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LM185-ADJ,LM285-ADJ,LM385-ADJ www.ti.com SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 LM185/LM285/LM385AdjustableMicropowerVoltageReferences Check forSamples: LM185-ADJ ,LM285-ADJ ,LM385-ADJ Carefuldesignof the LM185 has made the device1FEATURES tolerantofcapacitiveloading,making iteasy touse in 2• Adjustablefrom 1.24Vto5.30V almostany referenceapplication.The wide dynamic
- OperatingCurrentof10μA to20mA operatingrange allowsitsuse withwidelyvarying supplieswithexcellentregulation.• 1% and 2% InitialTolerance
- 1Ω Dynamic Impedance The extremelylowpower drainoftheLM185 makes it usefulformicropowercircuitry.Thisvoltagereference• Low Temperature Coefficient can be used to make portablemeters,regulatorsor The LM185 isratedforoperationover a −55°C to20mA currentrange,they featureexceptionallylow 125°C temperaturerange,whilethe LM285 israteddynamic impedance and good temperaturestability. −40°C to 85°C and the LM385 0°C to 70°C. TheOn-chip trimmingis used to providetightvoltage LM185 isavailableina hermeticTO package and atolerance.SincetheLM185 band-gapreferenceuses LCCC package, while the LM285/LM385 areonly transistorsand resistors,low noise and good availablein a low-costTO-92 package, as wellaslong-termstabilityresult. SOIC. Connection Diagram Figure1. TO-92 Package Figure2. TO Package Bottom View Bottom View Figure3. SOIC Package Figure4. 20-LCCC Top View Top View Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2000–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
LM185-ADJ,LM285-ADJ,LM385-ADJ SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 www.ti.com Block Diagram TypicalApplications Figure5. 1.2VReference Figure6. 5.0VReference These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates.
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LM185-ADJ,LM285-ADJ,LM385-ADJ www.ti.com SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 AbsoluteMaximum Ratings(1)(2)(3) ReverseCurrent 30mA ForwardCurrent 10mA OperatingTemperatureRange (4) LM185 Series −55°C to125°C LM285 Series −40°C to85°C LM385 Series 0°C to70°C ESD Susceptibility(5) 2kV StorageTemperature −55°C to150°C SolderingInformation Vapor Phase (60sec.) 215°C Infrared(15sec.) 220°C See An-450 “SurfaceMountingMethods and TheirEffecton ProductReliability”forothermethods ofsolderingsurfacemount devices. (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisintendedtobe functional.Forspecificationsand testconditions,see theElectricalCharacteristics.The specifications applyonlyforthetestconditionslisted. (2) RefertoRETS185H formilitaryspecifications. (3) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityand specifications. (4) Forelevatedtemperatureoperation,see Table1 and ThermalCharacteristics. (5) The human body model isa 100 pF capacitordischargedthrougha 1.5kΩ resistorintoeach pin. Table1.TJ(max) forElevatedTemperature Operation DEVICE TJ(max) (°C) LM185 150 LM285 125 LM385 100 Thermal Characteristics Over operatingfree-airtemperaturerange(unlessotherwisenoted) Thermal Resistance TO-92 TO-46 SOIC 180°C/W (0.4″ leads) θJA (JunctiontoAmbient) 440°C/W 165°C/W 170°C/W (0.125″ leads) θJC (JunctiontoCase) N/A 80°C/W N/A Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ,LM285-ADJ,LM385-ADJ SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 www.ti.com ElectricalCharacteristics(1) LM185, LM285 LM385 LM185BX, LM285 LM385 LM185BY LM385BX,LM185B, LM385BY UnitsParameter Conditions LM285BX, (Limit)Typ TypLM285BY Tested Design Tested Design Tested Design Tested Design Limit Limit Limit Limit Limit Limit Limit Limit Voltage 1.255 1.215 Voltage (max)1mA < IR < 20mA 4 10 20 10 20 5 15 25 15 25Change with Current Dynamic IR = 100μA, f= Output 100Hz Impedance IAC = 0.1IR VOUT = 0.3 0.4 ΩVREF VOUT = 0.7 1 5.3V Reference IR = 100μA Voltage mVChange with 1 3 6 3 6 2 5 10 5 10 (max)Output Voltage Feedback 13 20 25 20 25 16 30 35 30 35 nA (max) Current Minimum VOUT = VREF 6 9 10 9 10 7 11 13 11 13 μA Operating (max)VOUT = 5.3V 30 45 50 45 50 35 55 60 55 60Current(see curve) Output IR = 100μA,10Hz < f μVrms Wideband < 10kHz Noise VOUT = VREF 50 50 VOUT = 5.3V 170 170 Average IR = 100μA X Suffix 30 30 Temperature Y Suffix 50 50 ppm/°cCoefficient (max)All 150 150 150 150(4) Others Long Term IR = 100μA,T = 1000 20 20 ppm Stability Hr, TA = 25°C ± 0.1°C (1) Parametersidentifiedwithboldfacetypeapplyattemperatureextremes.Allothernumbers applyatTA = TJ = 25°C. Unlessotherwise specified,allparametersapplyforVREF < VOUT < 5.3V. (2) Productiontested. (3) Not productiontested.These limitsarenottobe used tocalculateaverageoutgoingqualitylevels. (4) The averagetemperaturecoefficientisdefinedas themaximum deviationofreferencevoltageatallmeasured temperaturesfromTMIN toTMAX ,dividedby TMAX − TMIN .The measured temperaturesare−55,−40,0,25,70,85,125°C.
