-flop. The timing function consists of an R-S flip-flop and a timer comparator connected to the external RtCt network. When the input comparator detects a voltage at pin 7 higher than pin 6, it sets the R-S flip-flop which turns ON the current switch and the output driver transistor. When the voltage at pin 5 rises to ⅔ VCC, the timer comparator causes the R-S flip-flop to reset. The reset transistor is then turned ON and the current switch is turned OFF. However, if the input comparator still detects the voltage on pin 7 as higher than pin 6 when pin 5 crosses ⅔ VCC, the flip-flop will not be reset, and the current at pin 1 will continue to flow, trying to make the voltage at pin 6 higher than pin 7. This condition will usually apply under start-up conditions or in the case of an overload voltage at signal input. During this sort of overload the output frequency will be 0. As soon as the signal is restored to the working range, the output frequency will be resumed.
8.2 Functional Block Diagram
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8.3 Feature Description
The LMx31 operate over a wide voltage range of 4 V to 40 V. The voltage at pin 2 is regulated at 1.90 VDC for all values of i between 10 μA to 500 μA. It can be used as a voltage reference for other components, but take care to ensure that current is not taken from it which could reduce the accuracy of the converter.
8.4 Device Functional Modes
The output driver transistor acts to saturate pin 3 with an ON resistance of about 50 Ω. In case of overvoltage, the output current is actively limited to less than 50 mA. If the voltage on pin 7 is higher than pin 6 when pin 5 crosses ⅔ VCC, the LMx31 internal flip-flop will not be reset, and the current at pin 1 will continue to flow, trying to make the voltage at pin 6 higher than pin 7. This condition will usually apply under start-up conditions or in the case of an overload voltage at signal input. During this sort of overload the output frequency will be 0. As soon as the signal is restored to the working range, the output frequency will be resumed.
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9 Application and Implementation
validate and test their design implementation to confirm system functionality.
9.1 Application Information
9.1.1 Simplified Voltage-to-Frequency Converter
flow out of the switched current source and provide a fixed amount of charge, Q = i × t, into the capacitor, CL. OFF, and the timer will reset itself. to the level of V1. Then the comparator will trigger the timer and start another cycle. provide a frequency precisely proportional to its input voltage over a wide range of frequencies.
9.1.2 Principles of Operation
LMx31 is shown in Figure 13 and consists of a switched current source, input comparator, and 1-shot timer. Figure 13. Simplified Block Diagram of Stand-Alone
9.2 Typical Applications
9.2.1 Basic Voltage-to-Frequency Converter
few components for improved performance. *Use stable components with low temperature coefficients. See Application Information. **0.1 μF or 1 μF, See Typical Applications. Figure 14. Simple Stand-Alone V-to-F Converter
9.2.1.1 Design Requirements
with an input voltage range of 25 mV to 12.5 V. The available supply voltage is 15.0 V.
9.2.1.2 Detailed Design Procedure
desired, NPO ceramic, polystyrene, Teflon or polypropylene are best suited.
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provide the excellent linearity. This results in the transfer function of ƒOUT = (VIN / 2.09 V) × (RS / RL) × (1 / RtCt).
9.2.1.3 Application Curve
Figure 15. Output Non-Linearity Error vs. Frequency
9.2.2 Precision V-To-F Converter
In this circuit, integration is performed by using a conventional operational amplifier and feedback capacitor, CF. 2 output pulses can be measured. non-linearity is the output impedance at pin 1 which causes i to change as a function of VIN). *Use stable components with low temperature coefficients. **This resistor can be 5 kΩ or 10 kΩ for VS = 8 V to 22 V, but must be 10 kΩ for VS = 4.5 V to 8 V. Figure 16. Standard Test Circuit and Applications Circuit, Precision Voltage-to-Frequency Converter
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9.3 System Examples
9.3.1 F-to-V Converters
flowing out of pin 1 is IAVERAGE = i × (1.1 RtCt) × f. than in Figure 18. However, for input frequencies below 200 Hz, this circuit will have worse ripple than Figure 18. *Use stable components with low temperature coefficients. *Use stable components with low temperature coefficients. recommended types LF411A or LF356. Figure 17. Precision Voltage-to-Frequency Figure 18. Simple Frequency-to-Voltage Converter
*Use stable components with low temperature coefficients. Figure 19. Precision Frequency-to-Voltage Figure 20. Light Intensity to Frequency Converter Figure 21. Temperature to Frequency Converter Figure 22. Long-Term Digital Integrator Using VFC Figure 23. Basic Analog-to-Digital Converter Using Figure 24. Analog-to-Digital Converter With
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10 Power Supply Recommendations
should be bypassing to ground with a low-ESR, 1-µF capacitor. It is acceptable to use X7R capacitors for this. For systems using higher supply voltages, ensure that the voltage rating for the bypass caps is sufficient.
11 Layout
11.1 Layout Guidelines
it is acceptable to place the bypass capacitor on the bottom layer. Use of a ground plane is recommended to provide a low-impedance ground across the circuit.
11.2 Layout Example
Figure 31. Layout Example
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12 Device and Documentation Support
12.1 Related Links
resources, tools and software, and quick access to sample or buy. Table 1. Related Links
12.2 Community Resources
solve problems with fellow engineers. contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments. Teflon is a registered trademark of E. All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
www.ti.com 8-Aug-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM231AN/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -25 to 85 LM 231AN LM231N/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -25 to 85 LM 231N LM331AN/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM LM 331AN LM331N/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LM 331N RC4151NB OBSOLETE PDIP P 8 TBD Call TI Call TI 0 to 70 LM 331N RV4151NB OBSOLETE PDIP P 8 TBD Call TI Call TI -25 to 85 LM 231N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
www.ti.com 8-Aug-2015 Addendum-Page 2 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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