LM185BYH2.5/883

LM185-2.5QML TI | Alldatasheet

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+ VREF N/C N/C N/C N/C N/C N/C N/C N/C LM185-2.5QML www.ti.com SNVS385A –NOVEMBER 2005–REVISED MARCH 2013 MicropowerVoltageReferenceDiode Check forSamples: LM185-2.5QML 1FEATURES DESCRIPTION The LM185-2.5 are micropower2-terminalband-gap 2• OperatingCurrentof20 μA to20 mA voltageregulatordiodes.Operatingover a 20 μA to• 0.6Ω Dynamic Impedance (A grade) 20 mA currentrange,theyfeatureexceptionallylow

• Low Temperature Coefficient dynamic impedance and good temperaturestability. On-chip trimmingis used to providetightvoltage• Low VoltageReference— 2.5V tolerance.Since the LM185-2.5 band-gap reference uses only transistorsand resistors,low noise and good longtermstabilityresult. CarefuldesignoftheLM185-2.5has made thedevice exceptionallytolerantofcapacitiveloading,making it easy touse inalmostany referenceapplication.The wide dynamic operatingrange allowsitsuse with widelyvaryingsupplieswithexcellentregulation. The extremelylow power drainof the LM185-2.5 makes itusefulformicropowercircuitry.Thisvoltage referencecan be used to make portablemeters, regulatorsor generalpurpose analog circuitrywith batterylifeapproachingshelflife.Further,the wide operatingcurrentallowsittoreplaceolderreferences witha tightertolerancepart.Forapplicationsrequiring 1.2Vsee LM185-1.2. Connection Diagram Figure1.CLGA Package-Top View Figure2.PFM MetalCan Package- Bottom View See Package Number NAC See Package Number NDU Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2005–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

LM185-2.5QML SNVS385A –NOVEMBER 2005–REVISED MARCH 2013 www.ti.com Schematic Diagram These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1) ReverseCurrent 30 mA ForwardCurrent 10 mA OperatingTemperatureRange −55°C ≤ TA ≤ + 125°C StorageTemperature −55°C ≤ TA ≤ + 150°C Maximum JunctionTemperature(TJmax ) (2) 150°C PFM MetalCan 300°C Lead Temperature(Soldering,10 sec) CeramicCLGA 260°C PFM MetalCan (StillAir) 300°C/W PFM MetalCan (500LF/Min AirFlow) 139°C/W θJA CeramicCLGA (StillAir) 194°C/W ThermalResistance CeramicCLGA (500LF/Min AirFlow) 128°C/W PFM MetalCan 57°C/W θJC CeramicCLGA 23°C/W PFM MetalCan TBD Package Weight(Typical) CeramicCLGA 210 mg ESD Tolerance(3) 4000V (1) AbsoluteMaximum Ratingsindicatelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsindicateconditionsfor whichthedeviceisfunctional,butdo notensurespecificperformancelimits.Forensuredspecificationsand testconditions,see the ElectricalCharacteristics.The ensuredspecificationsapplyonlyforthetestconditionslisted.Some performancecharacteristicsmay degradewhen thedeviceisnotoperatedunderthelistedtestconditions. (2) The maximum power dissipationmust be deratedatelevatedtemperaturesand isdictatedby TJmax (maximum junctiontemperature), θJA (packagejunctiontoambientthermalresistance),and TA (ambienttemperature).The maximum allowablepower dissipationatany temperatureisPDmax = (TJmax -TA)/θJA orthenumber givenintheAbsoluteMaximum Ratings,whicheverislower. (3) Human body model,1.5kΩ inserieswith100 pF

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LM185-2.5QML www.ti.com SNVS385A –NOVEMBER 2005–REVISED MARCH 2013 Table1.QualityConformance Inspection(1) Subgroup Description Temp °C