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LM185-ADJ,LM285-ADJ,LM385-ADJ www.ti.com SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 TypicalPerformance Characteristics Temperature Driftof3 RepresentativeUnits Feedback Current Figure7. Figure8. Minimum OperatingCurrent Reverse Characteristics Figure9. Figure10. Reverse Characteristics Forward Characteristics Figure11. Figure12. Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ,LM285-ADJ,LM385-ADJ SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics(continued) Output Noise Voltage Dynamic Output Impedance Figure13. Figure14. Response Time Figure15. Temperature CoefficientTypical LM185 (left), LM285 (center), LM385 (right) Figure16.
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LM185-ADJ,LM285-ADJ,LM385-ADJ www.ti.com SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 TYPICAL APPLICATIONS Figure17.Precision10V Reference Figure18.Low AC Noise Reference Figure19.25V Low CurrentShunt Regulator Figure20.200 mA Shunt Regulator Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ,LM285-ADJ,LM385-ADJ SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 www.ti.com Figure21.Series-Shunt20 mA Regulator Figure22.High EfficiencyLow Power Regulator Figure23.VoltageLevelDetector Figure24.VoltageLevelDetector Figure25.FastPositiveClamp Figure26.BidirectionalClamp 2.4V+ ΔVD1 ±2.4V
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LM185-ADJ,LM285-ADJ,LM385-ADJ www.ti.com SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 Figure27.BidirectionalAdjustableClamp Figure28.BidirectionalAdjustableClamp ±1.8Vto ±2.4V ±2.4Vto ±6V Figure29. Simple FloatingCurrentDetector Figure30. CurrentSource Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ,LM285-ADJ,LM385-ADJ SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 www.ti.com *D1 can be any LED, VF=1.5V to2.2Vat3 mA. D1 may actas an indicator.D1 willbe on ifITHRESHOLD fallsbelowthe thresholdcurrent,exceptwithI=O. Figure31. PrecisionFloatingCurrentDetector Figure32. CentigradeThermometer, 10mV/ °C Figure33. FreezerAlarm
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LM185-ADJ,LM285-ADJ,LM385-ADJ www.ti.com SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 Schematic Diagram Copyright© 2000–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ,LM285-ADJ,LM385-ADJ SNVS741F –FEBRUARY 2000–REVISED APRIL 2013 www.ti.com
REVISION HISTORY
Changes from RevisionE (April2013)toRevisionF Page
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www.ti.com 1-Nov-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM185BH ACTIVE TO NDV 3 1000 TBD Call TI Call TI -55 to 125 LM185BH LM185BH/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 125 LM185BH LM185H-2.5 ACTIVE TO NDU 2 1000 TBD Call TI Call TI -55 to 125 LM185H2.5 LM185H-2.5/NOPB ACTIVE TO NDU 2 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 125 LM185H2.5 LM285BXZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type -40 to 85 LM285 BXZ LM285BYM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM285 BYM LM285BYMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 85 LM285 BYM LM285BYZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type -40 to 85 LM285 BYZ LM285M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 85 LM285 M LM285MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 85 LM285 M LM285Z/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type -40 to 85 LM285 Z LM385BM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM385 BM LM385BM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 LM385 BM LM385BMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 LM385 BM LM385BXZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type 0 to 70 LM385 BXZ LM385BYZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type 0 to 70 LM385 BYZ LM385BZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type 0 to 70 LM385 BZ LM385M NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM385
www.ti.com 1-Nov-2013 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples M LM385M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 LM385 M LM385MX NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 70 LM385 M LM385MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 LM385 M LM385Z/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type 0 to 70 LM385 Z (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
www.ti.com 1-Nov-2013 Addendum-Page 3 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM285BYMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM285MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385BMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385MX SOIC D 8 2500 367.0 367.0 35.0 LM385MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 Pack Materials-Page 2
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