1 Statictestsat 25

2 Statictestsat 125

3 Statictestsat -55

4 Dynamic testsat 25

5 Dynamic testsat 125

6 Dynamic testsat -55

7 Functionaltestsat 25

9 Switchingtestsat 25

10 Switchingtestsat 125

11 Switchingtestsat -55

12 Settlingtimeat 25

13 Settlingtimeat 125

14 Settlingtimeat -55

(1) Mil-Std-883,Method 5005 -Group A LM185 –2.5ElectricalCharacteristicsDC Parameters Sub-Symbol Parameter Conditions Notes Min Max Units groups VRef ReverseBreakdown Voltage IR = 20µA 2.462 2.538 V 1 IR = 30µA 2.425 2.575 V 2,3 IR = 1mA 2.462 2.538 V 1 2.425 2.575 V 2,3 IR = 20mA 2.462 2.538 V 1 2.425 2.575 V 2,3 ΔVRef /ΔIR ReverseBreakdown Voltage 20µA ≤ IR ≤ 1mA -1.0 1.0 mV 1 Change withCurrent 30µA ≤ IR ≤ 1mA -1.5 1.5 mV 2,3 1mA ≤ IR ≤ 20mA -10.0 10.0 mV 1 -20.0 20.0 mV 2,3 VF ForwardBiasVoltage IF = 2mA -1.0 -0.4 V 1 LM185 –2.5ElectricalCharacteristicsDC DriftParameters Deltacalculationsperformedon QMLV devicesatgroupB ,subgroup5,unlessotherwisespecifiedon IPI. Sub-Symbol Parameter Conditions Notes Min Max Units groups VRef ReverseBreakdown Voltage IR = 20µA -10 10 mV 1 IR = 20mA -10 10 mV 1 Copyright© 2005–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM185-2.5QML

LM185-2.5QML SNVS385A –NOVEMBER 2005–REVISED MARCH 2013 www.ti.com LM185BY –2.5ElectricalCharacteristicsDC Parameters Sub-Symbol Parameter Conditions Notes Min Max Units groups VRef ReverseBreakdown Voltage IR = 20µA 2.462 2.538 V 1 IR = 30µA 2.425 2.575 V 2,3 IR = 1mA 2.462 2.538 V 1 2.425 2.575 V 2,3 IR = 20mA 2.462 2.538 V 1 2.425 2.575 V 2,3 ΔVRef /ΔIR ReverseBreakdown Voltage 20µA ≤ IR ≤ 1mA -1.0 1.0 mV 1 Change withCurrent 30µA ≤ IR ≤ 1mA -1.5 1.5 mV 2,3 1mA ≤ IR ≤ 20mA -10.0 10.0 mV 1 -20.0 20.0 mV 2,3 VF ForwardBiasVoltage IF = 2mA −1.0 −0.4 V 1 TC TemperatureCoefficient (1) 50 PPM/ °C 2,3 (1) The averagetemperaturecoefficientisdefinedas themaximum deviationofreferencevoltage,atallmeasured temperaturesbetween theoperatingTMin & TMax ,dividedby (TMax − TMin).The measured temperatures(TMeasured)are−55°C, 25°C, & 125°C orΔVRef /(TMax − TMin) LM185BY –2.5ElectricalCharacteristicsDC DriftParameters Deltacalculationsperformedon QMLV devicesatgroupB ,subgroup5,unlessotherwisespecifiedon IPI. Sub-Symbol Parameter Conditions Notes Min Max Units groups VRef 1 ReverseBreakdown Voltage IR = 20µA -10 10 mV 1 VRef 2 ReverseBreakdown Voltage IR = 20mA -10 10 mV 1

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LM185-2.5QML www.ti.com SNVS385A –NOVEMBER 2005–REVISED MARCH 2013 TypicalPerformance Characteristics Reverse Characteristics Reverse Characteristics Figure3. Figure4. Forward Characteristics Temperature Drift Figure5. Figure6. Reverse Dynamic Reverse Dynamic Impedance Impedance Figure7. Figure8. Copyright© 2005–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM185-2.5QML

LM185-2.5QML SNVS385A –NOVEMBER 2005–REVISED MARCH 2013 www.ti.com TypicalPerformance Characteristics(continued) Noise Voltage FilteredOutput Noise Figure9. Figure10. Response Time Figure11.

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LM185-2.5QML www.ti.com SNVS385A –NOVEMBER 2005–REVISED MARCH 2013

APPLICATIONS

Figure12. Wide InputRange Reference Figure13. Micropower Referencefrom 9V Battery Figure14. Micropower 5V Reference IQ ≃ 40 μA Figure15. Micropower 10V Reference IQ ≃ 30 μA standbycurrent Copyright© 2005–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM185-2.5QML

LM185-2.5QML SNVS385A –NOVEMBER 2005–REVISED MARCH 2013 www.ti.com Precision1 μA to1 mA CurrentSources METER THERMOMETERS Figure16. 0°C –100°C Thermometer Calibration 1. ShortLM385-2.5,adjustR3 forIOUT = temp at1μA/°K 2. Remove short,adjustR2 forcorrectreadingincentigrade

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LM185-2.5QML www.ti.com SNVS385A –NOVEMBER 2005–REVISED MARCH 2013 Figure17. 0°F–50°F Thermometer Calibration 1. ShortLM385-2.5,adjustR3 forIOUT =temp at1.8μA/°K 2. Remove short,adjustR2 forcorrectreadingin°F Figure18. ImprovingRegulationofAdjustableRegulators Figure19. Micropower Thermocouple Cold JunctionCompensator AdjustmentProcedure 1. AdjustTC ADJ potuntilvoltageacrossR1 equalsKelvintemperaturemultipliedby thethermocoupleSeebeck coefficient. 2. AdjustzeroADJ potuntilvoltageacrossR2 equalsthethermocoupleSeebeck coefficientmultipliedby 273.2. Copyright© 2005–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM185-2.5QML

LM185-2.5QML SNVS385A –NOVEMBER 2005–REVISED MARCH 2013 www.ti.com Thermocouple Seebeck Co-efficient R1 R2 VoltageAcross R1 VoltageAcross R2 Type (μV/°C) (Ω) (Ω) @25 °C (mV) (mV) J 52.3 523 1.24k 15.60 14.32 T 42.8 432 1k 12.77 11.78 K 40.8 412 953Ω 12.17 11.17 S 6.4 63.4 150Ω 1.908 1.766 REVISION HISTORY SECTION Released Revision Section Originator Changes 11/08/05 A New Release,Corporateformat L.Lytle 2 MDS datasheetsconvertedintoone Corp. datasheetformat.MNLM185-2.5-X Rev 2A2 and MNLM185-2.5BY-X Rev 1B1 willbe archived. 03/20/13 A All Changed layoutofNationalData SheettoTI format.

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www.ti.com 29-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) 5962-8759402XA Active Production TO (NDU) | 2 20 | TRAY NON-STD Yes Call TI Level-1-NA-UNLIM -55 to 125 8759402XA Q 5962-8759402YA Active Production CFP (NAC) | 10 54 | TUBE No Call TI Level-1-NA-UNLIM -55 to 125 LM185WG- 2.5/883 Q 5962-87594 02YA ACO 02YA >T 5962-8759406VXA Active Production TO (NDU) | 2 20 | JEDEC TRAY (5+1) Yes Call TI Level-1-NA-UNLIM -55 to 125 8759406VXA Q LM185-2.5 MD8 Active Production DIESALE (Y) | 0 100 | JEDEC TRAY (5+1) Yes Call TI Level-1-NA-UNLIM -55 to 125 LM185-2.5-MD8.A Active Production DIESALE (Y) | 0 100 | JEDEC TRAY (5+1) Yes Call TI Level-1-NA-UNLIM -55 to 125 LM185BYH2.5-QV Active Production TO (NDU) | 2 20 | JEDEC TRAY (5+1) No Call TI Level-1-NA-UNLIM -55 to 125 8759406VXA Q LM185BYH2.5-QV.A Active Production TO (NDU) | 2 20 | JEDEC TRAY (5+1) Yes Call TI Level-1-NA-UNLIM -55 to 125 8759406VXA Q LM185BYH2.5/883 Active Production TO (NDU) | 2 20 | TRAY NON-STD Yes Call TI Level-1-NA-UNLIM -55 to 125 LM185BY2.5 Q LM185H-2.5-SMD Active Production TO (NDU) | 2 20 | TRAY NON-STD Yes Call TI Level-1-NA-UNLIM -55 to 125 8759402XA Q LM185H-2.5/883 Active Production TO (NDU) | 2 20 | TRAY NON-STD Yes Call TI Level-1-NA-UNLIM -55 to 125 LM185-2.5 Q LM185H-2.5/883.A Active Production TO (NDU) | 2 20 | TRAY NON-STD Yes Call TI Level-1-NA-UNLIM -55 to 125 LM185-2.5 Q LM185WG-2.5/883 Active Production CFP (NAC) | 10 54 | TUBE No Call TI Level-1-NA-UNLIM -55 to 125 LM185WG- 2.5/883 Q 5962-87594 02YA ACO 02YA >T LM185WG-2.5/883.A Active Production CFP (NAC) | 10 54 | TUBE No Call TI Level-1-NA-UNLIM -55 to 125 LM185WG- 2.5/883 Q 5962-87594 02YA ACO 02YA >T (1) Status: For more details on status, see our product life cycle. Addendum-Page 1

www.ti.com 29-May-2025 (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM185-2.5QML, LM185-2.5QML-SP :

• Military : LM185-2.5QML
• Space : LM185-2.5QML-SP NOTE: Qualified Version Definitions:
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TRAY L - Outer tray length without tabs KO - Outer tray height W - Outer tray width P1 - Tray unit pocket pitch CW - Measurement for tray edge (Y direction) to corner pocket center CL - Measurement for tray edge (X direction) to corner pocket center Text Chamfer on Tray corner indicates Pin 1 orientation of packed units. *All dimensions are nominal Device Package Name Package Type Pins SPQ Unit array matrix Max temperature (°C) L (mm) W (mm) (µm) (mm) CL (mm) CW (mm) Pack Materials-Page 1

www.ti.com PACKAGE OUTLINE .100 [2.54] .500 MIN [12.7] .080-.105 [2.03-2.67] .030 MAX [0.76] UNCONTROLLED LEAD DIA .025[0.64] MAX (MIL/AERO) .055[1.397] MAX (COMMERCIAL) .214 .005 [5.44 0.12] .041 .005 [1.04 0.12] .038 .010 [0.97 0.25] .0175 .0015 TYP [0.445 0.038] .187 .008 [4.75 0.2] 4214762/B 09/2024 TO-CAN - 2.67 mm max heightNDU0002A TRANSISTOR OUTLINE NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. SEATING PLANE

www.ti.com PACKAGE OUTLINE 8X .050 .002 [1.27 0.05] 10X .017 .002 [0.43 0.05] .241+.020 -.005 [6.12+0.50 -0.12 .2410 .0030 [6.121 0.076] .410 .010 [10.41 0.25] .005 MIN [0.12] TYP .010 .002 [0.25 0.05] .070+.010 -.020 [1.78+0.25 -0.50 .008 .004 TYP [0.2 0.1] .045 MAX TYP [1.14] R.015 .002 [0.38 0.05] 0 -4 .040 .003 [1.02 0.07] .006 .002 TYP [0.15 0.05] CFP - 2.33mm max heightNAC0010A CERAMIC FLATPACK .004 [0.1] NOTES: 1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. For solder thickness and composition, see the "Lead Finish Composition/Thickness" link in the packaging section of the Texas Instruments website 3. Lead 1 identification shall be: a) A notch or other mark within this area b) A tab on lead 1, either side 4. No JEDEC registration as of December 2021 4215196/D 08/2022 5 6 NOTE 3 LEAD 1 ID SUPPLIER OPTION NOTE 3 SEE DETAIL A SEATING PLANE DETAIL A TYPICAL SCALE 1.800

www.ti.com EXAMPLE BOARD LAYOUT (8X .050 ) [1.27] (R.002 ) TYP [0.05] .003 MIN [0.07] ALL AROUND .003 MAX [0.07] ALL AROUND (10X .090 ) [2.29] (10X .027 ) [0.69] (.37 ) [9.4] CFP - 2.33mm max heightNAC0010A CERAMIC FLATPACK SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 7X 4215196/D 08/2022 NON SOLDERMASK DEFINED METAL OPENING SOLDERMASK EXPOSED METAL SOLDERMASK DEFINED SOLDERMASK OPENING SOLDER MASK METAL UNDER EXPOSED METAL

A SIZESCALE PAGE 4 OF REVISIONS BY/APP'DDATEE.C.N.DESCRIPTIONREV DAVID CHIN / ANIS FAUZI12/30/20212197877RELEASE TO DOCUMENT CONTROLA K. SINCERBOX02/14/20222198820NO CHANGE TO DRAWING; REVISION FOR YODA RELEASE;B D. CHIN / K. SINCERBOX02/18/20222198845CHANGE PIN 1 ID LOCATION ON PINC 4215196 REV D

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